A vacuum transfer chamber
By employing a parallel cooling design in the vacuum transfer cavity and efficient transfer by a robotic arm, the problems of low efficiency and path redundancy in the wafer cooling process were solved, achieving a high-throughput and high-efficiency wafer cooling process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI FUCHUANGDE PRECISION EQUIP CO LTD
- Filing Date
- 2025-06-18
- Publication Date
- 2026-07-10
AI Technical Summary
In existing semiconductor manufacturing processes, the cooling process after wafer coating suffers from low serial cooling efficiency and time loss due to path redundancy, making it difficult to meet high-capacity requirements.
The design employs a vacuum transfer chamber, including a buffer chamber, a transfer chamber, and dual cooling chambers, to achieve parallel cooling of the wafer input and output paths. The efficient transfer between the buffer chamber and multiple chambers is achieved through a robotic arm, and the compact layout reduces the robotic arm's travel distance and optimizes air pressure control.
It improved the overall capacity of wafer cooling, shortened the transmission time, improved transmission efficiency and production efficiency, and ensured high-quality transmission in a vacuum environment.
Smart Images
Figure CN224482024U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, and in particular to a vacuum transmission cavity. Background Technology
[0002] In semiconductor manufacturing processes, the cooling process after wafer coating is crucial to production efficiency and yield. Traditional cooling processes typically employ a single cooling chamber, into which the high-temperature wafers after coating are sequentially cooled. However, this approach has significant drawbacks:
[0003] 1. Low efficiency of serial cooling: Since it relies on only a single cooling chamber, the wafers must be cooled sequentially. Even if a translation mechanism is used to cool multiple wafers at the same time, the throughput is still limited by the linear transmission speed and the chamber capacity, making it difficult to meet the demand for high production capacity.
[0004] 2. Path redundancy leads to time loss: The wafer input and output paths need to pass through multiple independent chambers such as buffer chambers and transmission chambers. The robot needs to move long distances between the dispersed chambers, which increases the wafer transmission time and equipment idle rate.
[0005] To address the aforementioned issues, the wafer fabrication equipment and process disclosed in patent number CN202311190246.5, which improves single-cycle cooling efficiency by optimizing the air pressure stability and transmission path of the cooling chamber, is still limited by the serial processing mode of a single cooling chamber and the distributed chamber layout, making it difficult to further break through the capacity bottleneck and thus unable to meet the high throughput and high stability requirements of semiconductor manufacturing. Utility Model Content
[0006] This invention addresses the shortcomings of existing technologies by providing a vacuum transfer cavity in which the wafer input and output paths can operate independently and simultaneously, achieving parallel cooling. By concentrating the loading and unloading cavities on one side of the buffer cavity, combined with the compact layout of the dual cooling cavities, the moving distance of the robotic arm is reduced, the wafer transfer time is shortened, and the transfer efficiency is improved.
[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0008] This utility model provides a vacuum transmission cavity, including a buffer cavity, a transmission cavity and at least two cooling cavities. The two sides of the cooling cavity are respectively connected to the buffer cavity and the transmission cavity. The buffer cavity is provided with a feeding cavity and a discharging cavity. The transmission cavity is provided with at least one first process cavity. The cooling cavity can be filled with or extracted with protective gas to regulate the gas pressure.
[0009] The buffer cavity is equipped with a first robotic arm, which is used to transfer the wafer between the buffer cavity and the loading cavity, unloading cavity or cooling cavity. The transfer cavity is equipped with a second robotic arm, which is used to transfer the wafer between the transfer cavity and the cooling cavity or the first process cavity.
[0010] The wafer's input path consists of the loading chamber, buffer chamber, cooling chamber, transfer chamber, and first process chamber, while the wafer's output path consists of the first process chamber, transfer chamber, cooling chamber, buffer chamber, and unloading chamber.
[0011] The buffer cavity is provided with several second process cavities, and the first robot arm realizes the transfer of wafers between the buffer cavity and the second process cavities.
[0012] The cooling chamber is equipped with a first valve and a second valve at its interface, and the cooling chamber, buffer chamber and transmission chamber are all equipped with vacuum gauges.
[0013] A third valve is installed at the interface between the buffer chamber and the feeding chamber, and a fourth valve is installed at the interface between the buffer chamber and the discharge chamber.
[0014] A fifth valve is installed at the interface between the first process chamber and the transmission chamber, and a sixth valve is installed at the interface between the second process chamber and the buffer chamber.
[0015] The cooling chamber is connected to a charging / discharging pipe, which is connected to a filter and a pneumatic diaphragm valve.
[0016] The end of the charging / discharging pipe that extends into the cooling chamber is connected to a gas diffuser.
[0017] The beneficial effects of this utility model are:
[0018] This invention enables the wafer input and output paths to operate independently and simultaneously, achieving parallel cooling. For example, cooling is achieved through a cooling chamber on the input path, and the wafer is cooled again through a cooling chamber on the output path, significantly improving overall production capacity. By concentrating the loading and unloading chambers on one side of the buffer chamber, combined with the compact layout of the dual cooling chambers, the moving distance of the robot arm is reduced, the wafer transfer time is shortened, and the transfer efficiency is improved. Attached Figure Description
[0019] Figure 1 This is a top view of the vacuum transmission cavity.
[0020] Figure 2 This is a bottom view of the vacuum transmission cavity.
[0021] Figure 3 This is a cross-sectional view of the cooling chamber.
[0022] 1. Buffer chamber; 101. Feeding chamber; 102. Discharge chamber; 2. Transfer chamber;
[0023] 3. Cooling chamber; 31. First valve; 32. Second valve;
[0024] 301. Charging / discharging pipe; 302. Filter;
[0025] 303. Pneumatic diaphragm valve; 304. Gas diffuser.
[0026] 4. First process chamber;
[0027] 5. First robotic arm; 6. Second robotic arm;
[0028] 7. Second process chamber;
[0029] 8. Vacuum gauge;
[0030] 91. Third valve; 92. Fourth valve; 93. Fifth valve; 94. Sixth valve. Detailed Implementation
[0031] To facilitate understanding by those skilled in the art, the present invention will be further described below in conjunction with embodiments and accompanying drawings. Specific embodiments of the present invention will be described below. It should be noted that, in order to provide a concise description of these embodiments, this specification cannot provide a detailed description of all features of the actual embodiments.
[0032] refer to Figures 1 to 3 As shown, this utility model provides a vacuum transfer cavity, including a buffer cavity 1, a transfer cavity 2, and at least two cooling cavities 3. The two sides of the cooling cavity 3 are respectively connected to the buffer cavity 1 and the transfer cavity 2. The buffer cavity 1 is provided with a loading cavity 101 and a discharge cavity 102. The transfer cavity 2 is provided with at least one first process cavity 4. The cooling cavity 3 can be filled with or extracted with protective gas to regulate the gas pressure. The buffer cavity 1 is equipped with a first robotic arm 5, which is used to realize the transfer of wafers between the buffer cavity 1 and the loading cavity 101, the discharge cavity 102, or the cooling cavity 3. The transfer cavity 2 is equipped with a second robotic arm 6, which is used to realize the transfer of wafers between the transfer cavity 2 and the cooling cavity 3 or the first process cavity 4.
[0033] refer to Figure 3 As shown, in practical applications, a cooling device, which is a cooling plate, is installed inside the cooling cavity 3. During wafer cooling, the wafer is placed on the cooling plate, and the temperature of the cooling plate is conducted to the wafer to meet the cooling requirements. (Reference) Figure 1As shown, the wafers are smoothly transferred by the first robotic arm 5 and the second robotic arm 6, achieving smooth wafer transport. The wafer input path is sequentially the loading chamber 101, buffer chamber 1, cooling chamber 3, transfer chamber 2, and first process chamber 4, while the wafer output path is sequentially the first process chamber 4, transfer chamber 2, cooling chamber 3, buffer chamber 1, and unloading chamber 102. The wafer input and output paths can operate independently and simultaneously, achieving parallel cooling. For example, cooling is achieved through cooling chamber 3 on the input path, and the wafer is further cooled through cooling chamber 3 on the output path, significantly improving overall production capacity. By concentrating the loading chamber 101 and unloading chamber 102 on one side of the buffer chamber 1, combined with the compact layout of the dual cooling chambers 3, the movement distance of the robotic arms is reduced, the wafer transport time is shortened, and the transport efficiency is improved.
[0034] refer to Figure 1 , 2 As shown in this embodiment, the buffer cavity 1 is provided with a plurality of second process cavities 7. The first robotic arm 5 realizes the transfer of wafers between the buffer cavity 1 and the second process cavities 7. The second process cavities 7 are set with specified processing processes. By setting the second process cavities 7 in the buffer cavity 1, continuous processing of wafers can be realized, reducing the waiting time of wafers in the processing process, thereby significantly improving production efficiency and processing efficiency.
[0035] refer to Figure 2 As shown in this embodiment, a first valve 31 and a second valve 32 are respectively installed at the interface of the cooling chamber 3. Vacuum gauges 8 are installed in the cooling chamber 3, the buffer chamber 1, and the transmission chamber 2. The vacuum gauges 8 determine the vacuum level based on the gas pressure changes in the cooling chamber 3, the buffer chamber 1, and the transmission chamber 2. This allows the first valve 31 or the second valve 32 to be opened when the vacuum level of the cooling chamber 3 is consistent with that of the buffer chamber 1 or the transmission chamber 2, thereby improving the vacuum transmission quality of the wafer and allowing the wafer to be directly transported to the buffer chamber 1 or the transmission chamber 2, saving transmission path.
[0036] refer to Figure 2 As shown, in this embodiment, a third valve 91 is installed at the interface between the buffer chamber 1 and the loading chamber 101, and a fourth valve 92 is installed at the interface between the buffer chamber 1 and the discharge chamber 102. In practical applications, corresponding vacuum gauges 8 are installed in the buffer chamber 1, the loading chamber 101, and the discharge chamber 102. The vacuum gauges 8 can determine the vacuum level based on the gas pressure changes in the buffer chamber 1, the loading chamber 101, or the discharge chamber 102. When the vacuum levels of the buffer chamber 1 and the loading chamber 101 are consistent, the third valve 91 is opened, and the wafer is smoothly transferred by the first robotic arm 5. When the vacuum levels of the buffer chamber 1 and the discharge chamber 102 are consistent, the fourth valve 92 is opened, and the wafer is smoothly transferred by the first robotic arm 5, thereby improving the wafer transfer quality in a vacuum environment.
[0037] refer to Figure 1 ,2 As shown, in this embodiment, a fifth valve 93 is installed at the interface between the first process chamber 4 and the transmission chamber 2, and a sixth valve 94 is installed at the interface between the second process chamber 7 and the buffer chamber 1. In actual application, corresponding vacuum gauges 8 are installed in the first process chamber 4, the second process chamber 7, the transmission chamber 2, and the buffer chamber 1. The vacuum gauges 8 can determine the vacuum level based on the gas pressure changes in the first process chamber 4, the second process chamber 7, the transmission chamber 2, and the buffer chamber 1. When the vacuum levels of the first process chamber 4 and the transmission chamber 2 are consistent, the fifth valve 93 is opened, and the wafer is smoothly transferred by the second robotic arm 6. When the vacuum levels of the second process chamber 7 and the buffer chamber 1 are consistent, the sixth valve 94 is opened, and the wafer is smoothly transferred by the first robotic arm 5, thereby improving the wafer transfer quality in a vacuum environment.
[0038] refer to Figure 1 , 3 As shown, in this embodiment, the cooling chamber 3 is connected to a charging / discharging pipe 301, which is connected to a filter 302 and a pneumatic diaphragm valve 303. In practical applications, the gas is purified by the filter 302, and the gas flow is controlled by the pneumatic diaphragm valve 303. The charging / discharging pipe 301 is connected to a corresponding gas, such as argon or nitrogen. The charging / discharging pipe 301 is connected to a corresponding vacuum pump, which is used to charge and extract the gas, facilitating the smooth adjustment of the gas pressure inside the cooling chamber 3. Specifically, at least two charging / discharging pipes 301 are installed, with at least one used for charging the gas and at least one used for extracting the gas. By continuously charging the gas and simultaneously extracting the gas at the same flow rate, a dynamic balance can be maintained, which is beneficial for removing heat and accelerating the cooling efficiency of the wafer.
[0039] refer to Figure 2 , 3 As shown, in this embodiment, one end of the charging / discharging pipe 301 that extends into the cooling chamber 3 is connected to a gas diffuser 304. The gas diffuser 304 enables temperature uniformity and stability control over a large area and the entire range of the cooling chamber 3, thereby improving the coating quality.
[0040] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.
Claims
1. A vacuum transmission cavity, characterized in that, It includes a buffer chamber (1), a transfer chamber (2) and at least two cooling chambers (3). The two sides of the cooling chamber (3) are respectively connected to the buffer chamber (1) and the transfer chamber (2). The buffer chamber (1) is provided with a feeding chamber (101) and a discharging chamber (102). The transfer chamber (2) is provided with at least one first process chamber (4). The cooling chamber (3) can be filled with or extracted with protective gas to regulate the gas pressure. The buffer cavity (1) is equipped with a first robotic arm (5), which is used to realize the transfer of wafers between the buffer cavity (1) and the loading cavity (101), the unloading cavity (102) or the cooling cavity (3). The transfer cavity (2) is equipped with a second robotic arm (6), which is used to realize the transfer of wafers between the transfer cavity (2) and the cooling cavity (3) or the first process cavity (4). The wafer's input path is sequentially the loading chamber (101), buffer chamber (1), cooling chamber (3), transfer chamber (2) and first process chamber (4), and the wafer's output path is sequentially the first process chamber (4), transfer chamber (2), cooling chamber (3), buffer chamber (1) and unloading chamber (102).
2. The vacuum transmission cavity according to claim 1, characterized in that, The buffer cavity (1) is provided with a plurality of second process cavities (7), and the first robot (5) realizes the transfer of wafers between the buffer cavity (1) and the second process cavities (7).
3. The vacuum transmission cavity according to claim 1, characterized in that, The interface of the cooling chamber (3) is connected to and installed with a first gate valve (31) and a second gate valve (32), and a vacuum gauge (8) is installed in the cooling chamber (3), the buffer chamber (1) and the transmission chamber (2).
4. The vacuum transmission cavity according to claim 3, characterized in that, A third valve (91) is installed at the interface between the buffer chamber (1) and the feeding chamber (101), and a fourth valve (92) is installed at the interface between the buffer chamber (1) and the discharge chamber (102).
5. The vacuum transmission cavity according to claim 2, characterized in that, A fifth valve (93) is installed at the interface between the first process chamber (4) and the transmission chamber (2), and a sixth valve (94) is installed at the interface between the second process chamber (7) and the buffer chamber (1).
6. The vacuum transmission cavity according to claim 1, characterized in that, The cooling chamber (3) is connected to a charging / discharging pipe (301), and the charging / discharging pipe (301) is connected to a filter (302) and a pneumatic diaphragm valve (303).
7. The vacuum transmission cavity according to claim 6, characterized in that, The end of the charging / discharging pipe (301) that extends into the cooling chamber (3) is connected to a gas diffuser (304).