High-efficiency assembled heat-dissipation rectifier bridge

Abstract

The application discloses a high-efficiency assembly line rectifier bridge and relates to the technical field of semiconductors. The rectifier bridge comprises a plastic sealing body and a radiator. The back of the plastic sealing body is provided with fixedly connected positioning pins, and the positioning pins are provided with a plurality of groups of reverse-stud steps. The radiator is provided with positioning holes matched with the positioning pins, the back of the rectifier bridge is quickly connected with the surface of the radiator, and under the condition that the length and width of the rectifier bridge remain unchanged, the time required for screwing and fixing the plastic sealing body is reduced from 45 seconds to 3 seconds through the improvement of the plastic sealing body structure on the outer surface of the rectifier bridge and the optimization of the radiator structure, and the assembly efficiency is increased by 15 times. Meanwhile, the original mounting through holes on the surface of the body are cancelled, the structure inside the product can be optimized, the area of the internal copper sheet for conducting electricity is increased, and the heat conduction capacity is increased.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a high-efficiency assembled heat dissipation rectifier bridge. Background Technology

[0002] A rectifier bridge is an electronic circuit module that converts alternating current (AC) into direct current (DC). It consists of multiple rectifier diodes connected in a specific manner. Its core function is to use the unidirectional conductivity of diodes to "flip" the negative or positive half-cycle of the input AC voltage into a voltage of single polarity, thereby outputting pulsating direct current.

[0003] The rectifier bridge mainly consists of a bridge circuit composed of four diodes to convert the input AC voltage into the output DC voltage. In each working cycle of the rectifier bridge module, only two diodes work at the same time. Through the unidirectional conduction function of the diodes, the AC power is converted into a unidirectional DC pulsating voltage.

[0004] Currently, rectifier bridge products have a rectangular external structure and a flat back, intended for later assembly with heat sinks. During assembly, screws are currently used to fix the rectifier bridge to the heat sink, which is not only inefficient but also prone to cracking the components when the screw torque is high, posing a risk of insufficient insulation.

[0005] Therefore, how to improve the assembly efficiency of the rectifier bridge and heat sink and reduce the risk of insulation failure is a technical problem that urgently needs to be solved in this case. Utility Model Content

[0006] To address the above problems, this utility model provides a compact structure that improves the assembly efficiency of the rectifier bridge and heat sink, reduces the risk of insulation failure, and offers a highly efficient heat-dissipating rectifier bridge.

[0007] The technical solution of this utility model is:

[0008] A high-efficiency assembled heat-dissipating rectifier bridge includes:

[0009] The plastic-encapsulated body has a fixedly connected positioning pin on the back, and the positioning pin has several sets of barbed steps;

[0010] The heat sink is detachably and fixedly mounted on the back of the plastic encapsulation body; it is provided with positioning holes adapted to positioning pins, and the positioning holes are provided with limiting grooves adapted to several sets of barbed steps, so as to quickly attach and connect the back of the rectifier bridge to the surface of the heat sink.

[0011] Specifically, the locating pin has a circular or polygonal cross-section.

[0012] Specifically, the heat sink is provided with a matching receiving groove on the connection side with the rectifier bridge to improve installation positioning efficiency and accuracy.

[0013] Specifically, a boss is provided on the back of the rectifier bridge;

[0014] The locating pin is fixedly mounted on the boss.

[0015] Specifically, the surface of the positioning pin is provided with a glass fiber PPS layer.

[0016] Specifically, the top corner of the encapsulated body is provided with an anti-misfit bevel.

[0017] This utility model includes a molded body and a heat sink. The back of the molded body is provided with a locating pin for fixed connection, and the locating pin has several sets of barbed steps. The heat sink has locating holes that fit the locating pin, allowing for quick and easy connection between the back of the rectifier bridge and the surface of the heat sink. Without changing the length and width of the rectifier bridge itself, this invention, through improvements to the outer surface structure of the molded body and optimization of the heat sink structure, reduces the time required for screw fixing of the molded body from 45 seconds to 3 seconds, increasing assembly efficiency by 15 times. Simultaneously, by eliminating the original mounting through holes on the surface of the main body, the internal structure of the product can be optimized, increasing the conductive area of ​​the internal copper sheets and improving thermal conductivity. Attached Figure Description

[0018] Figure 1 This is a structural schematic diagram of Embodiment 1 of the present utility model;

[0019] Figure 2 This is a schematic diagram of the rectifier bridge structure;

[0020] Figure 3 This is a schematic diagram of the structure of Embodiment 2 of this utility model;

[0021] Figure 4 This is a structural schematic diagram of Embodiment 3 of this utility model;

[0022] Figure 5 This is a schematic diagram of the front structure of the rectifier bridge;

[0023] In the diagram, 100 is the plastic sealant, 110 is the locating pin, 111 is the barbed step, 120 is the boss, and 130 is the anti-misalignment bevel.

[0024] 200 is the heat sink. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0026] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "vertical," and "horizontal," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] like Figure 1 , 2 As shown, a high-efficiency assembled heat-dissipating rectifier bridge includes:

[0029] The plastic seal 100 has a fixedly connected positioning pin 110 on its back. The positioning pin 110 has several sets of barbed steps 111. The inclination angle α of the barbed steps 111 satisfies: 15°≤α≤25°.

[0030] The radiator 200 is detachably and fixedly mounted on the back of the plastic encapsulation body 100; it is provided with a positioning hole adapted to the positioning pin 110, and the positioning hole is provided with a limiting groove adapted to a number of barbed steps 111, so as to quickly attach and connect the back of the rectifier bridge to the surface of the radiator 200.

[0031] This project improves the structure of the rectifier bridge's outer surface molding compound 100 and optimizes the heat sink 200 structure, reducing the screw-fixing installation time of the molding compound 100 from 45 seconds to 3 seconds, thus increasing assembly efficiency by 15 times. Simultaneously, by eliminating the original mounting holes on the main body surface, the internal structure of the product can be optimized, increasing the conductive area of ​​the internal copper sheets and enhancing thermal conductivity.

[0032] The locating pin 110 has a circular or polygonal cross-section.

[0033] The locating pin 110 has a glass fiber PPS layer on its surface, which reduces the difference in thermal expansion coefficient with that of the aluminum alloy heat sink 200, thereby reducing the risk of thermal stress causing the insulation layer to crack.

[0034] like Figure 5 As shown, the top corner of the encapsulated body 100 is provided with an anti-misalignment bevel angle 130.

[0035] like Figure 3 As shown, the heat sink 200 is provided with a matching receiving groove on the side connected to the rectifier bridge, which improves the efficiency and accuracy of installation and positioning.

[0036] The receiving groove is provided with an elastic layer made of silver-containing silicone material with a thickness of 0.2-0.5mm. During assembly, it generates a compression deformation of 0.1-0.3mm, which improves the reliability and durability of the combination connection between the encapsulated body 100 and the heat sink 200.

[0037] like Figure 4 As shown, the rectifier bridge has a boss 120 on the back side, which increases the contact area with the heat sink 200 and improves the heat dissipation efficiency, while also increasing the impact resistance of the plastic encapsulation 100.

[0038] The positioning pin 110 is fixedly mounted on the boss 120.

[0039] Regarding the information disclosed in this case, the following points need to be clarified:

[0040] (1) The accompanying drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design.

[0041] (2) Where there is no conflict, the embodiments and features disclosed in this case can be combined with each other to obtain new embodiments;

[0042] The above are merely specific embodiments disclosed in this case, but the scope of protection of this disclosure is not limited thereto. The scope of protection disclosed in this case shall be determined by the scope of protection of the claims.

Claims

1. A high-efficiency assembly line rectifier bridge, characterized in that, include: The plastic seal (100) has a fixedly connected positioning pin (110) on its back. The positioning pin (110) has several sets of barbed steps (111). The inclination angle α of the barbed steps (111) satisfies 15°≤α≤25°. The positioning pin (110) has a circular or polygonal cross-section and a glass fiber PPS layer on its surface. The heat sink (200) is detachably fixed on the back of the plastic encapsulation body (100); it is provided with a positioning hole adapted to the positioning pin (110), and the positioning hole is provided with a limiting groove adapted to a number of barbed steps (111), so that the back of the rectifier bridge is quickly attached to the surface of the heat sink (200). The heat sink (200) is provided with a matching receiving groove on the side connected to the rectifier bridge, and a silver-containing silicone elastic layer with a thickness of 0.2-0.5mm is provided in the receiving groove; The rectifier bridge has a boss (120) on the back side, which increases the contact area with the heat sink (200) and improves the heat dissipation efficiency, while also increasing the impact resistance of the encapsulated body (100).

2. The high-efficiency assembly line rectifier bridge according to claim 1, characterized in that, The top corner of the encapsulated body (100) is provided with an anti-misfit beveled angle (130).

Images