Heat dissipation module and electronic device

Abstract

The application provides a heat dissipation module and an electronic device. The heat dissipation module comprises a first cover plate, a second cover plate and a capillary structure. The first cover plate is fixedly connected with the second cover plate and forms a closed cavity. The capillary structure is located in the cavity. The cavity comprises a first cavity, a second cavity and a third cavity which are in communication with each other. The first cavity, the second cavity and the third cavity are located in a first region, a second region and a third region of the heat dissipation module respectively. The second region and the third region are used for connecting a first heat generating component and a second heat generating component of the electronic device respectively. The heat generation of the first heat generating component is greater than that of the second heat generating component. The size of the first cavity in a first direction is greater than that of the second cavity in the first direction. The size of the second cavity in the first direction is greater than that of the third cavity in the first direction. The first direction is the arrangement direction of the first cover plate and the second cover plate. The application is beneficial to improving the heat dissipation capacity of the heat dissipation module by designing the heat dissipation module with different thicknesses.

Description

Technical Field

[0001] This application relates to the field of terminal equipment, and more specifically, to a heat dissipation module and an electronic device. Background Technology

[0002] As the performance of electronic devices improves, their power consumption and heat generation also increase, placing higher demands on heat dissipation technology. Currently, the heat dissipation efficiency and cooling capacity of heat dissipation modules in electronic devices are low, which may not be able to meet the heat dissipation needs of electronic devices. Therefore, optimizing the design of heat dissipation modules to improve their heat dissipation capabilities is crucial. Utility Model Content

[0003] This application provides a heat dissipation module and an electronic device. By setting different sizes for different areas of the heat dissipation module, the heat dissipation capacity of the heat dissipation module can be improved, thereby meeting the heat dissipation requirements of the electronic device.

[0004] In a first aspect, a heat dissipation module is provided for use in an electronic device. The heat dissipation module includes a first cover plate, a second cover plate, and a capillary structure. The first cover plate and the second cover plate are fixedly connected to form a closed cavity. The capillary structure is located within the cavity, and the cavity contains a liquid working fluid. The capillary structure guides the liquid working fluid to flow within the cavity. The cavity includes a first cavity, a second cavity, and a third cavity that are interconnected. The first cavity is located in a first region of the heat dissipation module, the second cavity is located in a second region of the heat dissipation module, and the third cavity is located in a third region of the heat dissipation module. The first region is used for heat dissipation, the second region is used to connect a first heat-generating component of the electronic device, and the third region is used to connect a second heat-generating component of the electronic device. The heat generated by the first heat-generating component is greater than the heat generated by the second heat-generating component. The dimension of the first cavity in a first direction is greater than the dimension of the second cavity in the first direction, and the dimension of the second cavity in the first direction is greater than the dimension of the third cavity in the first direction. The first direction is the arrangement direction of the first cover plate and the second cover plate.

[0005] For example, the second region can be in direct contact with and fixedly connected to the first heating element of the electronic device, or other structural components can be provided between the second region and the first heating element, with the second region connected to the first heating element through other structural components. The third region can be in direct contact with and fixedly connected to the second heating element of the electronic device, or other structural components can be provided between the third region and the second heating element, with the third region connected to the second heating element through other structural components. For example, the other structural components here can be thermally conductive foam, graphene, thermally conductive gel, thermally conductive silicone grease, etc., and this application does not limit them.

[0006] It should be understood that the first region is positioned away from the heat-generating components inside the electronic device relative to the second and third regions. For example, the second region is fixedly connected to the first heat-generating component, and the heat from the first heat-generating component can be transferred to the second region, vaporizing the liquid working fluid in the second region into a gas. The gas fills the cavity, and upon contact with the cooler first region, it liquefies into a liquid, dissipating heat. The liquefied liquid in the first region flows back to the second region under the capillary force of the capillary structure, and continues to vaporize in the second region, repeating the cycle to achieve continuous heat dissipation. The heat dissipation principle of the second heat-generating component in the third region is similar and will not be described further.

[0007] For example, the heat generated by the first heating element is greater than that generated by the second heating element. The first heating element can be a device on the motherboard with a larger heat generation, and the second heating element can be a device on the motherboard with a relatively smaller heat generation. For instance, the first heating element can be a central processing unit (CPU), and the second heating element can be a charging module, a power conversion module, or other heat-generating devices on the motherboard (such as memory, controller, etc.).

[0008] For example, the liquid working medium can be one or more of water, ethanol, methanol, acetone, fluorinated liquid, etc., and this application does not specifically limit it.

[0009] For example, the dimension of the cavity in the first direction can refer to the spacing between the structures that enclose the cavity in the first direction. The dimension of the first cavity in the first direction can refer to the spacing between the first cover plate and the second cover plate corresponding to the first region, the dimension of the second cavity in the first direction can refer to the spacing between the first cover plate and the second cover plate corresponding to the second region, and the dimension of the third cavity in the first direction can refer to the spacing between the first cover plate and the second cover plate corresponding to the third region.

[0010] In this embodiment, considering the varying heat generation of internal heat-generating components in electronic devices, a targeted design for the heat dissipation module structure is required to effectively dissipate heat from the electronic device and meet its heat dissipation needs. In the heat dissipation module's structural design, by setting the dimension of the first cavity in the first direction to be larger than that of the second cavity in the first direction, the air resistance of the gas in the first cavity is reduced, and the flow capacity is increased. This facilitates the timely and rapid diffusion of gas from the second cavity to the first cavity, thereby achieving heat dissipation for the first heat-generating component. Similarly, by setting the dimension of the first cavity in the first direction to be larger than that of the third cavity in the first direction, the air resistance of the gas in the first cavity is reduced, and the flow capacity is increased. This facilitates the timely and rapid diffusion of gas from the third cavity to the first cavity, thereby achieving heat dissipation for the second heat-generating component. Furthermore, considering that the heat generation of the first heat-generating component is greater than that of the second heat-generating component, by setting the dimension of the second cavity in the first direction to be larger than that of the third cavity in the first direction, the gas in the second cavity can diffuse to the first cavity more quickly and timely compared to the gas in the third cavity, thus carrying away more heat from the first heat-generating component and achieving efficient heat dissipation for the first heat-generating component. The above structural design helps to improve the heat dissipation efficiency and heat dissipation capacity of the heat dissipation module, thereby meeting the heat dissipation requirements of electronic devices.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the dimension of the second heating element in the first direction is greater than the dimension of the first heating element in the first direction. That is, the height (or thickness) of the second heating element is greater than the height (or thickness) of the first heating element.

[0012] In this embodiment, the heat dissipation module can be applied to heat dissipation of heat-generating components of various sizes. Considering that the size of the second heat-generating component in the first direction is larger than that of the first heat-generating component in the first direction, the size and heat generation of the heat-generating components in the electronic device can be comprehensively considered when designing the structure of the heat dissipation module, so that the heat dissipation module can meet the heat dissipation requirements of heat-generating components with different heat generation and different sizes. In other words, the heat dissipation module provided in this embodiment can dissipate heat from heat-generating components of different sizes and with different heat generation.

[0013] In conjunction with the first aspect, in some implementations of the first aspect, in the first direction, the size of the portion of the capillary structure located in the first region is larger than the size of the portion of the capillary structure located in the second region. For example, the size of the capillary structure in the first direction can be understood as the thickness of the capillary structure.

[0014] In this embodiment, by setting the size of the first cavity in the first direction to be larger than that of the second cavity in the first direction, that is, making the thickness of the first cavity greater than that of the second cavity, a thicker capillary structure can be set in the larger first cavity, thereby increasing the capillary force of the capillary structure in the first cavity and increasing the liquid return capacity in the first cavity, so that the liquid in the first cavity can return to the second cavity, thereby realizing the heat dissipation of the first heating element.

[0015] When a counter-gravity problem occurs, liquid accumulates in the first cavity, affecting its return flow to the second cavity and reducing the heat dissipation capacity of the heat dissipation module. This embodiment addresses this by incorporating a thicker capillary structure within a larger first cavity, increasing the capillary force within the first cavity. This facilitates the liquid's return flow even in counter-gravity scenarios, overcoming its own weight. The counter-gravity problem can be understood as a situation where the liquid's own weight and the capillary force of the capillary structure act in opposite directions, preventing the liquid from overcoming gravity and flowing back to the second or other cavities.

[0016] In conjunction with the first aspect, in some implementations of the first aspect, in the first direction, the size of the portion of the capillary structure located in the second region is larger than the size of the portion of the capillary structure located in the third region. For example, the size of the capillary structure in the first direction can be understood as the thickness of the capillary structure.

[0017] In this embodiment, by setting the dimension of the second cavity in the first direction to be larger than that of the third cavity in the first direction—that is, making the thickness of the second cavity greater than that of the third cavity—a thicker capillary structure can be formed in the larger second cavity, thereby increasing the capillary force of the capillary structure within the second cavity. By setting the thickness of the capillary structure in the second region to be greater than that in the third region, heat dissipation of the first heating element in the second region can be achieved more quickly, meeting the heat dissipation requirements of heating elements with high heat output.

[0018] In conjunction with the first aspect, in some implementations of the first aspect, the capillary structure includes a capillary mesh and capillary threads, the capillary mesh being fixed to the second cover plate, the capillary threads being disposed between the capillary mesh and the first cover plate, the capillary mesh covering the first region, the second region and the third region, and the capillary threads covering the first region and the second region.

[0019] For example, the capillary structure is a porous structure woven from metal wires or a porous structure formed by sintering metal powder.

[0020] For example, a capillary mesh can be a porous mesh structure used to provide capillary force to the capillary structure. A capillary mesh can be a mesh structure formed by weaving metal wires, or a mesh structure formed by sintering metal powder. Capillary threads can be porous strip structures used to guide the flow of liquid working fluid and improve the capillary force of the capillary structure. Capillary threads can be strip structures formed by weaving metal wires, or strip structures formed by sintering metal powder.

[0021] In this embodiment, by laying the entire capillary mesh on the second cover plate, the capillary mesh can cover the first region, the second region, and the third region, thereby achieving heat dissipation for the first and second heating elements. By setting capillary threads between the capillary mesh and the first cover plate, and having the capillary threads cover the first and second regions, heat dissipation for the first heating element, which generates more heat, can be achieved, thus meeting the heat dissipation needs of different heating elements.

[0022] In conjunction with the first aspect, in some implementations of the first aspect, in the first direction, the size of the portion of the capillary filament located in the first region is larger than the size of the portion of the capillary filament located in the second region. The size of the capillary filament in the first direction can be understood as the thickness of the capillary filament.

[0023] In this embodiment, by increasing the thickness of the portion of the capillary wire in the first region to increase the thickness of the capillary structure in the first region, it is beneficial to provide sufficient capillary force for the liquid in the first cavity, which is beneficial to the backflow of the liquid and solves the problem of anti-gravity.

[0024] In conjunction with the first aspect, in some implementations of the first aspect, in the first direction, the size of the portion of the capillary mesh located in the first region is larger than the size of the portion of the capillary mesh located in the third region. The size of the capillary mesh in the first direction can be understood as the thickness of the capillary mesh.

[0025] In this embodiment, by increasing the thickness of the capillary mesh in the first region to increase the thickness of the capillary structure in the first region, it is beneficial to provide sufficient capillary force for the liquid in the first cavity, which is beneficial to the backflow of the liquid and solves the problem of anti-gravity.

[0026] In conjunction with the first aspect, in some implementations of the first aspect, in the first direction, the size of the portion of the capillary mesh located in the second region is larger than the size of the portion of the capillary mesh located in the third region. The size of the capillary mesh in the first direction can be understood as the thickness of the capillary mesh.

[0027] In this embodiment, considering that the heat generation of the first heating element corresponding to the second region is greater than that of the second heating element corresponding to the third region, a thicker capillary mesh can be provided in the region with high heat generation, thereby improving the speed and efficiency of heat transfer and realizing heat dissipation of the heating element with high heat generation.

[0028] In conjunction with the first aspect, in some implementations of the first aspect, the capillary web includes a first capillary web and a second capillary web, wherein the first capillary web covers the first region, the second region and the third region, and the second capillary web covers the first region and the second region.

[0029] For example, the first capillary mesh can be fixed to the second cover plate, and the second capillary mesh can be fixed to the side of the first capillary mesh facing the first cover plate. The capillary mesh may include one or more layers. For example, two layers of capillary mesh may be provided in the second area where the heat dissipation requirement is large (or the heat generation is large); only one layer of capillary mesh may be provided in the third area where the heat dissipation requirement is relatively small (or the heat generation is small).

[0030] In this embodiment, the capillary mesh can be a double-layer structure. The first capillary mesh can be laid entirely on the second cover plate to achieve large-area heat dissipation. The second capillary mesh can be laid in the second area with higher heat generation (the third area does not have a second capillary mesh) to enhance heat dissipation in local hot spots. This structural arrangement helps to improve the heat dissipation efficiency and capacity of the heat dissipation module, thereby meeting the heat dissipation requirements of electronic devices.

[0031] In conjunction with the first aspect, in some implementations of the first aspect, the capillary includes a first capillary and a second capillary, and the first region includes a fourth region and a fifth region that are interconnected; the first capillary extends from the second region to the fourth region, and the second capillary extends from the second region to the fifth region, with a predetermined distance separating the portion of the first capillary located in the second region from the portion of the second capillary located in the second region. This predetermined distance can be determined according to actual circumstances, and this application does not limit it.

[0032] For example, the first region is used for heat dissipation, meaning the fourth and fifth regions are used for heat dissipation. The second and third regions are used for heat absorption, and the third region can be arranged adjacent to the second region.

[0033] For example, the second, fourth, and fifth regions can be in the form of a "Y" shape or a "T" shape. The second region can be fixedly connected to the first heating element. The heat from the first heating element is transferred to the second region, vaporizing the liquid working fluid in the second region into a gas. The gas fills the cavity. After the gas comes into contact with the lower-temperature fourth and fifth regions, it liquefies into a liquid and dissipates heat. The liquid liquefied in the fourth and fifth regions flows back to the second region under the capillary force of the capillary structure and continues to vaporize in the second region, repeating the cycle to achieve continuous heat dissipation.

[0034] In this embodiment, the capillary may include a first capillary and a second capillary. The first capillary and the second capillary may be spaced at a preset distance at the heat source end, which can accelerate the evaporation of heat from the first heating element, so that the liquid working fluid in the second region can be quickly vaporized into gas, thereby achieving efficient heat dissipation.

[0035] In conjunction with the first aspect, in some implementations of the first aspect, the heat dissipation module further includes a heat sink, which is fixedly connected to the fourth region and / or the fifth region.

[0036] For example, the heat dissipation module also includes a first heat sink and a second heat sink, with the first heat sink fixedly connected to the fourth region and the second heat sink fixedly connected to the fifth region.

[0037] In this embodiment, the heat sink can be disposed in the fourth region and / or the fifth region, which can distribute the heat transferred to the fourth region and / or the fifth region evenly, realize the rapid transfer of heat, so that the fan can run to remove the heat from the heat sink and achieve efficient heat dissipation.

[0038] In conjunction with the first aspect, in some implementations of the first aspect, the cavity further includes a fourth cavity, which is interconnected with the first cavity, the second cavity, and the third cavity. The fourth cavity is located in the sixth region of the heat dissipation module, and the sixth region is used to connect the third heat-generating component of the electronic device. The heat generated by the third heat-generating component is less than the heat generated by the first heat-generating component. The dimension of the fourth cavity in the first direction is smaller than the dimension of the first cavity in the first direction, and the dimension of the fourth cavity in the first direction is smaller than the dimension of the second cavity in the first direction.

[0039] For example, the third heat-generating component can be a charging module, a power conversion module, or other heat-generating devices on the motherboard (such as a memory, controller, etc.). The third heat-generating component can be the same type of device as the second heat-generating component but located in a different position, or the third heat-generating component can be a different type of device from the second heat-generating component. For example, the second heat-generating component is a power conversion module, and the third heat-generating component is a charging module, a memory, or a controller.

[0040] It should be understood that the embodiments of this application do not specifically limit the relative magnitude of the heat output of the third heating element and the second heating element. In the embodiments of this application, the heat output of the third heating element may be greater than, equal to, or less than the heat output of the second heating element. It should also be understood that the embodiments of this application do not specifically limit the size relationship between the third heating element and the second heating element. In the embodiments of this application, the size of the third heating element may be greater than, equal to, or less than the size of the second heating element.

[0041] It should be understood that the embodiments of this application do not specifically limit the relative size between the fourth cavity and the third cavity. In the embodiments of this application, the size of the fourth cavity in the first direction may be greater than, equal to, or less than the size of the third cavity in the first direction.

[0042] For example, the sixth region can be in direct contact with and fixedly connected to the third heating element of the electronic device, or other structural components can be provided between the sixth region and the third heating element, and the sixth region and the third heating element can be connected through other structural components. For example, the other structural components can be thermally conductive foam, graphene, thermally conductive gel, thermally conductive silicone grease, etc., and this application does not limit them.

[0043] For example, the dimension of the fourth cavity in the first direction can refer to the spacing between the first cover plate and the second cover plate corresponding to the sixth region.

[0044] In this embodiment, considering that the heat generation of the heat-generating components of the electronic device may vary, the heat dissipation module is configured with multiple cavities of varying thicknesses to dissipate heat from heat-generating components with different heat outputs, thereby meeting the heat dissipation requirements of the electronic device.

[0045] In conjunction with the first aspect, in some implementations of the first aspect, the dimension of the third heating element in the first direction is greater than the dimension of the first heating element in the first direction.

[0046] In the embodiments of this application, the heat dissipation module can dissipate heat from heat-generating components of different sizes, thereby meeting the heat dissipation requirements of heat-generating components of different heat outputs and sizes.

[0047] In some embodiments, the dimension of the third heating element in the first direction may be less than or equal to the dimension of the first heating element in the first direction, and this application does not limit this.

[0048] In conjunction with the first aspect, in some implementations of the first aspect, the material of the first cover plate or the second cover plate is at least one of stainless steel, copper, and titanium.

[0049] In this embodiment, the cavity formed by the first cover plate and the second cover plate has different thicknesses in different areas, meaning that the first cover plate or the second cover plate has an uneven structure. The first cover plate and the second cover plate can be formed by stamping, which requires the first cover plate or the second cover plate to have high strength. By setting the material of the first cover plate or the second cover plate to at least one of high-strength stainless steel, copper, and titanium, it is beneficial to the processing of the heat dissipation module.

[0050] In a second aspect, an electronic device is provided, including a first heating element, a second heating element, and a heat dissipation module as described in the first aspect and any implementation thereof, wherein the first heating element is connected to a second region of the heat dissipation module, the second heating element is connected to a third region of the heat dissipation module, and the heat dissipation module is used to dissipate heat from the first heating element and the second heating element.

[0051] For example, the electronic device can be a terminal device such as a laptop computer, a foldable computer, a foldable mobile phone, a 2-in-1 tablet, or a wind-cooled mobile phone.

[0052] In this embodiment, the heat dissipation module can dissipate heat from the first and second heat-generating components in the electronic device. That is, the heat dissipation module can dissipate heat from heat-generating components with different heat outputs, thereby meeting the heat dissipation requirements of the electronic device.

[0053] In conjunction with the second aspect, in some implementations of the second aspect, the electronic device further includes a display screen, a housing, a first fan, and a second fan; the display screen and the housing form a receiving cavity, and the first fan, the second fan, the first heating element, the second heating element, and the heat dissipation module are located within the receiving cavity; the first region of the heat dissipation module includes a fourth region and a fifth region that are interconnected, the air outlet of the first fan is correspondingly disposed with respect to the fourth region, and the air outlet of the second fan is correspondingly disposed with respect to the fifth region.

[0054] In this embodiment of the application, the electronic device can be designed as a dual-fan heat dissipation architecture. The electronic device may include a first fan and a second fan. The first fan and the second fan can dissipate heat from the heat dissipation module, thereby transferring the heat of the heat-generating components inside the electronic device to the outside of the electronic device, thus achieving heat dissipation of the electronic device.

[0055] In conjunction with the second aspect, in some implementations of the second aspect, the housing includes a side panel and a rear cover, the side panel being connected between the display screen and the rear cover; the side panel is provided with a first air inlet, a second air inlet, a first air outlet and a second air outlet, the first air inlet and the second air inlet being used for air intake of the first fan and the second fan respectively, and the first air outlet and the second air outlet being used for air exhaust of the first fan and the second fan respectively.

[0056] In this embodiment of the application, by setting an air inlet and an air outlet on the side panel of the electronic device, side air outlet and side air intake of the electronic device can be realized, which can improve the user experience.

[0057] In conjunction with the second aspect, in some implementations of the second aspect, at least one of the first air inlet, the second air inlet, the first air outlet, and the second air outlet can be an elliptical runway opening.

[0058] In some examples, the aforementioned air inlets and / or outlets can share a channel with the speaker, thereby saving space.

[0059] In this embodiment, by setting the air inlet and outlet as elliptical racetrack-shaped holes, the area of ​​the air inlet and outlet can be increased, which is more conducive to the air intake and exhaust of the fan and increases the air volume, thereby achieving efficient heat dissipation.

[0060] In conjunction with the second aspect, in some implementations of the second aspect, the central axis of the first air inlet forms a first acute angle with the plane where the display screen is located, and / or, the central axis of the second air inlet forms a second acute angle with the plane where the display screen is located.

[0061] In this embodiment, considering that the side panel of the electronic device may affect the air intake of the electronic device when supported on the support platform, thereby affecting the heat dissipation of the electronic device, the first air intake and / or the second air intake are tilted relative to the plane where the display screen is located to avoid the support platform blocking the air intake of the fan, thereby avoiding affecting the heat dissipation of the electronic device.

[0062] In some examples, the central axis of the first air outlet forms a fifth acute angle with the plane where the display screen is located, and the central axis of the second air outlet forms a sixth acute angle with the plane where the display screen is located. By tilting the first and second air outlets relative to the plane where the display screen is located, the airflow from the fan is not affected, and the heat dissipation of the electronic device is not affected.

[0063] In conjunction with the second aspect, in some implementations of the second aspect, the first acute angle is greater than or equal to 15°, and the second acute angle is greater than or equal to 15°. For example, the fifth acute angle is greater than or equal to 15°, and the sixth acute angle is greater than or equal to 15°.

[0064] In this embodiment of the application, by limiting the tilt angle of the first air inlet and the second air inlet to greater than or equal to 15°, it is more conducive to the air intake of the fan and to achieve efficient heat dissipation of electronic devices.

[0065] In conjunction with the second aspect, in some implementations of the second aspect, the electronic device further includes feet disposed on the housing, the feet being used to elevate the first air inlet and / or the second air inlet.

[0066] For example, the material of the foot pad can be plastic.

[0067] For example, the feet can be fixedly connected to the housing (such as the back cover) of the electronic device, and the connection method is not limited. For example, they can be fixedly connected by mechanical means or by adhesive. At least a portion of the feet is exposed outside the electronic device. The feet can elevate the electronic device so that the side panels can be completely removed from the support surface, which is beneficial for air intake of the first air inlet and / or the second air inlet.

[0068] In this embodiment, the feet can elevate the electronic device, allowing it to be completely removed from the support platform. In other words, the feet can increase the distance between the first and / or second air inlets and the support platform, reducing the obstruction of airflow by the support platform and enabling smooth airflow from the front and rear sides of the display screen.

[0069] Thirdly, an electronic device is provided, including a display screen, a housing, a heat dissipation module, a heat-generating component, and a fan. The display screen and the housing form a receiving cavity, and the fan, the heat-generating component, and the heat dissipation module are located within the receiving cavity. The heat dissipation module is used to transfer the heat from the heat-generating component to the air outlet of the fan. The housing includes a side panel and a rear cover. The side panel is connected between the display screen and the rear cover. The side panel is provided with an air inlet and an air outlet. The air inlet is used for the intake of air from the second fan, and the air outlet is used for the exhaust of air from the fan. The central axis of the air inlet forms a third acute angle with the plane where the display screen is located, and / or the central axis of the air outlet forms a fourth acute angle with the plane where the display screen is located.

[0070] In this embodiment, the air inlet and outlet can be located on the side panel, which avoids opening air inlets and outlets on the external surface of the electronic device for heat dissipation, thus improving the aesthetics of the electronic device. Furthermore, by tilting the air inlet and / or air inlet / outlet relative to the plane of the display screen, the support platform is prevented from obstructing the fan's airflow when the electronic device is placed on it, thus avoiding any impact on the device's heat dissipation.

[0071] In conjunction with the third aspect, in some implementations of the third aspect, the included angle of the third acute angle is greater than or equal to 15°, and the included angle of the fourth acute angle is greater than or equal to 15°.

[0072] In this embodiment of the application, by limiting the tilt angle of the air inlet and / or air outlet to greater than or equal to 15°, it is more conducive to the air intake of the fan and to achieve efficient heat dissipation of electronic devices.

[0073] In conjunction with the third aspect, in some implementations of the third aspect, the air inlet and / or the air outlet are elliptical runway-shaped openings.

[0074] In this embodiment of the application, by setting the air inlet and / or air outlet as an elliptical racetrack hole, the area of ​​the air inlet and outlet can be increased, which is more conducive to the air intake and exhaust of the fan, can provide the fan with greater airflow, and is beneficial to the heat dissipation of electronic devices.

[0075] In conjunction with the third aspect, in some implementations of the third aspect, the electronic device further includes feet disposed on the housing, the feet being used to elevate the air inlet and / or the air outlet.

[0076] In this embodiment, the foot pads can elevate the electronic device so that it can be completely removed from the support platform. That is, the foot pads can increase the distance between the air inlet and / or air outlet and the support platform, reduce the obstruction of the air inlet and outlet by the support platform, and achieve smooth air inlet and outlet on the front and rear sides of the display screen.

[0077] In conjunction with the third aspect, in some implementations of the third aspect, the fan includes a first fan and a second fan; the air inlet includes a first air inlet and a second air inlet; the air outlet includes a first air outlet and a second air outlet; the first air inlet and the second air inlet are respectively used for air intake of the first fan and the second fan; the first air outlet and the second air outlet are respectively used for air exhaust of the first fan and the second fan; the side plate includes a first side plate, a second side plate, and a third side plate; the second side plate is connected between the first side plate and the third side plate; the first side plate and the third side plate are two opposing side plates; the first air inlet is disposed on the first side plate; the second air inlet is disposed on the third side plate; and the first air outlet and the second air outlet are disposed on the second side plate.

[0078] In this embodiment of the application, the use of dual fans to dissipate heat from electronic devices is beneficial to improving the heat dissipation efficiency and capacity of electronic devices. Attached Figure Description

[0079] Figures 1 to 4 These are schematic diagrams of the electronic device provided in the embodiments of this application under different usage modes.

[0080] Figure 5 This is an exploded structural diagram of an electronic device provided in an embodiment of this application.

[0081] Figure 6 and Figure 7 This is a schematic diagram showing the installation location of the heat dissipation module in an electronic device according to an embodiment of this application.

[0082] Figure 8 This is a schematic diagram of the air outlet structure provided in the embodiment of this application.

[0083] Figure 9A and Figure 9B This is a schematic diagram of the air inlet provided in an embodiment of this application.

[0084] Figures 10 to 13 This is a top view of the heat dissipation module provided in the embodiment of this application on the xy plane.

[0085] Figure 14 and Figure 15 This is a schematic diagram of the heat dissipation module provided in the embodiments of this application projected onto the yz plane.

[0086] Figure 16 and Figure 17 This is a schematic diagram of the projection of another heat dissipation module provided in the embodiment of this application onto the yz plane.

[0087] Figure 18 and Figure 19 This is a schematic diagram of the projection of another heat dissipation module provided in the embodiment of this application onto the yz plane.

[0088] Figure 20 This is a schematic diagram of the heat dissipation module provided in the embodiments of this application projected onto the xz plane.

[0089] Figure 21 This is a perspective structural diagram of the heat dissipation module provided in the embodiments of this application on the xy plane.

[0090] Figure 22 yes Figure 21 A schematic diagram of the cross-section along the AA direction.

[0091] Figure 23 yes Figure 21 A schematic diagram of the cross-section along the BB direction.

[0092] Figure 24 yes Figure 21 A schematic diagram of the cross-section along the CC direction.

[0093] Figure 25 yes Figure 21 A schematic diagram of the cross-section along the DD direction. Detailed Implementation

[0094] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0095] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to at least two.

[0096] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0097] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0098] References to "one embodiment" or "some embodiments" as used in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in another embodiment" appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0099] For ease of description, we define the thickness direction of the electronic device in its flattened state as the z-axis, the length direction as the x-axis, and the width direction as the y-axis, the third direction. It is understood that the coordinate system of the electronic device can be flexibly set according to specific practical needs.

[0100] It is understood that the specific embodiments described herein are merely for explaining the relevant invention and not for limiting the invention. It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0101] Figures 1 to 4 These are schematic diagrams of the electronic device 10 provided in the embodiments of this application under different usage modes. Figure 5 This is an example of an exploded structural diagram of an electronic device 10. Exemplarily, the electronic device 10 can be a terminal device such as a laptop computer, a foldable computer, a foldable mobile phone, a 2-in-1 tablet, or a wind-cooled mobile phone. This application embodiment uses a foldable computer as an example for description.

[0102] like Figures 1 to 4 As shown, the electronic device 10 may include a display screen 11 and a housing assembly 12. The display screen 11 may be mounted on the housing assembly 12. The housing assembly 12 serves to protect the electronic device 10. The display screen 11 and the housing assembly 12 form a receiving cavity, which can be used to house the components of the electronic device 10 (e.g., heat dissipation module, fan, motherboard, power supply device, etc.). Figure 3 and Figure 5 As shown, the housing assembly 12 may include a middle frame 121 and a back cover 122. The middle frame 121 can be connected between the display screen 11 and the back cover 122. The middle frame 121 can serve to support and fix the internal components of the electronic device.

[0103] For example, electronic device 10 can be a foldable electronic device, and display screen 11 can be a flexible display screen. Figures 1 to 4 As shown, the electronic device 10 may include a first part 100 and a second part 200 connected together. Both the first part 100 and the second part 200 are covered with a flexible display screen. The first part 100 and the second part 200 can be opened and closed via a central hinge 15. The first part 100 (upper screen side) and the second part 200 (lower screen side) can both be display parts, capable of displaying text, images, etc. The electronic device 10 can be connected to an external keyboard to control the display of the first part 100 and the second part 200. In some embodiments, the first part 100 can also be a display part for displaying text, images, etc., and the second part 200 can be a touch keyboard to control the display of the first part 100.

[0104] In some examples, such as Figure 3As shown, the electronic device 10 also includes a support frame 13, which can be connected to the rear cover 122 of the housing assembly 12. For example, the rear cover 122 of the electronic device 10 may have a support frame receiving cavity 1221 for accommodating the support frame 13. When the support frame 13 is not in use, it can be housed within the support frame receiving cavity 1221; when the support frame 13 is needed, it can be removed from the support frame receiving cavity 1221 to support the electronic device 10 on the support platform 20.

[0105] For example, such as Figure 3 As shown, the support frame receiving cavity 1221 can be disposed on the rear cover of the second part 200 of the electronic device 10, and the support frame 13 can be supported on the second part 200 of the electronic device 10. In some examples, the support frame 13 and the heat dissipation module 600 of the electronic device 10 (i.e., the heat dissipation module 600 in the following six figures) are located on different parts of the electronic device 10. For example, the heat dissipation module 600 can be located in the first part 100 of the electronic device 10, and the support frame 13 can be located in the second part 200 of the electronic device 10; or, the support frame 13 can be located in the first part 100 of the electronic device 10, and the heat dissipation module 600 can be located in the second part 200 of the electronic device 10.

[0106] In this application embodiment, the electronic device 10 can have various usage forms, such as including Figure 1 The first usage mode shown is the traditional laptop usage mode. Figure 2 and Figure 3 The second usage mode shown (large screen usage mode) Figure 4 The third usage form shown is the flat panel usage form.

[0107] like Figure 1 As shown, in the first usage mode, the housing assembly 12 is in the open state, and the first part 100 and the second part 200 of the electronic device 10 are set at an angle (the angle is less than 180°). A part of the rear cover 122 of the housing assembly 12 is in contact with the support platform 20, while the other part of the rear cover 122 of the housing assembly 12 is not in contact with the support platform 20. In other words, the first part 100 of the electronic device 10 is not in contact with the support platform 20, while the second part 200 of the electronic device 10 is in contact with the support platform 20. The electronic device 10 can be used as a laptop computer.

[0108] It should be noted that, in this first usage mode, the x-direction is the length direction of the first part 100 of the electronic device 10, the y-direction is the width direction (rotation axis direction) of the first part 100 of the electronic device 10, and the z-direction is the thickness direction of the first part 100 of the electronic device 10.

[0109] like Figure 2 and Figure 3 As shown, in the second usage mode, the housing assembly 12 is in a fully open state, the first part 100 and the second part 200 of the electronic device 10 are in a flat state (that is, the angle between the plane where the first part 100 is located and the plane where the second part 200 is located is about 180°), the middle frame 121 of the housing assembly 12 is in contact with the support platform 20, the support frame 13 of the electronic device 10 can be supported on the support platform 20, and the electronic device 10 can be used as a large screen display.

[0110] like Figure 4 As shown, in the third usage mode, the housing assembly 12 is in a fully open state, and the first part 100 and the second part 200 of the electronic device 10 are in a flat state (that is, the angle between the plane where the first part 100 is located and the plane where the second part 200 is located is approximately 180°). The rear cover 122 of the housing assembly 12 is in contact with the support platform 20. In other words, both the first part 100 and the second part 200 of the electronic device 10 are in contact with the support platform 20, and the electronic device 10 can be used as a tablet.

[0111] It should be noted that the support platform 20 can be a solid structure such as a table or display stand, or it can be a human body part such as a hand or leg, or it can be other virtual structures. It should be understood that the support platform 20 can be a plane, a curved surface, or other shapes, and this application does not limit it in this regard.

[0112] Regardless of the usage mode of the electronic device 10, some components inside the electronic device 10 will generate heat. As the heat generated by the electronic device 10 increases, it will affect the operating performance of the electronic device 10 and reduce the user experience. Therefore, it is necessary to dissipate heat from the electronic device 10. In this embodiment, a heat dissipation module 600 is provided inside the electronic device 10 to achieve heat dissipation. It should be understood that the heat dissipation module 600 in this embodiment can also be referred to as a vapor chamber (VC).

[0113] Figure 6 and Figure 7 The location of the heat dissipation module 600 in the electronic device 10 is shown. Among them, Figure 6 This is a schematic diagram showing the installation position of the heat dissipation module 600 in the first usage mode of the electronic device 10. Figure 7 This is a schematic diagram showing the installation position of the heat dissipation module 600 of the electronic device 10 in its second usage mode.

[0114] like Figure 6 and Figure 7As shown, the electronic device 10 may include a heat-generating element (which may include a first heat-generating element 310 and a second heat-generating element 320) and a heat dissipation module 600, the heat dissipation module 600 being used to dissipate heat from the heat-generating element. It should be understood that... Figure 6 and Figure 7 The illustration primarily uses two heat-generating components as an example. It should be noted that the number of heat-generating components included in the electronic device 10 is not limited in this application embodiment; the number of heat-generating components can be one or more. In the following description, the structure of the heat dissipation module 600 is mainly illustrated using an example where the heat-generating components include a first heat-generating component 310 and a second heat-generating component 320.

[0115] For example, in combination Figures 5 to 7 As shown, the first heating element 310 and the second heating element 320 can be disposed on the motherboard 300, and the motherboard 300 can be fixedly connected to the middle frame 121. The first heating element 310 and the second heating element 320 can be heating devices located at different positions on the motherboard 300.

[0116] In some examples, the electronic device 10 may include a first fan 510 and a second fan 520. The first fan 510, the second fan 520, and the heat dissipation module 600 may be located within a receiving cavity of the electronic device 10. For example, Figure 5 As shown, the first fan 510, the second fan 520, and the heat dissipation module 600 can be disposed between the mid-frame 121 and the back cover 122 of the electronic device 10. The heat dissipation module 600 can be fixedly connected to the motherboard 300, and the first fan 510 and the second fan 520 can be fixedly connected to the mid-frame 121.

[0117] For example, such as Figure 5 As shown, the heat dissipation module 600 may include a heat sink 640, which can be fixedly connected to the side of the heat dissipation module 600 facing the mid-frame 121 (or display screen 11) and located at the air outlet of the first fan 510 and / or the second fan 520. The heat dissipation module 600 can transfer the heat from the first heat-generating component 310 and the second heat-generating component 320 to the heat sink 640. The air blown out by the first fan 510 and the second fan 520 can pass through the heat sink 640 to remove the heat from the heat sink 640, ultimately achieving heat dissipation for the first heat-generating component 310 and the second heat-generating component 320. It should be understood that, in this embodiment, by setting a dual-fan heat dissipation architecture, the heat dissipation efficiency and heat dissipation capacity of the electronic device can be improved.

[0118] In some examples, such as Figure 6 and Figure 7As shown, the middle frame 121 may include a side panel, which is connected between the display screen 11 and the back cover 122. The side panel may be provided with a first air inlet 101, a first air outlet 102, a second air inlet 103 and a second air outlet 104. The first air inlet 101 and the second air inlet 103 are used for the intake of the first fan 510 and the second fan 520, respectively, and the first air outlet 102 and the second air outlet 104 are used for the exhaust of the first fan 510 and the second fan 520, respectively.

[0119] For example, the middle frame 121 may include a first side plate 1211, a second side plate 1212, and a third side plate 1213 connected together. The second side plate 1212 is connected between the first side plate 1211 and the third side plate 1213, and the first side plate 1211 and the third side plate 1213 are two opposite side plates. A first air inlet 101 may be provided on the first side plate 1211, a second air inlet 103 may be provided on the third side plate 1213, and a first air outlet 102 and a second air outlet 104 may be provided on the second side plate 1212.

[0120] In some embodiments, the heat dissipation module 600 may include multiple modules, which may be disposed on the first part 100 of the electronic device 10, or on the second part 200 of the electronic device 10, or partially disposed on the first part 100 and partially disposed on the second part of the electronic device 10. This application does not specifically limit the specific placement of these modules. The position of the heat dissipation module 600 can be determined based on the position of the heat-generating components on the motherboard 300 to dissipate heat from the electronic device 10 in a timely manner.

[0121] For example, such as Figure 6 and Figure 7 As shown, the heat dissipation module 600 can be disposed on the first part 100 of the electronic device 10, and the first air inlet 101, the first air outlet 102, the second air inlet 103, and the second air outlet 104 can be disposed on the side panel of the middle frame of the first part 100. With this structural design, on the one hand, since the air inlets and outlets are disposed on the first part 100 of the electronic device 10, the hot air blown by the fan will not pass through the user, thereby improving the user experience. On the other hand, by opening the air inlets and outlets on the side panel of the middle frame of the first part 100 of the electronic device 10, it is possible to avoid opening air inlets and outlets on the outer surface of the electronic device 10 for heat dissipation, thereby improving the aesthetic appearance of the electronic device 10.

[0122] It should be understood that Figure 5 and Figure 6 The electronic device 10 shown is merely illustrative; the dimensions, shape, and position of the first heating element 310, the second heating element 320, and the heat dissipation module 600 can be configured as needed. This application does not limit the specific structure of the electronic device 10.

[0123] Considering that the electronic device 10 has multiple usage modes, when the electronic device 10 is used as a large screen (in the second usage mode), the air inlet and outlet will come into contact with the support platform 20, which may affect the airflow of the fan. In order to achieve smooth airflow in various usage modes, the embodiment of this application has made certain improvements to the structure of the air inlet and outlet. By improving the structure of the air inlet and outlet, a smooth airflow design under a dual-fan architecture that is compatible with multiple usage modes can be achieved.

[0124] Figure 8 This is a schematic diagram of the air outlet structure provided in an embodiment of this application. The structure of the air inlet can be referenced from the structure of the air outlet. Figure 8 As shown, the first air outlet 102 and the second air outlet 104 can be elliptical racetrack-shaped holes. Exemplarily, the first air inlet 101 and the second air inlet 103 can also be elliptical racetrack-shaped holes. That is, at least one of the first air inlet 101, the second air inlet 103, the first air outlet 102, and the second air outlet 104 can be designed as an elliptical racetrack-shaped hole. By setting the air inlet and / or outlet as elliptical racetrack-shaped holes, the area of ​​the air inlet and outlet can be increased, which is more conducive to the airflow of the fan, providing greater airflow to the fan and facilitating heat dissipation of electronic devices. In other embodiments, the first air inlet 101, the second air inlet 103, the first air outlet 102, or the second air outlet 104 may not be set as elliptical racetrack-shaped holes, but rather as through holes of other shapes (such as squares), which is not limited in this application.

[0125] In some examples, at least one of the first air inlet 101, the second air inlet 103, the first air outlet 102, and the second air outlet 104 can share a channel with a speaker or other structure, thereby saving space.

[0126] Figure 9A and Figure 9B This is a structural schematic diagram of the air inlet provided in an embodiment of this application. For example... Figure 9A and Figure 9B As shown, in the second usage mode, the support frame 13 of the electronic device 10 can be supported on the support platform 20, and a first acute angle can be formed between the central axis of the first air inlet 101 and the plane where the display screen 11 is located. And / or, the central axis of the second air inlet 103 can form a second acute angle with the plane where the display screen 11 is located. It should be noted that, considering that the electronic device 10 may be affected in the second usage mode, thus affecting the heat dissipation of the electronic device 10. Therefore, by tilting the first air inlet 101 and / or the second air inlet 103 relative to the plane where the display screen 11 is located, the support platform 20 is prevented from blocking the fan air intake, thus avoiding affecting the heat dissipation of the electronic device.

[0127] In some examples, the first acute angle ( The angle of the first air inlet 101 and the second air inlet 103 is greater than or equal to 15°, and the included angle of the second acute angle is greater than or equal to 15°. By limiting the tilt angle of the first air inlet 101 and the second air inlet 103 to greater than or equal to 15°, it is more conducive to the air intake of the fan, thereby ensuring smooth air intake of the electronic device 10 in various usage modes.

[0128] In some examples, the central axis of the first air outlet 102 forms a third acute angle with the plane where the display screen 11 is located, and / or, the central axis of the second air outlet 104 forms a fourth acute angle with the plane where the display screen 11 is located. For example, the third acute angle is greater than or equal to 15°, and the fourth acute angle is greater than or equal to 15°. By tilting the first air outlet 102 and / or the second air outlet 104 relative to the plane where the display screen 11 is located, the support platform 20 is prevented from obstructing the fan exhaust, thereby ensuring unobstructed airflow for the electronic device 10 in various usage modes, and thus not affecting the heat dissipation of the electronic device.

[0129] In some embodiments, such as Figure 9B As shown, the electronic device 10 may also include a foot pad 14, which can be fixedly connected to the housing assembly 12 of the electronic device 10. The connection method is not limited; for example, it can be fixedly connected by mechanical engagement or by adhesive. This application does not limit the material of the foot pad 14. For example, the foot pad 14 can be made of plastic or metal.

[0130] For example, the number of foot pads 14 can be one or more. The foot pads 14 can be fixedly connected to at least one of the first side plate 1211, the second side plate 1212, the third side plate 1213 or the rear cover 122.

[0131] For example, the foot pad 14 can be disposed on the first side panel 1211 or the rear cover 122 near the first side panel 1211, and the foot pad 14 can be used to elevate the first air inlet 101. As another example, the foot pad 14 can be disposed on the third side panel 1213 or the rear cover 122 near the third side panel 1213, and the foot pad 14 can be used to elevate the second air inlet 103. Yet another example, the foot pad 14 can be disposed simultaneously on the first side panel 1211, the rear cover 122 near the first side panel 1211, the third side panel 1213, and the rear cover 122 near the third side panel 1213, and the foot pad 14 can be used to elevate the first air inlet 101 and the second air inlet 103. At least a portion of the foot pad 14 is exposed outside the electronic device 10. The foot pad 14 can elevate the electronic device 10 so that the housing assembly 12 can be removed from the support platform. This can increase the distance between the first air inlet 101 and / or the second air inlet 103 and the support platform 20, reduce the obstruction of the air intake by the support platform 20, and achieve smooth air intake from the front and rear sides of the display screen 11 to avoid affecting the heat dissipation of the electronic device 10.

[0132] For example, the foot pad 14 can be set on the second side plate 1212 or the rear cover 122 near the second side plate 1212. The foot pad 14 can be used to raise the first air outlet 102 and the second air outlet 104, which can increase the distance between the first air outlet 102 and the second air outlet 104 and the support platform 20, reduce the obstruction of the air outlet by the support platform 20, and realize smooth air outlet on the front and rear sides of the display screen 11, so as to avoid affecting the heat dissipation of the electronic device 10.

[0133] The structure of the heat dissipation module 600 provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings. The heat dissipation module 600 can be applied in the above-mentioned electronic device 10, and the heat dissipation module 600 realizes heat dissipation of heat-generating components on the motherboard 300.

[0134] Figures 10 to 13 This is a top view of the heat dissipation module 600 provided in the embodiments of this application on the xy plane.

[0135] In some embodiments, the heat dissipation module 600 can be used to dissipate heat from a heat-generating component. For example... Figure 10 As shown, the heat dissipation module 600 may include a first region 621 and a second region 622. The first region 621 is used for heat dissipation, and the second region 622 may be connected to the first heat-generating component 310 of the electronic device 10. For example, the first heat-generating component 310 may be a central processing unit (CPU), a charging module, a power conversion module, or other heat-generating devices on the motherboard 300 (such as memory, controller, etc.), and this application does not limit this.

[0136] For example, the second region 622 can be in direct contact with and fixedly connected to the first heating element 310, or other structural components can be provided between the second region 622 and the first heating element 310, and the second region 622 and the first heating element 310 can be connected through other structural components. For example, the other structural components here can be thermally conductive foam, graphene, thermally conductive gel, thermally conductive silicone grease, etc., and this application does not limit them.

[0137] For example, the first region 621 is used for heat dissipation, and the second region 622 is used for heat absorption. The first region 621 is positioned away from the first heat-generating element 310 inside the electronic device 10 relative to the second region 622. The second region 622 is fixedly connected to the first heat-generating element 310, and the heat from the first heat-generating element 310 can be transferred to the second region 622, vaporizing the liquid working medium (such as water) in the second region 622 into gas, which fills the cavity of the heat dissipation module 600. After the gas comes into contact with the cooler first region 621, it liquefies into liquid, dissipating the heat. The liquid working medium liquefied in the first region 621 flows back to the second region 622 under the capillary force of the capillary structure of the heat dissipation module 600, and continues to vaporize in the second region 622, repeating the cycle to continuously dissipate heat for the first heat-generating element 310.

[0138] In some embodiments, the heat dissipation module 600 can be used to dissipate heat from multiple (e.g., two) heat-generating components. Figure 11 and Figure 12 As shown, the heat dissipation module 600 may include a first region 621, a second region 622, and a third region 623. The first region 621 is used for heat dissipation, the second region 622 can be connected to the first heat-generating component 310 of the electronic device 10, and the third region 623 can be connected to the second heat-generating component 320 of the electronic device 10. The heat generated by the first heat-generating component 310 is greater than that generated by the second heat-generating component 320. The first heat-generating component 310 may be a device on the motherboard 300 with a larger heat generation, and the second heat-generating component 320 may be a device on the motherboard 300 with a relatively smaller heat generation. For example, the first heat-generating component 310 may be a central processing unit (CPU), and the second heat-generating component 320 may be a charging module, a power conversion module, or other heat-generating components on the motherboard 300 (such as memory, controller, etc.).

[0139] For example, the second heat-generating element 320 has a larger dimension in the first direction (z-direction) than the first heat-generating element 310 in the first direction (z-direction). That is, the height (or thickness) of the second heat-generating element 320 is greater than the height (or thickness) of the first heat-generating element 310. It should be understood that the heat dissipation module 600 can be applied to heat dissipation of heat-generating elements of various sizes. Considering that the second heat-generating element 320 has a larger dimension in the first direction than the first heat-generating element 310, the size and heat output of the heat-generating elements of the electronic device 10 can be comprehensively considered when designing the structure of the heat dissipation module 600, so that the heat dissipation module 600 can meet the heat dissipation requirements of heat-generating elements with different heat outputs and different sizes. In other words, the heat dissipation module 600 provided in this application embodiment can dissipate heat from heat-generating elements of different sizes and with different heat outputs.

[0140] For example, the third region 623 can be in direct contact with and fixedly connected to the second heating element 320, or other structural components can be provided between the third region 623 and the second heating element 320, with the third region 623 and the second heating element 320 connected through other structural components. For example, the other structural components here can be thermally conductive foam, graphene, thermally conductive gel, thermally conductive silicone grease, etc., and this application does not limit them.

[0141] For example, the first region 621 is used for heat dissipation, and the second region 622 and the third region 623 are used for heat absorption. The first region 621 is positioned away from the heat-generating devices (first heat-generating element 310 and second heat-generating element 320) inside the electronic device 10 relative to the second region 622 and the third region 623. The second region 622 is fixedly connected to the first heat-generating element 310, and the heat from the first heat-generating element 310 can be transferred to the second region 622, vaporizing the liquid working medium (such as water) in the second region 622 into gas, which fills the cavity of the heat dissipation module 600. After the gas comes into contact with the lower-temperature first region 621, it liquefies into liquid, dissipating the heat. The liquid working medium liquefied in the first region 621 flows back to the second region 622 under the capillary force of the capillary structure of the heat dissipation module 600, and continues to vaporize in the second region 622, repeating the cycle to achieve continuous heat dissipation. The third region 623 is fixedly connected to the second heating element 320. The heat from the second heating element 320 can be transferred to the third region 623, vaporizing the liquid working medium (such as water) in the third region 623 into gas. The gas fills the cavity of the heat dissipation module 600. After the gas comes into contact with the first region 621, which has a lower temperature, it liquefies into liquid and dissipates the heat. The liquid working medium liquefied in the first region 621 flows back to the third region 623 under the capillary force of the capillary structure of the heat dissipation module 600, and continues to vaporize in the third region 623. This cycle repeats, achieving continuous heat dissipation.

[0142] In some embodiments, such as Figure 11 and Figure 12 As shown, the first region 621 includes a fourth region 6211 and a fifth region 6212 that are interconnected, and the fourth region 6211 and the fifth region 6212 can be used for heat dissipation. For example, the fourth region 6211 and the fifth region 6212 can be two interconnected heat dissipation regions. For example, the heat dissipation module 600 can have an approximately "Y" shaped structure or a "T" shaped structure.

[0143] For example, such as Figure 11 and Figure 12As shown, in the top view (xy plane), the heat dissipation module 600 can be in the form of a "T" shape. The first region 621 of the heat dissipation module 600 is located in the horizontal region of the "T" shape, that is, the fourth region 6211 and the fifth region 6212 are located in the horizontal region of the "T" shape. The second region 622 and the third region 623 are located in the vertical region of the "T" shape. The third region 623 is adjacent to the second region 622.

[0144] It should be noted that, in Figure 11 In the text, the overlapping area of ​​the horizontal and vertical axes of the "T"-shaped structure belongs to the first region 621, which means that... Figure 11 The thickness of the transverse regions of the "T"-shaped structure is the same. Figure 12 In the middle, the horizontal and vertical overlapping areas of the "T"-shaped structure belong to the second region 622, that is to say, Figure 12 The thickness of the overlapping area between the horizontal and vertical axes of the "T"-shaped structure is different from the thickness of the horizontal areas on both sides of the "T"-shaped structure. For example, the thickness of the overlapping area between the horizontal and vertical axes of the "T"-shaped structure can be less than the thickness of the horizontal areas on both sides of the "T"-shaped structure.

[0145] In some embodiments, the heat dissipation module 600 can be used to dissipate heat from multiple (e.g., three) heat-generating components. Figure 13 As shown, the electronic device 10 also includes a third heating element 330, which can be a heating device mounted on the motherboard 300. The heat generated by the third heating element 330 is less than that generated by the first heating element 310. The heat dissipation module 600 also includes a sixth region 624, which can be connected to the third heating element 330. Exemplarily, the sixth region 624 can be in contact with and fixedly connected to the third heating element 330, or other structural components can be provided between the sixth region 624 and the third heating element 330, and the sixth region 624 and the third heating element 330 can be connected through other structural components. Exemplarily, the other structural components can be thermally conductive foam, graphene, thermally conductive gel, thermally conductive silicone grease, etc., and this application does not limit them.

[0146] It should be understood that the embodiments of this application do not specifically limit the relative magnitude of the heat output of the third heating element 330 and the second heating element 320. In the embodiments of this application, the heat output of the third heating element 330 may be greater than, equal to or less than the heat output of the second heating element 320.

[0147] It should be understood that the embodiments of this application do not specifically limit the size relationship between the third heating element 330 and the second heating element 320. In the embodiments of this application, the size of the third heating element 330 may be greater than, equal to or smaller than the size of the second heating element 320.

[0148] For example, the third heating element 330 can be a charging module, a power conversion module, or other heat-generating devices on the motherboard (such as a memory, controller, etc.). The third heating element 330 can be the same type of device as the second heating element 320 but in a different location, or the third heating element 330 and the second heating element 320 can be different types of devices. For example, the second heating element 320 is a power conversion module, and the third heating element 330 is a charging module, a memory, or a controller.

[0149] In some examples, the dimension of the third heating element 330 in the first direction (z-direction) can be larger than the dimension of the first heating element 310 in the first direction (z-direction). In other examples, the dimension of the third heating element 330 in the first direction can be smaller than or equal to the dimension of the first heating element 310 in the first direction; this application does not limit this. In the embodiments of this application, the heat dissipation module 600 can dissipate heat for heating elements of different sizes, and can meet the heat dissipation requirements of heating elements with different heat outputs and different sizes.

[0150] For example, the second heating element 320 and the third heating element 330 can be distributed around the first heating element 310, and correspondingly, the sixth region 624 and the third region 623 can be located around the first region 621. For example, as Figure 13 As shown, the second heating element 320 and the third heating element 330 can be distributed on both sides of the first heating element 310, and the sixth region 624 and the third region 623 can be located on both sides of the first region 621.

[0151] It should be noted that the number and size of the heat-generating components are not limited in the embodiments of this application. The electronic device 10 may also include more heat-generating components, and the heat dissipation module 600 may also include a heat absorption area corresponding to the heat-generating component, so as to transfer the heat of the heat-generating component to the heat sink 640 to achieve heat dissipation.

[0152] In some embodiments, combined with Figure 5 , Figures 11 to 13 As shown, the fourth region 6211 and the fifth region 6212 of the heat dissipation module 600 can be equipped with heat sinks 640. The fourth region 6211 can be connected to the outside of the first heat sink 641, and the fifth region 6212 can be connected to the outside of the second heat sink 642. The first heat sink 641 can be located at the air outlet of the first fan 510, and the second heat sink 642 can be located at the air outlet of the second fan 520. The operation of the first fan 510 and the second fan 520 can dissipate the heat from the first heat sink 641 and the second heat sink 642, thereby achieving heat dissipation for the electronic device.

[0153] Figure 14 and Figure 15 This is a schematic diagram of the heat dissipation module 600 provided in the embodiments of this application projected onto the yz plane. Figure 16 and Figure 17 This is a schematic diagram of the projection of another heat dissipation module 600 provided in the embodiment of this application onto the yz plane. Figure 18 and Figure 19 This is a schematic projection of another heat dissipation module 600 provided in this application embodiment onto the yz plane. Wherein, Figure 15 , Figure 17 and Figure 19 The internal structural components of the heat dissipation module 600 are not shown. Figure 20 This is a schematic projection of the heat dissipation module 600 provided in this application embodiment onto the xz plane. It should be understood that, considering that when projected along the xz plane, other heat-generating components will be blocked by the first heat-generating component 310, therefore... Figure 20 The schematic diagram shown only shows the first heating element 310.

[0154] like Figures 14 to 20 As shown, the heat dissipation module 600 may include a heat dissipation module housing 610 and a capillary structure. The heat dissipation module housing 610 includes a first cover plate 611 and a second cover plate 612. The capillary structure includes a capillary mesh 620 and capillary threads 630. The second cover plate 612 and the first cover plate 611 are arranged along a first direction (z-direction), and the edges of the first cover plate 611 and the second cover plate 612 are fixedly connected to form a closed cavity between the first cover plate 611 and the second cover plate 612. The capillary structure is located within this cavity, and the cavity contains a liquid working fluid. The capillary structure guides the flow of the liquid working fluid within the cavity. For example, the liquid working fluid may be one or more of water, ethanol, methanol, acetone, fluorinated liquid, etc., and this application does not specifically limit it.

[0155] It should be noted that one end of the capillary structure can contact the second cover plate 612, and the other end of the capillary structure can contact the first cover plate 611; or, the other end of the capillary structure can not contact the first cover plate 611, but there is a certain gap between them. When the capillary structure includes a capillary mesh 620 and capillary threads 630, one end of the capillary mesh 620 can contact the second cover plate 612 and cover the second cover plate 612; the capillary threads 630 can be arranged on the side of the capillary mesh 620 facing the first cover plate 611 (the capillary threads 630 can contact the first cover plate 611, or there can be a certain gap between them), or the capillary threads 630 can be fixedly connected to the first cover plate 611 (the side of the capillary threads 630 facing the second cover plate 612 can contact the capillary mesh 620, or there can be a certain gap between them).

[0156] For example, the first cover plate 611 and the second cover plate 612 can be fixedly connected by welding. For example, the material of the first cover plate 611 can be at least one of stainless steel, copper, and titanium, and the material of the second cover plate 612 can also be at least one of stainless steel, copper, and titanium. For example, the first cover plate 611 can be made of stainless steel, or a composite material of stainless steel and copper, i.e., copper is plated on the surface of stainless steel. The material of the second cover plate 612 can be the same as or different from that of the first cover plate 611. In this embodiment, the cavity formed by the first cover plate 611 and the second cover plate 612 has different thicknesses in different areas, i.e., the first cover plate 611 or the second cover plate 612 is an uneven structure. The first cover plate 611 or the second cover plate 612 can be formed by stamping, requiring the first cover plate 611 or the second cover plate 612 to have high strength. By setting the material of the first cover plate 611 or the second cover plate 612 to at least one of high-strength stainless steel, copper, and titanium, it is beneficial to the processing of the heat dissipation module 600 and improve the manufacturing yield of the heat dissipation module 600.

[0157] In this embodiment of the application, in order to better dissipate heat from the electronic device 10, the thickness of the cavity of the heat dissipation module 600 can be different in different areas.

[0158] In some embodiments, combined with Figure 10 , Figure 14 and Figure 15 As shown, the cavity may include a first cavity 601 and a second cavity 602 that are interconnected. The first cavity 601 is located in the first region 621 of the heat dissipation module 600, and the second cavity 602 is located in the second region 622 of the heat dissipation module 600. The first region 621 is used for heat dissipation, and the second region 622 is used to connect the first heating element 310 to transfer the heat of the first heating element 310.

[0159] See Figure 15 The dimension H1 of the first cavity 601 in the first direction is greater than the dimension H2 of the second cavity 602 in the first direction. It should be understood that the dimension of the cavity in the first direction can refer to the spacing between the structures that enclose the cavity in the first direction. For example, the dimension H1 of the first cavity 601 in the first direction can refer to the spacing between the first cover plate 611 and the second cover plate 612 corresponding to the first region 621 in the first direction. The dimension H2 of the second cavity 602 in the first direction can refer to the spacing between the first cover plate 611 and the second cover plate 612 corresponding to the second region 622 in the first direction. The dimension H1 of the first cavity 601 in the first direction can be understood as the thickness of the first cavity 601 being H1, and the dimension H2 of the second cavity 602 in the first direction can be understood as the thickness of the second cavity 602 being H2.

[0160] In some embodiments, combined with Figure 11 , Figure 16 and Figure 17 As shown, the cavity may include a first cavity 601, a second cavity 602, and a third cavity 603 that are interconnected. The first cavity 601 is located in the first region 621 of the heat dissipation module 600, the second cavity 602 is located in the second region 622 of the heat dissipation module 600, and the third cavity 603 is located in the third region 623 of the heat dissipation module 600. The first region 621 is used for heat dissipation, the second region 622 is used to connect the first heating element 310 to transfer the heat of the first heating element 310, and the third region 623 is used to connect the second heating element 320 to transfer the heat of the second heating element 320.

[0161] See Figure 17 The dimension H1 of the first cavity 601 in the first direction is greater than the dimension H2 of the second cavity 602 in the first direction, and the dimension H2 of the second cavity 602 in the first direction is greater than the dimension H3 of the third cavity 603 in the first direction. It should be understood that the dimension of a cavity in the first direction can refer to the spacing between the structures that enclose the cavity in the first direction. For example, the dimension H3 of the third cavity 603 in the first direction can refer to the spacing between the first cover plate 611 and the second cover plate 612 corresponding to the third region 623 in the first direction. The dimension H3 of the third cavity 603 in the first direction can be understood as the thickness of the third cavity 603 being H3.

[0162] In some embodiments, combined with Figure 13 , Figure 18 and Figure 19 As shown, the cavity of the heat dissipation module 600 may further include a fourth cavity 604, which is interconnected with the first cavity 601, the second cavity 602 and the third cavity 603. The fourth cavity 604 is located in the sixth region 624 of the heat dissipation module 600. The sixth region 624 is used to connect the third heating element 330 to transfer the heat of the third heating element 330.

[0163] For example, such as Figure 19 As shown, the dimension H4 of the fourth cavity 604 in the first direction can be smaller than the dimension H1 of the first cavity 601 in the first direction, the dimension H2 of the second cavity 602 in the first direction, and the dimension H3 of the third cavity 603 in the first direction. Correspondingly, the dimension of the third heating element 330 in the first direction can be larger than the dimension of the second heating element 320 in the first direction and the dimension of the first heating element 310 in the first direction.

[0164] In this embodiment, considering the different heat generation and dimensions of the heat-generating components inside the electronic device 10, the structure of the heat dissipation module 600 needs to be designed specifically to dissipate heat from the electronic device 10 and meet its heat dissipation requirements. In the structural design of the heat dissipation module 600, for example, by setting the dimension H1 of the first cavity 601 in the first direction to be larger than the dimension H2 of the second cavity 602 in the first direction, the air resistance of the gas in the first cavity 601 is reduced and the flow capacity is increased, which facilitates the timely and rapid diffusion of gas from the second cavity 602 to the first cavity 601, thereby achieving heat dissipation for the first heat-generating component 310. Furthermore, considering that the heat generation of the first heat-generating component 310 is greater than that of the second heat-generating component 320, by setting the dimension of the second cavity 602 in the first direction to be larger than the dimension of the third cavity 603 in the first direction, the gas in the second cavity 602 can diffuse to the first cavity more timely and rapidly than the gas in the third cavity 603, thereby carrying away more heat from the first heat-generating component 310 and achieving efficient heat dissipation for the first heat-generating component 310. The above structural design helps to improve the heat dissipation efficiency and heat dissipation capacity of the heat dissipation module, thereby meeting the heat dissipation requirements of electronic devices.

[0165] In some embodiments, combined with Figure 11 , Figure 16 and Figure 20 As shown, in the first direction (z-direction), the size of the portion of the capillary structure located in the first region 621 is larger than the size of the portion of the capillary structure located in the second region 622, and the size of the portion of the capillary structure located in the second region 622 is larger than the size of the portion of the capillary structure located in the third region 623. The size of the capillary structure in the first direction can be understood as the thickness of the capillary structure. In some examples, combined with... Figure 13 , Figure 18 and Figure 19 As shown, the size of the portion of the capillary structure located in the third region 623 is larger than the size of the portion of the capillary structure located in the sixth region 624.

[0166] It should be understood that by setting the dimension H1 of the first cavity 601 in the first direction to be greater than the dimension H2 of the second cavity 602 in the first direction, and the dimension H2 of the second cavity 602 in the first direction to be greater than the dimension H of the third cavity 603 in the first direction, that is, by making the thickness of the first cavity 601 greater than the thickness of the second cavity 602, and the thickness of the second cavity 602 greater than the thickness of the first cavity 601, a larger cavity can be provided to set a thicker capillary structure, thereby increasing the capillary force of the capillary structure in the first cavity 601, increasing the liquid reflux capacity in the first cavity 601, and enabling the liquid in the first cavity 601 to reflux into the second cavity 602 and the third cavity 603.

[0167] It should be noted that, in this embodiment, the electronic device 10 may include multiple heat-generating components, and the heat output, size, and location of these components may vary. Therefore, when designing the heat dissipation module 600, the heat output, size, and location of the multiple heat-generating components can be comprehensively considered to design a heat dissipation module that meets the requirements, enabling the heat dissipation module to transfer and dissipate heat from the multiple heat-generating components. In other words, the structure of the heat dissipation module 600 can be modified accordingly based on the heat output, size, and location of the multiple heat-generating components to meet the heat dissipation requirements of the electronic device 10.

[0168] As mentioned earlier, the electronic device 10 can have various usage forms, such as being horizontal, vertical, or flat. The relative position of the heat dissipation module 600 will change in different usage scenarios. Figure 7 In the scenario shown, there may be a reverse gravity problem. The reverse gravity problem can be understood as the situation where the liquid in the first cavity 601 experiences its own gravity and the capillary force of the capillary structure in different directions, causing the liquid to be unable to overcome gravity and flow back into the second cavity 602, the third cavity 603 and the fourth cavity 604 through capillary force.

[0169] When a counter-gravity situation occurs, liquid accumulates in the first cavity 601, affecting its return flow to the second cavity 602, third cavity 603, and fourth cavity 604, thereby reducing the heat dissipation capacity of the heat dissipation module 600. This embodiment addresses this by incorporating a thicker capillary structure (the maximum thickness of the capillary structure in the first cavity 601 can reach H1) within the larger first cavity 601. This increases the capillary force within the capillary structure, facilitating the liquid's overcoming of gravity and achieving return flow even in counter-gravity scenarios.

[0170] Figure 21 This is a perspective structural diagram of the heat dissipation module 600 provided in the embodiments of this application on the xy plane. Figure 22 for Figure 21 A schematic diagram of the cross-section along the AA direction. Figure 23 for Figure 21 A schematic diagram of the cross-section along the BB direction. Figure 24 for Figure 21 A schematic diagram of the cross-section along the CC direction. Figure 25 for Figure 21 A schematic diagram of the cross-section along the DD direction.

[0171] Combination Figure 16 , Figure 20 and Figure 21As shown, the capillary structure may include a capillary mesh 620 and capillary threads 630. The capillary mesh 620 is fixed to the second cover plate 612, and the capillary threads 630 are disposed between the capillary mesh 620 and the first cover plate 611. For example, the capillary threads 630 may be fixed to the side of the capillary mesh 620 facing the first cover plate 611, or the capillary threads 630 may be fixed to the first cover plate 611.

[0172] In some examples, the capillary mesh 620 can be pre-fixed to the second cover plate 612 by spot welding, and the capillary wire 630 can be pre-fixed to the capillary mesh 620 by spot welding. Finally, the first cover plate 611 and the second cover plate 612 are welded together. After welding, the heat dissipation module 600 is sintered at high temperature, thereby stably fixing the capillary mesh 620 to the second cover plate 612 and stably fixing the capillary wire 630 between the capillary mesh 620 and the first cover plate 611, thus realizing the fabrication of the heat dissipation module 600. In other examples, the capillary mesh 620 can be pre-fixed to the second cover plate 612 by spot welding, and the capillary wire 630 can be pre-fixed to the first cover plate 611 by spot welding. Finally, the first cover plate 611 and the second cover plate 612 are welded together. After welding, the heat dissipation module 600 is sintered at high temperature, thereby stably fixing the capillary mesh 620 to the second cover plate 612 and stably fixing the capillary wire 630 between the first cover plates 611, thus realizing the fabrication of the heat dissipation module 600. This application does not limit the fixing method of the capillary mesh 620 or the capillary wire 630 in the heat dissipation module 600.

[0173] In some examples, combined Figure 11 and Figure 20 As shown, in the first direction (z-direction), the size D1 of the portion of the capillary 630 located in the first region 621 is larger than the size D2 of the portion of the capillary 630 located in the second region 622. Combined with... Figure 11 , Figure 22 and Figure 25 As shown, in the first direction (z-direction), the size L1 of the portion of the capillary mesh 620 located in the first region 621 is larger than the size L3 of the portion of the capillary mesh 620 located in the third region 623, and the size L2 of the portion of the capillary mesh 620 located in the second region 622 is larger than the size L3 of the portion of the capillary mesh 620 located in the third region 623. For example, refer to... Figure 24 The dimension L2 of the portion of the capillary mesh 620 located in the second region 622 is equal to the dimension L1 of the portion of the capillary mesh 620 located in the first region 621. The dimension of the capillary mesh 620 in the first direction can be understood as the thickness of the capillary mesh 620, and the dimension of the capillary thread 630 in the first direction can be understood as the thickness of the capillary thread 630.

[0174] For example, the capillary mesh 620 can be a porous mesh structure used to provide capillary force to the capillary structure. The capillary mesh 620 can be a mesh structure formed by weaving metal wires, or a mesh structure formed by sintering metal powder. The capillary thread 630 can be a porous strip structure used to guide the liquid working fluid and improve the capillary force of the capillary structure. The capillary thread 630 can be a structure formed by weaving metal wires (such as a strip structure), or a structure formed by sintering metal powder (such as a strip structure).

[0175] It should be understood that by laying the capillary mesh 620 entirely on the second cover plate 612, heat dissipation can be achieved for the first heating element 310 and the second heating element 320. By setting capillary filaments 630 on the side of the capillary mesh 620 facing the first cover plate 611 (first region 621 and second region 622), heat dissipation can be achieved for the first heating element 310, which generates more heat, thus meeting the heat dissipation requirements of different heating elements. In addition, by increasing the thickness of the portion of the capillary filaments 630 and the capillary mesh 620 in the first region 621, the thickness of the capillary structure in the first region 621 is increased, which is beneficial for providing sufficient capillary force to the liquid in the first cavity, facilitating liquid reflux, and solving the problem of anti-gravity.

[0176] For example, the number of capillary mesh 620 can be one or more layers (such as two layers), and this application does not specifically limit the number of layers of capillary mesh 620. For example, refer to Figure 22 and Figure 25 The area corresponding to the first heating element 310 (i.e., the second area 622) and the first area 621 of the heat dissipation area are provided with two layers of capillary mesh, and the area corresponding to the second heating element 320 (i.e., the third area 623) is provided with one layer of capillary mesh. It should be noted that... Figure 19 and Figure 25 The different thicknesses of the capillary mesh 620 can be understood as having different numbers of layers. The greater the thickness of the capillary mesh 620, the more layers are set; the smaller the thickness of the capillary mesh 620, the fewer layers are set.

[0177] In some examples, the capillary mesh 620 may include a first capillary mesh and a second capillary mesh. The first capillary mesh covers a first region 621, a second region 622, and a third region 623, while the second capillary mesh covers both regions 621 and 622. For example, two layers of capillary mesh may be provided in the second region 622, where the heat dissipation requirement is high (or the heat generation is high); while only one layer of capillary mesh may be provided in the third region 623, where the heat dissipation requirement is relatively low (or the heat generation is low). In this embodiment, the capillary mesh 620 may be a double-layer structure. The first capillary mesh may be laid across the entire surface of the second cover plate 612 to achieve large-area heat dissipation, while the second capillary mesh may be laid in the second region 622, where the heat generation is high, to enhance heat dissipation in local hot spots. This structural arrangement helps to improve the heat dissipation efficiency and capacity of the heat dissipation module, thereby meeting the heat dissipation requirements of electronic devices.

[0178] In some examples, combined Figure 11 and Figure 21 As shown, capillary 630 can cover the first region 621 and the second region 622. Capillary 630 includes a first capillary 631 and a second capillary 632. The first capillary 631 extends from the second region 622 to the fourth region 6211, and the second capillary 632 extends from the second region 622 to the fifth region 6212. The portion of the first capillary 631 located in the second region 622 is spaced apart from the portion of the second capillary 632 located in the second region 622 by a predetermined distance. This predetermined distance can be determined according to actual conditions, and this application does not limit it. In the embodiments of this application, the first capillary 631 and the second capillary 632 can be spaced apart by a predetermined distance at the heat source end (i.e., the second region 622), which can accelerate the evaporation of heat from the first heating element 310, allowing the liquid working fluid in the second region 622 to quickly vaporize into gas, achieving efficient heat dissipation.

[0179] For example, the preset distance between the portion of the first capillary 631 located in the second region 622 and the portion of the second capillary 632 located in the second region 622 can be a fixed value or a variable value. For instance, in the direction extending from the second region 622 to the first region 621, the preset distance between the portion of the first capillary 631 located in the second region 622 and the portion of the second capillary 632 located in the second region 622 can gradually increase.

[0180] It should be understood that, through the above structural design, the heat dissipation module 600 can achieve good heat dissipation of the heat-generating components of the electronic device 10 in both anti-gravity and non-anti-gravity scenarios, so that users can have a good user experience in any usage scenario (such as traditional laptop usage scenario, large screen usage scenario and tablet usage scenario, etc.).

[0181] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation module, used in electronic devices, characterized in that, include: A first cover plate, a second cover plate, and a capillary structure, wherein the first cover plate and the second cover plate are fixedly connected to form a closed cavity; The capillary structure is located within the cavity, which contains a liquid working fluid, and the capillary structure is used to guide the flow of the liquid working fluid within the cavity. The cavity includes a first cavity, a second cavity, and a third cavity that are interconnected. The first cavity is located in a first region of the heat dissipation module, the second cavity is located in a second region of the heat dissipation module, and the third cavity is located in a third region of the heat dissipation module. The first region is used for heat dissipation, the second region is used to connect a first heating element of the electronic device, and the third region is used to connect a second heating element of the electronic device. The heat generated by the first heating element is greater than the heat generated by the second heating element. The first cavity has a larger dimension in the first direction than the second cavity in the first direction, and the second cavity has a larger dimension in the first direction than the third cavity in the first direction. The first direction is the arrangement direction of the first cover plate and the second cover plate.

2. The heat dissipation module according to claim 1, characterized in that, The dimension of the second heating element in the first direction is larger than the dimension of the first heating element in the first direction.

3. The heat dissipation module according to claim 1 or 2, characterized in that, In the first direction, the size of the portion of the capillary structure located in the first region is larger than the size of the portion of the capillary structure located in the second region.

4. The heat dissipation module according to claim 1 or 2, characterized in that, In the first direction, the size of the portion of the capillary structure located in the second region is larger than the size of the portion of the capillary structure located in the third region.

5. The heat dissipation module according to claim 1 or 2, characterized in that, The capillary structure includes a capillary mesh and capillary threads. The capillary mesh is fixed to the second cover plate, and the capillary threads are disposed between the capillary mesh and the first cover plate. The capillary mesh covers the first region, the second region, and the third region, and the capillary threads cover the first region and the second region.

6. The heat dissipation module according to claim 5, characterized in that, In the first direction, the size of the portion of the capillary filament located in the first region is larger than the size of the portion of the capillary filament located in the second region.

7. The heat dissipation module according to claim 5, characterized in that, In the first direction, the size of the portion of the capillary web located in the first region is larger than the size of the portion of the capillary web located in the third region.

8. The heat dissipation module according to claim 6 or 7, characterized in that, In the first direction, the size of the portion of the capillary web located in the second region is larger than the size of the portion of the capillary web located in the third region.

9. The heat dissipation module according to claim 6 or 7, characterized in that, The capillary web includes a first capillary web and a second capillary web, wherein the first capillary web covers the first region, the second region and the third region, and the second capillary web covers the first region and the second region.

10. The heat dissipation module according to claim 6 or 7, characterized in that, The capillary includes a first capillary and a second capillary, and the first region includes a fourth region and a fifth region that are interconnected. The first capillary extends from the second region to the fourth region, and the second capillary extends from the second region to the fifth region. The portion of the first capillary located in the second region is spaced apart from the portion of the second capillary located in the second region by a predetermined distance.

11. The heat dissipation module according to claim 10, characterized in that, The heat dissipation module also includes a heat sink, which is fixedly connected to the fourth region and / or the fifth region.

12. The heat dissipation module according to claim 1 or 2, characterized in that, The cavity further includes a fourth cavity, which is interconnected with the first cavity, the second cavity and the third cavity. The fourth cavity is located in the sixth region of the heat dissipation module. The sixth region is used to connect the third heating element of the electronic device. The heat generated by the third heating element is less than that generated by the first heating element. The dimension of the fourth cavity in the first direction is smaller than the dimension of the first cavity in the first direction, and the dimension of the fourth cavity in the first direction is smaller than the dimension of the second cavity in the first direction.

13. The heat dissipation module according to claim 12, characterized in that, The dimension of the third heating element in the first direction is greater than the dimension of the first heating element in the first direction.

14. The heat dissipation module according to claim 1 or 2, characterized in that, The capillary structure is a porous structure woven from metal wires or a porous structure formed by sintering metal powder.

15. An electronic device, characterized in that, include: The heat dissipation module comprises a first heating element, a second heating element, and a heat dissipation module as described in any one of claims 1 to 14, wherein the first heating element is connected to a second region of the heat dissipation module, the second heating element is connected to a third region of the heat dissipation module, and the heat dissipation module is used to dissipate heat from the first heating element and the second heating element.

16. The electronic device according to claim 15, characterized in that, The electronic device also includes a display screen, a housing, a first fan, and a second fan; The display screen and the housing form a receiving cavity, and the first fan, the second fan, the first heating element, the second heating element and the heat dissipation module are located inside the receiving cavity; The first region of the heat dissipation module includes a fourth region and a fifth region that are interconnected. The air outlet of the first fan is configured to correspond to the fourth region, and the air outlet of the second fan is configured to correspond to the fifth region.

17. The electronic device according to claim 16, characterized in that, The housing includes a side panel and a rear cover, the side panel being connected between the display screen and the rear cover; The side panel is provided with a first air inlet, a second air inlet, a first air outlet, and a second air outlet. The first air inlet and the second air inlet are used for the intake of the first fan and the second fan, respectively, and the first air outlet and the second air outlet are used for the exhaust of the first fan and the second fan, respectively.

18. The electronic device according to claim 17, characterized in that, The central axis of the first air inlet forms a first acute angle with the plane where the display screen is located, and the central axis of the second air inlet forms a second acute angle with the plane where the display screen is located.

19. The electronic device according to claim 18, characterized in that, The first acute angle is greater than or equal to 15°, and the second acute angle is greater than or equal to 15°.

20. The electronic device according to any one of claims 17 to 19, characterized in that, The electronic device also includes a foot pad disposed on the housing, the foot pad being used to elevate at least one of the first air inlet, the second air inlet, the first air outlet, and the second air outlet.

21. The electronic device according to any one of claims 17 to 19, characterized in that, At least one of the first air inlet, the second air inlet, the first air outlet, and the second air outlet is an elliptical runway opening.

22. An electronic device, characterized in that, include: The device includes a display screen, a housing, a heat dissipation module, a heat-generating component, and a fan. The display screen and the housing form a receiving cavity. The fan, the heat-generating component, and the heat dissipation module are located within the receiving cavity. The heat dissipation module is used to transfer the heat from the heat-generating component to the air outlet of the fan. The housing includes a side panel and a rear cover. The side panel is connected between the display screen and the rear cover. The side panel is provided with an air inlet and an air outlet. The air inlet is used for the intake of air from the fan, and the air outlet is used for the exhaust of air from the fan. The central axis of the air inlet has a third acute angle with the plane where the display screen is located, and / or the central axis of the air outlet has a fourth acute angle with the plane where the display screen is located.

23. The electronic device according to claim 22, characterized in that, The included angle of the third acute angle is greater than or equal to 15°, and the included angle of the fourth acute angle is greater than or equal to 15°.

24. The electronic device according to claim 22 or 23, characterized in that, The air inlet and / or the air outlet are elliptical runway-shaped openings.

25. The electronic device according to claim 22 or 23, characterized in that, The electronic device also includes feet disposed on the housing, the feet being used to elevate the air inlet and / or the air outlet.

26. The electronic device according to claim 22 or 23, characterized in that, The fan includes a first fan and a second fan, the air inlet includes a first air inlet and a second air inlet, and the air outlet includes a first air outlet and a second air outlet. The first air inlet and the second air inlet are used for the intake of air for the first fan and the second fan, respectively, and the first air outlet and the second air outlet are used for the exhaust of air for the first fan and the second fan, respectively. The side panel includes a first side panel, a second side panel, and a third side panel, wherein the second side panel is connected between the first side panel and the third side panel, and the first side panel and the third side panel are two opposite side panels. The first air inlet is disposed on the first side plate, the second air inlet is disposed on the third side plate, and the first air outlet and the second air outlet are disposed on the second side plate.

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