A power control board suitable for an outdoor energy storage device

Abstract

This utility model relates to a power control board suitable for outdoor energy storage devices, including a PCB board, a thermally conductive silicone pad, and a heat dissipation substrate. The PCB board is divided into a central area, a middle area, and an edge area. A signal processing unit is arranged in the central area, and a power component unit is arranged in the edge area. Two plug-in strips are fixed at the top of the central area, and a display is arranged above the central area. The bottom of the display is connected to the two plug-in strips respectively. Several spring pointer connectors are arranged in the middle area. The signal processing unit includes an MCU, a temperature sensor, and a current sensor. The MCU is located at the center of the central area. The layout of the power control board is divided into a central area, a middle area, and an edge area, thereby separating the components of the power control board and solving the problem of large local heat accumulation during operation, thus improving the stability and reliability of the power control board.

Description

Technical Field

[0001] This utility model relates to the field of power control board technology, and specifically to a power control board suitable for outdoor energy storage devices. Background Technology

[0002] With the increasing demand for outdoor activities and emergency power supply, portable outdoor energy storage devices are widely used due to their lightweight and modular design, such as camping power supplies and portable photovoltaic energy storage systems. These devices need to integrate efficient energy management and environmental adaptability functions within a limited volume. Their core relies on the intelligent regulation capabilities of the power control board, including battery status monitoring, charge and discharge optimization, and multi-scenario adaptation, to ensure a safe and stable power supply in complex outdoor environments.

[0003] In the power control board layout of existing outdoor energy storage devices, high-power components such as MOSFETs and inductors are usually concentrated in a certain area of ​​the circuit board. This concentrated distribution will cause a large amount of local heat to accumulate during operation, forming a high-temperature area, which will lead to solder joint aging and capacitor failure, seriously affecting the performance and life of the components, and thus affecting the stability and reliability of the entire power control board. Utility Model Content

[0004] The purpose of this invention is to provide a power control board suitable for outdoor energy storage devices, so as to overcome the shortcomings of the prior art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A power control board suitable for outdoor energy storage devices includes a PCB board, a thermally conductive silicone pad, and a heat dissipation substrate. The PCB board is divided into a central area, a middle area, and an edge area. A signal processing unit is arranged in the central area, and a power component unit is arranged in the edge area. Two plug-in strips are fixed at the top of the central area, and a display is arranged above the central area. The bottom of the display is plugged into the two plug-in strips respectively.

[0007] Based on the above technical solution, the present invention can be further improved as follows.

[0008] Furthermore, a number of spring pointer connectors are provided in the intermediate area.

[0009] Furthermore, the signal processing unit includes an MCU, a temperature sensor, and a current sensor. The MCU is located at the very center of the central area, the temperature sensor is located to the left of the MCU, and the current sensor is located to the right of the MCU.

[0010] Furthermore, a shielding boundary layer located outside the signal processing unit is provided within the central area.

[0011] Furthermore, the power component unit includes MOSFETs, DC-DC chips, inductors, capacitors, and protection circuit components. There are several MOSFETs located above the signal processing unit. There are two groups of DC-DC chips, which are symmetrically distributed below the signal processing unit. The inductors are located below the DC-DC chips. There are several capacitors located on the right side of the signal processing unit. The protection circuit components are located on the left side of the signal processing unit.

[0012] Furthermore, the protection circuit element includes GDT, MOV, and PPTC components.

[0013] Furthermore, the thermally conductive silicone pad is disposed at the bottom of the PCB board, the heat dissipation substrate is disposed at the bottom of the thermally conductive silicone pad, and four spring screws, all of which penetrate the heat dissipation substrate, are disposed on the front side of the PCB board.

[0014] Compared with the prior art, the beneficial effects of this utility model are: the layout of the power control board is divided into a central area, a middle area and an edge area, thereby separating the components of the power control board and solving the problem of large local heat accumulation during operation, thus improving the stability and reliability of the power control board. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention from one perspective;

[0016] Figure 2 This is a three-dimensional structural diagram of the present invention from another perspective;

[0017] Figure 3 This is a three-dimensional structural diagram of the present invention from one of its perspectives;

[0018] Figure 4 This is a three-dimensional structural diagram of the present invention from another perspective.

[0019] The attached diagram lists the components represented by each number as follows:

[0020] 1. PCB board; 101. Central area; 102. Middle area; 103. Edge area; 2. Signal processing unit; 201. MCU; 202. Temperature sensor; 203. Current sensor; 3. Power component unit; 301. MOSFET; 302. DC-DC chip; 303. Inductor; 304. Capacitor; 305. Protection circuit components; 4. Connector strip; 5. Display; 6. Spring pointer connector; 7. Thermal conductive silicone pad; 8. Heat dissipation substrate; 9. Spring screw. Detailed Implementation

[0021] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0022] Example 1, such as Figures 1-4 As shown, a power control board suitable for outdoor energy storage devices includes a PCB board 1, a thermally conductive silicone pad 7, and a heat dissipation substrate 8. The PCB board 1 is divided into a central area 101, a middle area 102, and an edge area 103. A signal processing unit 2 is disposed in the central area 101, and a power component unit 3 is disposed in the edge area 103. Two plug-in strips 4 are fixed on the top of the central area 101, and a display 5 is disposed above the central area 101. The bottom of the display 5 is plugged into the two plug-in strips 4 respectively.

[0023] Based on the division of the central area 101, intermediate area 102, and edge area 103, the signal processing unit 2 is installed in the central area 101, and then the display 5 is installed through the plug-in strip 4, so that the housing of the energy storage device can be aligned with the display 5 during installation, and a gap is left between it and the signal processing unit 2 to facilitate airflow to remove the heat generated by the signal processing unit 2 during operation. The high heat-generating components are placed in the edge area 103 to reduce the impact on the components in the central area 101.

[0024] Example 2 is a further improvement based on Example 1, and it is as follows: Several spring pointer connectors 6 are provided in the middle area 102, and all spring pointer connectors 6 are evenly distributed on the left and right sides of the signal processing unit 2.

[0025] This configuration allows for the addition of extra expansion modules via the spring pointer connector 6, facilitating the installation of additional components according to user needs.

[0026] Example 3 is a further improvement based on Example 1, and its specific details are as follows: The signal processing unit 2 includes an MCU 201, a temperature sensor 202 and a current sensor 203. The MCU 201 is located at the center of the central area 101, the temperature sensor 202 is located to the left of the MCU 201, and the current sensor 203 is located to the right of the MCU 201. The MCU 201, the temperature sensor 202 and the current sensor 203 are all soldered to the PCB board 1.

[0027] This configuration places the signal processing unit in the central area 101 of the PCB board 1, away from the high-power heat-generating components and external interference sources in the edge area 103, thereby improving the stability and accuracy of signal transmission.

[0028] Example 4 is a further improvement on Example 3, and its specific details are as follows: a shielding boundary layer located outside the signal processing unit 2 is provided in the central area 101.

[0029] This configuration effectively reduces the impact of electromagnetic interference on signal processing unit 2.

[0030] Example 5 is a further improvement on Example 1, and is as follows: The power component unit 3 includes a MOSFET 301, a DC-DC chip 302, an inductor 303, a capacitor 304, and a protection circuit element 305. There are several MOSFETs 301, which are located above the signal processing unit 2. There are two groups of DC-DC chips 302, which are symmetrically distributed on the left and right sides and located below the signal processing unit 2. The inductor 303 is located below the DC-DC chip 302. There are several capacitors 304, which are located on the right side of the signal processing unit 2. The protection circuit element 305 is located on the left side of the signal processing unit 2. The MOSFETs 301, DC-DC chips 302, inductors 303, capacitors 304, and protection circuit elements 305 are all soldered to the PCB board 1.

[0031] This arrangement disperses the heat-generating components in power component unit 3, facilitating heat dissipation to the outside and improving the efficiency of PCB board 1.

[0032] Example 6 is a further improvement on Example 5, and its specific details are as follows: The protection circuit element 305 includes GDT, MOV and PPTC elements.

[0033] This configuration gives PCB board 1 three levels of protection, which improves the overall protection performance.

[0034] Example 7 is a further improvement based on Example 1. Specifically, the thermal conductive silicone pad 7 is disposed at the bottom of the PCB board 1, and the heat dissipation substrate 8 is disposed at the bottom of the thermal conductive silicone pad 7. Four spring screws 9 are disposed on the front side of the PCB board 1, all of which penetrate the heat dissipation substrate 8. Multiple heat dissipation grooves are opened in the heat dissipation substrate 8 to form heat dissipation fins.

[0035] This configuration allows the heat on the PCB board 1 to be effectively conducted through the thermal conductive silicone pad 7 and dissipated through the heat dissipation substrate 8. Furthermore, the spring screw 9 reduces the impact of vibration on the PCB board 1 during the movement of the energy storage device.

[0036] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A power control board suitable for outdoor energy storage devices, comprising a PCB board (1), a thermally conductive silicone pad (7), and a heat dissipation substrate (8), characterized in that: The PCB board (1) is divided into a central area (101), a middle area (102) and an edge area (103). A signal processing unit (2) is provided in the central area (101), and a power component unit (3) is provided in the edge area (103). Two plug-in bars (4) are fixed on the top of the central area (101). A display (5) is provided above the central area (101), and the bottom of the display (5) is plugged into the two plug-in bars (4) respectively.

2. The power control board for outdoor energy storage devices according to claim 1, characterized in that: Several spring pointer connectors (6) are provided in the intermediate area (102).

3. A power control board suitable for outdoor energy storage devices according to claim 1, characterized in that: The signal processing unit (2) includes an MCU (201), a temperature sensor (202), and a current sensor (203). The MCU (201) is located at the center of the central area (101), the temperature sensor (202) is located to the left of the MCU (201), and the current sensor (203) is located to the right of the MCU (201).

4. A power control board suitable for outdoor energy storage devices according to claim 3, characterized in that: The central area (101) is provided with a shielding boundary layer located outside the signal processing unit (2).

5. A power control board suitable for outdoor energy storage devices according to claim 1, characterized in that: The power element unit (3) includes a MOSFET (301), a DC-DC chip (302), an inductor (303), a capacitor (304), and a protection circuit element (305). There are several MOSFETs (301) located above the signal processing unit (2). There are two groups of DC-DC chips (302) located symmetrically below the signal processing unit (2). The inductor (303) is located below the DC-DC chip (302). There are several capacitors (304) located on the right side of the signal processing unit (2). The protection circuit element (305) is located on the left side of the signal processing unit (2).

6. A power control board suitable for outdoor energy storage devices according to claim 5, characterized in that: The protective circuit element (305) includes GDT, MOV, and PPTC components.

7. A power control board suitable for outdoor energy storage devices according to claim 1, characterized in that: The thermally conductive silicone pad (7) is disposed at the bottom of the PCB board (1), and the heat dissipation substrate (8) is disposed at the bottom of the thermally conductive silicone pad (7). Four spring screws (9) are disposed on the front side of the PCB board (1), and all of them penetrate the heat dissipation substrate (8).

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