A circuit board flying probe tester configured with a multi-stage buffer mechanism

Abstract

The utility model discloses a kind of circuit board flying probe testers with multistage buffer mechanism, it is related to circuit board detection technical field, including mounting bracket, the top of mounting bracket is fixedly installed with one single-shaft drive assembly, the drive end of one single-shaft drive assembly is fixedly installed with two single-shaft drive assemblies.The utility model in, drive block first extrusion is carried out to elastic buffer layer, realizes preliminary buffering, and elastic buffer layer is extruded to certain limit after driving buffer plate down pressure hydraulic damper to carry out secondary buffering, so that probe contact speed is from high speed, steady drop to low speed, in precision guarantee aspect, through the synergic effect of two-stage buffering, instantaneous speed peak value when probe contact element can be controlled in specified range, the risk that micro-patch component is displaced or broken due to excessive pressure is greatly reduced, effectively improve the yield and reliability of circuit board detection.

Description

Technical Field

[0001] This utility model relates to the field of circuit board testing technology, and in particular to a circuit board flying probe tester equipped with a multi-level buffer mechanism. Background Technology

[0002] A flying probe tester is an automated device used to test the electrical performance and soldering quality of circuit boards (PCBs). It uses movable probes (flying probes) to contact test points on the circuit board. Without the need for special test fixtures, it can accurately test open circuits, short circuits, component values ​​(such as resistance, capacitance, inductance, etc.), and circuit connections on the circuit board. It features high flexibility, wide testing range, and low cost. It is especially suitable for rapid testing of small batches and various types of circuit boards, and can effectively ensure the functional reliability and production quality of the circuit boards.

[0003] When using a flying probe tester to perform electrical performance testing on ultra-miniature surface-mount components, the peak instantaneous contact speed often exceeds the component's mechanical tolerance limit, causing failures such as displacement or structural breakage. This problem seriously affects test reliability, potentially leading to misinterpretations of test results and significantly damaging the yield and functionality of precision circuit boards. Utility Model Content

[0004] The purpose of this invention is to solve the problem that when using a flying probe tester to test the electrical performance of ultra-miniature surface mount components, the peak instantaneous contact speed often exceeds the mechanical tolerance limit of the component, causing the component to fail due to positional displacement or structural breakage. Therefore, this invention proposes a circuit board flying probe tester with a multi-level buffer mechanism.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a circuit board flying probe tester with a multi-stage buffer mechanism, comprising a mounting frame, a first single-axis drive assembly fixedly mounted on the top of the mounting frame, a second single-axis drive assembly fixedly mounted on the drive end of the first single-axis drive assembly, a third single-axis drive assembly fixedly mounted on the drive end of the second single-axis drive assembly, a detection flying probe fixedly mounted on the drive end of the third single-axis drive assembly, a multi-stage flying probe buffer mechanism fixedly mounted inside the third single-axis drive assembly, the multi-stage flying probe buffer mechanism being disposed on one side of the drive end of the third single-axis drive assembly, the multi-stage flying probe buffer mechanism comprising a hydraulic damper, a buffer plate, and an elastic buffer layer, one end of the hydraulic damper fixedly mounted inside the third single-axis drive assembly, the drive end of the hydraulic damper fixedly connected to one side of the buffer plate, and the other side of the buffer plate fixedly connected to the elastic buffer layer.

[0006] Preferably, the third single-axis drive assembly includes a mounting plate, a drive motor, a lead screw, a drive block, and a transmission table. The drive motor is fixedly mounted on one end of the mounting plate, and the drive end of the drive motor is connected to one end of the lead screw. The lead screw is threaded inside the drive block, and one side of the drive block is fixedly connected to one side of the transmission table. The elastic buffer layer is disposed on one side of the drive block, and the detection flying probe is fixedly mounted on the other side of the transmission table.

[0007] Preferably, the drive end of the first single-axis drive assembly is fixedly mounted with a mounting base plate, and the second single-axis drive assembly is fixedly mounted on one side of the mounting base plate.

[0008] Preferably, a slide rail is fixedly installed at the top of the mounting bracket, and a slider is slidably connected to the outside of the slide rail. The slider is fixedly installed at one end of the other side of the mounting base plate.

[0009] Preferably, an isolation plate is fixedly connected to one side of the mounting plate.

[0010] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0011] 1. In this utility model, the driving block first squeezes the elastic buffer layer to achieve initial buffering. After the elastic buffer layer is squeezed to a certain limit, it drives the buffer plate to press down the hydraulic damper for secondary buffering, so that the probe contact speed is smoothly reduced from high speed to low speed. In terms of accuracy assurance, through the synergistic effect of the two-stage buffering, the instantaneous speed peak when the probe contacts the component can be controlled within a specified range, which greatly reduces the risk of displacement or breakage of the ultra-micro surface mount component due to excessive pressure, and effectively improves the yield and reliability of circuit board testing.

[0012] 2. In this invention, the elastic buffer layer is constructed using a high-performance polymer elastomer material. Thanks to its unique cross-linked molecular chain structure and excellent elastic recovery characteristics, it can quickly return to its initial shape after being subjected to multiple compression deformations of the drive block. This material possesses excellent fatigue resistance, significantly reducing the replacement frequency of the buffer components, minimizing downtime for maintenance, and improving the overall utilization rate of the equipment. Attached Figure Description

[0013] Figure 1 A three-dimensional structural diagram of a circuit board flying probe tester with a multi-level buffer mechanism is provided for this utility model.

[0014] Figure 2 This utility model provides a schematic diagram of the transmission relationship between the second and third single-axis drive components in a circuit board flying probe tester equipped with a multi-level buffer mechanism.

[0015] Figure 3This utility model presents a three-dimensional structural diagram of the third single-axis drive component in a circuit board flying probe tester with a multi-level buffer mechanism.

[0016] Figure 4 for Figure 3 A magnified view of a portion of point A in the middle.

[0017] Legend: 1. Mounting bracket; 11. Slide rail; 12. Slider; 2. Single-axis drive assembly No. 1; 21. Mounting base plate; 3. Single-axis drive assembly No. 2; 4. Single-axis drive assembly No. 3; 40. Detection flying probe; 41. Mounting plate; 42. Drive motor; 43. Lead screw; 44. Drive block; 45. Transmission table; 46. Isolation plate; 5. Multi-stage flying probe buffer mechanism; 51. Hydraulic damper; 52. Buffer plate; 53. Elastic buffer layer. Detailed Implementation

[0018] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0019] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0020] Example 1: As Figures 1-4As shown, this utility model provides a circuit board flying probe tester with a multi-stage buffer mechanism, including a mounting frame 1. A first-axis drive assembly 2 is fixedly mounted on the top of the mounting frame 1. A second-axis drive assembly 3 is fixedly mounted on the drive end of the first-axis drive assembly 2. A third-axis drive assembly 4 is fixedly mounted on the drive end of the second-axis drive assembly 3. A detection flying probe 40 is fixedly mounted on the drive end of the third-axis drive assembly 4. A multi-stage flying probe buffer mechanism 5 is fixedly mounted inside the third-axis drive assembly 4. The multi-stage flying probe buffer mechanism 5 is located on one side of the drive end of the third-axis drive assembly 4. The multi-stage flying probe buffer mechanism 5 includes a hydraulic damper 51, a buffer plate 52, and an elastic buffer layer 53. One end of the hydraulic damper 51 is fixedly mounted inside the third-axis drive assembly 4. The drive end of the hydraulic damper 51 is fixedly connected to one side of the buffer plate 52, and the other side of the buffer plate 52 is fixedly connected to the elastic buffer layer 53. Layer 53 is fixedly connected. The third single-axis drive assembly 4 includes a mounting plate 41, a drive motor 42, a lead screw 43, a drive block 44, and a transmission table 45. The drive motor 42 is fixedly installed at one end of the mounting plate 41. The drive end of the drive motor 42 is connected to one end of the lead screw 43. The lead screw 43 is threaded inside the drive block 44. One side of the drive block 44 is fixedly connected to one side of the transmission table 45. An elastic buffer layer 53 is set on one side of the drive block 44. The detection flying needle 40 is fixedly installed on the other side of the transmission table 45. The drive end of the first single-axis drive assembly 2 is fixedly installed with a mounting base plate 21. The second single-axis drive assembly 3 is fixedly installed on one side of the mounting base plate 21. The top of the mounting frame 1 is fixedly installed with a slide rail 11. A slider 12 is slidably connected to the outside of the slide rail 11. The slider 12 is fixedly installed at one end of the other side of the mounting base plate 21. An isolation plate 46 is fixedly connected to one side of the mounting plate 41.

[0021] The specific settings and functions of this embodiment are described in detail below. Single-axis drive assembly 2 drives single-axis drive assembly 3 and single-axis drive assembly 4 to slide, causing them to move above the designated detection position. Single-axis drive assembly 3 drives single-axis drive assembly 4 to adjust the lateral detection point, causing it to move directly above the designated detection position. Drive motor 42 in single-axis drive assembly 4 drives lead screw 43 to rotate. Lead screw 43 causes drive block 44 and transmission table 45 to descend, causing one end of the detection probe 40 to contact the micro-patch element, completing the detection operation. During the descent of drive block 44, drive block 44 first... The buffer layer 53 is compressed to achieve initial buffering. After the elastic buffer layer 53 is compressed to a certain limit, it drives the buffer plate 52 to press down the hydraulic damper 51 for secondary buffering, so that the probe contact speed is smoothly reduced from high speed to low speed. In terms of accuracy assurance, through the synergistic effect of the two-stage buffering, the instantaneous speed peak when the probe contacts the component can be controlled within a specified range, which greatly reduces the risk of displacement or breakage of the micro-sized chip component due to excessive pressure, and effectively improves the yield and reliability of circuit board testing. The isolation plate 46 on one side of the mounting plate 41 can protect the drive motor 42, lead screw 43, drive block 44 and transmission table 45 on the side of the mounting plate 41. The slide rail 11 and the slider 12 cooperate with each other to provide stable support for the mounting base plate 21.

[0022] Example 2: Figures 1-4 As shown, the circuit board flying probe tester with a multi-stage buffer mechanism of this utility model includes a mounting frame 1. A first single-axis drive assembly 2 is fixedly installed at the top of the mounting frame 1. A second single-axis drive assembly 3 is fixedly installed at the drive end of the first single-axis drive assembly 2. A third single-axis drive assembly 4 is fixedly installed at the drive end of the second single-axis drive assembly 3. A detection flying probe 40 is fixedly installed at the drive end of the third single-axis drive assembly 4. A multi-stage flying probe buffer mechanism 5 is fixedly installed inside the third single-axis drive assembly 4. The multi-stage flying probe buffer mechanism 5 is located on one side of the drive end of the third single-axis drive assembly 4. The multi-stage flying probe buffer mechanism 5 includes a hydraulic damper 51, a buffer plate 52, and an elastic buffer layer 53. One end of the hydraulic damper 51 is fixedly installed inside the third single-axis drive assembly 4. The drive end of the hydraulic damper 51 is fixedly connected to one side of the buffer plate 52, and the other side of the buffer plate 52 is fixedly connected to the elastic buffer layer 53.

[0023] The overall effect of this embodiment is that the elastic buffer layer 53 is constructed from a high-performance polymer elastomer material. Thanks to its unique cross-linked molecular chain structure and excellent elastic recovery characteristics, it can quickly return to its initial shape after being subjected to multiple compression deformations by the drive block 44. This material possesses excellent fatigue resistance, significantly reducing the replacement frequency of the buffer components, minimizing downtime for maintenance, and improving the overall utilization rate of the equipment.

[0024] The operating method and working principle of this device are as follows: Single-axis drive assembly 2 drives single-axis drive assembly 3 and single-axis drive assembly 4 to slide, so that single-axis drive assembly 3 and single-axis drive assembly 4 move to above the designated detection position. Single-axis drive assembly 3 drives single-axis drive assembly 4 to adjust the horizontal detection point, so that single-axis drive assembly 4 moves to directly above the designated detection position. Drive motor 42 in single-axis drive assembly 4 drives lead screw 43 to rotate. Lead screw 43 drives drive block 44 and transmission table 45 to descend, so that one end of detection probe 40 contacts the ultra-micro patch element to complete the detection operation. During the descent of drive block 44, drive block 44 first squeezes elastic buffer layer 53 to achieve initial buffering. After elastic buffer layer 53 is squeezed to a certain limit, it drives buffer plate 52 to press down hydraulic damper 51 for secondary buffering, so that the probe contact speed smoothly decreases from high speed to low speed.

[0025] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the technical solution of this utility model shall still fall within the protection scope of this utility model.

Claims

1. A circuit board flying probe tester with a multi-stage buffer mechanism, comprising a mounting frame (1), wherein a single-axis drive assembly (2) is fixedly mounted on the top of the mounting frame (1), characterized in that: The first single-axis drive assembly (2) is fixedly installed with the second single-axis drive assembly (3), the second single-axis drive assembly (3) is fixedly installed with the third single-axis drive assembly (4), the third single-axis drive assembly (4) is fixedly installed with the detection flying needle (40), the third single-axis drive assembly (4) is fixedly installed with a multi-stage flying needle buffer mechanism (5) inside, the multi-stage flying needle buffer mechanism (5) is located on one side of the drive end of the third single-axis drive assembly (4), the multi-stage flying needle buffer mechanism (5) includes a hydraulic damper (51), a buffer plate (52) and an elastic buffer layer (53), one end of the hydraulic damper (51) is fixedly installed inside the third single-axis drive assembly (4), the drive end of the hydraulic damper (51) is fixedly connected to one side of the buffer plate (52), and the other side of the buffer plate (52) is fixedly connected to the elastic buffer layer (53).

2. The circuit board flying probe tester with a multi-stage buffer mechanism according to claim 1, characterized in that: The third single-axis drive assembly (4) includes a mounting plate (41), a drive motor (42), a lead screw (43), a drive block (44), and a transmission table (45). The drive motor (42) is fixedly mounted on one end of the mounting plate (41). The drive end of the drive motor (42) is connected to one end of the lead screw (43). The lead screw (43) is threadedly connected inside the drive block (44). One side of the drive block (44) is fixedly connected to one side of the transmission table (45). The elastic buffer layer (53) is disposed on one side of the drive block (44). The detection flying needle (40) is fixedly mounted on the other side of the transmission table (45).

3. The circuit board flying probe tester with a multi-stage buffer mechanism according to claim 1, characterized in that: The drive end of the first single-axis drive assembly (2) is fixedly mounted with a mounting base plate (21), and the second single-axis drive assembly (3) is fixedly mounted on one side of the mounting base plate (21).

4. A circuit board flying probe tester with a multi-stage buffer mechanism according to claim 3, characterized in that: The top of the mounting bracket (1) is fixedly mounted with a slide rail (11), and a slider (12) is slidably connected to the outside of the slide rail (11). The slider (12) is fixedly mounted on one end of the other side of the mounting base plate (21).

5. A circuit board flying probe tester with a multi-stage buffer mechanism according to claim 2, characterized in that: An isolation plate (46) is fixedly connected to one side of the mounting plate (41).

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