A semiconductor wafer cleaning apparatus

Abstract

This utility model relates to the field of wafer cleaning technology and discloses a semiconductor wafer cleaning device that solves the problems mentioned in the background art. It includes a cleaning machine body with a partition plate inside, dividing the interior of the cleaning machine body into a cleaning chamber and a recovery and conveying chamber. A cleaning box is provided inside the cleaning chamber, and a wafer slot is provided inside the cleaning box. The bottom of the cleaning box has a through hole that penetrates the partition plate and communicates with the recovery and conveying chamber. The recovery and conveying chamber includes a recovery box located at the bottom of the cleaning box. A cleaning fluid delivery box is located at the bottom of the recovery and conveying chamber and is connected to a cleaning tube. This utility model has the advantages of reducing waste liquid treatment costs and environmental pressure, allowing the cleaning fluid to be reused multiple times, reducing chemical consumption, and preventing wafers from colliding with each other.

Description

Technical Field

[0001] This utility model belongs to the field of wafer cleaning technology, specifically a semiconductor wafer cleaning device. Background Technology

[0002] In semiconductor manufacturing, wafer cleaning is a crucial step. Its purpose is to remove contaminants (such as particles, organic matter, metal ions, etc.) from the wafer surface to ensure the yield of subsequent processes and device performance.

[0003] Currently, RCA cleaning is the mainstream technology for semiconductor wafer cleaning and is widely used in various wafer fabs. However, RCA cleaning solution is usually discarded after one cleaning and cannot be reused. This not only leads to a huge waste of high-purity chemicals, but also significantly increases production costs. In addition, existing cleaning machines clean wafers together, and collisions between wafers can easily cause wear during the cleaning process. Therefore, we propose a semiconductor wafer cleaning device. Utility Model Content

[0004] To address the problems mentioned in the background art, this utility model provides the following technical solution: a semiconductor wafer cleaning apparatus, comprising a cleaning machine body, wherein a partition plate is disposed within the cleaning machine body, the partition plate dividing the interior of the cleaning machine body into a cleaning chamber and a recovery and conveying chamber.

[0005] The cleaning chamber is equipped with a cleaning box, which contains a wafer slot. The bottom of the cleaning box has a through hole that penetrates a partition plate and communicates with the recovery and conveying chamber.

[0006] The recycling and conveying chamber includes a recycling box located at the bottom of the cleaning box. A cleaning fluid conveying box is located at the bottom of the recycling and conveying chamber and is connected to a cleaning pipe. The cleaning pipe passes through a partition plate and is located at the top of the cleaning box. A filter assembly is installed on the recycling box and is connected to the recycling box through the recycling pipe. The other end of the recycling pipe is connected to the cleaning fluid conveying box.

[0007] Preferably, the cleaning tube has two tubes, which are symmetrically arranged on both sides of the cleaning box. The head of the cleaning tube is provided with a nozzle to improve the uniformity of the cleaning fluid coverage, avoid cleaning dead corners, enhance the cleaning effect, and reduce the residue of contaminants on the wafer surface.

[0008] Preferably, a pump body is provided on the cleaning pipe to provide power to pump the cleaning fluid from the cleaning fluid delivery box to the cleaning box. The cleaning fluid is composed of sulfuric acid, hydrogen peroxide and water.

[0009] Preferably, the cleaning machine body is provided with an observation window, which is made of transparent material, so that the operator can monitor the cleaning process in real time and detect problems in a timely manner.

[0010] Preferably, the cleaning pipe is fixed to the side wall of the cleaning chamber by a fastener to prevent the cleaning pipe from shaking or falling off during operation and to ensure the stability of the cleaning fluid delivery.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] During operation, the wafer to be cleaned is horizontally inserted into the wafer slot inside the cleaning box. The slot is secured with a flexible material to prevent displacement or collision caused by vibration or liquid impact during cleaning. The pump is activated, pumping the cleaning solution stored in the cleaning solution delivery box to the top of the cleaning box through two symmetrically arranged cleaning pipes. The cleaning solution is atomized or directed through the nozzles, evenly covering the wafer surface. The symmetrical nozzle design ensures that the front and back sides and edges of the wafer are fully wetted by the cleaning solution, avoiding cleaning dead spots. The cleaning solution dissolves or oxidizes organic matter, metal ions, and other contaminants on the wafer surface. After use, the cleaning solution, carrying contaminants, flows through the through-hole at the bottom of the cleaning box into the recovery box below by gravity or negative pressure. The waste liquid in the recovery box passes through the filtration assembly to remove contaminants step by step. The filtered cleaning solution flows back to the cleaning solution delivery box for storage through the recovery pipe. The cleaning solution is manually replenished according to the consumption, reducing waste liquid treatment costs and environmental pressure. The cleaning solution can be reused multiple times, reducing chemical consumption and preventing wafers from colliding with each other. Attached Figure Description

[0013] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0014] Figure 1 This is a front view structural diagram of the present invention;

[0015] Figure 2 This is a schematic diagram of the cross-sectional structure of this utility model;

[0016] Figure 3 This is a schematic diagram of the chip slot of this utility model;

[0017] In the diagram: 1. Cleaning machine body; 2. Divider plate; 3. Cleaning box; 4. Wafer slot; 5. Recovery box; 6. Cleaning fluid delivery box; 7. Cleaning tube; 8. Filter assembly; 9. Recovery tube; 10. Nozzle; 11. Observation window; 12. Fixture. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0019] Depend on Figure 1-3 The present invention includes a cleaning machine body 1, and a partition plate 2 is provided inside the cleaning machine body 1, which divides the interior of the cleaning machine body 1 into a cleaning chamber and a recycling and conveying chamber.

[0020] The cleaning chamber is equipped with a cleaning box 3, which contains a wafer slot 4. The bottom of the cleaning box 3 has a through hole that penetrates the partition plate 2 and communicates with the recycling and conveying chamber.

[0021] The recycling and conveying chamber includes a recycling box 5, which is located at the bottom of the cleaning box 3. A cleaning fluid conveying box 6 is located at the bottom of the recycling and conveying chamber. The cleaning fluid conveying box 6 is connected to a cleaning pipe 7. The cleaning pipe 7 passes through the partition plate 2 and is located at the top of the cleaning box 3. A filter assembly 8 is located on the recycling box 5. The filter assembly 8 is connected to the recycling box 5 through a recycling pipe 9. The other end of the recycling pipe 9 is connected to the cleaning fluid conveying box 6.

[0022] There are two cleaning tubes 7, which are symmetrically arranged on both sides of the cleaning box 3. The head of the cleaning tube 7 is equipped with a nozzle 10 to improve the uniformity of the cleaning fluid coverage, avoid cleaning dead corners, enhance the cleaning effect, and reduce the residue of contaminants on the wafer surface.

[0023] A pump body is installed on the cleaning pipe 7 to provide power to pump the cleaning solution from the cleaning solution delivery box 6 to the cleaning box 3. The cleaning solution is composed of sulfuric acid (H2SO4), hydrogen peroxide (H2O2), and water.

[0024] The main body 1 of the cleaning machine is equipped with an observation window 11, which is made of transparent material, so that the operator can monitor the cleaning process in real time and detect problems in time.

[0025] The cleaning pipe 7 is fixed to the side wall of the cleaning chamber by the fastener 12 to prevent the cleaning pipe 7 from shaking or falling off during operation and to ensure the stability of the cleaning fluid delivery.

[0026] Working principle: During operation, the wafer to be cleaned is horizontally inserted into the wafer slot 4 inside the cleaning box 3. The slot is secured to the wafer by a flexible material to prevent displacement or collision caused by vibration or liquid impact during the cleaning process. The pump is activated, pumping the cleaning solution stored in the cleaning solution delivery box 6 to the top of the cleaning box 3 through two symmetrically arranged cleaning pipes 7. The cleaning solution is atomized or directed through the nozzles 10, evenly covering the wafer surface. The symmetrically distributed nozzle design ensures that the front and back sides and edges of the wafer are fully wetted by the cleaning solution, avoiding cleaning dead spots, dissolution or oxidation of the cleaning solution. Organic matter, metal ions, and other contaminants on the wafer surface are removed by the cleaning solution after use. The cleaning solution carries these contaminant particles and metal ions through the through-hole at the bottom of the cleaning box 3 and flows into the recycling box 5 below by gravity or negative pressure. The waste liquid in the recycling box 5 passes through the filter assembly 8 to remove contaminants step by step. The filtered cleaning solution flows back to the cleaning solution delivery box 6 for storage through the recycling pipe 9. The cleaning solution is manually replenished according to the consumption of the cleaning solution, which reduces the cost of waste liquid treatment and environmental pressure. The cleaning solution can be reused multiple times, reducing the amount of chemicals consumed and preventing the wafers from colliding with each other.

[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer cleaning apparatus, comprising a cleaning machine body (1), characterized in that: The cleaning machine body (1) is provided with a partition plate (2), which divides the interior of the cleaning machine body (1) into a cleaning chamber and a recycling and conveying chamber. The cleaning chamber is equipped with a cleaning box (3), and the cleaning box (3) has a wafer slot (4) inside. The bottom of the cleaning box (3) has a through hole that penetrates the partition plate (2) and communicates with the recycling and conveying chamber. The recycling and conveying chamber includes a recycling box (5), which is located at the bottom of the cleaning box (3). A cleaning fluid conveying box (6) is located at the bottom of the recycling and conveying chamber. The cleaning fluid conveying box (6) is connected to a cleaning pipe (7). The cleaning pipe (7) passes through a partition plate (2) and is located at the top of the cleaning box (3). A filter assembly (8) is located on the recycling box (5). The filter assembly (8) is connected to the recycling box (5) through a recycling pipe (9). The other end of the recycling pipe (9) is connected to the cleaning fluid conveying box (6).

2. The semiconductor wafer cleaning apparatus according to claim 1, characterized in that: The cleaning tube (7) has two tubes, which are symmetrically arranged on both sides of the cleaning box (3). The head of the cleaning tube (7) is provided with a nozzle (10).

3. The semiconductor wafer cleaning apparatus according to claim 2, characterized in that: The cleaning pipe (7) is equipped with a pump body, and the cleaning solution is composed of sulfuric acid, hydrogen peroxide and water.

4. The semiconductor wafer cleaning apparatus according to claim 3, characterized in that: The cleaning machine body (1) is provided with an observation window (11), which is made of transparent material.

5. A semiconductor wafer cleaning apparatus according to claim 4, characterized in that: The cleaning pipe (7) is mounted on the side wall of the cleaning chamber via a fastener (12).

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