Heat dissipation structure of a computing node and SoC array server
By designing a triple heat conduction path in the computing node and combining it with a cooling fan, the problem of heat transfer difficulties in traditional heat dissipation structures is solved, achieving efficient heat dissipation and ensuring the stable operation of the computing node.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHUANGKE ZHILIAN (SHENZHEN) ELECTRONIC INFORMATION CO LTD
- Filing Date
- 2025-09-09
- Publication Date
- 2026-07-10
AI Technical Summary
In traditional multi-layer PCB stacked designs, heat from the heat source in the middle layer is difficult to transfer to external heat dissipation components, which can easily form local hot spots, causing computing nodes to reduce frequency or crash.
The design employs a triple heat conduction path, which includes opening a heat conduction position on the first PCB, using a third heat conductor embedded in the heat conduction position and in contact with the first heat conductor and the second PCB, and the second heat conductor being directly attached to the heat source to form bidirectional heat dissipation, combined with a cooling fan to achieve composite heat dissipation.
Effectively control the local temperature rise of high-density computing nodes, thereby improving the stability and lifespan of the equipment.
Smart Images
Figure CN224480701U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of server equipment, and in particular to a heat dissipation structure for a computing node and a SoC array server. Background Technology
[0002] With the development of cloud computing and artificial intelligence, computing nodes are evolving towards higher density and higher performance, and the power consumption of core components such as CPUs and GPUs continues to rise. Traditional heat dissipation structures mostly use a single heat conduction path. Especially in multi-layer PCB stack-up designs, heat from the heat source in the middle layer is difficult to transfer to external heat dissipation components, easily forming local hot spots, which can lead to computing node frequency reduction or downtime. Utility Model Content
[0003] The purpose of this invention is to address the technical problems existing in the background technology by proposing a heat dissipation structure for computing nodes.
[0004] To achieve the above-mentioned technical objectives, the technical solution adopted by this utility model in the first aspect is as follows:
[0005] A heat dissipation structure for a computing node includes a first heat conductor, a first PCB, a second PCB, a second heat conductor, and a third heat conductor. The first PCB is mounted on the first heat conductor and has heat conduction positions. The second PCB has a heat source and is mounted on the first PCB. The second heat conductor is attached to the heat source. The third heat conductor is embedded in the heat conduction positions and contacts both the first heat conductor and the second PCB. The contact point between the third heat conductor and the second PCB is directly below the heat source.
[0006] Preferably, the heat-conducting position includes a slot, and the third heat conductor includes a piece of thermally conductive adhesive, which is embedded in the slot and contacts the first heat conductor and the second PCB respectively.
[0007] Preferably, the heat-conducting position includes multiple heat-excess holes, and the third heat conductor includes two pieces of thermally conductive adhesive and a thermally conductive liquid. The thermally conductive liquid fills each heat-excess hole, and one of the thermally conductive adhesives contacts the first end of each heat-excess hole and the second PCB, and the other thermally conductive adhesive contacts the second end of each heat-excess hole and the first heat conductor.
[0008] Preferably, the third heat conductor further includes two heat-conducting sheets, which are attached to the ends of each heat-excess hole and between the heat-conducting adhesive.
[0009] Preferably, the heat-conducting sheet comprises copper foil.
[0010] Preferably, the walls of the superheated holes are made of copper.
[0011] Preferably, the first heat conductor includes a tray with thermally conductive properties.
[0012] Preferably, the second heat conductor includes a heat sink with multiple fins.
[0013] Preferably, the heat dissipation structure of the computing node further includes a cooling fan, which is mounted on the heat sink.
[0014] The technical solution adopted by this utility model in the second aspect is as follows:
[0015] A SoC array server includes hot-swappable compute nodes, management nodes, network switching nodes, heat dissipation modules, and power modules. Multiple compute nodes are configured, and each compute node is equipped with at least six SoC modules. The server also includes a BMC management module and multiple optical ports for signal transmission. The BMC management module supports web-based visual management. The SoC array server also includes a heat dissipation structure for the compute nodes as described in any of the above solutions.
[0016] Compared with the prior art, the utility model has the following beneficial technical effects: by opening a heat-conducting position on the first PCB and embedding a third heat-conducting body in the heat-conducting position, and contacting the first heat-conducting body and the second PCB respectively, wherein the contact point between the third heat-conducting body and the second PCB is directly below the heat source, and the second heat-conducting body is directly attached to the heat source, thereby realizing bidirectional heat dissipation of the heat source (chip) placed in the multilayer PCB stacked structure, effectively controlling the local temperature rise of high-density computing nodes, and improving the stability and lifespan of the equipment. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present utility model;
[0018] Figure 2 This is a structural schematic diagram of Embodiment 2 of the present invention.
[0019] Icon labels:
[0020] 100 First heat conductor, 200 First PCB, 201 Heat conduction position, 300 Second PCB, 301 Heat source, 400 Second heat conductor, 500 Third heat conductor. Detailed Implementation
[0021] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments of the present invention can be combined with each other.
[0022] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or assembly referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more features. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a link, or a specific connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the connection within two groups. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0024] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0025] like Figures 1-2 As shown, the present invention proposes a heat dissipation structure for a computing node in its first aspect, comprising a first heat conductor 100, a first PCB 200, a second PCB 300, a second heat conductor 400, and a third heat conductor 500. The first PCB 200 is mounted on the first heat conductor 100 and has a heat conduction position 201. The second PCB 300 is provided with a heat source 301 and is mounted on the first PCB 200. The second heat conductor 400 is attached to the heat source 301. The third heat conductor 500 is embedded in the heat conduction position 201 and is in contact with both the first heat conductor 100 and the second PCB 300. The contact point between the third heat conductor 500 and the second PCB 300 is directly below the heat source 301.
[0026] It should be noted that the first heat conductor 100, as the basic heat dissipation carrier, can be made of aluminum alloy or copper alloy with high thermal conductivity, and its bottom is designed with array-type heat dissipation fins to increase the contact area with air.
[0027] The second PCB 300 is stacked parallel above the first PCB 200. The two are separated by pillars with a spacing of 3-5mm to form an air convection layer. The bottom of the heat source 301 (such as CPU, GPU and other chips) is copper-plated in the contact area with the PCB to enhance local heat conduction.
[0028] The second heat conductor 400 can be a flexible graphite patch or a phase change thermal pad, with its thickness designed according to the height of the heat source 301. Its top surface can be selectively connected to the top heat dissipation module to form a vertical heat dissipation channel.
[0029] This structure achieves heat dissipation through a triple heat conduction path: first, the second heat conductor 400 directs heat to the top heat dissipation system; second, the third heat conductor 500 directly conducts core heat to the first heat conductor 100; and third, auxiliary heat dissipation is achieved through the PCB board itself and air convection. This composite heat dissipation design makes the heat source 301 more efficient than traditional structures, effectively controlling the temperature of the computing node under high load and ensuring stable operation of the device.
[0030] In one embodiment of this application, the heat-conducting position 201 includes a slot, and the third heat conductor 500 includes a piece of thermally conductive adhesive, which is embedded in the slot and contacts the first heat conductor 100 and the second PCB 300 respectively.
[0031] In Embodiment 1: The heat conduction position 201 of the first PCB 200 is a circular or square through hole structure, and the third heat conductor 500 is a columnar structure with a cross-sectional shape and diameter corresponding to the heat conduction position 201. Its top end is in contact with the area directly below the heat source 301 of the second PCB 300, and its bottom end is directly connected to the first heat conductor 100, thus constructing the shortest heat conduction path from the heat source to the basic heat sink.
[0032] In Embodiment 2: the heat conduction position 201 includes multiple heat-exceeding holes, the third heat conductor 500 includes two pieces of thermally conductive adhesive and a thermally conductive liquid, the thermally conductive liquid is filled in each heat-exceeding hole, one of the thermally conductive adhesives contacts the first end of each heat-exceeding hole and the second PCB 300 respectively, and the other thermally conductive adhesive contacts the second end of each heat-exceeding hole and the first heat conductor 100 respectively.
[0033] It should be noted that the multiple superheated holes of the heat conduction position 201 are arranged in a matrix. The arrangement parameters of hole diameter and hole spacing can be determined according to the actual application to form a dense array of heat conduction channels.
[0034] The heat transfer fluid of the third heat conductor 500 is made of nano-copper-based heat transfer oil, which has a thermal conductivity of 0.8-1.2W / (m・K). It has both fluidity and insulation properties and can fully fill the gaps inside the overheating holes. The heat transfer fluid can also be ink or resin.
[0035] Firstly, the thermally conductive adhesive covers the top openings of all the overheating holes, completely adhering to the heat source projection area of the second PCB300, eliminating contact gaps through micro-deformation; secondly, the thermally conductive adhesive seals the bottom of the overheating holes, tightly bonding with the surface of the first heat conductor 100. This structure forms a composite heat transfer path of "thermal conductive adhesive-thermal conductive liquid-thermal conductive adhesive," significantly improving the heat dissipation response speed by utilizing the synergistic effect of liquid convection and solid conduction.
[0036] In one embodiment of this application, the third heat conductor 500 further includes two heat-conducting sheets, which are attached to the ends of each heat-excess hole and between the heat-conducting adhesive, and the heat-conducting sheets include copper foil.
[0037] In one embodiment of this application, the wall of the overheating hole is made of copper, that is, copper plating. Of course, the hole wall can also be plated with metals with high thermal conductivity, such as gold plating or electrolytic silver plating. The thickness of the plated metal depends on the cost, thermal conductivity, size of the overheating hole, and user requirements.
[0038] In one embodiment of this application, the first heat conductor 100 includes a tray with thermal conductivity, which serves to support computing nodes and also as a heat-conducting material for the computing nodes.
[0039] In one embodiment of this application, the second heat conductor 400 includes a heat sink with multiple fins.
[0040] In one embodiment of this application, the heat dissipation structure of the computing node further includes a cooling fan, which is mounted on the heat sink.
[0041] It should be noted that, to avoid electrical continuity between the tray and the first PCB 200, the tray edge is designed with positioning bosses to form a precise fit with the first PCB 200. Therefore, a guide groove is left between the tray and the first PCB 200. The heat sink of the second heat conductor 400 is an aluminum extrusion structure, with the base and fins integrally molded. The fins are arranged vertically in a comb-like pattern. The base of the heat sink is connected to the second PCB 300 through a thermal pad. A threaded hole is machined in the center of the base for fixing the cooling fan, forming a forced convection system.
[0042] Silicone shock-absorbing pads can be installed between the cooling fan and the heatsink, and a floating connection can be achieved with screws, which not only achieves heat dissipation but also reduces operating noise. The fan exhaust outlet is directly opposite the inlet of the tray's airflow channel, forming a closed-loop airflow path of "heat absorption-conduction-heat dissipation": heat from the heat source is conducted to the fins via the second heat conductor 400, and the fan drives cool air to sweep horizontally across the fins to carry away the heat.
[0043] The tray serves the dual functions of structural support and basic heat dissipation, improving heat dissipation capacity compared to traditional single heat dissipation methods, and is particularly suitable for high-density deployment computing node environments.
[0044] In a second aspect, this invention provides a SoC array server, which includes a heat dissipation structure for a computing node as described in any of the above solutions.
[0045] It should be noted that the SoC array server uses blade servers, which have the following features:
[0046] 1. Adopting a modular design concept, computing nodes, management nodes, network switching nodes, heat dissipation modules, power supply modules, etc. all support hot-swappable online operation and maintenance;
[0047] 2. High computing density design: Each server is configured with 12 computing nodes, each computing node is configured with 6 or 7 SoC modules, and each node is configured with no less than 2x2.5Gb network; each SoC has no less than 16GB of memory, storage capacity of 64-256GB, and network bandwidth of no less than 1.0Gb.
[0048] 1. The server supports two 25Gb optical ports for overall network traffic access;
[0049] 2. The server supports web-based visual management; supports BMC management functions; and supports system firmware upgrade functions.
[0050] It should be noted that the above descriptions are one or more embodiments provided in conjunction with specific content, and do not imply that the specific implementation of this utility model is limited to these descriptions. Any methods or structures that are similar to or identical to those of this utility model, or any technical deductions or substitutions made based on the concept of this utility model, should be considered within the scope of protection of this utility model.
Claims
1. A heat dissipation structure for a computing node, characterized in that, include: First heat conductor (100); The first PCB (200) is mounted on the first heat conductor (100), and the first PCB (200) has a heat conduction position (201). The second PCB (300) is provided with a heat source (301), and the second PCB (300) is mounted on the first PCB (200); The second heat conductor (400) is attached to the heat source (301); The third heat conductor (500) is embedded in the heat-conducting position (201) and contacts the first heat conductor (100) and the second PCB (300) respectively. The contact point between the third heat conductor (500) and the second PCB (300) is directly below the heat source (301).
2. The heat dissipation structure for a computing node according to claim 1, characterized in that, The heat-conducting position (201) includes a slot, and the third heat conductor (500) includes a piece of thermally conductive adhesive. The thermally conductive adhesive is embedded in the slot and contacts the first heat conductor (100) and the second PCB (300) respectively.
3. The heat dissipation structure for a computing node according to claim 1, characterized in that, The heat-conducting position (201) includes multiple heat-exceeding holes, and the third heat conductor (500) includes two pieces of thermally conductive adhesive and a thermally conductive liquid. The thermally conductive liquid fills each of the heat-exceeding holes. One of the thermally conductive adhesives contacts the first end of each heat-exceeding hole and the second PCB (300), and the other thermally conductive adhesive contacts the second end of each heat-exceeding hole and the first heat conductor (100).
4. The heat dissipation structure for a computing node according to claim 3, characterized in that, The third heat conductor (500) further includes two heat-conducting sheets, which are attached to the ends of each of the overheating holes and between the heat-conducting adhesive.
5. The heat dissipation structure for a computing node according to claim 4, characterized in that, The heat-conducting sheet includes copper foil.
6. The heat dissipation structure for a computing node according to claim 3, characterized in that, The walls of the overheating holes are made of copper.
7. The heat dissipation structure for a computing node according to claim 1, characterized in that, The first heat conductor (100) includes a tray with thermal conductivity.
8. The heat dissipation structure for a computing node according to claim 1, characterized in that, The second heat conductor (400) includes a heat sink with multiple fins.
9. The heat dissipation structure for a computing node according to claim 8, characterized in that, It also includes a cooling fan, which is mounted on the heat sink.
10. A SoC array server, comprising hot-swappable compute nodes, management nodes, network switching nodes, heat dissipation modules, and power modules, wherein multiple compute nodes are configured, and each compute node is equipped with at least six SoC modules; the server further comprises a BMC management module and multiple optical ports for signal transmission; the BMC management module supports Web-based visual management, characterized in that... The SoC array server also includes a heat dissipation structure for a computing node as described in any one of claims 1-9.