Wafer film pasting device

Abstract

The application relates to a wafer film pasting device which comprises a base, a recess for containing a wafer is arranged on one side of the top of the base, a positioning mechanism for positioning the wafer is arranged in the recess, a cover body for covering the recess is hingedly arranged on one side of the top of the base, a pressing mechanism extending to the top of the wafer is arranged on the cover body, and a cutting mechanism is arranged on the pressing mechanism; the pressing mechanism comprises a U-shaped frame arranged radially above the wafer, a pressing roller is arranged in the opening of the U-shaped frame, and the top of the U-shaped frame is connected with the output shaft of the motor on the cover body through a square rod; the cutting mechanism comprises a circular plate for the square rod to pass through, a slide groove with a convex-shaped section structure is arranged around the top of the circular plate, a slide block matched with the slide groove is arranged in the slide groove, a motor-driven push rod with the output shaft connected with the slide block is arranged on the cover body, a mounting rod is radially arranged on the circular plate, and a cutting blade is arranged at the bottom of the mounting rod. The wafer film pasting device has the advantages of simple structure and convenient use.

Description

Technical Field

[0001] This invention relates to the field of wafer bonding, and particularly to a wafer bonding device. Background Technology

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seed crystals. Then it is slowly pulled out to form a cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, which is a wafer. Before the wafer is thinned or cut, a film needs to be attached to the side of the wafer with the circuit structure to protect the circuit structure.

[0003] Specifically, a movable wafer laminating device with patent number CN219778860U has the following drawbacks when laminating wafers: it requires manual operation of pressure rollers to press the blue film onto the wafer, which is not conducive to improving production efficiency and reducing labor intensity. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer bonding device.

[0005] The technical problem of this invention is mainly solved by the following technical solution:

[0006] A wafer lamination device includes a base, a groove for accommodating a wafer is provided on one side of the top of the base, a positioning mechanism for positioning the wafer is provided in the groove, a cover covering the groove is hinged to one side of the top of the base, a pressing mechanism extending to the top of the wafer is provided on the cover, and a cutting mechanism is provided on the pressing mechanism.

[0007] The pressing mechanism includes a convex frame radially arranged directly above the wafer, with a pressure roller installed inside the opening of the convex frame, and the top side of the convex frame connected to the motor output shaft on the cover via a square rod;

[0008] The cutting mechanism includes a circular plate for a square rod to pass through. A groove with a convex cross-section is arranged around the top of the circular plate. A slider adapted to the groove is arranged in the groove. An electric push rod with an output shaft connected to the slider is arranged on the cover. A mounting rod is also arranged radially on the circular plate. A cutting blade is arranged at the bottom of the mounting rod.

[0009] Preferably, the top of the cover is provided with a rim that surrounds the motor and electric push rod, and a cover plate is provided at the top opening of the rim. The cover plate is fixed to the rim with bolts, and a vent pipe is also provided on the side wall of the rim.

[0010] Preferably, one end of the pressure roller extends to the outside of the wafer, the length of the pressure roller is greater than the radius of the wafer and less than its diameter, the mounting rod is located above the shaped frame, the mounting rod is staggered from the shaped frame, the end of the mounting rod is fitted with a sliding sleeve that is locked by bolts, the top of the cutting blade is fixed to the sliding sleeve by bolts, and the bottom of the cutting blade is higher than the horizontal plane of the bottom of the pressure roller.

[0011] Preferably, the square rod is coaxially arranged with the wafer, and the circular plate is provided with a square hole for the square rod to pass through, and the square rod and the square hole are matched in size.

[0012] Preferably, a receiving groove is provided on the other side of the top of the base, a film roller is provided in the receiving groove, and a connecting groove is provided on the top of the base to connect the receiving groove and the groove, and a guide roller is provided in the connecting groove.

[0013] Preferably, the positioning mechanism includes movable grooves on both sides of the bottom of the groove, a slider is provided in the movable groove, one end of the slider extends to the bottom of the wafer, the top of the slider is provided with an arc plate for clamping the edge of the wafer, the base is also provided with positive and negative lead screws passing through the two sets of sliders, the slider is provided with a screw hole for screwing the positive and negative lead screws, and the end of the positive and negative lead screws extends to the outside of the base and is equipped with a handle.

[0014] The beneficial effects of this invention are: In this invention, the pressing mechanism is rotated by a motor to press and bond the blue film to the wafer, so that no bubbles or wrinkles will appear, thus improving the film bonding quality. At the same time, by changing the height position of the circular plate, the motor can drive the cutting mechanism to rotate through the square rod, so that the cutting blade in the cutting mechanism can perform circular cutting on the film on the wafer to remove the excess blue film on the outside of the wafer. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the present invention;

[0016] Figure 2 This is a cross-sectional view of the present invention;

[0017] Figure 3 yes Figure 2 Enlarged view of point A in the middle.

[0018] In the diagram: 1. Base, 2. Groove, 3. Wafer, 4. Positioning mechanism, 41. Movable groove, 42. Slider, 43. Arc plate, 44. Positive and negative lead screws, 5. Cover, 6. Pressing mechanism, 61. C-shaped frame, 62. Pressure roller, 63. Square rod, 64. Motor, 7. Cutting mechanism, 71. Circular plate, 72. Slide groove, 73. Slider, 74. Electric push rod, 75. Mounting rod, 76. Cutting blade, 8. Edge, 9. Cover plate, 10. Sliding sleeve, 11. Receiving groove, 12. Membrane roller, 13. Connecting groove, 14. Guide roller. Detailed Implementation

[0019] The technical solution of the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0020] A wafer lamination device includes a base 1, a groove 2 for accommodating a wafer 3 is provided on one side of the top of the base 1, a positioning mechanism 4 for positioning the wafer 3 is provided in the groove 2, a cover 5 for covering the groove 2 is hinged to one side of the top of the base 1, a pressing mechanism 6 extending to the top of the wafer 3 is provided on the cover 5, and a cutting mechanism 7 is provided on the pressing mechanism 6.

[0021] The pressing mechanism 6 includes a convex frame 61 radially arranged directly above the wafer 3. A pressure roller 62 is provided in the opening of the convex frame 61. The top side of the convex frame 61 is connected to the output shaft of the motor 64 on the cover 5 through a square rod 63.

[0022] The cutting mechanism 7 includes a circular plate 71 through which a square rod 63 passes. The square rod 63 is coaxially arranged with the wafer 3. The circular plate 71 has a square hole through which the square rod 63 passes. The square rod 63 and the square hole are matched in size. A groove 72 with a convex cross-section is arranged around the top of the circular plate 71. A slider 73 that matches the groove 72 is arranged in the groove 72. An electric push rod 74 with an output shaft connected to the slider 73 is arranged on the cover 5. A mounting rod 75 is also arranged radially on the circular plate 71. A cutting blade 76 is arranged at the bottom of the mounting rod 75.

[0023] The top of the cover 5 is provided with a rim 8 that surrounds the motor 64 and the electric push rod 74. A cover plate 9 is provided at the top opening of the rim 8. The cover plate 9 is fixed to the rim 8 with bolts. A vent pipe is also provided on the side wall of the rim 8 for ventilation.

[0024] like Figure 2As shown, one end of the pressure roller 62 extends to the outside of the wafer 3. The length of the pressure roller 62 is greater than the radius of the wafer 3 but less than its diameter, so that when the motor 64 drives the mortise frame 61 via the square rod 63 to rotate the pressure roller 62 above the wafer 3 and cause the pressure roller 62 to roll, the pressure roller 62 can cover the entire top end face of the wafer 3. The mounting rod 75 is located above the mortise frame 61, and the mounting rod 75 is staggered from the mortise frame 61. Figure 2 As shown, the left end of the shaped bracket 61 and the pressure roller 62 extends to the outside of the wafer 3, while the right end of the mounting rod 75 extends to the outside of the wafer 3. The end of the mounting rod 75 is fitted with a sliding sleeve 10 that is fixed by bolts. The top of the cutting blade 76 is fixed to the sliding sleeve 10 by bolts, and the bottom of the cutting blade 76 is higher than the bottom of the pressure roller 62. That is to say, the position of the cutting blade 76 can be adjusted by adjusting the position of the sliding sleeve 10 on the mounting rod 75. At the same time, when the pressure roller 62 presses the wafer 3 and the blue film together, the cutting blade 76 is suspended above the blue film and does not contact it.

[0025] like Figure 2 As shown, a receiving groove 11 is provided on the other side of the top of the base 1, and a film roller 12 is provided in the receiving groove 11. A connecting groove 13 is provided on the top of the base 1, connecting the receiving groove 11 and the groove 2, and a guide roller 14 is provided in the connecting groove 13.

[0026] The positioning mechanism 4 includes movable grooves 41 disposed on both sides of the bottom of the groove 2. A slider 42 is disposed in the movable groove 41. One end of the slider 42 extends to the bottom of the wafer 3. An arc plate 43 for clamping the edge of the wafer 3 is disposed on the top of the slider 42. A positive and negative lead screw 44 passing through the two sets of sliders 43 is also disposed in the base 1. The slider 42 is provided with a screw hole for screwing the positive and negative lead screw 44. The end of the positive and negative lead screw 44 extends to the outside of the base 1 and is equipped with a handle.

[0027] The method of using this invention is as follows: First, the sliced ​​wafer 3 is placed between two sets of arc plates 43 in the groove 2. The slider 42 is driven to slide in the movable groove 41 by rotating the forward and reverse lead screws 44, thereby indirectly driving the two sets of arc plates 43 to move, thereby reducing the distance between the two sets of arc plates 43. This allows the two sets of arc plates 43 to clamp and position the wafer 3. Then, the blue film outside the film roller 12 is pulled so that it covers the wafer 3 after passing through the guide roller 14.

[0028] Next, cover 5 is placed on top. At this time, cover 5 drives the pressure roller 62 on the pressing mechanism 6 to press tightly against the wafer 3, while the cutting blade 76 is suspended above the blue film on the outside of the wafer 3. The motor 64 drives the pressure roller 62 to rotate above the wafer 3 through the square rod 63 and the C-shaped frame 61. At the same time, the pressure roller 62 also rolls on the top of the wafer 3, thereby pressing the blue film tightly against the wafer 3. During this process, the side wall of the square rod 63 abuts against the side wall of the square hole, driving the circular plate 71 to move. The plates rotate in the same direction, and the groove 72 on the circular plate 71 slides on the slider 73. At this time, the circular plate 71 drives the cutting blade 76 to rotate through the mounting rod 75. The electric push rod 74 pulls the slider 73 to suspend it at a high position, thereby fixing the circular plate 71 to prevent it from moving down. Finally, the height of the cutting blade 76 is positioned so that the cutting blade 76 will not move down and contact the blue film, preventing the blue film on the wafer 3 from being cut off by the cutting blade 76 without being pressed.

[0029] After the blue film is pressed against the wafer 3, the electric push rod 74 drives the slider 73 to move down, while simultaneously moving the circular plate 71 downward on the square rod 63. At this time, the circular plate 71 drives the cutting blade 76 to move down and contact the blue film through the mounting rod 75. Then, when the motor 64 drives the circular plate 71 to rotate through the square rod 63, the circular plate 71 drives the cutting blade 76 to make a circular motion through the mounting rod 75. At this time, the cutting blade 76 will cut off the excess blue film on the outside of the wafer 3.

[0030] The present invention has been described in detail above, but the content described is only a preferred embodiment of the present invention and should not be considered as limiting the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A wafer bonding device, comprising a base, characterized in that: The base has a groove on one side of its top that can accommodate a wafer. A positioning mechanism for positioning the wafer is provided in the groove. A cover that covers the groove is hinged to one side of the base. A pressing mechanism that extends to the top of the wafer is provided on the cover. A cutting mechanism is provided on the pressing mechanism. The pressing mechanism includes a convex frame radially arranged directly above the wafer, with a pressure roller installed inside the opening of the convex frame, and the top side of the convex frame connected to the motor output shaft on the cover via a square rod; The cutting mechanism includes a circular plate for a square rod to pass through. A groove with a convex cross-section is arranged around the top of the circular plate. A slider adapted to the groove is arranged in the groove. An electric push rod with an output shaft connected to the slider is arranged on the cover. A mounting rod is also arranged radially on the circular plate. A cutting blade is arranged at the bottom of the mounting rod.

2. The wafer bonding device according to claim 1, characterized in that: The top of the cover is provided with a rim that surrounds the motor and electric push rod. A cover plate is provided at the top opening of the rim and the cover plate is fixed to the rim with bolts. A vent pipe is also provided on the side wall of the rim.

3. The wafer bonding device according to claim 1, characterized in that: One end of the pressure roller extends to the outside of the wafer. The length of the pressure roller is greater than the radius of the wafer and less than its diameter. The mounting rod is located above the shaped frame. The mounting rod and the shaped frame are staggered. The end of the mounting rod is fitted with a sliding sleeve that is locked and fixed by bolts. The top of the cutting blade is fixed to the sliding sleeve by bolts. The bottom of the cutting blade is higher than the horizontal plane of the bottom of the pressure roller.

4. The wafer bonding device according to claim 1, characterized in that: The square rod is coaxially arranged with the wafer, and the circular plate is provided with a square hole for the square rod to pass through. The square rod and the square hole are matched in size.

5. A wafer lamination device according to claim 1, characterized in that: A receiving groove is provided on the other side of the top of the base, and a film roller is provided in the receiving groove. A connecting groove is provided on the top of the base to connect the receiving groove and the groove, and a guide roller is provided in the connecting groove.

6. The wafer bonding device according to claim 1, characterized in that: The positioning mechanism includes movable grooves on both sides of the bottom of the groove, with sliders installed in the movable grooves. One end of the slider extends to the bottom of the wafer, and the top of the slider is provided with an arc-shaped plate for clamping the edge of the wafer. The base is also provided with positive and negative lead screws passing through the two sets of sliders. The sliders are provided with screw holes for screwing the positive and negative lead screws, and the ends of the positive and negative lead screws extend to the outside of the base and are equipped with handles.

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