A module terminal using a laminated busbar structure and an HPD package module

Abstract

The utility model relates to a semiconductor device and its packaging technical field, specifically disclose a kind of module terminal and HPD packaging module using laminated busbar structure, including DC terminal, DC terminal includes: two ends and chip and direct current power supply intercommunication's first component and second component, first component and second component current is opposite;First component and second component form laminated busbar structure to offset reverse current magnetic field, the partial area of first component and the overall area of second component overlap to expand magnetic field offset effective area.The utility model forms laminated busbar structure by setting first component and second component, offset the magnetic field generated by reverse current, secondly, the projection area of second component is the effective overlapping area of first component and second component, to expand the effective area of magnetic field offset as far as possible, to reduce total magnetic flux without affecting laser welding, to reduce stray inductance, improve system reliability.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device and packaging technology, specifically to a module terminal and HPD packaging module using a stacked busbar structure. Background Technology

[0002] As the most crucial component in electronic control, the power module's performance and reliability directly affect the overall performance of the electronic control system and even the entire electric drive assembly. IGBTs, as core components of power semiconductors, utilize HPD packaging. The HPD packaged module employs a three-phase full-bridge architecture, integrating six switching transistors to form a standard three-phase inverter circuit. It uses a stacked busbar design to reduce parasitic inductance and stray inductance. Parasitic inductance is the inherent additional inductance generated by all conductors in a circuit due to electromagnetic effects, including wires, solder joints, and package pins. It is inherent in the physical structure but can be reduced. Stray inductance, on the other hand, is caused by unintended magnetic field coupling formed by the conductor layout, resulting in a large current loop caused by the stacked busbar of the IGBT.

[0003] Chinese patent CN214152889U discloses a power module terminal and a power module. The power module terminal structure is the same as that of an HPD packaged module terminal. Both power module terminals include DC and AC terminals. The DC terminal includes: a first component comprising a first contact area, a first transition area, a first stacked area, and a first pin. The first stacked area is connected to the first contact area via the first transition area, and the first pin is located on the side of the first stacked area away from the first transition area; and a second component comprising a second contact area, a second transition area, a second stacked area, and a second pin. The second stacked area is connected to the second contact area via the second transition area, and the second pin is located on the side of the second stacked area away from the second transition area. The first and second contact areas are parallel to each other or located on the same plane; the first and second transition areas are parallel to each other and do not contact each other; and the first and second stacked areas are parallel to each other and do not contact each other. This invention effectively reduces the current density in the stacked region and lowers current loss by setting a transition region between the contact region and the stacked region. By utilizing the electromagnetic field cancellation effect generated by the current in the transition region and the stacked region, the stray inductance of the power module terminals can be effectively reduced. However, the current in the first contact region and the second contact region cannot generate an electromagnetic field cancellation effect, which will cause the HPD packaged module terminals to continuously generate stray inductance, making it impossible to further reduce stray inductance and reduce system reliability. Utility Model Content

[0004] This invention addresses the problem of persistently large stray inductance in existing HPD packaged module terminals by providing a module terminal and HPD packaged module using a stacked busbar structure. The specific technical solution is as follows:

[0005] A module terminal using a stacked busbar structure, the module terminal including a plurality of DC terminals, the DC terminals including: a first component and a second component, both ends of which are respectively connected to a chip and a DC power supply, the first component and the second component having opposite currents; the first component and the second component forming a stacked busbar structure to cancel the magnetic field of the reverse current, a portion of the first component overlapping the entire portion of the second component to expand the effective area of ​​magnetic field cancellation.

[0006] Furthermore, the first component includes a first conductor, and the second component includes a second conductor; the first conductor and the second conductor are parallel to each other and do not contact each other to form a stacked busbar structure, and the projection of the first conductor along the direction perpendicular to the second conductor can cover the second conductor.

[0007] Preferably, the first component further includes a first welding area, and the second component further includes a second welding area; a portion of the side of the first conductor forms the first welding area, which is opposite to but does not overlap with the second conductor, and the first welding area connects the DC power supply to the first conductor; a portion of the side of the second conductor forms the second welding area, which is away from the first conductor and close to the first welding area, and the second welding area connects the DC power supply to the second conductor.

[0008] Preferably, the first component further includes several first pins connected to the chip, and the second component further includes several second pins connected to the chip; both the first pins and the second pins are Z-shaped, and the first pins and the second pins are parallel to each other and do not contact each other; the height H2 of the second pin minus the height H1 of the first pin is the vertical distance between the second conductor and the first conductor.

[0009] Preferably, it also includes three AC terminals, which are respectively connected to the U phase, V phase and W phase of the AC power supply. The AC terminals include a third component, which includes a third conductor. The two ends of the third conductor are respectively connected to a third soldering area and a third pin. The plane of the third conductor is parallel to the plane of the stacked busbar structure. The two ends of the third conductor form a third pin and a third soldering area, respectively. The third pin has a Z-shaped structure and is connected to the chip. The third soldering area is connected to the AC power supply.

[0010] An HPD packaging module includes: the module terminals mentioned above, the module terminals including DC terminals and AC terminals; a packaging housing, the two ends of the packaging housing respectively encapsulating the DC terminals and AC terminals, and the middle part of the packaging housing encapsulating a chip.

[0011] Preferably, the DC terminal includes a first soldering area and a second soldering area connected to a DC power supply, and the AC terminal includes a third soldering area connected to an AC power supply; the width and length of the first soldering area, the second soldering area and the third soldering area exposed at both ends of the package housing are the same, and the first soldering area, the second soldering area and the third soldering area are connected to the DC power supply or the AC power supply by laser welding.

[0012] As can be seen from the above technical solution, this utility model has the following beneficial effects:

[0013] This invention forms a stacked busbar structure by setting a first component and a second component to cancel the magnetic field generated by the reverse current and reduce the total magnetic flux. Secondly, the projected area of ​​the second component is set to be the effective overlap area of ​​the first component and the second component, thereby expanding the effective area of ​​magnetic field cancellation as much as possible. This reduces the total magnetic flux without affecting laser welding, thereby reducing stray inductance and improving system reliability. Attached Figure Description

[0014] Figure 1 This is a front view of Embodiment 2 of the present utility model;

[0015] Figure 2 This is a schematic diagram of the DC terminal structure in Embodiment 1 of this utility model;

[0016] Figure 3 for Figure 1 AA section view in the middle;

[0017] Figure 4 for Figure 3 Enlarged view of the structure at point F in the image;

[0018] Figure 5 for Figure 1 BB section view in the middle;

[0019] Figure 6 for Figure 5 Enlarged view of the structure at point D in the image;

[0020] Figure 7 for Figure 5 Enlarged view of the structure at point E in the image;

[0021] Figure 8 This is a schematic diagram of the AC terminal structure in Embodiment 1 of this utility model;

[0022] Figure 9 This is a top view of Embodiment 2 of the present invention.

[0023] In the diagram: 1. DC terminal; 11. First component; 111. First conductor; 112. First soldering area; 113. First pin; 12. Second component; 121. Second conductor; 122. Second soldering area; 123. Second pin; 2. AC terminal; 21. Third component; 211. Third conductor; 212. Third soldering area; 213. Third pin; 3. Package housing. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] In the description of the embodiments of this utility model, it should be noted that the terms "inner", "outer", "upper", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0026] Example 1

[0027] like Figure 1 As shown, this embodiment is a module terminal using a stacked busbar structure, which includes a plurality of DC terminals 1. Each DC terminal 1 includes a first component 11 and a second component 12, both of which are respectively connected to a chip and a DC power supply. The first component 11 and the second component 12 are energized with opposite currents. The first component 11 and the second component 12 form a stacked busbar structure to cancel the magnetic field of the reverse current. A portion of the first component 11 overlaps with the entire portion of the second component 12 to expand the effective area of ​​magnetic field cancellation.

[0028] Specifically, this embodiment includes three DC terminals 1, which are connected to the positive and negative terminals of a DC power supply to power the chip. The first component 11 and the second component 12 are respectively connected to the positive and negative terminals of the DC power supply to form positive and negative conductors. The two are closely attached and separated by a thin insulating layer to form a stacked busbar structure. This stacked busbar structure is a conventional design in the art. The area where the first component 11 and the second component 12 are closely attached is called the overlapping area. The effective overlapping area is the actual projected area of ​​the first component 11 and the second component 12 overlapping.

[0029] The upper ends of the first component 11 and the second component 12 are respectively connected to the positive and negative terminals of a DC power supply (the structure of the DC power supply is not shown in the figure, but it is a conventional structure in the art). The lower ends of both are respectively connected to the positive and negative input ports of the chip to form DC loops with opposite current flow directions (the structure of the chip is not shown in the figure, but it is a conventional structure in the art). According to the law of electromagnetic induction, the magnetic fields generated by the first component 11 and the second component 12 are opposite in direction and have the same magnetic field strength. However, the opposite direction of the magnetic field lines reduces the total magnetic flux. Therefore, the total magnetic flux is inversely proportional to the effective overlapping area. At the same time, according to the fact that magnetic flux is the product of inductance and current, the total magnetic flux is directly proportional to stray inductance. Among them, a part of the area of ​​the first component 11 overlaps with the entire area of ​​the second component 12, so that the effective overlapping area is the projected area of ​​the second component 12. Compared with the existing embodiments where there are complementary overlapping areas for both positive and negative terminals, this embodiment can maximize the effective overlapping area, reduce the total magnetic flux, thereby reducing stray inductance and improving the reliability of the system.

[0030] like Figure 2 As shown, the first component 11 includes a first conductor 111, and the second component 12 includes a second conductor 121; the first conductor 111 and the second conductor 121 are parallel to each other and do not contact each other to form a stacked busbar structure, and the projection of the first conductor 111 along the direction perpendicular to the second conductor 121 can cover the second conductor 121.

[0031] Specifically, both the first conductor 111 and the second conductor 121 are plate-mounted structures, tightly bonded together with insulating material in between to prevent the formation of a circuit, thus forming a stacked busbar structure; wherein the second conductor 121 is projected onto the first conductor 111 along a direction perpendicular to the first conductor 111, and its projected area is the actual area of ​​the second conductor 121, and this projected area is the effective overlap area of ​​the first conductor 111 and the second conductor 121, so that the total magnetic flux in the second conductor 121 is zero, thereby making the stray inductance in the region of the second conductor 121 zero.

[0032] Combination Figure 1 As shown, the first component 11 further includes a first welding area 112, and the second component 12 further includes a second welding area 122; a portion of the side of the first conductor 111 forms the first welding area 112, which is opposite to but does not overlap with the second conductor 121, and the first welding area 112 connects the DC power supply to the first conductor 111; a portion of the side of the second conductor 121 forms the second welding area 122, which is away from the first conductor 111 and close to the first welding area 112, and the second welding area 122 connects the DC power supply to the second conductor 121.

[0033] Specifically, the first welding area 112 faces the second conductor 121 but does not overlap with it, allowing sufficient space for the laser to weld the DC power supply to it. The magnetic flux through the first welding area 112 is the total magnetic flux of the first component 11 and the second component 12. Therefore, reducing the area of ​​the first welding area 112 can reduce the stray inductance of this embodiment. The first welding area 112 and the positive terminal of the DC power supply are fixedly connected by laser welding. Therefore, the first welding area 112 needs to reserve a suitable area to allow the laser to weld. The specific area of ​​the first welding area 112 is a conventional design, which is determined by those skilled in the art based on factors such as laser welding machines and production experience, and will not be elaborated here.

[0034] Specifically, the second welding area 122 is formed on the side of the second conductor 121 away from the first conductor 111, so that there is enough space for the laser to weld the negative terminal of the DC power supply to it. At the same time, the second welding area 122 is formed at the end of the second conductor 121 close to the first conductor 111, so that the second welding area 122 is as close as possible to the first welding area 112, thereby maximizing the current path through the second conductor 121, thereby increasing the effective overlap area of ​​the first component 11 and the second component 12, thereby expanding the effective area of ​​magnetic field cancellation, and thereby reducing stray inductance.

[0035] like Figures 3 to 6 As shown, the first component 11 also includes several first pins 113 connected to the chip, and the second component 12 also includes several second pins 123 connected to the chip; both the first pins 113 and the second pins 123 are Z-shaped, and the first pins 113 and the second pins 123 are parallel to each other and do not contact each other; the height H2 of the second pin 123 minus the height H1 of the first pin 113 is the vertical distance between the second conductor 121 and the first conductor 111.

[0036] Specifically, in this embodiment, the first component 11 includes four first pins 113 which are soldered to the chip. The four first pins 113 are parallel and non-contacting at the end of the first conductor 111 away from the first soldering area 112, so that the DC current of the DC power supply flows sequentially through the first soldering area 112, the first conductor 111, and the first pins 113 to the positive input interface of the chip, forming a positive current and generating a positive magnetic field. Secondly, the cross-section of the first pin 113 along the current flow direction is Z-shaped, and the height of the first pin 113 refers to the height of the Z-shape along the current flow direction, specifically the distance H1 from the first conductor 111 to the chip.

[0037] Secondly, in this embodiment, the second component 12 includes four second pins 123. The four second pins 123 are arranged in parallel and without contact at the end of the second conductor 121 away from the second soldering area 122, so that the DC current from the negative output port of the chip flows sequentially into the second pins 123, the second conductor 121, the second soldering area 122 and the DC power supply, forming a complete current loop with the first component 11, thereby forming a current opposite to that of the first component 11, generating a magnetic field opposite to that of the first component 11, thereby generating magnetic field cancellation and reducing stray inductance. Secondly, the cross-section of the second pin 123 along the current flow direction is Z-shaped. The height of the second pin 123 refers to the height of the Z-shape along the current flow direction, specifically the distance H2 from the second conductor 121 to the chip. H2 can roughly determine the thickness of this embodiment. Therefore, H2 needs to be determined according to the actual production requirements. The difference between H2 and H1 is the distance between the first conductor 111 and the second conductor 121. H1 is determined according to the distance requirements in actual production and H2.

[0038] Secondly, the four first pins 113 are divided into two groups and distributed on both sides of the same end of the first conductor 111, with a space in the middle for placing the four second pins 123. The contact surfaces of the first pins 113 and the second pins 123 with the chip are on the same plane, and their length directions are parallel and in the direction of current flow. This optimizes the structure of the first component 11 and the second component 12, reduces their size, and thus reduces the size of this embodiment.

[0039] like Figure 7 and Figure 8 As shown, this embodiment also includes three AC terminals 2, which are connected to the U phase, V phase and W phase of the AC power supply respectively. The AC terminal 2 includes a third component 21, which includes a third conductor 211. The two ends of the third conductor 211 are connected to the third soldering area 212 and the third pin 213 respectively. The plane of the third conductor 211 is parallel to the plane of the stacked busbar structure. The two ends of the third conductor 211 form the third pin 213 and the third soldering area 212 respectively. The third pin 213 has a Z-shaped structure and is connected to the chip. The third soldering area 212 is connected to the AC power supply.

[0040] Specifically, three AC terminals 2 and three DC terminals 1 are respectively located at both ends of the chip. The AC terminals 2 include a third component 21, and the three third components 21 are respectively connected to the three phases of the AC power to form a complete AC circuit. Among them, the plane of the third conductor 211 is parallel to the plane of the first conductor 111. The end of the third conductor 211 near the chip forms four third pins 213. The four third pins 213 are parallel and do not touch. The cross-section of the third pins 213 along the current direction is Z-shaped. The end of the third conductor 211 near the AC power source forms a third welding area 212. The third welding area 212 is connected to the AC power source by laser welding to form a fixed connection, ensuring the welding strength of the third welding area 212.

[0041] Example 2

[0042] like Figure 9 As shown, this embodiment 2 is an HPD packaging module, which includes: Embodiment 1, which includes a DC terminal 1 and an AC terminal 2; a packaging shell 3, which encapsulates the DC terminal 1 and the AC terminal 2 at both ends of the packaging shell 3, and encapsulates a chip in the middle part of the packaging shell 3.

[0043] Specifically, the middle part of the packaging shell 3 forms a cavity for packaging the chip (the chip structure diagram is not shown in the figure, which is a conventional design). The upper part of the packaged DC terminal 1 is laser-welded to the DC power supply, and the lower part of the packaged AC terminal 2 is laser-welded to the AC power supply, ensuring the stability of the welding position. At the same time, the DC terminal 1 and the AC terminal 2 respectively form the first welding area 112, the second welding area 122, and the third welding area 212 to form the working surface of the laser, ensuring the welding quality of the laser welding. The laser welding machine is a robot-driven laser welding device, which is a conventional machine in this field. It can improve the automation level of packaging, thereby improving the efficiency of packaging.

[0044] Combination Figure 1 As shown, DC terminal 1 includes a first soldering area 112 and a second soldering area 122 connected to a DC power supply, and AC terminal 2 includes a third soldering area 212 connected to an AC power supply. The width and length of the first soldering area 112, the second soldering area 122 and the third soldering area 212 exposed at both ends of the package housing 3 are the same. The first soldering area 112, the second soldering area 122 and the third soldering area 212 are connected to the DC power supply or the AC power supply by laser welding.

[0045] Specifically, the first welding area 112 and the second welding area 122 are formed at the upper end of the encapsulation shell 3, and the third welding area 212 is formed at the lower end of the encapsulation shell 3. The length and width of the three areas not encapsulated by the encapsulation shell 3 are the same, and they are parallel to each other and do not contact each other. At the same time, the first welding area 112, the second welding area 122 and the third welding area 212 are arranged in three rows and three columns to further determine the position of the first welding area 112, the second welding area 122 and the third welding area 212 relative to the encapsulation shell 3. This allows the laser welding machine to determine the position of the encapsulation shell 3, and thus the position of the first welding area 112, the second welding area 122 and the third welding area 212, thereby improving the welding accuracy and welding quality.

[0046] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

[0047] The technologies, shapes, and structures not described in detail in this utility model are all known technologies.

Claims

1. A modular terminal using a stacked busbar structure, the modular terminal comprising a plurality of DC terminals (1), characterized in that, The DC terminal (1) includes: The first component (11) and the second component (12) are connected to the chip and the DC power supply at both ends respectively, and the currents of the first component (11) and the second component (12) are opposite. The first component (11) and the second component (12) form a stacked busbar structure to counteract the magnetic field of the reverse current. A portion of the first component (11) overlaps with the entire region of the second component (12) to expand the effective area of ​​magnetic field counteracting.

2. The module terminal according to claim 1, characterized in that, The first component (11) includes a first conductor (111), and the second component (12) includes a second conductor (121); The first conductor (111) and the second conductor (121) are parallel to each other and do not contact each other to form the stacked busbar structure. The projection of the first conductor (111) along the direction perpendicular to the second conductor (121) can cover the second conductor (121).

3. The module terminal according to claim 2, characterized in that: The first component (11) further includes a first welding area (112), and the second component (12) further includes a second welding area (122); A portion of the side surface of the first conductor (111) forms the first welding area (112), which is opposite to but does not overlap with the second conductor (121). The first welding area (112) connects the DC power supply to the first conductor (111). A portion of the side surface of the second conductor (121) forms the second welding area (122), which is away from the first conductor (111) and close to the first welding area (112). The second welding area (122) connects the DC power supply to the second conductor (121).

4. The module terminal according to claim 3, characterized in that: The first component (11) further includes a plurality of first pins (113) connected to the chip, and the second component (12) further includes a plurality of second pins (123) connected to the chip; Both the first pin (113) and the second pin (123) are Z-shaped, and the first pin (113) and the second pin (123) are parallel to each other and do not touch. The height H2 of the second pin (123) minus the height H1 of the first pin (113) is the vertical distance between the second conductor (121) and the first conductor (111).

5. The module terminal according to claim 1, characterized in that, It also includes three AC terminals (2), which are respectively connected to the U phase, V phase and W phase of the AC power supply. The AC terminal (2) includes a third component (21), which includes a third conductor (211). The two ends of the third conductor (211) are respectively connected to the third soldering area (212) and the third pin (213). The plane containing the third conductor (211) is parallel to the plane containing the stacked busbar structure. The two ends of the third conductor (211) form a third pin (213) and a third soldering area (212), respectively. The third pin (213) has a Z-shaped structure and is connected to the chip. The third soldering area (212) is connected to the AC power supply.

6. An HPD packaging module, characterized in that, include: The module terminal as described in any one of claims 1 to 5, wherein the module terminal includes the DC terminal (1) and the AC terminal (2); The package housing (3) encapsulates the DC terminal (1) and the AC terminal (2) at its two ends, and encapsulates the chip in the middle part of the package housing (3).

7. The HPD packaging module according to claim 6, characterized in that: The DC terminal (1) includes a first soldering area (112) and a second soldering area (122) connected to a DC power supply, and the AC terminal (2) includes a third soldering area (212) connected to an AC power supply. The first welding area (112), the second welding area (122) and the third welding area (212) are exposed at both ends of the packaging shell (3) with the same width and length. The first welding area (112), the second welding area (122) and the third welding area (212) are connected to a DC power supply or an AC power supply by laser welding.

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