High-temperature-resistant ceramic circuit board

Abstract

The utility model discloses a kind of high-temperature-resistant ceramic circuit board, it relates to ceramic circuit board technical field, including bottom plate, the upper end of the bottom plate is penetrated and is provided with two symmetrical distribution first through-hole, the upper end of bottom plate is covered with copper thick layer by magnetron sputtering, the upper end of copper thick layer and the corresponding position of first through-hole is penetrated and is provided with second through-hole, the upper end of bottom plate is closely combined with polyimide glue layer, the utility model is formed high-density high-temperature-resistant circuit board by three-layer composite structure and metal sputtering process, more electronic components and more complex circuit layout can be contained in limited space content, meet the development demand of electronic equipment miniaturization, integration, the stability of ceramic material and polyimide glue used by circuit board is good, when meeting sudden high temperature, high pressure and the like, circuit board can effectively prevent explosion, improve the security of electronic equipment.

Description

Technical Field

[0001] This utility model relates to the field of ceramic circuit board technology, specifically to a high-temperature resistant ceramic circuit board. Background Technology

[0002] Circuit boards play an indispensable role in electronic devices, undertaking the important tasks of supporting electronic components and realizing electrical connections.

[0003] Traditional circuit boards mostly use organic materials as the substrate. Due to the inherent characteristics of organic materials, their high-temperature resistance is poor. Under high-temperature environments, they are prone to deformation, scorching, or even melting. This not only damages the physical structure of the circuit board but also leads to unstable electrical performance, affecting the normal operation of electronic equipment and even causing safety accidents. At the same time, traditional circuit boards have relatively low hardness, making them prone to cracking and breakage when subjected to external impacts or vibrations, reducing the service life and reliability of the circuit board. Therefore, a high-temperature resistant ceramic circuit board is proposed to solve the problems mentioned above. Utility Model Content

[0004] To address the aforementioned technical problems, a high-temperature resistant ceramic circuit board is provided. This technical solution solves the problem mentioned in the background art that traditional circuit boards mostly use organic materials as substrates. Due to the inherent characteristics of organic materials, their high-temperature resistance is poor, and they are prone to deformation, scorching, or even melting in high-temperature environments. This not only damages the physical structure of the circuit board but also leads to unstable electrical performance, affecting the normal operation of electronic equipment and even causing safety accidents. At the same time, traditional circuit boards have relatively low hardness, and are prone to cracking and breakage when subjected to external impacts or vibrations, reducing the service life and reliability of the circuit board.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A high-temperature resistant ceramic circuit board includes a base plate. Two symmetrically distributed first through holes are formed at the upper end of the base plate. A thick copper layer is coated on the upper end of the base plate by magnetron sputtering. A second through hole is formed at the upper end of the copper layer corresponding to the first through holes. A polyimide adhesive layer is tightly bonded to the upper end of the base plate. A groove with the same size as the copper layer is formed at the lower end of the polyimide adhesive layer, into which the copper layer is inserted. A third through hole is formed at the center of the upper end of the polyimide adhesive layer. A fourth through hole is formed at the upper end of the polyimide adhesive layer corresponding to the second through hole. A cover plate is fastened to the upper end of the polyimide adhesive layer. A fifth through hole is formed at the center of the upper end of the cover plate. A sixth through hole is formed at the upper end of the cover plate corresponding to the fourth through hole.

[0007] Preferably, both the base plate and the cover plate are alumina ceramic sheets.

[0008] Preferably, the first through hole and the second through hole have the same size.

[0009] Preferably, the third through hole and the fifth through hole have the same size.

[0010] Preferably, the fourth through hole and the sixth through hole have the same size, and the diameter of the fourth through hole is larger than the diameter of the second through hole.

[0011] The advantages of this utility model compared with the prior art are:

[0012] This solution proposes a high-temperature resistant ceramic circuit board. Both the ceramic substrate and the polyimide adhesive layer possess excellent high-temperature resistance, reducing the risk of deformation or burn-out under high-temperature conditions and ensuring the reliability of electronic devices. The ceramic-based circuit board exhibits high hardness, effectively resisting external impacts and vibrations, reducing the probability of failure due to physical damage and extending its lifespan. Furthermore, the three-layer composite structure combined with metal sputtering technology creates a high-density, high-temperature resistant circuit board, enabling the inclusion of more electronic components and more complex circuit layouts within a limited space, meeting the miniaturization and integration needs of electronic devices. The ceramic materials and polyimide adhesive used in the circuit board possess excellent stability, effectively preventing explosions under sudden high temperatures and pressures, thus improving the safety of electronic devices. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 This is a cross-sectional view of the present invention;

[0015] Figure 3 This is a schematic diagram showing the connection between the copper thick layer and the base plate in this utility model;

[0016] Figure 4 This is a schematic diagram of the copper thick layer structure in this utility model;

[0017] Figure 5 This is a schematic diagram of the structure of the polyimide adhesive layer in this utility model;

[0018] Figure 6 This is a schematic diagram of the cover plate in this utility model;

[0019] Figure 7 This is a schematic diagram of the structure of the bottom plate in this utility model;

[0020] Figure 8 This is a schematic diagram showing the connection between the copper thick layer and the polyimide adhesive layer in this utility model.

[0021] The numbers on the map are:

[0022] 1. Base plate; 101. First through hole; 2. Copper thick layer; 201. Second through hole; 3. Polyimide adhesive layer; 301. Groove; 302. Third through hole; 303. Fourth through hole; 4. Cover plate; 401. Fifth through hole; 402. Sixth through hole. Detailed Implementation

[0023] The following description is intended to disclose the present invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0024] Reference Figures 1-8 As shown, a high-temperature resistant ceramic circuit board includes a base plate 1. Two symmetrically distributed first through holes 101 are formed through the upper end of the base plate 1. A copper thick layer 2 is deposited on the upper end of the base plate 1 by magnetron sputtering. A second through hole 201 is formed through the upper end of the copper thick layer 2 at a position corresponding to the first through holes 101. A polyimide adhesive layer 3 is tightly bonded to the upper end of the base plate 1. A groove 301 with the same size as the copper thick layer 2 is formed at the lower end of the polyimide adhesive layer 3. Layer 2 is inserted into the interior of groove 301. A third through hole 302 is provided through the center of the upper end of polyimide layer 3. A fourth through hole 303 is provided through the upper end of polyimide layer 3 at the corresponding position of the second through hole 201. A cover plate 4 is fastened to the upper end of polyimide layer 3. A fifth through hole 401 is provided through the center of the upper end of cover plate 4. A sixth through hole 402 is provided through the upper end of cover plate 4 at the corresponding position of the fourth through hole 303.

[0025] Furthermore, both the base plate 1 and the cover plate 4 are made of alumina ceramic sheets. The base plate 1 serves as a high-temperature resistant substrate, utilizing the high melting point and low thermal expansion characteristics of alumina ceramics to provide stable mechanical support and insulation performance, ensuring that the circuit board structure does not warp or deform under high temperatures, and providing a reliable foundation for the upper conductive structure.

[0026] Furthermore, the high-purity copper thick layer 2 formed by metal sputtering is tightly bonded to the ceramic substrate 1 to achieve a low-resistance conductive path. The upper end of the copper thick layer 2 is engraved with circuits through etching. The etching process can form fine conductive paths to support high-density circuit layout and meet the requirements of high-integration circuit design.

[0027] Furthermore, the first through hole 101 and the second through hole 201 have the same size and are coaxial. The first through hole 101 is used to install conductive pillars or component pins, and the inner wall of the second through hole 201 is plated with copper to form a conductive channel, thereby achieving a low-resistance connection between the base plate 1 and the copper thick layer 2 and ensuring reliable conductivity in the vertical direction.

[0028] Furthermore, the third through-hole 302 and the fifth through-hole 401 have the same dimensions, and the fourth through-hole 303 and the sixth through-hole 402 have the same dimensions. The diameter of the fourth through-hole 303 is larger than the diameter of the second through-hole 201, forming a stepped structure. The fourth through-hole 303 and the sixth through-hole 402 provide ample space for solder, increasing the interlayer soldering contact area, improving mechanical connection strength and electrical reliability, and adapting to long-term vibration and temperature cycling environments. The third through-hole 302 and the fifth through-hole 401 provide mounting channels for the pins of large devices, ensuring stable mounting and long-term reliable connection of devices such as central processing units.

[0029] Furthermore, the polyimide adhesive layer 3 serves as an intermediate bonding layer, possessing both high heat resistance and bonding strength. After the base plate 1, polyimide adhesive layer 3, and cover plate 4 are assembled, they are pressed together using a hot press. Under high temperature and pressure, the polyimide adhesive layer 3 melts and adheres to the base plate 1 and cover plate 4, using its adhesiveness to firmly bond the base plate 1 and cover plate 4 together.

[0030] Furthermore, the groove 301 forms an embedded engagement with the edge of the copper thick layer 2, increasing the interlayer contact area, improving peel resistance, effectively resisting interlayer separation caused by high temperature and mechanical stress, and ensuring the long-term stability of the composite structure.

[0031] Working principle: The horizontal conductive path utilizes the low resistivity of the high-purity copper thick layer 2 and the fine etching process to ensure efficient signal and power transmission. The first through hole 101 and the second through hole 201 are interconnected with low resistance through coaxial design and copper plating on the inner wall of the second through hole 201. The base plate 1 and cover plate 4 made of alumina ceramic sheet can quickly dissipate the heat generated by the circuit board due to their high thermal conductivity. The insulating properties of the polyimide adhesive layer 3, combined with the non-combustible nature of the ceramic base plate 1 and cover plate 4, form an efficient heat dissipation and explosion-proof barrier. The polyimide adhesive layer 3 carbonizes at high temperature to form an insulating layer, blocking the transfer of heat and oxygen. The ceramic base plate 1 and cover plate 4, as non-combustible materials, prevent the spread of flames. The structure formed by the superposition of the three can resist thermal stress and mechanical stress at high temperature, ensuring the structural stability for long-term use.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-temperature resistant ceramic circuit board, characterized in that, The system includes a base plate (1), with two symmetrically distributed first through holes (101) extending through the upper end of the base plate (1). A copper thick layer (2) is coated on the upper end of the base plate (1) by magnetron sputtering. A second through hole (201) is provided at the corresponding position of the upper end of the copper thick layer (2) and the first through holes (101). A polyimide adhesive layer (3) is tightly bonded to the upper end of the base plate (1). A groove (301) with the same size as the copper thick layer (2) is provided at the lower end of the polyimide adhesive layer (3). The copper thick layer (2) is inserted into... Inside the groove (301), a third through hole (302) is provided through the center of the upper end of the polyimide adhesive layer (3), a fourth through hole (303) is provided through the upper end of the polyimide adhesive layer (3) at the corresponding position of the second through hole (201), a cover plate (4) is fastened to the upper end of the polyimide adhesive layer (3), a fifth through hole (401) is provided through the center of the upper end of the cover plate (4), and a sixth through hole (402) is provided through the upper end of the cover plate (4) at the corresponding position of the fourth through hole (303).

2. The high-temperature resistant ceramic circuit board according to claim 1, characterized in that: Both the base plate (1) and the cover plate (4) are alumina ceramic sheets.

3. The high-temperature resistant ceramic circuit board according to claim 1, characterized in that: The first through hole (101) and the second through hole (201) have the same size.

4. The high-temperature resistant ceramic circuit board according to claim 1, characterized in that: The third through hole (302) has the same size as the fifth through hole (401).

5. A high-temperature resistant ceramic circuit board according to claim 1, characterized in that: The fourth through hole (303) has the same size as the sixth through hole (402), and the diameter of the fourth through hole (303) is larger than the diameter of the second through hole (201).

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