Wafer connection assembly

Abstract

This utility model discloses a wafer interconnection assembly, relating to the field of semiconductor technology. It includes a base with an internal cavity. Two limiting protrusions are located at the top edge of the base. Each of the two limiting protrusions contains several flexible positioning blocks. An arc-shaped groove is formed inside each of the two limiting protrusions near the flexible positioning blocks. An arc-shaped block is installed inside each of the two limiting protrusions through the arc-shaped groove. A top block matching the flexible positioning block is located at the opposite end of each of the two arc-shaped blocks. A connecting plate is located at the bottom end of each of the two connecting plates, with the bottom of each connecting plate extending out of the base. This utility model, through its series of structures, eliminates the need for robotic arms or fingers to penetrate the base when handling or placing wafers, reducing operational difficulty, improving placement accuracy, ensuring wafer stability, and preventing contact with the wafer top, thus avoiding wafer damage or deformation.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a wafer interconnection component. Background Technology

[0002] Wafer interconnect components refer to various components used in the semiconductor manufacturing process to enable interconnection between wafers and between wafers and other chips or circuits. These components play a crucial role in ensuring circuit conduction, signal transmission, and the stable performance of the entire semiconductor device.

[0003] Existing wafer interconnection assemblies require a robotic arm or operator to reach into the base to place or handle wafers during cleaning. Due to the small size of the base, interference can easily occur, affecting accuracy. Wafers are mostly fixed by pressing down from the top, which can easily damage the top of the wafer and may cause deformation due to uneven stress. Utility Model Content

[0004] The purpose of this invention is to provide a wafer interconnection assembly to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer interconnect assembly, including a base, the base having an internal cavity, two limiting protrusions at the top edge of the base, each of the two limiting protrusions having a plurality of flexible positioning blocks inside, an arc-shaped groove being formed inside the two limiting protrusions near the flexible positioning blocks, an arc-shaped block being installed inside the two limiting protrusions through the arc-shaped groove, a top block matching the flexible positioning block being provided at the opposite ends of the two arc-shaped blocks, a connecting plate being provided at the bottom end of each of the two arc-shaped blocks, the bottom of each of the two connecting plates extending out of the base, a rotating disk being connected to the extended ends of the two connecting plates, a support block being provided at the middle position of the top of the base, the bottom of the support block extending into the internal cavity of the base, a threaded section being provided at the extended end of the support block, and a circular hole being provided through the middle position of the rotating disk.

[0006] Preferably, an opening is provided on one side of the base, and an extension block is provided on one side of the rotating disk. The extension block extends through the opening to the outside of the base. When using the wafer connection assembly, the rotating disk can be rotated at a certain angle by moving the extension block, which is convenient to operate.

[0007] Preferably, a locking frame is provided at the bottom edge of the opening. When the extension block rotates above the locking frame, the rotating disk rotates to lower the support block. The top of the support block is level with the top of the base, so that the wafer is placed stably on the top of the base. At the same time, one end of each of the several flexible positioning blocks extends a limiting protrusion to clamp the circumferential surface of the wafer, fix the wafer, and prevent the wafer from shifting.

[0008] Preferably, each of the flexible positioning blocks is provided with a return spring at its top and bottom. One end of the return spring is fixedly connected to the inside of the limiting protrusion. When the top block leaves the corresponding flexible positioning block, the return spring will pull the flexible positioning block back into the limiting protrusion, releasing the lock on the wafer, so as to facilitate wafer replacement.

[0009] Preferably, the top of the base is provided with two through slots communicating with the cavity, and the two connecting plates pass through the corresponding through slots respectively. The through slots limit the two connecting plates, so that the two connecting plates can be driven by the rotating disk to rotate.

[0010] Preferably, the circular hole is threaded onto the outer surface of the threaded section, and four positioning grooves are provided at the bottom end of the rotating disk near the circular hole. Four inserts matching the positioning grooves are provided at the bottom edge of the support block. The four inserts are respectively inserted into the corresponding positioning grooves. When the rotating disk rotates, the circular hole will rotate on the outer surface of the threaded section. The support block is limited by the positioning grooves through the inserts, so that the threaded section will not rotate, but will be driven to make vertical linear movement, causing the support block to rise or fall.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] This wafer connection assembly features a liftable tray at the top center of the base, driven by a rotating disk. When placing or picking up wafers, the top of the tray extends beyond the top of the base, eliminating the need for robotic arms or fingers to be inserted into the base, thus reducing operational difficulty and improving placement accuracy.

[0013] This wafer connection assembly uses two limiting protrusions at the top edge of the base. Each of the two limiting protrusions has several flexible positioning blocks at its opposite ends. When placing the wafer, the flexible positioning blocks extend to generate clamping force on the wafer, clamping it tightly and ensuring the stability of the wafer fixation. This prevents the wafer from contacting the top of the wafer, thus avoiding damage or deformation. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a cross-sectional schematic diagram of the top structure of the base of this utility model;

[0016] Figure 3 For the present utility model Figure 2 Enlarged schematic diagram of the structure at point A in the middle;

[0017] Figure 4 This is a schematic diagram of the rotating disk structure of this utility model;

[0018] Figure 5 This is a schematic diagram of the support block structure of this utility model;

[0019] Figure 6 This is a cross-sectional schematic diagram of the base structure of this utility model.

[0020] In the diagram: 1. Base; 2. Limiting protrusion; 3. Support block; 4. Opening; 5. Extension block; 6. Rotating disc; 7. Arc block; 8. Top block; 9. Return spring; 10. Flexible positioning block; 11. Connecting plate; 12. Round hole; 13. Positioning groove; 14. Threaded section; 15. Locking frame; 16. Through groove. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] like Figures 1 to 6As shown, this embodiment of a wafer interconnect assembly includes a base 1 with an internal cavity. Two limiting protrusions 2 are located at the top edge of the base 1, with gaps at both ends. A trajectory line is provided between the gaps and the base 1 for connecting the wafer to other chips or circuits. Each of the two limiting protrusions 2 contains several flexible positioning blocks 10. When the wafer is placed on the top of the base 1, its outer surface approaches the two limiting protrusions 2, and the flexible positioning blocks 10 apply a clamping force to the outer surface of the wafer, fixing it to the top of the base 1. Arc-shaped grooves are formed inside the two limiting protrusions 2 near the flexible positioning blocks 10. Arc-shaped blocks 7 are installed inside each of the two limiting protrusions 2 through these grooves, and are limited by the arc-shaped grooves, allowing them to rotate within the limiting protrusions 2. The opposite ends of the two arc-shaped blocks 7 are provided with flexible positioning blocks. When the wafer is placed on the top of the base 1, the top block 8 of the position block 10 is matched with the top block 8. When the wafer is placed on the top of the base 1, the two arc blocks 7 rotate, causing the top block 8 to push the corresponding flexible positioning block 10 to extend out of the limiting protrusion 2 and clamp the outer surface of the wafer. The bottom of the two arc blocks 7 is provided with a connecting plate 11, and the bottom of the two connecting plates 11 extends out of the base 1. The extension ends of the two connecting plates 11 are connected to a rotating disk 6. When the rotating disk 6 rotates, it will drive the corresponding arc blocks 7 to rotate through the two connecting plates 11 respectively. A support block 3 is provided at the middle position of the top of the base 1. The bottom of the support block 3 extends into the cavity inside the base 1. The extension end of the support block 3 is provided with a threaded section 14. A circular hole 12 is provided through the middle position of the rotating disk 6. The circular hole 12 and the threaded section 14 are threadedly connected. The support block 3 is limited to vertical linear movement. When the rotating disk 6 rotates, it will be driven to move up and down through the circular hole 12 and the threaded section 14.

[0024] Specifically, an opening 4 is provided on one side of the base 1, and an extension block 5 is provided on one side of the rotating disk 6. The extension block 5 extends through the opening 4 to the outside of the base 1. When using the wafer connection assembly, the rotating disk 6 can be rotated at a certain angle by moving the extension block 5, which is convenient to operate.

[0025] Furthermore, a locking frame 15 is provided at the bottom edge of the opening 4. When the extension block 5 rotates above the locking frame 15, the rotating disk 6 rotates to lower the support block 3. The top of the support block 3 is level with the top of the base 1, so that the wafer is placed stably on the top of the base 1. At the same time, one end of each of the several flexible positioning blocks 10 extends a limiting protrusion 2 to clamp the circumferential surface of the wafer, fix the wafer, and prevent the wafer from shifting.

[0026] Furthermore, each of the flexible positioning blocks 10 is provided with a reset spring 9 at its top and bottom. One end of the reset spring 9 is fixedly connected to the inside of the limiting protrusion 2. When the top block 8 leaves the corresponding flexible positioning block 10, the reset spring 9 will pull the flexible positioning block 10 back into the limiting protrusion 2, releasing the lock on the wafer, so as to facilitate wafer replacement.

[0027] Furthermore, the top of the base 1 is provided with two through slots 16 that communicate with the cavity. The two connecting plates 11 pass through the corresponding through slots 16 respectively. The through slots 16 limit the two connecting plates 11 so that the two connecting plates 11 can be driven by the rotating disk 6 to rotate.

[0028] Furthermore, the circular hole 12 is threaded onto the outer surface of the threaded section 14. Four positioning grooves 13 are provided at the bottom end of the rotating disk 6 near the circular hole 12. Four inserts matching the positioning grooves 13 are provided at the bottom edge of the support block 3. The four inserts are respectively inserted into the corresponding positioning grooves 13. When the rotating disk 6 rotates, the circular hole 12 will rotate on the outer surface of the threaded section 14. The support block 3 is limited by the positioning grooves 13 through the inserts, so that the threaded section 14 will not rotate, but will be driven to make vertical linear movement, causing the support block 3 to rise or fall.

[0029] The usage method of this embodiment is as follows: When using the wafer interconnect assembly, first move the extension block 5 away from the locking frame 15. When the extension block 5 is moved, the rotating disk 6 will rotate. The rotating disk 6 will drive the corresponding arc-shaped block 7 to rotate through the two connecting plates 11, so that the top block 8 moves away from the corresponding flexible positioning block 10. The reset spring 9 will pull the flexible positioning block 10 back into the limiting protrusion 2, so that the flexible positioning block 10 is stored in the corresponding limiting protrusion 2. At the same time, the round hole 12 and the threaded section 14 work together to make the support block 3 rise and extend out of the top of the base 1. At this time, the wafer is placed on the top of the support block 3. Then, move the extension block 5 towards the locking frame 15. At this time, the rotating disk 6 will rotate. Through the round hole 12 and the threaded section 14, it pulls the support block 3 down, so that the top of the support block 3 is level with the top of the base 1, and the wafer is driven into the base 1. At the same time, the two connecting plates 11 drive the corresponding arc-shaped blocks 7 to rotate, so that the top block 8 moves towards the position of the flexible positioning block 10, and pushes the corresponding flexible positioning block 10 to move towards the wafer, clamping the outer surface of the wafer and fixing the wafer tightly. Then, the bottom of the base 1 can be connected to the pneumatic actuator through fasteners to ensure that the wafer can be driven to move.

[0030] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer interconnect assembly, comprising a base (1), characterized in that: The base (1) has an internal cavity. Two limiting protrusions (2) are provided at the top edge of the base (1). Each of the two limiting protrusions (2) has several flexible positioning blocks (10) inside. An arc-shaped groove is opened in the interior of the two limiting protrusions (2) near the position of the flexible positioning block (10). An arc-shaped block (7) is installed in the interior of the two limiting protrusions (2) through the arc-shaped groove. A top block (8) matching the flexible positioning block (10) is provided at the opposite end of the two arc-shaped blocks (7). The bottom ends of the two arc-shaped blocks (7) are provided with connecting plates (11), the bottom of the two connecting plates (11) extends out into the base (1), the extended ends of the two connecting plates (11) are connected to a rotating disk (6), a support block (3) is provided at the middle position of the top of the base (1), the bottom of the support block (3) extends into the cavity inside the base (1), the extended end of the support block (3) is provided with a threaded section (14), and a circular hole (12) is provided through the middle position of the rotating disk (6).

2. The wafer interconnect assembly according to claim 1, characterized in that: An opening (4) is provided on one side of the base (1), and an extension block (5) is provided on one side of the rotating disk (6). The extension block (5) extends through the opening (4) to the outside of the base (1).

3. A wafer interconnect assembly according to claim 2, characterized in that: A locking frame (15) is provided at the bottom edge of the opening (4).

4. A wafer interconnect assembly according to claim 1, characterized in that: Each of the flexible positioning blocks (10) is provided with a return spring (9) at its top and bottom, and one end of the return spring (9) is fixedly connected to the inside of the limiting protrusion (2).

5. A wafer interconnect assembly according to claim 1, characterized in that: The top of the base (1) is provided with two through slots (16) that communicate with the cavity, and the two connecting plates (11) pass through the corresponding through slots (16) respectively.

6. A wafer interconnect assembly according to claim 1, characterized in that: The circular hole (12) is threaded onto the outer surface of the threaded section (14). Four positioning grooves (13) are provided at the bottom end of the rotating disk (6) near the circular hole (12). Four inserts matching the positioning grooves (13) are provided at the bottom edge of the support block (3).

Images