A conductive copper foil structure

Abstract

The utility model discloses a conductive copper foil structure, include: copper foil main part, bonding assembly and heat dissipation subassembly, bonding assembly sets up at the bottom of copper foil main part, and bonding assembly includes the adhesive member of setting at the bottom of copper foil main part, heat dissipation subassembly sets up at the top of copper foil main part, and heat dissipation subassembly is used for the surface heat dissipation of copper foil main part, and heat dissipation subassembly includes the heat conduction part of setting at the top of copper foil main part, and the top of heat conduction part is provided with the protection part for protecting heat conduction part, and the connecting place of heat conduction part and copper foil main part is provided with the reinforcing part for increasing the contact area of copper foil main part and heat conduction part. The utility model discloses the top of copper foil main part is provided with heat dissipation subassembly, and the heat conduction part in heat dissipation subassembly carries out the heat dissipation to copper foil main part, and the connecting place of heat conduction part and copper foil main part is provided with the reinforcing part, and compared with the plane contact of heat conduction part and copper foil main part, this design utilizes the reinforcing part and converts plane contact into curved surface contact to increase the heat conduction area of copper foil main part and heat conduction part.

Description

Technical Field

[0001] This utility model relates to the field of conductive copper foil, and in particular to a conductive copper foil structure. Background Technology

[0002] In fields such as electronic and electrical equipment, new energy batteries and high-power devices, conductive copper foil is a key conductor material, and its heat dissipation performance directly affects the operational stability and service life of the equipment.

[0003] However, traditional conductive copper foils mostly adopt a single planar structure, and their heat-conducting components and the copper foil body are in planar contact. Their effective heat-conducting area is limited by the adhesion between the two, and the limited heat-conducting area affects the heat conduction between the copper foil body and the heat-conducting components.

[0004] Therefore, how to increase the heat conduction area of ​​the heat-conducting components and copper foil through structural design has become an urgent technical problem to be solved. Utility Model Content

[0005] The purpose of this invention is to provide a conductive copper foil structure to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a conductive copper foil structure.

[0007] A conductive copper foil structure, comprising:

[0008] A copper foil body, wherein the copper foil body is used to carry current transmission;

[0009] An adhesive assembly is disposed at the bottom of a copper foil body and is used for bonding and fixing the copper foil body. The adhesive assembly includes adhesive attachments disposed at the bottom of the copper foil body.

[0010] A heat dissipation assembly is disposed on the top of a copper foil body. The heat dissipation assembly is used for heat dissipation from the surface of the copper foil body. The heat dissipation assembly includes a heat-conducting component disposed on the top of the copper foil body. A protective component is disposed on the top of the heat-conducting component to protect the heat-conducting component. A reinforcing component is disposed at the connection between the heat-conducting component and the copper foil body to increase the contact area between the copper foil body and the heat-conducting component.

[0011] Preferably, the thermally conductive component includes a thermally conductive coating disposed on the top of the copper foil body, and the thermally conductive coating is used for heat dissipation from the surface of the copper foil body.

[0012] Preferably, the reinforcing member includes rough ridges, and a plurality of rough ridges are disposed on the top of the copper foil body. The rough ridges are used to increase the thermal conductivity area at the connection between the copper foil body and the thermally conductive coating.

[0013] Preferably, the protective element includes:

[0014] An isolation covering film is disposed on top of a thermally conductive coating and is used to temporarily protect the copper foil body from contamination during processing;

[0015] The outer edges, a plurality of said outer edges are disposed on the side of the isolation covering film, said outer edges are used to prevent the isolation covering film from being torn off.

[0016] Preferably, the adhesive attachment includes:

[0017] A conductive adhesive layer is disposed on the bottom of the copper foil body, and the conductive adhesive layer is used for bonding and fixing the copper foil body;

[0018] A release material layer is disposed at the bottom of the conductive adhesive layer, and the release material layer is used for isolation and protection of the conductive adhesive layer;

[0019] A tear strip is disposed on the side of the release material layer and is used to assist in lifting the release material layer.

[0020] Preferably, the bottom of the copper foil body is provided with a plurality of attachment protrusions, which are used to increase the surface roughness of the copper foil body.

[0021] The technical effects and advantages of this utility model are as follows:

[0022] This utility model provides a heat dissipation component on the top of the copper foil body. The heat dissipation component in the heat dissipates heat to the copper foil body. A reinforcing component is provided at the connection between the heat dissipation component and the copper foil body. Compared with the planar contact between the heat dissipation component and the copper foil body, this design uses the reinforcing component to transform the planar contact into a curved contact, thereby increasing the heat conduction area between the copper foil body and the heat dissipation component. Attached Figure Description

[0023] Figure 1 This is a cross-sectional view of the entire utility model.

[0024] Figure 2 This is a schematic diagram of the structure of the copper foil body of this utility model.

[0025] In the figure: 1. Copper foil body; 101. Attachment protrusion; 102. Rough ridge; 2. Conductive adhesive layer; 3. Release material layer; 301. Tear strip; 4. Thermally conductive coating; 5. Isolation cover film; 501. Outer edge. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] This utility model provides, for example Figure 1-2 The conductive copper foil structure shown includes: a copper foil body 1, an adhesive assembly, and a heat dissipation assembly;

[0028] It should be noted that the copper foil body 1 is used to carry current transmission, the adhesive component is set at the bottom of the copper foil body 1, the adhesive component is used to bond and fix the copper foil body 1, the adhesive component includes an adhesive attachment set at the bottom of the copper foil body 1, and the heat dissipation component is set at the top of the copper foil body 1, the heat dissipation component is used to dissipate heat from the surface of the copper foil body 1.

[0029] Specifically, the heat dissipation component includes a heat-conducting component disposed on the top of the copper foil body 1, a protective component for protecting the heat-conducting component is disposed on the top of the heat-conducting component, and a reinforcing component for increasing the contact area between the copper foil body 1 and the heat-conducting component is disposed at the connection between the heat-conducting component and the copper foil body 1.

[0030] It should be noted that the heat-conducting component includes a heat-conducting coating 4, which is disposed on the top of the copper foil body 1 and is used for heat dissipation on the surface of the copper foil body 1.

[0031] Specifically, the thermally conductive coating 4 is a graphene coating, which is directly grown on the surface of the copper foil body 1 by magnetron sputtering or chemical vapor deposition (CVD) to form atomic-level bonding, thereby conducting heat.

[0032] It should be noted that the reinforcing member includes a rough ridge 102. Multiple rough ridges 102 are disposed on the top of the copper foil body 1. The rough ridges 102 are used to increase the heat conduction area at the connection between the copper foil body 1 and the thermally conductive coating 4.

[0033] Specifically, the rough ridge 102 is made of the same material as the copper foil body 1 and is integrally die-cast and fixed with the copper foil body 1. The rough ridge 102 is an arc-shaped ridge, which increases the heat transfer area between the copper foil body 1 and the heat-conducting coating 4.

[0034] It should be noted that the protective components include: the isolation covering film 5 and the outer extension edge 501;

[0035] Specifically, the isolation cover film 5 is disposed on top of the thermally conductive coating 4. The isolation cover film 5 is used to temporarily protect the copper foil body 1 from contamination during processing. Multiple outer edges 501 are disposed on the sides of the isolation cover film 5.

[0036] It should be noted that the isolation cover film 5 is a PET (polyester) cover film, which is bonded by pressure-sensitive adhesive (PSA) applied to the surface. It is not easy to leave adhesive residue when peeling, making it suitable for short-term protection needs. The outer edge 501 is used for tearing off the isolation cover film 5.

[0037] Specifically, the adhesive attachments include: conductive adhesive layer 2, release material layer 3, and tear strip 301;

[0038] It should be noted that the conductive adhesive layer 2 is disposed at the bottom of the copper foil body 1, and the conductive adhesive layer 2 is used for bonding and fixing the copper foil body 1; the release material layer 3 is disposed at the bottom of the conductive adhesive layer 2, and the release material layer 3 is used for isolating and protecting the conductive adhesive layer 2; the tear strip 301 is disposed on the side of the release material layer 3, and the tear strip 301 is used to assist in lifting the release material layer 3.

[0039] Specifically, the conductive coating layer 2 is an acrylic conductive adhesive, and the bottom of the copper foil body 1 is provided with multiple attachment protrusions 101;

[0040] It should be noted that the attachment protrusion 101 is a hemispherical protrusion, and the attachment protrusion 101 is used to increase the surface roughness of the copper foil body 1.

[0041] In practical use, this utility model provides a heat dissipation component on the top of the copper foil body 1. The heat conduction component in the heat dissipates heat to the copper foil body 1. A reinforcing component is provided at the connection between the heat conduction component and the copper foil body 1. Compared with the planar contact between the heat conduction component and the copper foil body 1, this design uses the reinforcing component to transform the planar contact into a curved contact, thereby increasing the heat conduction area between the copper foil body 1 and the heat conduction component.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A conductive copper foil structure, characterized in that, include: A copper foil body (1) is used to carry out current transmission; An adhesive assembly is disposed at the bottom of the copper foil body (1) and is used for bonding and fixing the copper foil body (1). The adhesive assembly includes an adhesive attachment disposed at the bottom of the copper foil body (1). A heat dissipation assembly is disposed on the top of the copper foil body (1). The heat dissipation assembly is used for heat dissipation on the surface of the copper foil body (1). The heat dissipation assembly includes a heat-conducting component disposed on the top of the copper foil body (1). A protective component is disposed on the top of the heat-conducting component to protect the heat-conducting component. A reinforcing component is disposed at the connection between the heat-conducting component and the copper foil body (1) to increase the contact area between the copper foil body (1) and the heat-conducting component.

2. The conductive copper foil structure according to claim 1, characterized in that, The heat-conducting component includes a heat-conducting coating (4), which is disposed on the top of the copper foil body (1) and is used for heat dissipation on the surface of the copper foil body (1).

3. The conductive copper foil structure according to claim 1, characterized in that, The reinforcing member includes a rough ridge (102), and a plurality of the rough ridges (102) are disposed on the top of the copper foil body (1). The rough ridges (102) are used to increase the thermal conductivity area at the connection between the copper foil body (1) and the thermally conductive coating (4).

4. The conductive copper foil structure according to claim 1, characterized in that, The protective component includes: An isolation covering film (5) is disposed on top of the thermally conductive coating (4) and is used to temporarily protect the copper foil body (1) from contamination during processing. Extended edges (501), a plurality of said extended edges (501) are disposed on the side of the isolation covering film (5), said extended edges (501) are used to isolate the tearing and detachment of the isolation covering film (5).

5. The conductive copper foil structure according to claim 1, characterized in that, The adhesive attachments include: A conductive adhesive layer (2) is disposed at the bottom of the copper foil body (1) and is used for bonding and fixing the copper foil body (1). Release material layer (3), the release material layer (3) is disposed at the bottom of the conductive adhesive layer (2), the release material layer (3) is used for isolation and protection of the conductive adhesive layer (2); A tear strip (301) is provided on the side of the release material layer (3) and is used to assist in lifting the release material layer (3).

6. The conductive copper foil structure according to claim 1, characterized in that, The bottom of the copper foil body (1) is provided with a plurality of attachment protrusions (101), which are used to increase the surface roughness of the copper foil body (1).

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