Housing and module assembly
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LUXSHARE PRECISION IND SHENZHEN
- Filing Date
- 2025-06-19
- Publication Date
- 2026-07-10
AI Technical Summary
The fit between the shielding shell and the sub-board of the existing module components is difficult to guarantee, resulting in poor electromagnetic shielding effect. Furthermore, the conductive terminals of the board-to-board connector may cause the sub-board to bend and the solder joints to crack and fail under external force.
The cover plate and metal grounding frame are set separately. The cover plate and metal grounding frame are fixed by welding or gluing. The metal grounding frame is equipped with a contact spring to elastically contact the grounding layer on the circuit board, which enhances the structural strength and improves the electromagnetic shielding effect.
It improves the structural strength and electromagnetic shielding effect of the module components, reduces the problems of sub-board bending and welding failure caused by external forces on conductive terminals, and enhances the reflection and conduction functions of electromagnetic waves.
Smart Images

Figure CN224481883U_ABST