Server heat dissipation device and server

Abstract

The application discloses a server heat dissipation device and a server. The server heat dissipation device comprises a base, the base is provided with a mounting groove; a heat dissipation fin, the heat dissipation fin is detachably arranged in the mounting groove; a limiting assembly, the limiting assembly is connected with the base, at least a part of the limiting assembly is provided with elasticity, the limiting assembly and the heat dissipation fin are in abuttable and separable cooperation, when the limiting assembly abuts against the heat dissipation fin, the heat dissipation fin is hindered from being taken out of the mounting groove, and when the limiting assembly is deformed and separated from the heat dissipation fin, the heat dissipation fin is avoided from being taken out of the mounting groove. The application solves the problem of poor universality of the server heat dissipation fin in the prior art.

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and in particular to a server heat dissipation device and a server. Background Technology

[0002] Currently, in common server heat sinks, the heat dissipation fins are mostly connected to the heat sink base and heat dissipation pipes through methods such as welding and riveting. For example, in high-performance server CPU heat sinks, the fins and base are usually welded together as a single unit to achieve higher initial heat dissipation efficiency.

[0003] However, existing technologies have significant limitations in server cooling. On one hand, servers typically need to operate 24 / 7, and dust easily accumulates on the fins over long periods, especially in environments like data centers where dust buildup is even faster, leading to a sharp decline in heat dissipation efficiency. Since the fins are fixedly connected to other components, replacing fins often requires replacing the entire heatsink, significantly increasing server maintenance costs and making the process complex and time-consuming, impacting uptime. On the other hand, different types of servers and servers under varying workloads have significantly different requirements for fins. For example, servers running high-load computing tasks require fins with large heat dissipation areas, while some low-power servers require small-sized, low-noise fins. Fixed-structure heatsinks cannot flexibly adapt to these different needs, limiting their versatility in the server field.

[0004] Although some technologies have attempted to improve the fin connection method, they either have a complex structure that makes disassembly and assembly inconvenient and unsuitable for the rapid maintenance needs of server rooms, or poor connection stability that affects heat dissipation and fails to meet the high stability requirements of servers. Utility Model Content

[0005] This application provides a server heat dissipation device and a server to at least solve the problem of poor versatility of server heat dissipation fins in related technologies.

[0006] This application provides a server heat dissipation device, including: a base having a mounting groove; a heat sink detachably disposed in the mounting groove; and a limiting component connected to the base, at least a portion of which is elastic, wherein the limiting component and the heat sink can be mated and separated, wherein when the limiting component abuts against the heat sink, it prevents the heat sink from coming out of the mounting groove, and when the limiting component deforms and separates from the heat sink, it prevents the heat sink from coming out of the mounting groove.

[0007] This application also provides a server, including a chassis and the aforementioned server heat dissipation device, wherein the server heat dissipation device is disposed inside the chassis and contacts the components to be cooled for heat transfer.

[0008] This application provides a mounting slot on the base, and the heat sink is detachably connected to the mounting slot, allowing the heat sink to be replaced as needed. To ensure ease of replacement, this embodiment includes a limiting component. This component is elastically designed; it prevents the heat sink from detaching from the mounting slot when no external force is applied, thus keeping the heat sink stable within the slot. When the heat sink needs to be removed, force is applied to the limiting component, causing it to deform and no longer obstruct the heat sink's removal, allowing it to be pulled out of the mounting slot for quick replacement. This design allows for easy installation, removal, and replacement of the heat sink as needed. The installation of individual heat sinks, their size, and type can all be adjusted as required. The installation process is convenient and quick, and the heat sink remains stable and reliable on the base after installation. This achieves quick removal, reduces maintenance costs and effort, meets the needs of different scenarios, improves versatility, and ensures stable and reliable heat dissipation. Attached Figure Description

[0009] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of the server heat dissipation device provided in an embodiment of this application;

[0011] Figure 2 for Figure 1 The main view;

[0012] Figure 3 for Figure 2 Enlarged view of the middle limit component;

[0013] Figure 4 for Figure 1 Side view;

[0014] Figure 5 for Figure 4 Enlarged view of the heat sink area;

[0015] Figure 6 This is a top sectional view of the base.

[0016] The above figures include the following reference numerals:

[0017] 10. Base; 11. Flow channel cavity; 20. Heat sink; 21. Heat sink body; 22. Protrusion; 30. Limiting component; 31. Bracket; 311. First segment; 312. Second segment; 32. Elastic element; 33. Baffle. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0019] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0020] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] To address the issue of poor versatility of server heat sinks in related technologies, this application provides a server heat dissipation device and a server.

[0022] like Figures 1 to 6 The server heat dissipation device shown includes a base 10, a heat sink 20, and a limiting component 30. The base 10 has a mounting groove; the heat sink 20 is detachably disposed in the mounting groove; the limiting component 30 is connected to the base 10, and at least a portion of the limiting component 30 is elastic. The limiting component 30 and the heat sink 20 can be mated and separated. When the limiting component 30 abuts against the heat sink 20, it prevents the heat sink 20 from coming out of the mounting groove. When the limiting component 30 deforms and separates from the heat sink 20, it avoids the heat sink 20 from coming out of the mounting groove.

[0023] In this embodiment, a mounting slot is provided on the base 10, and the heat sink 20 is detachably connected to the mounting slot, allowing the heat sink 20 to be replaced as needed. To ensure ease of replacement, this embodiment includes a limiting component 30. The limiting component 30 is elastically designed; it prevents the heat sink 20 from detaching from the mounting slot when no external force is applied, thus keeping the heat sink 20 stable within the mounting slot. When it is necessary to remove the heat sink 20, only force needs to be applied to the limiting component 30, causing it to deform and no longer obstruct the detachment of the heat sink 20. This allows the heat sink 20 to be pulled out of the mounting slot, enabling quick replacement of the heat sink 20. The above-mentioned configuration allows the heat sink 20 to be disassembled, installed, and replaced as needed. Whether a single heat sink 20 is installed, its size, and type can all be adjusted as required. Moreover, the disassembly and installation process is convenient and quick. After installation, the heat sink 20 can be ensured to be stable and reliable on the base 10. This not only meets the need for quick disassembly, reducing maintenance costs and effort, but also meets the needs of different scenarios, improves versatility, and ensures stable and reliable heat dissipation.

[0024] like Figure 1 and Figure 2As shown, in this embodiment, the mounting groove extends along the surface of the base 10. The heat sink 20 is positioned above the base 10, thus the mounting groove is located on the upper surface of the base 10. The first end of the mounting groove penetrates the side of the base 10, and the second end is a sealing section. Therefore, the heat sink 20 can only be installed or removed from the base 10 through its first end. That is, the bottom end of the heat sink 20 is laterally aligned with the first end, and then the heat sink 20 is moved laterally until its bottom end extends into the mounting groove from the first end. The heat sink 20 is then moved laterally until its end abuts against the second end. Based on the above, in this embodiment, the limiting component 30 is disposed at the first end. When the limiting component 30 is connected to the heat sink 20, the limiting component 30 blocks the opening at the first end, thereby preventing the heat sink 20 from coming out of the mounting slot at the first end, thus achieving stable fixation of the heat sink 20. When the limiting component 30 is separated from the heat sink 20, the limiting component 30 deforms to avoid the opening at the first end, thereby allowing the heat sink 20 to be pulled out from the first end, thus achieving disassembly of the heat sink 20.

[0025] like Figure 3 As shown, in this embodiment, the limiting component 30 includes a bracket 31 and a deformable elastic element 32. The bracket 31 is connected to the base 10 and is a fixed part; the bracket 31 itself will not deform. The elastic element 32 is the main deformable part. The elastic element 32 can adopt a structure such as a spring sheet. One end of the elastic element 32 is connected to the bracket 31, and the other end of the elastic element 32 is located at the second end, so that this end is located at the heat sink 20, thereby achieving blocking and avoidance cooperation with the heat sink 20. When the elastic element 32 is not deformed, its end is located at the first end, thereby blocking the heat sink 20 from detaching. When it is necessary to remove the heat sink 20, the operator applies force to the elastic element 32, causing the elastic element 32 to deform. Since the deformation of the end of the elastic element 32 connected to the bracket 31 is very small, the main deformable part is the end located at the first end. This causes this end to deform and avoid the detachment movement of the heat sink 20, thereby allowing the heat sink 20 to be pulled out of the mounting slot for replacement.

[0026] In this embodiment, considering that the end of the spring piece is relatively small and its blocking effect on the heat sink 20 may be insufficient, the limiting component 30 in this embodiment also includes a baffle 33. The baffle 33 is movably disposed at the heat sink 20 and is used to block or avoid the heat sink 20. The baffle 33 is movably disposed at the end of the elastic member 32 away from the bracket 31. The baffle 33 is arranged approximately parallel to the side of the base 10, that is, the baffle 33 is vertically disposed, so that the side with a larger area of ​​the baffle 33 faces the first end, so that the opening at the first end can be blocked by the baffle 33 as much as possible, ensuring the blocking effect on the heat sink 20, and thus ensuring the stability of the heat sink 20 after installation. Since the baffle 33 is located at the end of the elastic member 32 away from the bracket 31, when the elastic member 32 deforms under the action of external force, the baffle 33 deforms along with the elastic member 32, thereby avoiding the opening at the first end and realizing the disassembly operation of the heat sink 20.

[0027] In this embodiment, the bracket 31 includes a first segment 311, which is connected to the side of the base 10. The extension direction of the first segment 311 is inclined relative to the side of the base 10. One end of the elastic member 32 is connected to the inclined side of the first segment 311, and the extension direction of the elastic member 32 is at an angle to the extension direction of the first segment 311. The extension direction of the elastic member 32 is also inclined relative to the side of the base 10. The extension direction of the elastic member 32 is essentially the length direction of the elastic member 32. The inclined first segment 311 and the elastic member 32 ensure that when the elastic member 32 is not under force, if the heat sink 20 exerts a force on the baffle 33, the force will be transmitted to the first segment 311 through the elastic member 32. Thus, most or even all of the force can be distributed by the first segment 311, further ensuring the stability of the heat sink 20 after installation and fixing, and preventing accidental detachment.

[0028] Preferably, the extension direction of the elastic element 32 and the extension direction of the first segment 311 can be perpendicular to each other, thereby further improving the load-bearing effect of the first segment 311.

[0029] The bracket 31 in this embodiment also includes a second segment 312, which is located at the top of the first segment 311. The second segment 312 extends laterally, and the top of the first segment 311 is connected to the bottom surface of the middle part of the second segment 312, so that the second segment 312 can play an auxiliary support role and ensure the structural strength of the bracket 31.

[0030] like Figure 6As shown, in this embodiment, the base 10 has a flow channel cavity 11 inside, which serves to allow the heat dissipation medium to pass through, thereby achieving liquid cooling. Since the base 10 is in contact with the components to be cooled inside the chassis, the heat is transferred to the base 10 and then evenly distributed to the entire upper surface of the base 10 through the heat dissipation medium in the flow channel cavity 11. Then it is transferred to the heat sink 20 installed on the upper surface of the base 10, and heat exchange with the airflow is achieved through the heat sink 20 to achieve heat dissipation.

[0031] In this embodiment, the flow channel cavity 11 is arranged in a spiral pattern along the surface of the base 10 and has an S-shaped structure. The spiral flow channel cavity 11 can take the form of one or more S-shaped structures, thereby increasing the flow path of the heat dissipation medium and improving the heat dissipation capacity through the formed serpentine bending structure. Since the base 10 participates in the heat transfer and heat dissipation process, the material of the base 10 is preferably a material with excellent thermal conductivity.

[0032] like Figure 4 and Figure 5 As shown, in this embodiment, the heat sink 20 includes a heat sink body 21, which has a plate-like structure and a protrusion 22. In this embodiment, the heat sink body 21 has an overall upright plate-like structure, playing a primary role in heat dissipation. Its bottom can be installed into a mounting groove, thereby achieving a fixed installation fit with the base 10. The protrusion 22 is located on the longitudinal side of the heat sink body 21 and protrudes laterally from the surface of the heat sink body 21. Thus, the protrusion 22 forms a serrated structure on the side of the heat sink body 21, thereby increasing the heat dissipation area and enhancing the heat dissipation effect.

[0033] Optionally, multiple protrusions 22 are provided, with each protrusion 22 spaced apart along the side of the heat sink body 21. In this embodiment, protrusions 22 are provided on both opposite sides of the heat sink body 21, thereby increasing the heat exchange area on both sides of the heat sink body 21. In addition to the protrusions 22 on opposite sides, multiple protrusions 22 are also provided on one side. For one side, these protrusions 22 are spaced apart longitudinally along the side of the heat sink body 21, thereby further increasing the heat exchange area and improving the heat exchange effect.

[0034] Alternatively, the protrusion can be made of aluminum, copper, or a copper-aluminum composite, thereby forming an aluminum part, a copper part, or a copper-aluminum composite part.

[0035] The heat sink body 21 of this embodiment includes a bottom end and a heat dissipation part arranged vertically. The bottom end is located below the heat dissipation part and is the part that cooperates with the mounting groove. The heat dissipation part is the part that mainly performs the heat dissipation function. The heat dissipation part has a relatively high vertical height, so as to ensure the heat exchange effect with the airflow. The protrusion 22 is provided on the side of the heat dissipation part. The bottom end has a larger lateral dimension than the heat dissipation part. The top of the bottom end, i.e., the connection between the bottom end and the heat dissipation part, is provided with a stepped structure. Correspondingly, the mounting groove also includes a large diameter section and a small diameter section, with the small diameter section located above the large diameter section. The opening size of the small diameter section is smaller than that of the large diameter section. When the bottom end is installed into the mounting groove, the part below the stepped structure is aligned with the large diameter section and extends into the large diameter section, while the part above the stepped structure is aligned with the small diameter section and extends into the small diameter section. Since a stepped surface is formed between the large diameter section and the small diameter section, the stepped surface will abut and cooperate with the stepped structure, thereby limiting the bottom end to be located in the mounting groove. This prevents the heat sink 20 from being pulled upwards and allows it to move laterally. Due to the obstruction of the limiting component 30, the heat sink 20 cannot move laterally, thus achieving the effect of stably and reliably installing and fixing the heat sink 20 on the base 10, ensuring the stable and reliable installation of the heat sink 20.

[0036] In this embodiment, the stepped surface of the stepped structure is set in the form of an inclined plane, that is, the top of the bottom end adopts a conical structure. From bottom to top, the inclined planes on both sides of the conical structure slope towards each other, thereby forming a dovetail groove structure with a gradually decreasing cross-sectional size from bottom to top at the top of the bottom end. When installed in the mounting groove, the stepped surface between the large-diameter section and the small-diameter section abuts against the inclined plane of the dovetail groove structure. Of course, the specific fit between the mounting groove and the heat sink 20 is not limited to the setting method described in this embodiment, and can be adjusted as needed, as long as installation stability is ensured.

[0037] Optionally, a layer of thermally conductive materials such as flexible graphene or thermally conductive silicone can be provided at the dovetail groove structure to ensure close thermal contact between the heat sink 20 and the base 10, and to ensure the thermal conductivity between the heat sink and the flow channel cavity 11.

[0038] Optionally, the number of heat sinks 20 can be set as needed, using one or more. This embodiment preferably uses multiple heat sinks 20, arranged in parallel intervals. The gaps between the heat sinks 20 serve as channels for airflow. When the airflow passes between the heat sinks 20, it exchanges heat with them, achieving air-cooling. In this embodiment, the heat sinks 20 are arranged at intervals perpendicular to the airflow direction, ensuring that the gaps between them align with the airflow direction and guaranteeing effective heat exchange. Simultaneously, the extension direction of the mounting groove is angled to the arrangement direction of the heat sinks 20; more specifically, the mounting groove extends parallel to the airflow direction. This ensures good heat dissipation while preventing interference between the installation and removal of each heat sink 20.

[0039] Since there are multiple heat sinks 20 and mounting slots, multiple limiting components 30 can also be provided in this embodiment. The limiting components 30 can be arranged in a one-to-one correspondence with the mounting slots, that is, a limiting component 30 is provided at the first end of each mounting slot, so that the installation and disassembly of each heat sink 20 are completely independent. Alternatively, some or all of the limiting components 30 can be integrated into one, that is, one limiting component 30 can cooperate with multiple mounting slots at the same time, so as to block and avoid multiple heat sinks 20. In this case, the bracket 31 extends a certain length along the arrangement direction of the heat sinks 20, so as to cover the first end of multiple mounting slots. Similarly, the elastic member 32 can adopt a sheet structure, and the elastic member 32 can also cover the first end of multiple mounting slots at the same time, so that when the elastic member 32 deforms, it can avoid multiple mounting slots at the same time, so as to achieve the effect of disassembling multiple heat sinks 20 at the same time. In addition to the above methods, some of the limiting components 30 can also be integrated together. For example, the bracket 31 can be extended along the arrangement direction of the heat sink 20 to cover the first end of multiple mounting slots. However, the elastic element 32 does not cover the first end of multiple mounting slots, but still adopts a one-to-one correspondence with the mounting slots. Multiple elastic elements 32 can be connected to the same bracket 31, thereby simplifying the structure of the limiting component 30 while realizing the independent assembly and disassembly of each heat sink 20.

[0040] This embodiment also provides a server, including a chassis and the aforementioned server heat dissipation device. The server heat dissipation device is disposed inside the chassis, which also houses various components such as hard drives, memory, and processors. The base 10 of the server heat dissipation device contacts and engages with the components to be cooled, thereby achieving contact heat transfer. The base 10 can be made of a material with good thermal conductivity, such as pure copper. For example, the base 10 of the server heat dissipation device can be mounted above the processor, and the bottom surface of the base 10 can contact and engage with the processor, thereby achieving air cooling for the processor.

[0041] The server cooling device of this embodiment enables rapid installation and removal of the heat sink 20, reducing server maintenance costs and downtime, and solving the problem of difficult replacement of traditional fixed-connection heat sinks 20, thus meeting the needs of efficient server room maintenance. Simultaneously, the structure of the flow channel cavity 11 and the heat sink 20 is optimized, improving heat conduction and heat dissipation efficiency while ensuring the heat sink 20 is replaceable, meeting the heat dissipation requirements of high-load servers and ensuring stable server operation under high computational loads. Furthermore, the connection stability between the heat sink 20 and components such as the base 10 is enhanced, ensuring that the heat sink 20 does not loosen or shift during high-speed server operation, and it can adapt to heat sinks 20 of different materials and sizes, improving the versatility of the heat sink on different types of servers.

[0042] It should be noted that "multiple" in the above embodiments refers to at least two.

[0043] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0044] By providing a mounting slot on the base 10 and detachably connecting the heat sink 20 to the mounting slot, the heat sink 20 can be replaced as needed. To ensure ease of replacement, this embodiment includes a limiting component 30. The limiting component 30 is elastically designed so that it prevents the heat sink 20 from detaching from the mounting slot when not subjected to external force, thus keeping the heat sink 20 stable within the mounting slot. When it is necessary to remove the heat sink 20, only force needs to be applied to the limiting component 30 to deform it, thereby removing the limiting component 30 from obstructing the detachment of the heat sink 20. This allows the heat sink 20 to be pulled out of the mounting slot, enabling quick replacement of the heat sink 20. The above-mentioned configuration allows the heat sink 20 to be disassembled, installed, and replaced as needed. Whether a single heat sink 20 is installed, its size, and type can all be adjusted as required. Moreover, the disassembly and installation process is convenient and quick. After installation, the heat sink 20 can be ensured to be stable and reliable on the base 10. This not only meets the need for quick disassembly, reducing maintenance costs and effort, but also meets the needs of different scenarios, improves versatility, and ensures stable and reliable heat dissipation.

[0045] The above provides a detailed description of a server heat dissipation device and a server provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A server heat dissipation device, characterized in that, include: A base (10) having a mounting groove; Heat sink (20), which is detachably disposed in the mounting slot; A limiting component (30) is connected to the base (10), and at least a portion of the limiting component (30) is elastic. The limiting component (30) and the heat sink (20) can be docked and separated. When the limiting component (30) abuts against the heat sink (20), it prevents the heat sink (20) from coming out of the mounting groove. When the limiting component (30) deforms and separates from the heat sink (20), it avoids the heat sink (20) from coming out of the mounting groove.

2. The server heat dissipation device according to claim 1, characterized in that, The mounting groove extends along the surface of the base (10), and the first end of the mounting groove penetrates the side of the base (10). The heat sink (20) is detached from the first end and mounted on the base (10). The limiting component (30) is located at the first end. When the limiting component (30) is connected to the heat sink (20), the limiting component (30) blocks the first end. When the limiting component (30) is separated from the heat sink (20), the limiting component (30) avoids the first end.

3. The server heat dissipation device according to claim 1, characterized in that, The limiting component (30) includes: A bracket (31) is connected to the base (10); A deformable elastic element (32) is provided, one end of which is connected to the bracket (31), and the other end of which is located at the heat sink (20) and is able to avoid the heat sink (20) from dislodging during deformation.

4. The server heat dissipation device according to claim 3, characterized in that, The limiting component (30) further includes a baffle (33), which is disposed at the end of the elastic member (32) away from the bracket (31). When the elastic member (32) deforms, the baffle (33) moves together with the elastic member (32). The baffle (33) is movably disposed at the heat sink (20) and is used to block or avoid the heat sink (20).

5. The server heat dissipation device according to claim 3, characterized in that, The bracket (31) includes a first segment (311), which is connected to the side of the base (10), and the extension direction of the first segment (311) is inclined relative to the side of the base (10). One end of the elastic member (32) is connected to the inclined side of the first segment (311), and the extension direction of the elastic member (32) is at an angle to the extension direction of the first segment (311).

6. The server heat dissipation device according to claim 1, characterized in that, The base (10) has a flow channel cavity (11), which is arranged in a spiral along the surface of the base (10) and has an S-shaped structure.

7. The server heat dissipation device according to claim 1, characterized in that, The heat sink (20) includes: Heat sink body (21), the heat sink body (21) has a plate-like structure; The protrusion (22) is located on the side of the heat sink body (21) and protrudes from the surface of the heat sink body (21). There are multiple protrusions (22), and each protrusion (22) is spaced apart along the side of the heat sink body (21).

8. The server heat dissipation device according to claim 1, characterized in that, There are multiple heat sinks (20), and each heat sink (20) is arranged in parallel with intervals between them. The extension direction of the mounting groove is set at an angle to the arrangement direction of the heat sinks (20).

9. The server heat dissipation device according to claim 1, characterized in that, The mounting groove extends along the surface of the base (10), the first end of the mounting groove penetrates the side of the base (10), the second end of the mounting groove is a blocking section, and the limiting component (30) is located at the first end; There are multiple heat sinks (20), and the heat sinks (20) are arranged at intervals along the direction perpendicular to the airflow direction, and the mounting groove extends along the direction parallel to the airflow direction. The limiting component (30) includes a bracket (31), a deformable elastic element (32), and a baffle (33). The bracket (31) is connected to the base (10). One end of the elastic element (32) is connected to the bracket (31), and the other end of the elastic element (32) is located at the heat sink (20) and is provided with the baffle (33). When the elastic element (32) deforms, the baffle (33) moves synchronously with the elastic element (32) and avoids the heat sink (20) from coming off. The base (10) has a flow channel cavity (11), which is arranged in a spiral along the surface of the base (10) and has an S-shaped structure; The heat sink (20) has protruding protrusions (22) on its side. There are multiple protrusions (22). The protrusions (22) are provided on both sides of the heat sink (20), and at least some of the protrusions (22) are longitudinally spaced along the side of the heat sink (20).

10. A server, characterized in that, The system includes a chassis and a server heat dissipation device according to any one of claims 1 to 9, wherein the server heat dissipation device is disposed inside the chassis and contacts the components to be cooled for heat transfer.

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