A PCB board of a welding type integrated power module

Abstract

The utility model belongs to the field of circuit board, especially involve a kind of welding type power module's PCB board for FPGA;A kind of welding type integrated power module's PCB board, it includes PCB mainboard, still includes a vice board, power module is integrally arranged on vice board, the vice board is stacked on PCB mainboard and is connected with PCB mainboard by welding mode;The utility model will power module be integrated separately on vice board, different from the prior art that power module is integrated on PCB mainboard, can reduce or completely avoid the influence caused to circuit board periphery sensitive electronic component or high-frequency signal by electromagnetic interference due to high-frequency power conversion.

Description

Technical Field

[0001] This utility model belongs to the field of circuit boards, and specifically relates to a PCB board for a solderable power module for FPGA. Background Technology

[0002] Electronic component circuit boards are the main carriers of many electronic products. Currently, the power step-down modules required for electronic component circuit boards are designed with wiring directly on the circuit board, and then the power step-down chip is soldered to the solder joints of the wiring design. The power module may involve high-frequency power conversion, which can easily generate electromagnetic interference and affect sensitive electronic components located around the power module.

[0003] Mechanical stress can affect the power chip and the motherboard during the soldering process and in subsequent application environments. They may experience different coefficients of thermal expansion, which can lead to mechanical stress at the solder joints. Over time, this can cause solder joint fatigue or even breakage.

[0004] Furthermore, if a certain chip in the power module is out of stock, the corresponding circuit board will become unusable.

[0005] Compared to this design, it increases the difficulty of product testing, development costs, and the challenges of sustainable application in the future. Furthermore, if chip shortages occur later, the corresponding circuit board may become unusable due to chip availability issues. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention designs a PCB board with a sub-board and a main board, integrating the power module onto the sub-board and connecting the sub-board and the main board through soldering.

[0007] The technical solution of this utility model is as follows:

[0008] A PCB board for a solderable integrated power module includes a PCB main board, characterized in that: it also includes a sub-board, on which the power module is integrated and disposed, the sub-board being stacked on the PCB main board and connected to the PCB main board by soldering.

[0009] Furthermore, the lower surface of the sub-board is provided with several connecting pins, and the PCB main board is provided with plug holes corresponding to the connecting pins. The connecting pins of the sub-board are soldered and fixed to the plug holes of the PCB main board.

[0010] Furthermore, the sub-board has several stamp holes on its edge, and the PCB main board has pads corresponding to the stamp holes. The sub-board is connected and fixed to the pads on the PCB main board through the stamp holes.

[0011] Furthermore, the two corners at the left end of the sub-plate are provided with clearance notches.

[0012] Furthermore, the sub-plate is rectangular, and from left to right, the upper end of the sub-plate is provided with a first stamp hole group, a second stamp hole group, and a third stamp hole group; the left end of the sub-plate is provided with a fourth stamp hole group; the right end of the sub-plate is provided with a fifth stamp hole group; and the lower end of the sub-plate is provided with a sixth stamp hole group.

[0013] Furthermore, the first stamp hole group includes six stamp holes, and the first stamp hole group is the GND of the power supply.

[0014] Furthermore, the second stamp hole group includes seven stamp holes, which, from left to right, are a spare pin, the input potential level of the external power chip, the PG00D level of the two chip power supplies, and the remaining one is the GND of the power supply.

[0015] Furthermore, the third stamp hole group includes six stamp holes, while the first stamp hole group is the 1V2 output of the power chip.

[0016] Furthermore, the fourth stamp hole group includes six stamp holes and is a 5V power input, while the fifth stamp hole group includes four stamp holes and is the GND of the power supply.

[0017] Furthermore, the sixth stamp hole group includes twenty-nine stamp holes. From left to right, the first stamp hole is the input potential level of the external power chip, the second to seventh stamp holes are the 1V0 output of the power chip, the eighth to eleventh stamp holes are the GND of the power supply, the twelfth to eighteenth stamp holes are the 1V25 output of the power chip, the nineteenth to twenty-second stamp holes are the GND of the power supply, and the twenty-third to twenty-ninth stamp holes are the 1V2 output of the power chip.

[0018] In summary, this utility model has the following beneficial effects:

[0019] 1. This utility model integrates the power module separately on the sub-board, which is different from the existing technology of integrating the power module on the PCB motherboard. This can reduce or completely avoid the impact of electromagnetic interference caused by high-frequency power conversion on sensitive electronic components or high-frequency signals around the circuit board.

[0020] 2. This utility model integrates the power supply module separately on the sub-board, which also eliminates the mechanical stress caused by the different coefficients of thermal expansion when the power supply module is designed on the PCB motherboard in the prior art. This overcomes the problem of solder joint fatigue or breakage that may be caused by long-term mechanical stress.

[0021] 3. The secondary board of this utility model occupies only one side of the PCB motherboard, which makes it possible to design the performance layout on the other side of the PCB motherboard, and facilitates the layout of components on both sides of the circuit board.

[0022] 4. The sub-board of this utility model is a separate power module. If a chip in the power module cannot be continuously supplied, we only need to redesign a sub-board instead of redesigning the entire PCB motherboard. The development cost and testing difficulty of the redesigned sub-board are significantly lower than those of redesigning the PCB motherboard, greatly reducing time and production costs. Attached Figure Description

[0023] Figure 1 This is a perspective view of Embodiment 1 of the present utility model;

[0024] Figure 2 This is a perspective view of Embodiment 2 of the present invention;

[0025] Figure 3 This is a front view schematic diagram of Embodiment 2 of this utility model;

[0026] In the diagram, 1 represents the PCB motherboard, and 10 represents the connector holes.

[0027] 2 is the subplate, 20 is the connecting pin, 21 is the stamp hole, 23 is the clearance notch, 24 is the first stamp hole group, 25 is the second stamp hole group, 26 is the third stamp hole group, 27 is the fourth stamp hole group, 28 is the fifth stamp hole group, and 29 is the sixth stamp hole group. Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0029] It should be noted that when a component is referred to as being "set on" or "fixed to" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as being "fixed to" another component, or "fixedly connected" to another component, the fixing method can be detachable or non-detachable. When a component is considered to be "connected" or "rotatably connected" to another component, it can be directly connected to the other component or there may be an intermediate component. The terms "vertical," "horizontal," "left," "right," "upper," "lower," and similar expressions used are for illustrative purposes only and do not represent the only possible implementation.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0031] In this invention, terms such as "first," "second," and "third" are used not to represent specific quantities or orders, but merely to distinguish names.

[0032] Example 1

[0033] See Figure 1 As shown, a PCB board for a solderable integrated power module includes a main PCB board 1 and a secondary board 2. The power module is integrated on the secondary board 2, which is stacked on the main PCB board and connected to the main PCB board 1 by soldering.

[0034] This invention designs a PCB board, including a main PCB board with a processor, memory, and storage chips. A power module is integrated onto a secondary board. A blank area of ​​the same size as the secondary board is left on one side of the main PCB board. The secondary board is stacked on the blank area of ​​the main PCB board, and the connection between the secondary board and the main PCB board is achieved through soldering. This invention separates the power module, which reduces interference to surrounding sensitive components. Furthermore, the secondary board supports the power module, and its overall operating temperature is similar to that of the power module. The thermal expansion coefficients between the power chip and the secondary board are also similar, eliminating the problem of different thermal expansion coefficients that may occur when the power module is placed on the main board in existing technologies. This overcomes the mechanical stress at the solder joints in existing technologies, which can easily lead to solder joint fatigue or even breakage. In addition, integrating the power module separately onto the secondary board reduces the testing difficulty and development cost of the PCB board. Moreover, when a component of the power module is out of stock, the secondary board can be redeveloped promptly, overcoming the problem of the entire batch of main boards being scrapped and unusable due to the integration of the power module with the main board in existing technologies.

[0035] In this embodiment, the lower surface of the sub-board 2 is provided with a plurality of connecting pins 20, and the PCB main board is provided with plug holes 10 corresponding to the connecting pins. The connecting pins of the sub-board are soldered and fixed to the plug holes of the PCB main board. In this embodiment, the connection between the sub-board and the PCB main board is realized through the connecting pins. When the power module on the sub-board fails, the sub-board can be quickly replaced as a whole, thereby improving the efficiency of maintenance.

[0036] Example 2

[0037] See Figures 2 to 3 As shown, a PCB board for a solderable integrated power module includes a main PCB board 1 and a secondary board 2. The power module is integrated on the secondary board 2, which is stacked on the main PCB board and connected to the main PCB board 1 by soldering.

[0038] In this embodiment, the edge of the sub-board 2 is provided with a plurality of stamp holes 21, and the PCB main board 1 is provided with pads corresponding to the stamp holes. The sub-board is connected and fixed to the pads on the PCB main board through the stamp holes. This utility model provides another way to connect the sub-board and the PCB main board by adopting a stamp hole interface design, which eliminates the need for additional connectors, saves vertical and horizontal space, and has low processing cost, making it suitable for mass production scenarios. Furthermore, the stamp hole interface enables the soldering and fixing of the PCB main board and the sub-board, providing better vibration and shock resistance and meeting the needs of more stringent operating environments. Moreover, by using the stamp hole interface to connect the PCB main board and the sub-board, only one side of the PCB main board is occupied, while other circuit designs can still be arranged on the other side, providing more possibilities for the wiring design of the PCB main board.

[0039] The two corners of the left end of the sub-board 2 are provided with clearance recesses 23. The clearance recesses are used to avoid the connection holes between the PCB motherboard and other devices, which facilitates the installation of the PCB motherboard.

[0040] The structure of the sub-plate is further described below. The sub-plate 2 is rectangular. The upper end of the sub-plate 2 is provided with a first stamp hole group 24, a second stamp hole group 25 and a third stamp hole group 26 from left to right. The left end of the sub-plate is provided with a fourth stamp hole group 27. The right end of the sub-plate is provided with a fifth stamp hole group 28. The lower end of the sub-plate is provided with a sixth stamp hole group 29.

[0041] The first stamp hole group 24 includes six stamp holes, and the first stamp hole group is the GND of the power supply.

[0042] The second stamp hole group 25 includes seven stamp holes, which, from left to right, are a spare pin, the input potential level of the external power chip, the PG00D level of the two chip power supplies, and the remaining one is the GND of the power supply.

[0043] The third stamp hole group 26 includes six stamp holes, while the first stamp hole group is the 1V2 output of the power chip.

[0044] The fourth stamp hole group 27 includes six stamp holes and is a 5V power input. The fifth stamp hole group 28 includes four stamp holes and is the GND of the power supply.

[0045] The sixth stamp hole group 29 includes twenty-nine stamp holes. From left to right, the first stamp hole is the input potential level of the external power chip, the second to seventh stamp holes are the 1V0 output of the power chip, the eighth to eleventh stamp holes are the GND of the power chip, the twelfth to eighteenth stamp holes are the 1V25 output of the power chip, the nineteenth to twenty-second stamp holes are the GND of the power chip, and the twenty-third to twenty-ninth stamp holes are the 1V2 output of the power chip.

[0046] In summary, this utility model has the following beneficial effects:

[0047] 1. This utility model integrates the power module separately on the sub-board, which is different from the existing technology of integrating the power module on the PCB motherboard. This can reduce or completely avoid the impact of electromagnetic interference caused by high-frequency power conversion on sensitive electronic components or high-frequency signals around the circuit board.

[0048] 2. This utility model integrates the power supply module separately on the sub-board, which also eliminates the mechanical stress caused by the different coefficients of thermal expansion when the power supply module is designed on the PCB motherboard in the prior art. This overcomes the problem of solder joint fatigue or breakage that may be caused by long-term mechanical stress.

[0049] 3. The secondary board of this utility model occupies only one side of the PCB motherboard, which makes it possible to design the performance layout on the other side of the PCB motherboard, and facilitates the layout of components on both sides of the circuit board.

[0050] 4. The sub-board of this utility model is a separate power module. If a chip in the power module cannot be continuously supplied, we only need to redesign a sub-board instead of redesigning the entire PCB motherboard. The development cost and testing difficulty of the redesigned sub-board are significantly lower than those of redesigning the PCB motherboard, greatly reducing time and production costs.

[0051] Based on the described embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

Claims

1. A PCB board for a solderable integrated power module, comprising a PCB motherboard, characterized in that: It also includes a sub-board, on which the power module is integrated. The sub-board is stacked on the PCB main board and connected to the PCB main board by soldering.

2. The PCB board of a welded integrated power module according to claim 1, characterized in that: The lower surface of the sub-board is provided with several connecting pins, and the PCB main board is provided with plug holes corresponding to the connecting pins. The connecting pins of the sub-board are soldered and fixed to the plug holes of the PCB main board.

3. The PCB board of a welded integrated power module according to claim 1, characterized in that: The sub-board has several stamp holes on its edge, and the PCB main board has pads corresponding to the stamp holes. The sub-board is connected and fixed to the pads on the PCB main board through the stamp holes.

4. The PCB board of a welded integrated power module according to claim 3, characterized in that: The two corners at the left end of the sub-plate are provided with clearance notches.

5. The PCB board of a welded integrated power module according to claim 3, characterized in that: The sub-plate is rectangular. From left to right, the upper end of the sub-plate has a first stamp hole group, a second stamp hole group, and a third stamp hole group. The left end of the sub-plate has a fourth stamp hole group, the right end of the sub-plate has a fifth stamp hole group, and the lower end of the sub-plate has a sixth stamp hole group.

6. The PCB board of a welded integrated power module according to claim 5, characterized in that: The first stamp hole group includes six stamp holes, and the first stamp hole group is the GND of the power supply.

7. The PCB board of a welded integrated power module according to claim 5, characterized in that: The second stamp hole group includes seven stamp holes, which, from left to right, are the spare pin, the input potential level of the external power chip, the PG00D level of the two chip power supplies, and the remaining one is the GND of the power supply.

8. The PCB board of a welded integrated power module according to claim 5, characterized in that: The third stamp hole group includes six stamp holes, while the first stamp hole group is the 1V2 output of the power chip.

9. The PCB board of a welded integrated power module according to claim 5, characterized in that: The fourth stamp hole group includes six stamp holes and is a 5V power input. The fifth stamp hole group includes four stamp holes and is the GND of the power supply.

10. The PCB board of a welded integrated power module according to claim 5, characterized in that: The sixth stamp hole group includes twenty-nine stamp holes. From left to right, the first stamp hole is the input potential level of the external power chip, the second to seventh stamp holes are the 1V0 output of the power chip, the eighth to eleventh stamp holes are the GND of the power chip, the twelfth to eighteenth stamp holes are the 1V25 output of the power chip, the nineteenth to twenty-second stamp holes are the GND of the power chip, and the twenty-third to twenty-ninth stamp holes are the 1V2 output of the power chip.

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