Multi-axis linkage wafer carrier handling device
By designing a multi-axis linkage wafer carrier handling device, precise alignment of the carrier at multiple stations and angles is achieved, solving the problems of poor flexibility and inaccurate alignment in existing technologies, and improving production efficiency and equipment reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SEMICON WET ADVANCED TECH CO LTD
- Filing Date
- 2025-07-24
- Publication Date
- 2026-07-10
AI Technical Summary
Existing wafer carrier handling devices have poor flexibility, cannot match processing slots at multiple stations and angles, and positional deviations during gripping lead to inaccurate alignment, affecting the production process.
Design a multi-axis linkage wafer carrier handling device. By using the positioning group and pick-and-place group of the clamping components to form a positioning reference in the thickness direction of the carrier, and combining the movement of the rotating seat, the transverse seat and the clamping seat, the carrier can be accurately aligned in multiple angles and directions.
It improves the success rate of precise insertion of carriers and processing tanks, ensures production stability, prevents equipment interference, and enhances the reliability of equipment operation.
Smart Images
Figure CN224482030U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor processing, and specifically relates to a multi-axis linkage wafer carrier handling device. Background Technology
[0002] In the semiconductor industry, wafers are typically mounted on wafer carriers, and transport devices move the carriers to move the wafers between various processing steps.
[0003] Currently, traditional handling devices generally include lateral movement components, lifting power components, and clamping components for gripping and releasing the vehicle. The lateral movement and lifting power components work together to achieve the lateral and lifting movements of the vehicle.
[0004] However, in actual production, existing handling devices have poor flexibility, only enabling the wafer carrier to move in a single direction and unable to adjust its own posture, making it difficult to match multi-station, multi-angle processing slots. At the same time, if there is a positional deviation when grabbing the carrier in the early stage, it is easy for the wafer carrier to fail to be precisely aligned with the processing slot of the next process, causing interference between the carrier and the processing slot during the lifting and lowering movement, thus preventing the carrier from being successfully inserted into the processing slot and affecting the production process. Summary of the Invention
[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the existing technology and provide a brand-new multi-axis linkage wafer carrier handling device.
[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:
[0007] A multi-axis linkage wafer carrier handling device includes a clamping component and a drive mechanism for reciprocating the clamping component between various workstations. The clamping component includes a clamping base, a positioning group and a pick-and-place group respectively disposed on the clamping base, wherein the positioning group forms a positioning reference in the thickness direction of the carrier to keep the carrier vertical, and the pick-and-place group can grasp or release the carrier; the handling device further includes an alignment power mechanism, which includes a base, a rotational power component and a lateral movement power component, wherein the rotational power component includes a rotary mechanism disposed on the base. The rotating seat includes a first rotary power unit and a second rotary power unit for driving the rotating seat to rotate around a first vertical center line. The lateral movement force assembly includes a lateral moving seat disposed on the rotating seat and a lateral movement force unit for driving the lateral moving seat to reciprocate radially along the motion trajectory formed by the rotating seat. The clamping seat is disposed on the lateral moving seat, and the second rotary power unit drives the clamping seat to rotate around a second vertical center line. As the clamping component moves to any work position, the combined motion of the rotating seat, the lateral moving seat, and the clamping seat drives the carrier to align with the processing slot of the corresponding work position.
[0008] According to a specific embodiment and preferred aspect of this utility model, the driving mechanism includes a transverse drive for driving the base to move horizontally between workstations, a lifting drive for driving the base to move vertically; and / or, a second vertical centerline coincides with the centerline of the wafer carrier. Here, the combination of horizontal and vertical displacement allows for precise insertion or removal of the wafer carrier from the processing slot when the wafer carrier is aligned with the processing slot of the corresponding workstation.
[0009] According to another specific embodiment and preferred aspect of this utility model, the base is recessed inward from one side to form a rotating groove, and the rotating seat is inserted from one end and rotatably connected in the rotating groove via a first pivot. This facilitates assembly and implementation.
[0010] Preferably, the rotating slot has a first limiting edge and a second limiting edge formed in the rotation direction of the rotating seat, and the rotating seat rotates between the first limiting edge and the second limiting edge. Here, the rotation path of the rotating seat is restricted by the first and second limiting edges, thereby effectively preventing the rotating seat from rotating too much and interfering with other components of the equipment, and improving the reliability of the equipment operation.
[0011] Specifically, the rotation angle between the first limiting edge and the second limiting edge of the rotating seat is 0° to 90°.
[0012] According to another specific embodiment and preferred aspect of the present invention, the rotating seat extends radially along its own motion trajectory, and a guide groove is formed on the rotating seat, and the transverse seat is slidably connected to the guide groove; the clamping seat is rotatably connected to the transverse seat through a second pivot.
[0013] Preferably, the lateral movement power unit includes a lateral movement motor and a guide wheel respectively disposed at both ends of the rotating seat, an annular conveyor belt connected between the lateral movement motor and the guide wheel, and the lateral movement seat is fixedly connected to the conveyor belt and moves laterally back and forth along the guide groove as the conveyor belt moves.
[0014] According to another specific embodiment and preferred aspect of this utility model, there are at least two positioning groups, which are respectively arranged close to both sides of the vehicle in the width direction, and the pick-and-place group is arranged between the positioning groups. This facilitates the precise gripping of the vehicle by the claw hook.
[0015] According to another specific embodiment and preferred aspect of the present invention, the positioning group includes a first clamping plate and a second clamping plate connected to the bottom of the clamping seat and arranged at a relative distance in the thickness direction of the carrier. When the carrier is clamped, the carrier is positioned between the first clamping plate and the second clamping plate.
[0016] Preferably, the first clamping plate and the second clamping plate each include a clamping plate body extending vertically downward from the clamping seat and a buffer pad disposed inside the clamping plate body. This forms a clamping and positioning mechanism and avoids damage to the carrier.
[0017] Due to the implementation of the above technical solution, this utility model has the following advantages compared with the prior art:
[0018] Existing handling devices lack flexibility, only enabling the wafer carrier to move in a single direction and unable to adjust its own orientation, making it difficult to match multi-station, multi-angle processing bays. Furthermore, if there is a positional deviation during the initial carrier grabbing, it can easily lead to the wafer carrier failing to accurately align with the next processing bay, causing interference between the carrier and the processing bay during lifting and lowering, preventing smooth insertion and impacting the production process. This application addresses these shortcomings by providing a holistic structural design for a multi-axis linkage wafer carrier handling device. To address the shortcomings of existing technologies, this handling device employs a positioning group to establish a positioning reference along the thickness of the carrier, ensuring its verticality. The pick-and-place group then grips the carrier, and once gripped, a drive mechanism moves the clamping component to the corresponding workstation. A rotating seat rotates the clamping component around a first vertical centerline, a transverse seat moves the clamping component along the trajectory formed by the rotating seat, and the clamping seat rotates around a second vertical centerline. This combined motion of the three components ensures precise alignment of the wafer carrier with the corresponding processing slot. Therefore, compared to existing technologies, this invention, based on the positioning reference formed by the clamping component to maintain carrier verticality, utilizes the coordinated movement of the rotating seat, transverse seat, and clamping seat to flexibly match and precisely align with processing slots at various angles and directions, effectively improving the success rate of precise insertion into the processing slot and ensuring stable production. Attached Figure Description
[0019] Figure 1 This is a three-dimensional structural diagram (first-person view) of the multi-axis linkage wafer carrier handling device of this utility model;
[0020] Figure 2 This is a three-dimensional structural diagram (second perspective) of the multi-axis linkage wafer carrier handling device of this utility model;
[0021] Figure 3 for Figure 1 A magnified diagram of the local structure in the middle;
[0022] Figure 4 for Figure 1 Top view of a partial structure in the middle;
[0023] Figure 5 for Figure 4 Schematic diagram of the sectional view along the central AA direction;
[0024] Wherein: 1. Clamping component; 10. Clamping seat; 11. Positioning group; 111. First clamping plate; 112. Second clamping plate; a0. Clamping plate body; a1. Buffer pad;
[0025] 2. Alignment power mechanism; 20. Base; 200. Rotating groove; b1. First limiting edge; b2. Second limiting edge; 21. Rotating power assembly; 210. Rotating seat; c. Guide groove; 211. First rotating power unit; 212. Second rotating power unit; 22. Lateral movement power assembly; 220. Lateral movement seat; k. Sliding module; 221. Lateral movement power unit; d0. Lateral movement motor; d1. Guide wheel; d2. Conveyor belt; s1. First pivot; s2. Second pivot;
[0026] 3. Drive mechanism; 30. Lifting driver;
[0027] J. Vehicle. Detailed Implementation
[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0029] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0031] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0032] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0033] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0034] like Figures 1 to 5 As shown, the multi-axis linkage wafer carrier handling device of this embodiment includes a clamping component 1 for clamping a vertical wafer carrier J, an alignment power mechanism 2, and a drive mechanism 3.
[0035] Specifically, the clamping component 1 includes a clamping seat 10, a positioning group 11 and a pick-and-place group (not shown in the figure, but easy to imagine) respectively disposed on the clamping seat 10. The positioning group 11 forms a positioning reference in the thickness direction of the carrier J to keep the carrier J vertical, and the pick-and-place group can grab or release the carrier.
[0036] There are two positioning groups 11, which are respectively arranged close to both sides of the vehicle J in the width direction, and the pick-and-place group is arranged between the two positioning groups 11. This facilitates the precise gripping of the vehicle by the grappling hook.
[0037] For ease of implementation, each positioning group 11 includes a first clamping plate 111 and a second clamping plate 112 connected to the bottom of the clamping seat 10 and arranged at relative intervals in the thickness direction of the carrier J. When clamping the carrier J, the carrier J is positioned between the first clamping plate 111 and the second clamping plate 112.
[0038] In some specific embodiments, the first clamping plate 111 and the second clamping plate 112 each include a clamping plate body a0 extending vertically downward from the clamping seat 10 and a buffer pad a1 disposed inside the clamping plate body a0. Here, clamping and positioning are formed, and damage to the carrier is avoided.
[0039] The pick-and-place assembly can be any conventional vehicle pick-and-place device. For example, the pick-and-place assembly in this embodiment includes two pneumatic metal hooks to pick up or release the vehicle from the top of the vehicle.
[0040] In this example, the alignment power mechanism 2 includes a base 20, a rotary power assembly 21, and a lateral movement power assembly 22. The rotary power assembly 21 includes a rotary seat 210 mounted on the base 20, a first rotary power unit 211 for driving the rotary seat 210 to rotate around a first vertical centerline, and a second rotary power unit 212. The lateral movement power assembly 22 includes a lateral moving seat 220 mounted on the rotary seat 210 and a lateral movement power unit 221. The lateral movement power unit 221 drives the lateral moving seat 220 to reciprocate radially along the motion trajectory formed by the rotary seat 210. The clamping seat 10 is mounted on the lateral moving seat 220, and the second rotary power unit 212 drives the clamping seat 10 to rotate around a second vertical centerline. As the clamping component 1 moves to any work position, the combined movement of the rotary seat 210, the lateral moving seat 220, and the clamping seat 10 drives the wafer carrier J to align with the processing slot of the corresponding work position.
[0041] In some specific embodiments, the base 20 is recessed inward from one side to form a rotating groove 200. The rotating seat 210 is inserted from one end and rotatably connected to the rotating groove 200 via a first pivot s1. A first rotating power unit 211 is mounted on the base 20 and is a conventional motor, which drives the rotating seat 210 to rotate around the first pivot s1 via a belt from its output shaft. This facilitates assembly and implementation.
[0042] Meanwhile, the rotating groove 200 has a first limiting edge b1 and a second limiting edge b2 formed in the rotation direction of the rotating seat 210, and the rotating seat 210 rotates between the first limiting edge b1 and the second limiting edge b2. Here, the rotation path of the rotating seat is restricted by the first and second limiting edges, thereby effectively preventing the rotating seat from rotating too much and interfering with other components of the equipment, and improving the reliability of the equipment operation.
[0043] Specifically, the rotation angle of the rotating seat 210 between the first limiting edge b1 and the second limiting edge b2 is 0° to 90°.
[0044] In this example, the rotating seat 210 extends radially along its own motion trajectory, and a guide groove c is formed on the rotating seat 210. The transverse seat 220 is slidably connected to the rotating seat 210 via a slide rail, and is slidably connected to the guide groove c via a sliding module k. The clamping seat 10 is rotatably connected to the transverse seat 220 via a second pivot s 2.
[0045] For ease of implementation, the second vertical centerline coincides with the centerline of the wafer carrier J, that is, the centerline of the second pivot s2 coincides with the centerline of the wafer carrier J. The second rotary power unit 212 is mounted on the transverse support 220 and uses a conventional motor, and drives the clamping seat 10 to rotate around the second pivot s2 via a belt from its output shaft.
[0046] In this example, the transverse motion power unit 221 includes a transverse motor d0 and a guide wheel d1 respectively disposed at both ends of the rotating seat 210, and an annular conveyor belt d2 connected between the transverse motor d0 and the guide wheel d1. The transverse seat 220 is fixedly connected to the conveyor belt d2 and moves reciprocally along the guide groove c as the conveyor belt d2 moves.
[0047] In addition, the drive mechanism 3 includes a transverse drive (not shown in the figure, but easy to imagine) that drives the base 20 to move horizontally between each station, and a lift drive 30 that drives the base 20 to move up and down. The drive of the lift drive 30 enables the aligned wafer carrier to be accurately inserted into the processing slot downwards or taken out of the processing slot upwards. At the same time, the lift drive 30 is driven by the transverse drive to drive the clamping component to reciprocate between each station.
[0048] In summary, after adopting this handling device, the positioning group forms a positioning reference in the thickness direction of the carrier to keep the carrier vertical. Then, the pick-and-place group grabs the carrier. After the wafer carrier is clamped, the drive mechanism drives the clamping component to move the wafer carrier to the corresponding workstation. Then, the rotating seat drives the clamping component to rotate around the first vertical center line. The transverse seat drives the clamping component to move along the motion trajectory formed by the rotating seat. The clamping seat rotates around the second vertical center line. In the combination of the three movements, the wafer carrier is precisely aligned with the corresponding processing tank. Therefore, compared with the prior art, this utility model maintains the verticality of the carrier based on the positioning reference formed by the clamping component. Through the coordinated movement of the rotating seat, the transverse seat, and the clamping seat, it flexibly matches and accurately aligns the processing slot at any position under multi-angle and multi-directional displacement, effectively improving the success rate of the carrier's accurate insertion into the processing slot and ensuring stable production. Secondly, the rotation path of the rotating seat is restricted by the first and second limiting edges, thereby effectively preventing the rotating seat from rotating too much and interfering with other components of the equipment, improving the reliability of the equipment operation. Thirdly, the clamping and positioning based on the positioning clamping plate facilitates the precise gripping of the carrier by the claw hook.
[0049] The present utility model has been described in detail above, with the aim of enabling those skilled in the art to understand its contents and implement it. However, this description should not be construed as limiting the scope of protection of the present utility model. All equivalent changes or modifications made in accordance with the spirit and essence of the present utility model should be included within the scope of protection of the present utility model.
Claims
1. A multi-axis linkage wafer carrier handling device, comprising a clamping component and a drive mechanism for driving the clamping component to reciprocate between various workstations, characterized in that, The clamping component includes a clamping seat, a positioning group and a pick-and-place group respectively disposed on the clamping seat, wherein the positioning group forms a positioning reference in the thickness direction of the carrier to keep the carrier vertical, and the pick-and-place group can grasp or release the carrier; the conveying device also includes an alignment power mechanism, which includes a base, a rotary power component and a lateral movement power component, wherein the rotary power component includes a rotary seat disposed on the base, a first rotary power unit for driving the rotary seat to rotate around a first vertical center line, and a second rotary power unit; the lateral movement power component includes a lateral movement seat disposed on the rotary seat, and a lateral movement power unit for driving the lateral movement seat to reciprocate radially along the motion trajectory formed by the rotary seat, wherein the clamping seat is disposed on the lateral movement seat, and the second rotary power unit drives the clamping seat to rotate around a second vertical center line. As the clamping component moves to any work position, the combined movement of the rotary seat, the lateral movement seat and the clamping component drives the carrier to align with the processing slot of the corresponding work position.
2. The multi-axis linkage wafer carrier handling device according to claim 1, characterized in that, The driving mechanism includes a transverse drive that drives the base to move horizontally between each workstation, a lifting drive that drives the base to move up and down; and / or, the second vertical centerline coincides with the centerline of the carrier.
3. The multi-axis linkage wafer carrier handling device according to claim 1, characterized in that, The base is recessed inward from one side to form a rotating groove, and the rotating seat is inserted from one end and rotatably connected in the rotating groove through a first pivot.
4. The multi-axis linkage wafer carrier handling device according to claim 3, characterized in that, The rotating groove has a first limiting edge and a second limiting edge formed in the rotation direction of the rotating seat, and the rotating seat rotates between the first limiting edge and the second limiting edge.
5. The multi-axis linkage wafer carrier handling device according to claim 4, characterized in that, The rotation angle between the first limiting edge and the second limiting edge of the rotating seat is 0° to 90°.
6. The multi-axis linkage wafer carrier handling device according to claim 1, characterized in that, The rotating seat extends radially along its own motion trajectory, and a guide groove is formed on the rotating seat. The transverse seat is slidably connected to the guide groove. The clamping seat is rotatably connected to the transverse seat via a second pivot.
7. The multi-axis linkage wafer carrier handling device according to claim 6, characterized in that, The lateral movement power unit includes a lateral movement motor and a guide wheel respectively disposed at both ends of the rotating seat, and an annular conveyor belt connected between the lateral movement motor and the guide wheel. The lateral movement seat is fixedly connected to the conveyor belt and moves laterally back and forth along the guide groove as the conveyor belt moves.
8. The multi-axis linkage wafer carrier handling device according to claim 1, characterized in that, The positioning group consists of at least two groups, which are respectively arranged close to both sides of the vehicle in the width direction, and the pick-up and put-down group is arranged between the positioning groups.
9. The multi-axis linkage wafer carrier handling device according to claim 1 or 8, characterized in that, The positioning assembly includes a first clamping plate and a second clamping plate connected to the bottom of the clamping seat and spaced apart from each other in the thickness direction of the carrier. When the carrier is clamped, the carrier is positioned between the first clamping plate and the second clamping plate.
10. The multi-axis linkage wafer carrier handling device according to claim 9, characterized in that, The first clamp and the second clamp each include a clamp body extending vertically downward from the clamping seat and a buffer pad disposed inside the clamp body.