Hollow inductive dual encoding device
By reducing the number of coil layers and optimizing the coil layout, the problems of production complexity and heat accumulation in hollow inductive dual encoders have been solved, achieving efficient production and temperature stability, extending product life, and promoting the widespread application of low- and mid-range automated equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG REAGLE SENSING TECH CO LTD
- Filing Date
- 2025-05-23
- Publication Date
- 2026-07-10
AI Technical Summary
The existing hollow inductive dual encoder has a complex manufacturing process and high cost. The heat inside the multi-layer board is difficult to dissipate, which leads to temperature instability and deterioration of measurement accuracy, limiting its promotion and service life in low- and mid-range automation scenarios.
The first and second coil boards are mechanically fixed together by welding, reducing the number of coil board layers. Reflow soldering process is used to ensure electrical connection. The excitation coil and induction coil do not overlap. Heating elements are distributed to avoid heat accumulation. Hardware processing circuits are used for signal processing and calculation.
Reduce the difficulty of production processes, improve production yield and product life, reduce component costs, improve temperature stability, avoid coil deformation, and promote the large-scale application of low- and mid-range automation scenarios.
Smart Images

Figure CN224480182U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of encoder technology, and in particular to a hollow inductor-type dual encoder device. Background Technology
[0002] In fields such as industrial automation, robot joint control, and precision instruments, hollow inductive dual encoders, with their non-contact measurement, high precision, and adaptability to extreme environments, have become core components for achieving redundant position detection and synchronous control. They are widely used in CNC machine tool servo systems, collaborative robot joints, and semiconductor wafer inspection equipment. A dual encoder is an encoder with two encoding channels, typically used in scenarios where servo motors and reducers are located on both sides. The output of the servo motor is connected to the input of the reducer; generally, the servo motor output is referred to as the high-speed end, and the reducer output is referred to as the low-speed end.
[0003] However, current hollow inductive dual encoders face significant technical bottlenecks: the dual-track design based on high-frequency electromagnetic induction relies on high-precision analog circuits and complex PCB layouts, often using eight-layer PCBs and double-sided coil layouts. This results in stringent manufacturing processes, high component costs, and significantly increased complexity in processes such as multi-layer lamination, high-precision drilling, and blind / buried via machining, leading to reduced production yields and longer production cycles. Simultaneously, the heat generated by the coils within the multi-layer PCB is difficult to dissipate effectively, causing localized temperature rises and affecting the temperature stability of the inductive encoder. Under prolonged high-temperature environments, aging of the interlayer adhesives can lead to coil deformation, causing a deterioration in measurement accuracy, severely restricting its large-scale adoption in low- to mid-range automation scenarios and extending product lifespan. Utility Model Content
[0004] To address the aforementioned problems, this invention provides a hollow inductor-type dual-encoding device.
[0005] The hollow inductor-type dual-encoding device provided by this utility model adopts the following technical solution:
[0006] A hollow inductor-type dual-encoding device includes a first rotor code disk, a second rotor code disk, and a reading plate. The reading plate consists of a first coil plate, a hardware processing circuit, and a second coil plate. The first coil plate is provided with a first excitation coil and a first induction coil, and the second coil plate is provided with a second excitation coil and a second induction coil. The hardware processing circuit is disposed on the first coil plate. The first coil plate and the second coil plate are mechanically and electrically connected by welding. The first rotor code disk is provided with a first copper foil code track, and the second rotor code disk is provided with a second copper foil code track. The first copper foil code track is directly opposite the first induction coil, and the second copper foil code track is directly opposite the second induction coil.
[0007] Preferably, the first excitation coil, the first induction coil, the second excitation coil, and the second induction coil do not overlap in space.
[0008] Preferably, the hardware processing circuit is used to generate excitation signals to the first excitation coil and the second excitation coil, and to receive the induction signals generated by the first induction coil and the second induction coil, and to perform signal processing and position calculation.
[0009] Preferably, the first coil board is provided with a plurality of first pad arrays consisting of multiple first pads, wherein any one or more first pads are connected to PCB traces; the second coil board is provided with a plurality of second pad arrays consisting of multiple second pads, wherein any one or more second pads are connected to PCB traces.
[0010] Preferably, the substrate of the first coil plate is either a 4-layer plate or a 6-layer plate.
[0011] Preferably, the substrate of the second coil plate is either a two-layer plate or a four-layer plate.
[0012] Preferably, the first coil board and the second coil board are manufactured using a reflow soldering process to ensure a stable mechanical connection and a reliable electrical connection between the first coil board and the second coil board.
[0013] Preferably, the first copper foil code track includes a first N code track and a first M code track, the second copper foil code track includes a second N code track and a second M code track, the first induction coil includes a first N coil and a first M coil, and the second induction coil includes a second N coil and a second M coil.
[0014] Preferably, both the first excitation coil and the second excitation coil comprise a three-turn coil with multiple concentric turns connected in series.
[0015] Compared with existing technologies, this invention can reduce the difficulty of the production process, reduce complex processes such as multi-layer lamination and high-precision drilling, thereby improving production yield and shortening the production cycle, while reducing the component costs caused by complex design. In addition, compared with the eight-layer board that highly concentrates the heating elements into one piece, this invention makes the heating elements more dispersed, effectively avoiding the problem of local temperature rise caused by excessive heat accumulation, improving temperature stability, and avoiding the aging of interlayer adhesives and coil deformation caused by high temperature, thereby extending the product's service life and promoting its large-scale promotion in low- and mid-end automation scenarios. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of a hollow inductor-type dual-encoding device according to an embodiment of the present invention.
[0017] Figure 2This is another schematic diagram of a hollow inductor-type dual-encoding device according to an embodiment of the present invention.
[0018] Figure 3 This is another schematic diagram of a hollow inductor-type dual-encoding device according to an embodiment of the present invention.
[0019] Figure 4 This is a schematic diagram of a reading plate of a hollow inductor-type dual-encoding device according to an embodiment of the present invention.
[0020] Explanation of reference numerals in the attached figures:
[0021] 1. First rotor code disk; 101. First N code track; 102. First M code track;
[0022] 2. Second rotor code disk, 201, second N code track, 202, second M code track;
[0023] 3. Reading board, 31. First coil board, 311. First excitation coil, 3121. First N coil, 3122. First M coil, 313. First pad, 32. Second coil board, 321. Second excitation coil, 3221. Second N coil, 3222. Second M coil, 323. Second pad. Detailed Implementation
[0024] The present invention will be further described in detail below with reference to the accompanying drawings.
[0025] Reference Figures 1-4 The present invention provides a hollow inductor-type dual encoding device, comprising a first rotor code disk 1, a second rotor code disk 2, and a reading plate 3.
[0026] The reading board 3 includes a first coil board 31, a hardware processing circuit (not separately marked in the figure), and a second coil board 32.
[0027] The first coil board 31 is a 6-layer board. The multi-layer design optimizes circuit layout, reduces electromagnetic interference, and improves device performance. The first coil board 31 houses a first excitation coil 311 and a first induction coil. The first excitation coil 311 consists of three concentrically connected three-turn coils. This structure generates a relatively stable and appropriately strong excitation magnetic field. Each pair of the three concentrically connected three-turn coils forms an induction zone. The first induction coil includes a first N coil 3121 and a first M coil 3122, respectively positioned within the induction zones formed by the pairs of the three concentrically connected three-turn coils of the first excitation coil 311. Both the first N coil 3121 and the first M coil 3122 are composed of two periodic sine coils with a 180° phase difference, where the number of periods in the first M coil 3122 is greater than that in the first N coil 3121. Simultaneously, the first coil board 31 has four sets of first pad arrays composed of multiple first pads 313, some of which connect to PCB traces, providing a convenient interface for circuit connections.
[0028] The second coil board 32 is a four-layer board, on which a second excitation coil 321 and a second induction coil are mounted. Similar to the first excitation coil 311, the second excitation coil 321 is also a three-turn coil with three concentric turns connected in series, capable of generating a stable excitation magnetic field. Each pair of the three concentric turns also forms an induction zone. The second induction coil also includes a second N coil 3221 and a second M coil 3222, respectively positioned within the induction zones formed by each pair of the three concentric turns of the second excitation coil 321. Both are composed of two periodic sine coils with a 180° phase difference, and the number of periods of the second M coil 3222 is greater than that of the second N coil 3221. The second coil board 32 has four sets of second pad arrays composed of multiple second pads 323, some of which are connected to PCB traces. The first coil board 31 and the second coil board 32 are mechanically fixed together by reflow soldering to ensure the stability of the device structure; the first pad 313 and the second pad 323 connecting the PCB traces are electrically connected to ensure the accuracy and stability of signal transmission.
[0029] Furthermore, the first excitation coil 311, the first induction coil, the second excitation coil 321, and the second induction coil do not overlap in space, thus avoiding electromagnetic interference between the coils and further improving the performance of the device.
[0030] The first rotor code disk 1 is provided with a first copper foil code track, which is composed of metallic copper foil and insulating medium spaced apart, specifically including a first N code track 101 and a first M code track 102 arranged concentrically. The number of copper foils in the first M code track 102 is greater than the number of copper foils in the first N code track 101. The first N code track 101 is directly opposite to the first N coil 3121 in the first induction coil, and the first M code track 102 is directly opposite to the first M coil 3122 in the first induction coil. The induction coil accurately acquires the encoded information on the first rotor code disk 1.
[0031] The second rotor code disk 2 is provided with a second copper foil code track, which is also composed of metal copper foil and insulating medium spacing, including a second N code track 201 and a second M code track 202 arranged concentrically. The number of copper foils in the second M code track 202 is greater than the number of copper foils in the second N code track 201. The second N code track 201 is directly opposite to the second N coil 3221 in the second induction coil, and the second M code track 202 is directly opposite to the second M coil 3222 in the second induction coil, thereby realizing accurate sensing of the encoded information of the second rotor code disk.
[0032] The hardware processing circuit is mounted on the first coil board 31. Its main function is to generate excitation signals for the first excitation coil 311 and the second excitation coil 321. The excitation signals cause the excitation coils to generate a suitable alternating magnetic field, which then interacts with the copper foil code track on the rotor code disk. Simultaneously, the hardware processing circuit also receives the induced eddy current signals generated by the first and second induction coils, processes these signals, and calculates their position. Through complex algorithms and circuit design, the hardware processing circuit can convert the induced signals into accurate position information, realizing the encoding function of the inductive dual-encoding device.
[0033] The above are all preferred embodiments of this utility model, and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape and principle of this utility model should be covered within the scope of protection of this utility model.
Claims
1. A hollow inductor-type dual-encoding device, characterized in that, The system includes a first rotor code disk, a second rotor code disk, and a reading plate. The reading plate consists of a first coil board, a hardware processing circuit, and a second coil board. The first coil board is provided with a first excitation coil and a first induction coil, and the second coil board is provided with a second excitation coil and a second induction coil. The hardware processing circuit is located on the first coil board. The first coil board and the second coil board are mechanically and electrically connected by welding. The first rotor code disk has a first copper foil code track, and the second rotor code disk has a second copper foil code track. The first copper foil code track is directly opposite the first induction coil, and the second copper foil code track is directly opposite the second induction coil.
2. The hollow inductor-type dual-encoding device according to claim 1, characterized in that, The first excitation coil, the first induction coil, the second excitation coil, and the second induction coil do not overlap in space.
3. The hollow inductor-type dual-encoding device according to claim 1, characterized in that, The hardware processing circuit is used to generate excitation signals to the first excitation coil and the second excitation coil, and to receive the induction signals generated by the first induction coil and the second induction coil, and to perform signal processing and position calculation.
4. The hollow inductor-type dual-encoding device according to claim 1, characterized in that, The first coil board is provided with several sets of first pad arrays consisting of multiple first pads, wherein any one or more first pads are connected to PCB traces; the second coil board is provided with several sets of second pad arrays consisting of multiple second pads, wherein any one or more second pads are connected to PCB traces.
5. The hollow inductor-type dual-encoding device according to claim 1, characterized in that, The substrate of the first coil board is either a 4-layer board or a 6-layer board.
6. The hollow inductor-type dual-encoding device according to claim 1, characterized in that, The substrate of the second coil board is either a 2-layer board or a 4-layer board.
7. The hollow inductor-type dual-encoding device according to claim 1, characterized in that, The first coil board and the second coil board are manufactured using a reflow soldering process to ensure a stable mechanical connection and a reliable electrical connection between the first coil board and the second coil board.
8. The hollow inductor-type dual-encoding device according to claim 1, characterized in that, The first copper foil code track includes a first N code track and a first M code track, the second copper foil code track includes a second N code track and a second M code track, the first induction coil includes a first N coil and a first M coil, and the second induction coil includes a second N coil and a second M coil.
9. The hollow inductor-type dual-encoding device according to claim 1, characterized in that, Both the first excitation coil and the second excitation coil consist of multiple three-turn coils connected in concentric series.