Liquid cooling device

By setting a heat exchange cavity in the cold plate assembly and making the heat conduction component in double contact with the cold plate assembly, combined with the double-layer cold plate design, the problem of high thermal resistance in memory heat dissipation is solved, achieving a more efficient heat dissipation effect and a simplified maintenance process.

CN224480696UActive Publication Date: 2026-07-10GUANGDONG ENVICOOL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGDONG ENVICOOL TECH CO LTD
Filing Date
2025-06-30
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing memory cooling solutions have high thermal resistance, resulting in high memory temperatures. Traditional natural convection cooling methods cannot meet the high power demands of memory.

Method used

A liquid cooling device is used. By setting a heat exchange cavity in the cold plate assembly and making the first end of the heat conduction component contact with both the upper and lower surfaces of the cold plate assembly, the contact area between the heat conduction component and the cold plate is increased, and the thermal resistance is reduced. At the same time, a double-layer cold plate design is adopted to increase the heat exchange area and reduce the flow resistance.

Benefits of technology

It effectively reduces the operating temperature of heat-generating components, improves heat dissipation efficiency, simplifies the maintenance process, and reduces the flow rate and flow resistance of the coolant.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224480696U_ABST
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Abstract

The application discloses a liquid cooling device, which comprises a cold plate assembly and a heat conduction assembly. The cold plate assembly comprises a cold plate provided with a heat exchange cavity. The heat conduction assembly is installed on the cold plate assembly, and the first end of the heat conduction assembly is located in the heat exchange cavity, so that the upper surface of the first end of the heat conduction assembly is in contact with the upper inner wall of the heat exchange cavity, and the lower surface of the first end of the heat conduction assembly is in contact with the lower inner wall of the heat exchange cavity. The cold plate is provided with the heat exchange cavity, and the first end of the heat conduction assembly is arranged in the heat exchange cavity, so that the upper surface and the lower surface of the first end of the heat conduction assembly can be in contact with the surface of the cold plate, thereby effectively reducing the heat conduction thermal resistance of the position where the cold plate is in contact with the heat conduction assembly, reducing the temperature of the heating device during operation, and ensuring the normal work of the heating device.
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