A high-resolution image acquisition device for wafer inspection
By incorporating an electric telescopic rod and a heat dissipation grille, the design solves the problems of inaccurate positioning, cumbersome adjustment, and easy damage in existing high-resolution image acquisition devices during wafer inspection, achieving efficient and stable image acquisition and convenient maintenance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU ASEN SEMICON CO LTD
- Filing Date
- 2025-08-12
- Publication Date
- 2026-07-10
AI Technical Summary
Existing high-resolution image acquisition devices suffer from problems such as inaccurate positioning, cumbersome adjustment, easy damage, and high maintenance costs in wafer inspection.
The device employs an electric telescopic rod to drive the moving block in conjunction with the positioning protrusion, enabling precise positioning and automated installation of the image acquisition unit. Combined with the design of a heat dissipation grille and inspection plate, it improves the stability and ease of maintenance of the device.
It enables rapid and accurate positioning of the image acquisition device, improves detection efficiency, reduces maintenance time and costs, and ensures stable operation of the device for a long time.
Smart Images

Figure CN224481756U_ABST