Connecting structure of soft board and hard board and battery protection board

Abstract

The utility model provides a kind of connecting structure of soft board and hard board and battery protection board, it is related to circuit board technical field, by being arranged on the top surface portion recess of printed circuit board and being formed on step surface, the portion of first flexible circuit board and printed circuit board overlap is placed on step surface, effectively reduce the occupation of overall space, and by first bonding line, printed circuit board and flexible circuit board are connected, reduce connection space, improve the space use rate of printed circuit board, shorten flexible circuit board length, alleviate the technical problem that the connection between battery protection board and flexible printed circuit board in prior art is through tin paste welding, make land size larger, the space of battery protection board is larger.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a connection structure between a flexible board and a rigid board, and a battery protection board. Background Technology

[0002] With the increasing trend of miniaturization and integration in electronic products, the design and manufacturing process of battery protection boards (PCBs) are constantly being optimized as one of the key components. In existing technologies, the connection between the battery protection board PCB and the flexible printed circuit board (FPC) is typically achieved through solder paste bonding. This connection method requires relatively large pads to ensure sufficient contact between the solder joints, thereby guaranteeing adequate pull-out force and alignment accuracy.

[0003] However, larger pad sizes inevitably increase the overall space occupied by the PCB and reduce the efficiency of PCB space utilization, which is a significant drawback for products that pursue compact design. Utility Model Content

[0004] The purpose of this utility model is to provide a connection structure between a flexible board and a rigid board, as well as a battery protection board, to alleviate the technical problem in the prior art where the connection between the battery protection board and the flexible printed circuit board is soldered with solder paste, resulting in large solder pad sizes and a large space for the battery protection board.

[0005] In a first aspect, the connection structure between the flexible board and the rigid board provided by this utility model includes: a printed circuit board, a first flexible circuit board, and a first bonding line;

[0006] The printed circuit board is provided with a first soldering part;

[0007] The first flexible circuit board is provided with a second welding part;

[0008] The top surface of the printed circuit board is recessed near the side end to form a stepped surface. The first flexible circuit board is disposed on the stepped surface, and the two ends of the first bonding line are respectively connected to the first soldering part and the second soldering part.

[0009] In an optional embodiment, the first soldering portion is disposed on the top surface of the printed circuit board, or the first soldering portion is disposed on the stepped surface.

[0010] In an optional embodiment, multiple first welding portions and multiple second welding portions are provided, and the multiple first welding portions and multiple second welding portions are connected one-to-one through the first bonding line.

[0011] In an optional embodiment, a third welding part is provided on the stepped surface, a fourth welding part is provided on the first flexible circuit board, and a first slot is provided on the first flexible circuit board.

[0012] The connection structure between the flexible board and the rigid board also includes a second bonding line;

[0013] The third welding part is embedded in the first slot, and the two ends of the second bonding line are respectively connected to the third welding part and the fourth welding part.

[0014] In an optional embodiment, the connection structure between the flexible board and the rigid board further includes a second flexible circuit board;

[0015] The second flexible circuit board is connected to the top surface of the printed circuit board;

[0016] The top surface of the printed circuit board is provided with a fifth welding part, the second flexible circuit board is provided with a sixth welding part, and the second flexible circuit board is provided with a second slot.

[0017] The connection structure between the flexible board and the rigid board also includes a third bonding line;

[0018] The fifth welding part is embedded in the second slot, and the two ends of the third bonding line are respectively connected to the fifth welding part and the sixth welding part.

[0019] In an optional embodiment, the first flexible circuit board is divided into a connection area and a bending area, and the bending area can be bent relative to the connection area. The connection area is provided with a second welding part, a third welding part and a first slot.

[0020] A connector is provided in the bending area.

[0021] In an optional implementation, the first flexible circuit board is provided with multiple components;

[0022] The connection areas of multiple first flexible circuit boards are stacked.

[0023] One or more of the first flexible circuit boards are stacked together to form a set of flexible circuit board units;

[0024] There is a gap between the bending areas of any two adjacent sets of the flexible circuit board units.

[0025] In an optional embodiment, the connection structure between the flexible board and the rigid board further includes a molding structure;

[0026] The encapsulation structure is connected to the printed circuit board and the first flexible circuit board respectively, and the encapsulation structure is used to encapsulate the printed circuit board and the first flexible circuit board.

[0027] In an optional embodiment, the first flexible circuit board is bonded to the stepped surface.

[0028] Secondly, the battery protection board provided by this utility model includes the connection structure of the flexible board and the rigid board.

[0029] The connection structure between the flexible and rigid circuit boards provided by this utility model places the first flexible circuit board on the stepped surface formed by the recess in the top part of the printed circuit board, so that the overlapping part of the first flexible circuit board and the printed circuit board is placed on the stepped surface, which effectively reduces the overall space occupation. Furthermore, the printed circuit board and the flexible circuit board are connected by the first bonding line, which reduces the connection space, improves the space utilization of the printed circuit board, shortens the length of the flexible circuit board, and alleviates the technical problem in the prior art that the connection between the battery protection board and the flexible printed circuit board is soldered with solder paste, resulting in a large solder pad size and a large space for the battery protection board. Attached Figure Description

[0030] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0031] Figure 1 A schematic diagram of the overall structure of the connection structure between the flexible board and the rigid board provided in an embodiment of this utility model;

[0032] Figure 2 A schematic diagram of the printed circuit board structure in the connection structure between the flexible board and the rigid board provided in the embodiment of this utility model;

[0033] Figure 3 A schematic diagram of the structure of the first flexible circuit board in the connection structure between the flexible board and the rigid board provided in the embodiment of this utility model;

[0034] Figure 4 A schematic diagram of the printed circuit board in the connection structure between the flexible board and the rigid board provided in the embodiment of this utility model, viewed from the front.

[0035] Figure 5 A schematic diagram of the connection between the printed circuit board and the first flexible circuit board in the connection structure of the flexible board and rigid board provided in the embodiment of this utility model;

[0036] Figure 6 A schematic diagram showing the connection between the printed circuit board, the first flexible circuit board, and the second flexible circuit board in the connection structure of the flexible and rigid boards provided in the embodiment of this utility model.

[0037] Figure 7 A top view of the multilayer first flexible circuit board in the connection structure between the flexible board and the rigid board provided in the embodiment of this utility model;

[0038] Figure 8 This is a side view of the first multilayer flexible circuit board in the connection structure between the flexible board and the rigid board provided in the embodiment of this utility model.

[0039] Icons: 10 - First bonding line; 20 - Second bonding line; 30 - Third bonding line; 100 - Printed circuit board; 110 - First solder joint; 120 - Stepped surface; 130 - Third solder joint; 140 - Fifth solder joint; 150 - Nickel sheet; 200 - First flexible circuit board; 210 - Second solder joint; 220 - Fourth solder joint; 230 - First slot; 240 - Connection area; 250 - Bending area; 260 - Connector; 300 - Second flexible circuit board; 310 - Sixth solder joint. Detailed Implementation

[0040] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0041] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0042] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0044] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the connection structure between the flexible circuit board and the rigid circuit board provided in this embodiment includes: a printed circuit board 100, a first flexible circuit board 200, and a first bonding line 10; the printed circuit board 100 is provided with a first soldering part 110, which is specifically a signal pad on the printed circuit board 100, and the top layer of the printed circuit board 100 serves as a device carrier layer. The first soldering part 110 is located on the top layer or the stepped surface 120 of the printed circuit board 100. The first flexible circuit board 200 is provided with a second soldering part 210, which is specifically a signal pad on the first flexible circuit board 200, and the second soldering part 210 is located on the top layer of the first flexible circuit board 200.

[0045] The top surface of the printed circuit board 100 is recessed near the side end to form a stepped surface 120. The stepped surface 120 is lower in height than the top surface of the printed circuit board 100. The first flexible circuit board 200 is disposed on the stepped surface 120, thereby reducing the overall space occupied.

[0046] The connection structure between the flexible circuit board and the rigid circuit board provided in this embodiment, by placing the first flexible circuit board 200 on the stepped surface 120 formed by the recess in the top part of the printed circuit board 100, so that the overlapping part of the first flexible circuit board 200 and the printed circuit board 100 is placed on the stepped surface 120, effectively reduces the overall space occupation. Furthermore, by connecting the printed circuit board 100 and the flexible circuit board through the first bonding line 10, the connection space occupation is reduced, the space utilization rate of the printed circuit board 100 is improved, the length of the flexible circuit board is shortened, and the technical problem of the connection between the battery protection board and the flexible printed circuit board in the prior art, which is soldered with solder paste, resulting in a large solder pad size and a large space for the battery protection board, is alleviated.

[0047] Based on the above embodiments, in optional embodiments, the first welding part 110 in the connection structure between the flexible board and the rigid board provided in this embodiment is disposed on the top surface of the printed circuit board 100, or the first welding part 110 is disposed on the stepped surface 120.

[0048] Specifically, the first welding part 110 can be disposed on the top surface of the printed circuit board 100, or it can be disposed on the step surface 120. The specific position of the first welding part 110 is selected according to the thickness of the flexible printed circuit board. For example, when the thickness of the flexible printed circuit board located on the step surface 120 is high, the first welding part 110 is disposed on the top surface of the printed circuit board 100. When the thickness of the flexible printed circuit board located on the step surface 120 is low, the first welding part 110 is disposed on the step surface 120 of the printed circuit board 100, thereby effectively reducing the height difference between the first welding part 110 and the flexible printed circuit board.

[0049] In an optional embodiment, multiple first welding portions 110 and multiple second welding portions 210 are provided, and the multiple first welding portions 110 and multiple second welding portions 210 are connected one-to-one by a first bonding line 10.

[0050] Specifically, the number of the first welding part 110 and the second welding part 210 are set in a one-to-one correspondence, for example... Figure 1 As shown, there are four first welding parts 110 and four second welding parts 210. The four first welding parts 110 and the four second welding parts 210 are connected one-to-one by the first bonding line 10. The first welding parts 110 and the second welding parts 210 are connected by the first bonding line 10 to improve the connection stability and corrosion resistance and shock resistance.

[0051] In addition, a nickel sheet 150 is provided on the top layer of the printed circuit board 100. The nickel sheet 150 is used to improve the adhesion between the printed circuit board 100 and the soldering material, so as to ensure the stability and reliability of the soldering effect.

[0052] In an optional embodiment, a third welding portion 130 is provided on the stepped surface 120, specifically a current pad on the printed circuit board 100, and a fourth welding portion 220 is provided on the first flexible circuit board 200, specifically a current pad on the first flexible circuit board 200. A first slot 230 is provided on the first flexible circuit board 200. The connection structure between the flexible board and the rigid board also includes a second bonding line 20. When the printed circuit board 100 and the first flexible circuit board 200 are assembled, the third welding portion 130 is embedded in the first slot 230, and the two ends of the second bonding line 20 are respectively connected to the third welding portion 130 and the fourth welding portion 220. Connecting the third welding portion 130 and the fourth welding portion 220 through the second bonding line 20 can improve the connection stability.

[0053] In alternative implementations, such as Figure 6 As shown, the connection structure between the flexible circuit board and the rigid circuit board also includes a second flexible circuit board 300. Both the first flexible circuit board 200 and the second flexible circuit board 300 can be bent, rolled, or even folded. The second flexible circuit board 300 is connected to the top surface of the printed circuit board 100. The top surface of the printed circuit board 100 is provided with a fifth soldering part 140, which is specifically a current pad on the top surface of the printed circuit board 100 that is different from the third soldering part 130. The second flexible circuit board 300 is provided with a sixth soldering part 310, which is specifically a current pad on the second flexible circuit board 300. The second flexible circuit board 300 is provided with a second slot. The connection structure between the flexible circuit board and the rigid circuit board also includes a third bonding line 30. When the second flexible circuit board 300 and the printed circuit board 100 are assembled, the fifth soldering part 140 is embedded in the second slot, and the two ends of the third bonding line 30 are connected to the fifth soldering part 140 and the sixth soldering part 310 respectively, thereby forming a second current loop.

[0054] The connection between the first flexible circuit board 200 and the printed circuit board 100 forms a first current loop, and the connection between the second flexible circuit board 300 and the printed circuit board 100 forms a second current loop, thereby splitting the current into multiple paths to reduce internal resistance and heat generation.

[0055] In an optional embodiment, the first flexible circuit board 200 has a certain degree of flexibility and can be bent. The first flexible circuit board 200 is divided into a connection area 240 and a bending area 250, and the bending area 250 can be bent relative to the connection area 240. The connection area 240 is provided with a second welding part 210, a third welding part 130 and a first slot 230. A connector 260 is provided in the bending area 250 to facilitate the staggered connection of multiple connectors 260 when multiple first flexible circuit boards 200 are stacked in the future.

[0056] In an optional embodiment, a plurality of first flexible circuit boards 200 are provided; the connection areas 240 of the plurality of first flexible circuit boards 200 are stacked; one or more first flexible circuit boards 200 are stacked to form a set of flexible circuit board units; there is a gap between the bending areas 250 of any two adjacent sets of flexible circuit board units.

[0057] Specifically, such as Figure 8 As shown, taking a four-layer first flexible circuit board 200 as an example, referred to as the first layer, second layer, third layer and fourth layer respectively, the connection areas 240 of each layer are stacked. The first layer and the second layer form a flexible circuit board unit, and the third layer and the fourth layer form another flexible circuit board unit. The bending areas 250 of the first layer and the bending areas 250 of the second layer are connected by adhesive. The bending areas 250 of the third layer and the bending areas 250 of the fourth layer are connected by adhesive. The bending areas 250 of the second layer and the bending areas 250 of the third layer are not filled with adhesive. Therefore, there is a gap between the bending areas 250 of the second layer and the bending areas 250 of the third layer to avoid misalignment between the two flexible circuit boards during bending, which would cause the flexible circuit board to bulge or wrinkle.

[0058] It is important to note that, such as Figure 7 As shown, the connectors 260 on the multilayer first flexible circuit board 200 are staggered to improve the current carrying capacity of the flexible circuit board.

[0059] In an optional embodiment, the connection structure between the flexible board and the rigid board further includes a molding structure; the molding structure is connected to the printed circuit board 100 and the first flexible circuit board 200 respectively, and the printed circuit board 100 and the first flexible circuit board 200 are molded by the molding structure.

[0060] After the first flexible circuit board 200 and the printed circuit board 100 are connected by the first bonding line 10, they can be encapsulated by a molding structure. The molding structure can protect the connection structure of the first flexible circuit board 200 and the printed circuit board 100 and improve the reliability of their connection.

[0061] In an alternative embodiment, the first flexible circuit board 200 is bonded to the stepped surface 120.

[0062] Specifically, the first flexible circuit board 200 is fixed to the step surface 120 with adhesive. By using adhesive, the first flexible circuit board 200 can be completely cut into the step surface 120, thereby effectively reducing the overall space. Alternatively, the first flexible circuit board 200 can be fixed to the step surface 120 by welding.

[0063] The connection structure between the flexible board and the rigid board provided by this utility model has the following advantages:

[0064] (1) The printed circuit board 100 and the first flexible circuit board 200 are bonded together and then encapsulated to improve space utilization;

[0065] (2) The impedance is reduced by shunting the main circuit of multiple flexible circuit boards;

[0066] (3) The multilayer first flexible circuit board 200 and multiple connectors 260 increase the current carrying capacity.

[0067] The battery protection board provided in this embodiment includes a connection structure of flexible board and rigid board.

[0068] Since the technical effect of the battery protection board provided in this embodiment is the same as that of the connection structure of the flexible board and rigid board provided in the above embodiment, it will not be described again here.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A connection structure between a flexible board and a rigid board, characterized in that, include: Printed circuit board (100), first flexible circuit board (200) and first bonding line (10); The printed circuit board (100) is provided with a first soldering part (110). The first flexible circuit board (200) is provided with a second welding part (210); The top surface of the printed circuit board (100) near the side end is recessed to form a stepped surface (120). The first flexible circuit board (200) is disposed on the stepped surface (120). The two ends of the first bonding line (10) are respectively connected to the first welding part (110) and the second welding part (210).

2. The connection structure between the flexible board and the rigid board according to claim 1, characterized in that, The first soldering part (110) is disposed on the top surface of the printed circuit board (100), or the first soldering part (110) is disposed on the stepped surface (120).

3. The connection structure between the flexible board and the rigid board according to claim 2, characterized in that, Multiple first welding parts (110) and multiple second welding parts (210) are provided. Multiple first welding parts (110) and multiple second welding parts (210) are connected one-to-one through the first bonding line (10).

4. The connection structure between the flexible board and the rigid board according to claim 1, characterized in that, A third welding part (130) is provided on the stepped surface (120), a fourth welding part (220) is provided on the first flexible circuit board (200), and a first slot (230) is provided on the first flexible circuit board (200). The connection structure between the flexible board and the rigid board also includes a second bonding line (20). The third welding part (130) is embedded in the first slot (230), and the two ends of the second bonding line (20) are respectively connected to the third welding part (130) and the fourth welding part (220).

5. The connection structure between the flexible board and the rigid board according to claim 4, characterized in that, The connection structure between the flexible board and the rigid board also includes a second flexible circuit board (300). The second flexible circuit board (300) is connected to the top surface of the printed circuit board (100); The top surface of the printed circuit board (100) is provided with a fifth soldering part (140), the second flexible circuit board (300) is provided with a sixth soldering part (310), and the second flexible circuit board (300) is provided with a second slot. The connection structure between the flexible board and the rigid board also includes a third bonding line (30). The fifth welding part (140) is embedded in the second slot, and the two ends of the third bonding line (30) are connected to the fifth welding part (140) and the sixth welding part (310) respectively.

6. The connection structure between the flexible board and the rigid board according to claim 3, characterized in that, The first flexible circuit board (200) is divided into a connection area (240) and a bending area (250), and the bending area (250) can be bent relative to the connection area (240). The connection area (240) is provided with a second welding part (210), a third welding part (130) and a first slot (230). The bending area (250) is provided with a connector (260).

7. The connection structure between the flexible board and the rigid board according to claim 6, characterized in that, The first flexible circuit board (200) is provided with multiple components; The connection areas (240) of a plurality of the first flexible circuit boards (200) are stacked; One or more of the first flexible circuit boards (200) are stacked to form a set of flexible circuit board units; There is a gap between the bending areas of any two adjacent sets of the flexible circuit board units.

8. The connection structure between the flexible board and the rigid board according to claim 1, characterized in that, The connection structure between the flexible board and the rigid board also includes a molding structure; The encapsulation structure is connected to the printed circuit board (100) and the first flexible circuit board (200) respectively, and the encapsulation structure is used to encapsulate the printed circuit board (100) and the first flexible circuit board (200).

9. The connection structure between the flexible board and the rigid board according to claim 1, characterized in that, The first flexible circuit board (200) is bonded to the stepped surface (120).

10. A battery protection board, characterized in that, Includes the connection structure of flexible board and rigid board as described in any one of claims 1-9.

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