IPM-SSOP lead frame

Abstract

An IPM-SSOP lead frame includes frame units arranged laterally in a rectangular array on a frame body, with their length direction parallel to the length direction of the frame body. Each frame unit includes a central connecting rib located in the middle and arranged along its length; a first base island distributed on one side of the central connecting rib, and second, third, fourth, fifth, sixth, and seventh base islands distributed on the other side; the central connecting rib connects to the frame body, the second base island connects to the fourth base island, and the fourth base island connects to the sixth base island; twenty-seven pins are sequentially spaced on one side of the frame unit, with two connected to the central connecting rib and four connected to the first base island; ten pins are sequentially spaced on the other side of the frame unit, with the second, third, fifth, and seventh base islands each connected to one pin on that side; the pin connected to the second base island has a wider width than the other pins. This design achieves a multi-base island structure, improves heat dissipation, reduces the risk of wire breakage during molding, and increases material utilization.

Description

Technical Field

[0001] This application pertains to semiconductor technology and relates to multi-chip integrated packaging technology, specifically to an IPM-SSOP lead frame. Background Technology

[0002] SSOP (Shrink Small Outline Package) is a type of miniaturized small outline package. The SSOP leadframe, widely used in the industry, employs a single-island design, which limits the integration of multiple chips and restricts its application in complex integrated circuit packaging. With the increasing demand for packaging in intelligent power modules (IPMs), current IPM packages are mostly based on single-row or dual-row leadframe structures. However, this design suffers from several drawbacks. Firstly, the leadframe layout has low space utilization and negatively impacts the convenience of subsequent packaging processes. Secondly, the single-island structure limits multi-chip integration capabilities. Furthermore, it suffers from insufficient leadframe metal material utilization and low unit package yield efficiency, making it difficult to meet the technical requirements of IPM packaging. Utility Model Content

[0003] To meet the needs of existing product development, this application provides an IPM-SSOP lead frame, which realizes a multi-island structure through base island layout and shape design to support the integration of multiple functional chips. Furthermore, it improves the heat dissipation effect after integration through pin integration, optimizes the matrix array layout to change the glue injection method, reduces the risk of wire breakage during plastic encapsulation, and improves material utilization.

[0004] To achieve the above objectives, the present invention employs the following technology:

[0005] An IPM-SSOP lead frame includes frame units arranged in a rectangular array on a frame body. The frame units are arranged laterally, with their length direction parallel to the length direction of the frame body. Each frame unit includes:

[0006] Intermediate connecting bars located in the middle of the frame unit and arranged along its length;

[0007] The first base island is spaced apart on one side of the intermediate connecting reinforcement;

[0008] The second, third, fourth, fifth, sixth, and seventh base islands are spaced apart on the other side of the intermediate connecting rib and arranged in sequence at intervals.

[0009] Among them, the middle connecting rib connects the main frame, the second base island connects to the fourth base island, and the fourth base island connects to the sixth base island;

[0010] Twenty-seven pins are arranged at intervals on one side of the frame unit. Two of the pins are connected to the middle connecting rib, four of the other pins are connected to the first base island, and the remaining twenty-one pins are arranged at intervals with the first base island.

[0011] Ten pins are arranged at intervals on the other side of the frame unit, wherein the second base island, the third base island, the fifth base island, and the seventh base island are respectively connected to a pin on the other side of the frame unit;

[0012] The pin width connected to the second base island is greater than the width of the other pins.

[0013] Furthermore, the first base island is provided with a plurality of longitudinal waist-shaped locking holes arranged along the width direction of the frame unit, and at least one of the second base island, the third base island, the fourth base island, the fifth base island, the sixth base island, and the seventh base island is provided with a plurality of transverse waist-shaped locking holes arranged along the length direction of the frame unit.

[0014] Furthermore, at least two of the second, fourth, sixth, and seventh base islands have inward grooves formed on them, with the inward grooves extending from the side of the base island adjacent to the intermediate connecting rib toward the center of the base island.

[0015] Furthermore, the side protrusions of the intermediate connecting rib adjacent to the first base island are formed with multiple arc-shaped or trapezoidal protrusions, and the side concave of the first base island adjacent to the intermediate connecting rib are formed with multiple arc-shaped or trapezoidal concave portions.

[0016] Furthermore, the first base island is arranged along the length direction of the frame unit, and along the length direction of the frame unit, one end of the first base island corresponds to the seventh base island, and the other end of the first base island corresponds to the second base island.

[0017] The beneficial effects of this utility model are as follows:

[0018] 1. Through the layout and shape design of the base islands, an electrically isolated multi-base island structure is realized on the IPM-SSOP type frame to support the integration of multiple functional chips;

[0019] 2. Improving heat dissipation through pin integration allows for the design of chips with higher power consumption on the corresponding base island;

[0020] 3. The matrix array layout has been optimized, which not only enables high-volume production through multiple rows and columns and improves material utilization, but also sets the frame units horizontally in the array layout so that their length direction is parallel to the length direction of the frame body. This changes the glue injection method, reduces the risk of wire breakage during molding, and improves material utilization.

[0021] 4. By combining horizontal and vertical waist-shaped locking holes, the locking area is expanded, and the combination of horizontal and vertical elements further improves the locking adhesion.

[0022] 5. The internal groove facilitates better stamping during lead frame fabrication; the arc-shaped or trapezoidal concave and convex parts not only improve the bonding strength with the molding compound, but also facilitate stamping without increasing mold complexity. Attached Figure Description

[0023] Figure 1 This is a partial structural schematic diagram of the overall array layout of the lead frame according to an embodiment of this application.

[0024] Figure 2 This is a schematic diagram of an example of a framework unit in an embodiment of this application.

[0025] Figure 3 This is a schematic diagram of another example of the framework unit in the embodiments of this application. Detailed Implementation

[0026] To make the objectives, technical solutions and advantages of the present utility model clearer, the implementation methods of the present utility model will be described in detail below with reference to the accompanying drawings. However, the embodiments described in the present utility model are only some embodiments of the present utility model, and not all embodiments.

[0027] This application provides an IPM-SSOP lead frame, including frame units 2 formed in a rectangular array on the frame body 1, such as... Figure 1 As shown, the rectangular array is arranged in 3 rows and 10 columns, with frame unit 2 arranged horizontally and its length direction parallel to the length direction of frame body 1.

[0028] This example optimizes the layout of frame unit 2 in a matrix, achieving not only high-volume production with multiple rows and columns and improved frame material utilization, but also horizontally arranging the frame units in the array layout so that their length direction is parallel to the length direction of the frame body. This changes the glue injection method, reducing the risk of wire breakage during molding and improving material utilization. Specifically, glue can be injected simultaneously into two lead frames from between the two lead frames in this example, such as... Figure 1 The direction indicated by the middle arrow is the glue injection direction.

[0029] like Figure 2 As shown, the frame unit 2 includes: an intermediate connecting rib 20 located in the middle of the frame unit 2 and arranged along its length direction; a first base island 201 spaced apart on one side of the intermediate connecting rib 20; and a second base island 202, a third base island 203, a fourth base island 204, a fifth base island 205, a sixth base island 206, and a seventh base island 207 spaced apart on the other side of the intermediate connecting rib 20 and arranged in sequence.

[0030] Among them, the intermediate connecting rib 20 connects to the main frame 1, the second base island 202 connects to the fourth base island 204, and the fourth base island 204 connects to the sixth base island 206.

[0031] from Figure 2 As can be seen, the first base island 201 is arranged along the length of frame unit 2 and has a large span, roughly equivalent to the span between the second base island 202 and the seventh base island 207. Along the length of frame unit 2, one end of the first base island 201 corresponds to the seventh base island 207, and the other end of the first base island 201 corresponds to the second base island 202. This design allows for the selection of multiple chips on the first base island 201 by utilizing its large area due to the large span. At the same time, each base island on the other side of the connecting rib 20 can also be equipped with a chip, realizing a multi-chip layout within the IPM-SSOP type frame.

[0032] As a preferred embodiment of this example, to further improve the bonding force between the frame and the molding compound and enhance molding stability in multi-chip integration, the first base island 201 is provided with a plurality of longitudinal waist-shaped locking holes 21 arranged along the width direction of the frame unit 2, and at least one of the second base island 202, third base island 203, fourth base island 204, fifth base island 205, sixth base island 206, and seventh base island 207 is provided with a plurality of transverse waist-shaped locking holes 22 arranged along the length direction of the frame unit 2, such as... Figure 2 As shown, on the second base island 202, the third base island 203, and the fourth base island 204, a waist-shaped design is used to increase the area of ​​the locking holes, and the locking ability is optimized through a combination of horizontal and vertical design. Among the second base island 202, the third base island 203, the fourth base island 204, the fifth base island 205, the sixth base island 206, and the seventh base island 207, the base islands without horizontally waist-shaped locking holes 22 have circular locking holes 23, such as... Figure 2 The example shown is the fifth base island 205, the sixth base island 206, and the seventh base island 207.

[0033] As another preferred embodiment, at least two of the second base island 202, the fourth base island 204, the sixth base island 206, and the seventh base island 207 have recessed grooves 24 formed therein. The recessed grooves 24 are formed recessed from the side of the base island adjacent to the intermediate connecting rib 20 toward the center of the base island. As a specific example, such as Figure 2 As shown, the second base island 202, the fourth base island 204, the sixth base island 206, and the seventh base island 207 all have inner grooves 24. The design of the inner grooves 24 facilitates better stamping and forming.

[0034] To further improve the stability of molding, the side of the intermediate connecting rib 20 adjacent to the first base island 201 is formed with multiple protrusions 25, and the side of the first base island 201 adjacent to the intermediate connecting rib 20 is formed with multiple concave portions 26. The concave and convex arrangement can improve the bonding effect during molding. In order not to increase the complexity of the stamping mold and to make the protrusions 25 and concave portions 26 easy to process, the protrusions 25 and concave portions 26 can be set as arc-shaped or trapezoidal.

[0035] Twenty-seven pins are arranged sequentially at intervals on one side of frame unit 2, namely, pin A1, pin A2, pin A3, pin A4, pin A5, pin A6, pin A7, pin A8, pin A9, pin A10, pin A11, pin A12, pin A13, pin A14, pin A15, pin A16, pin A17, pin A18, pin A19, pin A20, pin A21, pin A22, pin A23, pin A24, pin A25, pin A26, and pin A27.

[0036] Two pins are connected to the intermediate connecting rib 20. Specifically, the first pin A1 and the twenty-seventh pin A27 extend inward along the width direction of the frame unit 2 and connect to both ends of the intermediate connecting rib 20. Four other pins are connected to the first base island 201. Specifically, one end of the first base island 201 extends outward along the width direction of the frame unit 2 and connects to the second pin A2 and the third pin A3. The other end of the first base island 201 extends outward along the width direction of the frame unit 2 and connects to the twenty-fifth pin A25 and the twenty-sixth pin A26. Preferably, both ends of the extension are provided with longitudinal waist-shaped locking holes 21 to improve the molding bonding force of this section. The remaining twenty-one pins are spaced apart from the first base island 201.

[0037] On the other side of frame unit 2, ten pins are arranged at intervals, namely pin 28 A28, pin 29 A29, pin 30 A30, pin 31 A31, pin 32 A32, pin 33 A33, pin 34 A34, pin 35 A35, pin 36 A36, and pin 37 A37.

[0038] Among them, the second base island 202, the third base island 203, the fifth base island 205, and the seventh base island 207 are respectively connected to the pins on the other side of a frame unit 2; the pin connected to the second base island 202 is wider than the other pins to improve the heat dissipation effect.

[0039] Pin A28 is connected to the second base island 202, pin A30 is connected to the third base island 203, pin A33 is connected to the fifth base island 205, and pin A36 is connected to the seventh base island 207.

[0040] A first dummy pin B1 is provided between the 34th pin A34 and the 35th pin A35. The first dummy pin B1 is connected to the sixth base island 206. The first dummy pin B1 does not actually form a pin after packaging, but will be flushed out in the later stage of packaging. Its purpose is to provide a connection channel between the sixth base island 206 and the frame body 1 to improve the structural stability after packaging.

[0041] The 29th pin A29 extends inward along the width direction of frame unit 2, and the extended section is located between the second base island 202 and the third base island 203; the 32nd pin A32 extends inward along the width direction of frame unit 2, and the extended section is located between the fourth base island 204 and the fifth base island 205; the 35th pin A35 extends inward along the width direction of frame unit 2, and the extended section is located between the sixth base island 206 and the seventh base island 207.

[0042] Pin A1 is symmetrical to pin A37, pin A4 is symmetrical to pin A36, pin A6 is symmetrical to pin A35, pin A8 is symmetrical to pin B1, pin A10 is symmetrical to pin A34, pin A13 is symmetrical to pin A33, pin A15 is symmetrical to pin A32, pin A18 is symmetrical to pin A31, pin A21 is symmetrical to pin A30, and pin A23 is symmetrical to pin A29.

[0043] As another alternative, such as Figure 3 As shown, the second pin A2 and the third pin A3 are combined into one pin A223, and / or the twenty-fifth pin A25 and the twenty-sixth pin A26 are combined into one pin A256. The width of the combined pin is consistent with the width of the pin connected to the second base island 202, thereby providing more widened pins to improve the heat dissipation of the chip on the first base island 201.

[0044] The above description is only a preferred embodiment of this application and is not intended to limit this application. Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application.

Claims

1. An IPM-SSOP lead frame, comprising frame units (2) formed in a rectangular array on a frame body (1), characterized in that, Frame unit (2) includes: Intermediate connecting reinforcement (20) located in the middle of frame unit (2) and arranged along its length; The first base island (201) is distributed at intervals on one side of the intermediate connecting bar (20); The second base island (202), the third base island (203), the fourth base island (204), the fifth base island (205), the sixth base island (206), and the seventh base island (207) are arranged at intervals on the other side of the intermediate connecting rib (20). Among them, the intermediate connecting rib (20) connects the main frame (1), the second base island (202) connects the fourth base island (204), and the fourth base island (204) connects the sixth base island (206). Twenty-seven pins are arranged at intervals on one side of the frame unit (2). Among them, two pins are connected to the middle connecting rib (20), four other pins are connected to the first base island (201), and the remaining twenty-one pins are arranged at intervals with the first base island (201). Ten pins are arranged at intervals on the other side of the frame unit (2), wherein the second base island (202), the third base island (203), the fifth base island (205), and the seventh base island (207) are respectively connected to the pins on the other side of the frame unit (2); The pin width connected to the second base island (202) is greater than the width of the other pins.

2. The IPM-SSOP lead frame according to claim 1, characterized in that, The rectangular array is arranged in 3 rows and 10 columns. The frame unit (2) is arranged horizontally, and its length direction is parallel to the length direction of the frame body (1).

3. The IPM-SSOP lead frame according to claim 1, characterized in that, The first base island (201) is provided with a plurality of longitudinal waist-shaped locking holes (21) arranged along the width direction of the frame unit (2), and at least one of the second base island (202), the third base island (203), the fourth base island (204), the fifth base island (205), the sixth base island (206), and the seventh base island (207) is provided with a plurality of transverse waist-shaped locking holes (22) arranged along the length direction of the frame unit (2).

4. The IPM-SSOP lead frame according to claim 1, characterized in that, At least two of the second base island (202), the fourth base island (204), the sixth base island (206), and the seventh base island (207) have indentations (24) formed therein, the indentations (24) being formed from the side of the base island adjacent to the intermediate connecting rib (20) toward the center of the base island.

5. The IPM-SSOP lead frame according to claim 1, characterized in that, The intermediate connecting rib (20) has multiple arc-shaped or trapezoidal protrusions (25) on the side protrusion adjacent to the first base island (201), and the first base island (201) has multiple arc-shaped or trapezoidal concave parts (26) corresponding to the side concavity adjacent to the intermediate connecting rib (20).

6. The IPM-SSOP lead frame according to claim 1, characterized in that, The first base island (201) is arranged along the length direction of the frame unit (2), and along the length direction of the frame unit (2), one end of the first base island (201) corresponds to the seventh base island (207), and the other end of the first base island (201) corresponds to the second base island (202).

7. The IPM-SSOP lead frame according to claim 1, characterized in that, The pins on one side of the frame unit (2) are, in order, the first pin (A1), the second pin (A2), the third pin (A3), the fourth pin (A4), the fifth pin (A5), the sixth pin (A6), the seventh pin (A7), the eighth pin (A8), the ninth pin (A9), the tenth pin (A10), the eleventh pin (A11), the twelfth pin (A12), the thirteenth pin (A13), the fourteenth pin (A14), the fifteenth pin (A15), the sixteenth pin (A16), the seventeenth pin (A17), the eighteenth pin (A18), the nineteenth pin (A19), the twentieth pin (A20), the twenty-first pin (A21), the twenty-second pin (A22), the twenty-third pin (A23), the twenty-fourth pin (A24), the twenty-fifth pin (A25), the twenty-sixth pin (A26), and the twenty-seventh pin (A27). The first pin (A1) and the twenty-seventh pin (A27) extend inward along the width direction of the frame unit (2) and are connected to both ends of the intermediate connecting rib (20); One end of the first base island (201) extends outward along the width direction of the frame unit (2) and connects to the second pin (A2) and the third pin (A3). The other end of the first base island (201) extends outward along the width direction of the frame unit (2) and connects to the twenty-fifth pin (A25) and the twenty-sixth pin (A26).

8. The IPM-SSOP lead frame according to claim 7, characterized in that, The pins on the other side of the frame unit (2) are, in order, pin 28 (A28), pin 29 (A29), pin 30 (A30), pin 31 (A31), pin 32 (A32), pin 33 (A33), pin 34 (A34), pin 35 (A35), pin 36 (A36), and pin 37 (A37). Pin 28 (A28) is connected to the second base island (202), pin 30 (A30) is connected to the third base island (203), pin 33 (A33) is connected to the fifth base island (205), and pin 36 (A36) is connected to the seventh base island (207); A first dummy pin (B1) is provided between the thirty-fourth pin (A34) and the thirty-fifth pin (A35), and the first dummy pin (B1) is connected to the sixth base island (206). The 29th pin (A29) extends inward along the width direction of the frame unit (2), and the extended section is located between the second base island (202) and the third base island (203); The 32nd pin (A32) extends inward along the width direction of the frame unit (2), and the extended section is located between the fourth base island (204) and the fifth base island (205); The 35th pin (A35) extends inward along the width direction of the frame unit (2), and the extended section is located between the sixth base island (206) and the seventh base island (207).

9. The IPM-SSOP lead frame according to claim 8, characterized in that, Pin 1 (A1) is symmetrical to pin 37 (A37), pin 4 (A4) is symmetrical to pin 36 (A36), pin 6 (A6) is symmetrical to pin 35 (A35), pin 8 (A8) is symmetrical to pin 1 (B1), pin 10 (A10) is symmetrical to pin 34 (A34), pin 13 (A13) is symmetrical to pin 33 (A33), pin 15 (A15) is symmetrical to pin 32 (A32), pin 18 (A18) is symmetrical to pin 31 (A31), pin 21 (A21) is symmetrical to pin 30 (A30), and pin 23 (A23) is symmetrical to pin 29 (A29).

10. The IPM-SSOP lead frame according to claim 7, characterized in that, The second pin (A2) and the third pin (A3) are combined into one pin, and / or the twenty-fifth pin (A25) and the twenty-sixth pin (A26) are combined into one pin, and the width of the combined pin is the same as the width of the pin connected to the second base island (202).

Images