Multi-stage arch bridge type compression-resistant packaging assembly

Abstract

This utility model relates to the technical field of multi-stage arch-bridge type pressure-resistant packaging assembly, including a packaging base with copper pillars disposed on a first surface of the packaging base; and components, including chips and passive devices, disposed on the first surface of the packaging base; and a packaging layer disposed on the inner side of the packaging base, the packaging layer including a lower part and an upper part of a filler, the lower part of the filler being connected to the copper pillars. This assembly, through the multi-stage arch-bridge structure of the packaging layer and the copper pillars connecting the packaging layer on the first surface of the packaging base, achieves the purpose of protecting the components when the packaging assembly is subjected to pressure, by dispersing the pressure through the packaging layer and the copper pillars, and by dissipating heat through the copper pillars.

Description

Technical Field

[0001] The present invention relates to the technical field of multi-level arch bridge type pressure-resistant packaging components. Background Technology

[0002] System-in-Package (SIP) is a technology that integrates multiple semiconductor chips with different functions, passive components (such as resistors and capacitors), and other electronic components into a single package. Its core objective is to achieve system-level functionality through high integration, while optimizing performance, reducing cost, and miniaturizing size.

[0003] The patent application with application number 202222620976.1 discloses a packaging component for a SIP chip, including a chip and passive devices, and a base. A filler for wrapping the chip and passive devices is provided in the mounting groove. The filler is formed by injecting and photocuring a light-curing resin liquid. The filler abuts against each inner wall of the mounting groove and wraps the chip and passive devices in the mounting groove. At this time, the protrusions provided on the side wall of the mounting groove abut against the limiting groove to limit the filler. The first side of the filler is a convex arc surface to form an arched structure.

[0004] In the aforementioned prior art, the arched structure of the filler is used to conduct the pressure through the filler to the sidewall of the mounting groove, and the protrusion is mechanically limited by abutting against the limiting groove of the filler. When the pressure is too high, on the one hand, the deformation of the sidewall may increase the clearance between the protrusion and the limiting groove, or even cause them to lose contact, making the filler loose; on the other hand, the pressure is conducted to the sidewall of the mounting groove, which can prevent the chip and passive devices from being damaged by the pressure, thus affecting the packaging. Furthermore, the heat dissipation of the packaging structure is not designed, which affects the device performance. Utility Model Content

[0005] In view of the problems existing in the above-mentioned arch-bridge type pressure-resistant packaging components, this utility model is proposed.

[0006] Therefore, the purpose of this utility model is to provide a multi-level arch bridge type pressure-resistant packaging component, which aims to protect the chip and passive device from pressure damage and increase the heat dissipation path.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a multi-stage arch bridge-type pressure-resistant encapsulation assembly, comprising,

[0008] An encapsulation base includes sidewalls and a bottom, a first surface disposed on the bottom, and copper pillars disposed on the first surface; and,

[0009] The components include chips and passive devices, and both the chips and passive devices are disposed on the first surface of the packaging base.

[0010] The encapsulation layer includes a lower filler portion and an upper filler portion, wherein the lower filler portion is disposed on the first surface, and the upper filler portion is disposed above the lower filler portion, and the lower filler portion encloses the copper pillar.

[0011] As a preferred embodiment of the multi-stage arch bridge type pressure-resistant packaging assembly of this utility model, the lower part of the filler includes multiple sets of filler blocks, and a copper pillar is provided between each two adjacent filler blocks.

[0012] In a preferred embodiment of the multi-level arch bridge-type pressure-resistant encapsulation assembly of this utility model, the upper surface of each group of filling blocks is arc-shaped.

[0013] As a preferred embodiment of the multi-stage arch bridge-type pressure-resistant encapsulation assembly of this utility model, a protective cover is provided on the encapsulation base.

[0014] As a preferred embodiment of the multi-stage arch bridge type pressure-resistant packaging assembly of this utility model, the packaging base is provided with a second surface, and a plurality of pins are provided on the second surface.

[0015] As a preferred embodiment of the multi-stage arch bridge type pressure-resistant packaging assembly of this utility model, wherein: a mounting groove is provided on the packaging base, and the components are placed in the mounting groove.

[0016] As a preferred embodiment of the multi-stage arch bridge-type pressure-resistant encapsulation assembly of this utility model, heat dissipation holes are provided on the protective cover.

[0017] In a preferred embodiment of the multi-stage arch bridge-type pressure-resistant encapsulation assembly of this utility model, the protective cover is made of iron material.

[0018] As a preferred embodiment of the multi-stage arch bridge-type pressure-resistant packaging component of this utility model, the surface of the copper pillar is subjected to micro-etching treatment.

[0019] In a preferred embodiment of the multi-stage arch bridge-type pressure-resistant encapsulation component of this utility model, the encapsulation layer is formed by curing a photocurable resin.

[0020] The beneficial effects of this invention are as follows: The filler in the encapsulation layer has a multi-level arch bridge structure, with a copper pillar placed between every two adjacent filler blocks. The upper surface of each filler block is arc-shaped. When the protective cover is subjected to pressure, on the one hand, the multi-level arch bridge structure of the encapsulation layer disperses the pressure of the filler, preventing the encapsulation layer from cracking due to excessive pressure, thus protecting the chip and passive devices from damage caused by pressure. On the other hand, the connection between the encapsulation layer and the copper pillars prevents the encapsulation layer from moving due to pressure deformation or vibration, which would affect the encapsulation effect. The copper pillars placed between every two adjacent filler blocks can simultaneously achieve the dual functions of support and heat conduction. This not only disperses the pressure on the encapsulation layer, preventing damage to the encapsulation layer structure, but also disperses the heat generated by the chip, thus achieving the purpose of protecting the chip and passive devices from both pressure and heat dissipation perspectives. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the multi-stage arch-bridge type pressure-resistant encapsulation assembly of Embodiment 1 is shown;

[0023] Figure 2 A schematic diagram of the external structure of the multi-stage arch bridge-type pressure-resistant encapsulation assembly of Embodiment 2 is shown;

[0024] Figure 3 A schematic diagram of the multi-stage arch bridge-type pressure-resistant encapsulation assembly of Embodiment 3 is shown.

[0025] Reference numerals: 1. Package base; 2. Copper pillar; 3. Chip; 4. Passive device; 5. Upper part of filler; 6. Lower part of filler; 7. Protective cover; 8. Pin; 9. First surface; 10. Second surface. Detailed Implementation

[0026] To enable those skilled in the art to better understand this utility model, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0027] The terminology used in this invention refers to those general terms currently widely used in the art in consideration of the functionality of this invention; however, these terms may vary according to the intent, precedent, or new technology of those skilled in the art. Furthermore, specific terms may be chosen by the applicant, and in such cases, their detailed meanings will be described in the detailed description of this invention. Therefore, the terminology used in this specification should not be construed as simple names, but rather based on the meaning of the terms and the overall description of this invention.

[0028] Example 1, referring to Figure 1 The first embodiment of this utility model provides a multi-level arch bridge-type pressure-resistant packaging assembly, which includes a packaging base 1 and components.

[0029] The encapsulation base 1 includes a sidewall and a bottom, a first surface 9 disposed on the bottom, and a copper pillar 2 disposed on the first surface 9.

[0030] The components include chip 3 and passive device 4, both of which are disposed on the first surface 9 of the packaging base 1.

[0031] The encapsulation layer includes a lower filler portion 6 and an upper filler portion 5. The lower filler portion 6 is disposed on the first surface 9, and the upper filler portion 5 is disposed above the lower filler portion 6. The lower filler portion 6 encapsulates the copper pillar 2.

[0032] The encapsulation base 1 is a rectangular box-shaped structure with an open top, including side walls and a bottom substrate. Components and an encapsulation layer are placed in the encapsulation base 1 to protect the components. The encapsulation layer is placed above the components. The upper part 5 of the filler is connected to the lower part 6 of the filler. A high-strength adhesive is applied to the contact surface between the encapsulation layer and the encapsulation base 1 to increase the adhesion between them.

[0033] The first surface 9 of the packaging base 1 is used to set the components. Copper pillars 2 are preset on the first surface 9 of the packaging base 1 to support the packaging layer and transfer the heat generated by the chip 3. The number of copper pillars 2 is set according to the distribution of the packaging base 1, the chip 3 and the passive device 4, which greatly improves the heat dissipation efficiency of the packaging component.

[0034] The components include chip 3 and passive device 4. Operators can select chip 3 according to actual usage requirements, and users can select the model of chip 3 according to the function they want to achieve and the performance of chip 3 required to achieve that function. This application does not limit the type of chip 3.

[0035] Furthermore, a second surface 10 is provided on the packaging base 1, and a plurality of pins 8 are provided on the second surface 10.

[0036] The surface opposite to the first surface 9 of the packaging base 1 is the second surface 10 of the packaging base 1. The pins 8 connect the internal circuitry of the component to the external circuitry through soldering or plugging to form a complete electronic system. The pins 8 are fixed to the PCB by soldering or plugging to provide mechanical support for the component and prevent it from loosening or falling off during vibration, impact, or transportation.

[0037] Furthermore, a mounting slot is provided on the packaging base 1, and the component is placed in the mounting slot.

[0038] The mounting slot, through precise dimensional design, can embed components inside the substrate. The gap between the slot and the chip 3 is filled with photosensitive adhesive film or resin to fix the position of the chip 3, reducing damage caused by vibration or collision during transportation or use, while preventing static electricity or mechanical damage caused by friction between the chip 3 and other components on the substrate surface.

[0039] During use, a packaging base 1 is set up, and components are installed in the mounting slots of the packaging base 1 that match the size of the packaging base 1 on the first surface 9. The packaging layer includes an upper filler 5 and a lower filler 6, which are used to fill the interior of the packaging structure and prevent the chip 3 from moving during use. Copper anchors are set on the lower filler 6 to support the lower filler 6, distribute the pressure of the filler, and prevent the filler from cracking due to excessive pressure, which would affect the packaging components and cause damage to the chip 3 and passive device 4. The second surface 10 of the packaging base 1 is provided with pins 8 for connection with external circuits.

[0040] Example 2, refer to Figure 2 This is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that: a protective cover 7 is provided on the encapsulation base 1; heat dissipation holes are opened on the protective cover 7; and the protective cover 7 is made of iron material.

[0041] The packaging base 1 has buckles at the four corners of its side wall and the midpoint of its long side; a protective cover 7 is provided above the packaging base 1, and slots are provided at the four corners of the side wall and the midpoint of its long side, which engage with the buckles provided on the side wall of the packaging base 1.

[0042] The packaging base 1 has latches at the midpoint of its long sidewall and at its four corners. The protective cover 7 is a rectangular box-shaped structure with an open bottom. The dimensions of the packaging base 1 and the protective cover 7 are the same. The lower sidewall of the protective cover 7 has a groove structure corresponding to the packaging base 1. The protective cover 7 is connected to the packaging base 1 by engaging with the latches on the packaging base 1 through the grooves of the protective cover 7. The protective cover 7 reduces damage to the packaging layer and components from external impacts, friction, and vibration by covering, wrapping, and supporting them. The protective cover 7 has heat dissipation holes to accelerate the heat dissipation of the packaging components by utilizing air convection. The protective cover 7 is made of iron material, which can shield external electromagnetic waves to avoid signal interference or data loss.

[0043] The remaining structure is the same as that in Example 1.

[0044] During use, a protective cover 7 is installed above the encapsulation base 1 and the entire encapsulation layer to protect the internal structure of the encapsulation component. The engagement between the encapsulation base 1 and the groove of the protective cover 7 ensures that the protective cover 7 will not move due to external influences. When the protective cover 7 is subjected to pressure, it transfers the pressure to the encapsulation layer. The multi-stage arch-bridge-type filler structure and the embedded copper pillars 2 of the encapsulation layer disperse the pressure, preventing cracking of the filler in the encapsulation layer due to excessive local pressure. This achieves the purpose of protecting the chip 3 and passive devices 4. In addition, heat dissipation holes are provided on the protective cover to enhance the heat dissipation effect of the encapsulation structure.

[0045] Example 3, referring to Figure 3 This is the third embodiment of the present invention. The difference between this embodiment and the second embodiment is that: the lower part 6 of the filler includes multiple sets of filler blocks, and a copper pillar 2 is provided between each two adjacent filler blocks; the upper surface of each set of filler blocks is arc-shaped; the surface of the copper pillar 2 is micro-etched; and the encapsulation layer is cured by photocurable resin.

[0046] Furthermore, the lower part 6 of the filler includes multiple sets of filler blocks, with a copper pillar 2 between each pair of adjacent filler blocks.

[0047] The number of filler blocks is designed based on the distribution of chips 3. The distribution of copper pillars 2 is determined based on the number of filler blocks in the lower part 6 of the filler. Copper pillars 2 are set at the connection of each arch bridge, and the copper pillars 2 are embedded in the lower part 6 of the filler. The upper part of the filler is set with a corresponding position to the lower part 6 of the filler.

[0048] Furthermore, the upper surface of each set of filler blocks is curved.

[0049] The radius of curvature of the filler block above chip 3 is greater than that of the filler block above passive device 4. By increasing the radius of curvature of the filler block above chip 3, it can be ensured that when chip 3 is subjected to external pressure, the pressure is more evenly distributed to other parts of the encapsulation layer, reducing direct impact on chip 3. When the encapsulation assembly is subjected to pressure, the pressure is transmitted to the upper surface of the filler, and the pressure is transmitted to the support pillars through the arc-shaped structure of the upper surface of the filler. The pressure of the filler is dispersed by multiple filler blocks with arc-shaped upper surfaces and copper pillars 2, preventing the filler from cracking due to excessive pressure, which would affect the encapsulation assembly and cause damage to chip 3 and passive device 4.

[0050] The surface of the copper pillar 2 is roughened to increase the contact area with the lower part 6 of the filler, preventing direct contact between the copper pillar 2 and the lower part 6 of the filler from causing cracks and affecting the structure of the encapsulation component. The encapsulation layer is cured with photocurable resin, which facilitates the design of the encapsulation layer.

[0051] The remaining structure is the same as that in Example 2.

[0052] During use, components are installed in mounting slots of a size matching the encapsulation base 1. Layered curing and multi-level support are used, and a multi-level arch bridge structure is formed between the upper 5 and lower 6 of the filler in the encapsulation layer using photocurable resin. Copper pillars 2 are placed between every two adjacent filler blocks. The upper surface of each filler block is arc-shaped. Copper pillars 2, pre-set on the first surface 9 of the encapsulation base 1, are embedded at the connection between every two adjacent filler blocks. The copper pillars 2 are micro-etched to increase the contact area with the lower 6 of the filler. The copper pillars 2 support the lower 6 of the filler. Pins 8 are provided on the second surface 10 of the encapsulation base 1 for connection to external circuitry. When the encapsulated assembly is subjected to pressure, the pressure is transmitted to the encapsulation layer. The pressure is then transmitted to the support pillars through the multi-level arch bridge structure of the encapsulation layer. The pressure on the filler is dispersed by the multi-level arch bridges and supports, preventing the filler from cracking due to excessive pressure. It is important to note that the construction and arrangement of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., variations in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), installation arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of exemplary embodiments without departing from the scope of this invention. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0053] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to the implementation of the present invention) may be omitted.

[0054] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A multi-stage arch bridge-type pressure-resistant encapsulation assembly, characterized in that: include, The encapsulation base (1) includes a sidewall and a bottom, a first surface (9) disposed on the bottom, and a copper pillar (2) disposed on the first surface (9); as well as, The components include a chip (3) and a passive device (4), both of which are disposed on the first surface of the packaging base (1); The encapsulation layer includes a lower filler portion (6) and an upper filler portion (5), the lower filler portion (6) being disposed on the first surface (9), the upper filler portion (5) being disposed above the lower filler portion (6), and the lower filler portion (6) encapsulating the copper pillar (2).

2. The multi-stage arch bridge type pressure-resistant encapsulation assembly according to claim 1, characterized in that: The lower part (6) of the filler includes multiple sets of filler blocks, and the copper pillar (2) is provided between each two adjacent filler blocks.

3. The multi-stage arch bridge type pressure-resistant encapsulation assembly according to claim 2, characterized in that: The upper surface of each set of filling blocks is arc-shaped.

4. The multi-stage arch bridge type pressure-resistant encapsulation assembly according to claim 1, characterized in that: The encapsulation base (1) is provided with a protective cover (7).

5. The multi-stage arch bridge type pressure-resistant encapsulation assembly according to claim 1, characterized in that: The packaging base (1) is provided with a second surface (10), and a plurality of pins (8) are provided on the second surface (10).

6. The multi-stage arch bridge type pressure-resistant encapsulation assembly according to claim 1, characterized in that: The packaging base (1) has a mounting slot, and the components are placed in the mounting slot.

7. The multi-stage arch bridge type pressure-resistant encapsulation assembly according to claim 4, characterized in that: The protective cover (7) has heat dissipation holes.

8. The multi-stage arch bridge type pressure-resistant encapsulation assembly according to claim 7, characterized in that: The protective cover (7) is made of iron.

9. The multi-stage arch bridge type pressure-resistant encapsulation assembly according to claim 1, characterized in that: The surface of the copper pillar (2) is micro-etched.

10. The multi-stage arch bridge type pressure-resistant encapsulation assembly according to claim 1, characterized in that: The encapsulation layer is formed by curing a photocurable resin.

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