BGA automatic welding equipment based on multi-angle image positioning
By employing multi-angle image positioning technology and highly automated BGA soldering equipment, the problem of insufficient accuracy of single vision positioning systems has been solved, enabling high-precision soldering and efficient production, thus ensuring the quality and stability of electronic products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU OKK ELECTRONICS CO LTD
- Filing Date
- 2025-06-18
- Publication Date
- 2026-07-14
AI Technical Summary
In existing BGA automated soldering equipment, the single vision positioning system is limited by the viewing angle and accuracy, making it difficult to accurately identify the slight deviations between PCB board pads and BGA chip pads. This can easily lead to problems such as chip misalignment and cold solder joints during soldering, affecting the soldering quality and the performance stability of electronic products. At the same time, the degree of automation is insufficient, increasing labor costs and reducing production efficiency.
The BGA automatic welding equipment adopts multi-angle image positioning. By using upper and lower cameras for recognition, multi-angle image positioning technology is used to improve positioning accuracy. Combined with highly automated operation processes, including automatic homing, temperature control and camera recognition positioning, labor costs are reduced and production continuity and stability are improved.
It effectively improves welding quality, reduces issues such as cold solder joints and chip misalignment, ensures the electrical performance and stability of electronic products, and at the same time reduces labor costs and improves production efficiency and continuity.
Smart Images
Figure CN224487910U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of automatic welding technology, and in particular to an automatic BGA welding device based on multi-angle image positioning. Background Technology
[0002] In the electronics manufacturing industry, BGA (Ball Grid Array) packaging technology is widely used in various electronic products due to its high pin density and excellent electrical performance. Automated BGA soldering equipment plays a crucial role in the soldering process of BGA chips, and its soldering quality directly affects the performance and reliability of electronic products.
[0003] BGA automated soldering equipment typically includes the following key components:
[0004] 1. The welding platform is used to support the PCB board and must have high-precision positioning and stable support performance to ensure that the PCB board does not shift during the welding process;
[0005] 2. The heating system is the core component for welding. It heats the BGA chip and PCB board through different methods (such as hot air, infrared heating, etc.) to melt the solder and complete the welding process.
[0006] 3. The motion control system is responsible for controlling the movement of components such as the welding head and nozzle to achieve precise material handling, positioning, and welding operations;
[0007] 4. Welding materials (such as solder balls, flux, etc.) are the basic materials for completing welding, and their quality and usage have a significant impact on the welding quality.
[0008] Currently, various equipment and technologies are employed in the industry to achieve efficient and high-quality soldering of BGA chips. Some equipment uses a single vision positioning system, employing a simple camera to initially identify the BGA position on the PCB board. Other equipment focuses on optimizing the heating system, using new heating materials or methods to improve heating efficiency and uniformity. Still others improve the motion control system to enhance the precision and speed of moving parts.
[0009] However, the above-described implementation still has the following problems. Regarding positioning accuracy, a single vision positioning system is limited by its viewing angle and precision, making it difficult to accurately identify minute deviations between PCB board pads and BGA chip pads. This can easily lead to chip misalignment and cold solder joints during soldering, affecting soldering quality and the performance stability of electronic products. Regarding automation, while some existing equipment has achieved automation in certain stages, the overall process still requires significant manual intervention, increasing labor costs and easily leading to low production efficiency and inconsistent product quality due to human factors. To address these problems, this application proposes an automated BGA soldering device based on multi-angle image positioning. This device utilizes multi-angle image positioning technology to improve positioning accuracy and possesses a high degree of automation, effectively solving the shortcomings of existing technologies and improving the quality and efficiency of BGA chip soldering. Utility Model Content
[0010] To address the shortcomings of existing technologies, this invention provides an automatic BGA soldering device based on multi-angle image positioning. This solves the problem that single vision positioning systems are limited by viewing angle and accuracy, making it difficult to accurately identify minute deviations between PCB board pads and BGA chip pads. This leads to problems such as chip misalignment and cold solder joints during soldering, affecting soldering quality and the performance stability of electronic products.
[0011] To achieve the above objectives, this utility model provides the following technical solution:
[0012] An automated BGA soldering device based on multi-angle image positioning includes a worktable, a protective shell above the worktable, an upper camera and an upper heating wire inside the protective shell, an upper temperature control probe below the upper heating wire, an upper fan above the upper heating wire, an upper X-axis and an upper Y-axis above the worktable, an infrared heating zone inside the worktable, a lower heating head Z-axis, a lower heating head Y-axis and a lower heating head X-axis above the infrared heating zone, a heating mechanism above the infrared heating zone, the heating mechanism including a lower heating wire and a lower temperature control probe, a set of heating tubes inside the infrared heating zone, and two negative pressure gauges above the upper light source.
[0013] Preferably, two limiting blocks are provided in the upper X-axis, a plate frame is provided above the infrared heating zone, and a heating zone probe is provided in the infrared heating zone.
[0014] Preferably, a set of heating box cooling fans is provided on the surface of the infrared heating zone, a lower air pipe is fixedly connected to the surface of the heating mechanism, and an upper light source is provided below the upper camera.
[0015] Compared with the prior art, the present invention has the following beneficial effects:
[0016] 1. In the alignment and soldering process, the upper camera first uses the navigation function to determine the position of the PCB board pads. After the placement nozzle picks up the material, it moves above the lower camera. The lower camera identifies the BGA pads, providing a basis for accurate placement. This minimizes the chip placement position error, effectively improves the soldering quality, reduces problems such as cold solder joints and misalignment, and ensures the electrical performance and stability of electronic products.
[0017] 2. From the automatic return of each component to the automatic control of heating temperature and the automatic identification and positioning of the camera, a large number of automated operations have reduced labor costs and improved the continuity and stability of production. For example, in the welding process, the automatic control of heating and cooling processes avoids errors and time delays that may occur in manual operation. Attached Figure Description
[0018] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.
[0019] Figure 1 This is an overall structural diagram of the present invention;
[0020] Figure 2 This is a structural diagram of the upper X-axis of this utility model;
[0021] Figure 3 This is a structural diagram of the internal structure of the protective shell of this utility model;
[0022] Figure 4 This is a structural diagram of the workbench of this utility model;
[0023] Figure 5 This is a structural diagram of the heating mechanism of this utility model;
[0024] Figure 6 This is a structural diagram of the infrared heating zone of this utility model.
[0025] Legend: 1. Workbench; 2. Protective shell; 3. Upper X-axis; 4. Upper Y-axis; 5. Plate frame; 6. Heating mechanism; 7. Infrared heating zone; 8. Limit block; 9. Negative pressure gauge; 10. Upper camera; 11. Upper light source; 12. Upper heating wire; 13. Upper temperature control probe; 14. Lower heating wire; 15. Upper fan; 16. Lower heating head Z-axis; 17. Lower heating head Y-axis; 18. Lower heating head X-axis; 19. Lower temperature control probe; 20. Lower air pipe; 21. Heating zone probe; 22. Heating tube; 23. Heating chamber cooling fan. Detailed Implementation
[0026] This application provides an automated BGA soldering device based on multi-angle image positioning. This effectively solves the problem that single-vision positioning systems are limited by their viewing angle and accuracy, making it difficult to accurately identify minute deviations between PCB board pads and BGA chip pads. This leads to chip misalignment and cold solder joints during soldering, affecting soldering quality and the performance stability of electronic products. The proposed automated BGA soldering device utilizes multi-angle image positioning technology to improve positioning accuracy and features a high degree of automation. It effectively addresses the shortcomings of existing technologies, improving the quality and efficiency of BGA chip soldering.
[0027] Example
[0028] like Figures 1 to 6 As shown, the technical solution in this application embodiment effectively solves the problem that a single vision positioning system, limited by its viewing angle and accuracy, struggles to accurately identify minute deviations between PCB board pads and BGA chip pads, leading to chip misalignment and cold solder joints during soldering, thus affecting soldering quality and the performance stability of electronic products. The overall approach is as follows:
[0029] To address the problems existing in the prior art, this utility model provides an automatic BGA soldering device based on multi-angle image positioning, including a worktable 1, a protective shell 2 above the worktable 1, an upper camera 10 and an upper heating wire 12 inside the protective shell 2, an upper temperature control probe 13 below the upper heating wire 12, an upper fan 15 above the upper heating wire 12, an upper X-axis 3 and an upper Y-axis 4 above the worktable 1, an infrared heating zone 7 inside the worktable 1, a lower heating head Z-axis 16, a lower heating head Y-axis 17 and a lower heating head X-axis 18 above the infrared heating zone 7, and a heating mechanism 6 above the infrared heating zone 7, the heating mechanism 6 including a lower heating wire 14 and a lower temperature control probe 15. 9. A set of heating tubes 22 is installed in the infrared heating zone 7. Two negative pressure gauges 9 are installed above the upper light source 11. After the device is powered on, each moving part quickly returns to its initial preset position. The upper X-axis 3 moves to the left limit, the upper Y-axis 4 moves to the rear limit, and each axis moves to the designated limit position under the limitation of the limit block 8. The disassembly nozzle Z2 axis, the mounting nozzle Z3 axis, etc., rise to the upper limit position. Then, the upper heating head, the lower heating head, and the infrared heating zone 7 are preheated to 100 degrees. The upper heating wire 12, the lower heating wire 14 in the heating mechanism 6, and the heating tubes 22 in the infrared heating zone 7 work. During this process, the temperature is monitored by the upper temperature control probe 13, the lower temperature control probe 19, and the heating zone probe 21. During the self-test process, if any step fails, the device will automatically shut down. The preparation process includes timely prompts and pauses. After self-testing, the buzzer sounds intermittently three times to prepare for subsequent work. The PCB board is fixed on the board holder 5. The BGA location is selected using the navigation function of the upper camera 10. The upper camera 10 provides illumination using the upper light source 11. After selecting appropriate temperature curve parameters, heating is initiated. The upper heating wire 12 and lower heating wire 14 in the heating mechanism 6 begin to work. The upper temperature control probe 13 and lower temperature control probe 19 monitor the temperature respectively. Simultaneously, the heating tube 22 of the infrared heating zone 7 is also working, with the temperature monitored by the heating zone probe 21. At this time, the upper heating head descends to the heating height along the Z1 axis, and the upper X-axis 3 and upper Y-axis 4 move, moving the upper heating head directly above the BGA. The lower heating head moves along the X-axis... 18. The lower heating head moves along the Y-axis 17 and Z-axis 16 to move it directly below the BGA. The lifting cylinder Z5 axis rises, and the three temperature zones heat up simultaneously. After heating, the lifting cylinder Z5 axis descends, and the upper fan 15 and the heating box cooling fan 23 turn on for cooling. After cooling is complete, a buzzer sounds to indicate that the soldering is complete. The PCB board is fixed on the board holder 5. The navigation and recognition functions of the upper camera 10 are used to determine the position of the PCB board pads. The upper camera 10 uses the upper light source 11 to lower the placement nozzle along the Z3 axis to pick up the material. The upper X-axis 3 and upper Y-axis 4 move to move the placement nozzle above the lower camera for recognition. Then, the upper X-axis 3 and upper Y-axis 4 move to move it above the PCB pads for placement.
[0030] Two limiting blocks 8 are installed inside the upper X-axis 3. A plate frame 5 is installed above the infrared heating zone 7. A heating zone probe 21 is installed inside the infrared heating zone 7. A set of heating box cooling fans 23 is installed on the surface of the infrared heating zone 7. A lower air pipe 20 is fixedly connected to the surface of the heating mechanism 6. An upper light source 11 is installed below the upper camera 10. The lower heating head moves along the X-axis 18, Y-axis 17, and Z-axis 16 to move the lower heating head into position. The upper X-axis 3 and upper Y-axis 4 move to move the upper heating head into position, and heating is started. The upper heating wire 12 and lower heating wire 14 operate, the upper temperature control probe 13 and lower temperature control probe 19 monitor the temperature, the heating tube 22 in the infrared heating zone 7 operates, and the heating zone probe 21 monitors the temperature. After heating, the upper fan 15 and the heating box cooling fan 23 turn on for cooling, prompting the removal of the PCB board for precise soldering. The PCB board is fixed on the board holder 5, the upper camera 10 selects the BGA position on the PCB board, and after selecting the set temperature curve, heating is started. The upper heating wire 12 and lower heating wire 14 in the heating mechanism 6 operate, and the upper temperature control probe 13 and lower temperature control probe 19 monitor the temperature. The lower temperature control probe 19 monitors the temperature, the heating tube 22 of the infrared heating zone 7 operates, and the heating zone probe 21 monitors the temperature. At this time, the lower heating head Z-axis 16 and the upper heating head Z1 axis descend to the heating height. After heating ends, the high temperature is maintained for a period of time. The disassembly nozzle Z2 axis descends to suck up the material. The negative pressure of the material suction is detected by the negative pressure gauge 9. After rising to a certain height, air is blown. Finally, the upper X-axis 3 and the upper Y-axis 4 move to move the disassembly nozzle above the unloading tray, indicating that the disassembly is complete. The chip disassembly is completed, from the automatic return of each component and the automatic control of the heating temperature to the automatic recognition and positioning of the camera. The extensive automation of operations reduces labor costs and improves the continuity and stability of production. For example, in the welding process, the automatic control of heating and cooling avoids errors and time delays that may occur with manual operation. In the alignment welding process, the upper camera 10 first uses the navigation function to determine the position of the PCB board pads. After the placement nozzle picks up the material, it moves to the top of the lower camera. The lower camera identifies the BGA pads, providing a basis for accurate placement. This minimizes the chip placement position error, effectively improves welding quality, reduces problems such as cold solder joints and misalignment, and ensures the electrical performance and stability of electronic products.
[0031] Among them, the workbench 1 is used to support the various components of the equipment, providing a stable support platform for the entire welding operation, and is the basic carrier for the operation of the equipment;
[0032] The protective shell 2 can protect the internal components from the influence of the external environment, and can also ensure the safety of operators to a certain extent and create a good working environment;
[0033] The upper X-axis 3 is responsible for controlling the movement of the upper component in the X direction, and works with other axes to achieve precise positioning, ensuring accurate positioning for operations such as welding;
[0034] The upper Y-axis 4 controls the movement of the upper component in the Y direction, and works in conjunction with the upper X-axis 3 to precisely adjust the position of the upper component to meet welding requirements;
[0035] The board holder 5 is used to fix the PCB board, ensuring the stability of the PCB board position during soldering, disassembly and other operations, and ensuring operational accuracy;
[0036] The heating mechanism 6 generates heat through the upper heating wire 12 and the lower heating wire 14, and in conjunction with the temperature control probe, provides a suitable temperature for welding and disassembly.
[0037] The infrared heating zone 7 uses the heating tube 22 to generate heat, which, together with the heating zone probe 21, provides an additional heat source to assist welding and disassembly operations;
[0038] Limiting block 8 limits the movement range of each axis, ensuring that each axis runs in a specified position and preventing damage to components caused by exceeding the travel range;
[0039] The negative pressure gauge 9 detects the suction negative pressure of the disassembly nozzle to ensure a stable and reliable suction process and prevent problems such as chip falling out;
[0040] The upper camera 10 uses navigation and recognition functions to determine the position of the PCB board pads, providing a positioning basis for precise mounting and dismounting;
[0041] The upper light source 11 provides illumination for the upper camera 10, enabling the camera to clearly photograph the PCB board and improve the accuracy of positioning and identification;
[0042] The upper heating wire 12 generates heat to heat the PCB board and chip, melting the solder to enable soldering or assist in disassembly.
[0043] The upper temperature control probe 13 monitors the upper heating temperature and feeds it back to the control system to precisely control the heating of the upper heating wire 12 and ensure temperature stability.
[0044] The lower heating wire 14 provides heat for the lower heating and works in conjunction with the upper heating wire 12 to achieve uniform heating of the PCB board and the chip;
[0045] The upper fan 15 starts after heating is complete to accelerate cooling, shorten the processing cycle, and ensure the stable performance of equipment and products.
[0046] The lower heating head Z-axis 16 controls the movement of the lower heating head in the Z direction, adjusting the distance between the heating head and the PCB board to achieve precise heating;
[0047] The lower heating head Y-axis 17 drives the lower heating head to move in the Y direction, cooperating with other axes to align the lower heating head with the welding position;
[0048] The lower heating head X-axis 18 is responsible for the movement of the lower heating head in the X direction, and works with other axes to ensure accurate positioning of the lower heating head;
[0049] The lower temperature control probe 19 monitors the lower heating temperature to ensure a stable lower heating process and avoid abnormal temperature affecting welding quality;
[0050] The lower air pipe 20 is used to transport compressed air and may play a role in blowing, cooling and other processes, assisting in welding and disassembly operations.
[0051] The heating zone probe 21 monitors the temperature of the infrared heating zone 7 to ensure stable heating of the infrared heating zone 7 and provide appropriate heat for welding and disassembly.
[0052] Heating element 22 is the heating element of infrared heating zone 7, which generates heat and provides additional heating support for welding and disassembly;
[0053] After the heating box cooling fan 23 operates in the infrared heating zone 7, it cools the heating box, protects the equipment, and extends the service life of the equipment.
[0054] Working principle:
[0055] After the equipment is powered on, all moving parts quickly return to their initial preset positions. The upper X-axis 3 moves to the left limit, the upper Y-axis 4 moves to the rear limit, and each axis moves to its designated limit position under the constraint of the limit block 8. The disassembly nozzle Z2 axis and the mounting nozzle Z3 axis rise to their upper limit positions. Subsequently, the upper heating head, lower heating head, and infrared heating zone 7 preheat to 100 degrees Celsius. The upper heating wire 12, lower heating wire 14, and heating tube 22 of the infrared heating zone 7 in the heating mechanism 6 begin to operate. During this process, the temperature is monitored by the upper temperature control probe 13, lower temperature control probe 19, and heating zone probe 21. During the self-test, if any step fails, the equipment will promptly prompt and pause. After the self-test is completed, the buzzer will sound intermittently three times to prepare for subsequent work. The PCB board is then fixed in place. On the board frame 5, the BGA position is selected using the navigation function of the upper camera 10. The upper camera 10 provides illumination using the upper light source 11. After selecting appropriate temperature curve parameters, heating is initiated. The upper heating wire 12 and lower heating wire 14 in the heating mechanism 6 begin to work. The upper temperature control probe 13 and lower temperature control probe 19 monitor the temperature respectively. At the same time, the heating tube 22 of the infrared heating zone 7 is also working, with the temperature monitored by the heating zone probe 21. At this time, the upper heating head Z1 axis descends to the heating height, and the upper X-axis 3 and upper Y-axis 4 move, moving the upper heating head directly above the BGA. The lower heating head X-axis 18, lower heating head Y-axis 17, and lower heating head Z-axis 16 move, moving the lower heating head directly below the BGA. The lifting cylinder Z5 axis... The heating element rises, and all three temperature zones heat simultaneously. After heating, the lifting cylinder Z5 axis descends, and the upper fan 15 and the heating box cooling fan 23 turn on for cooling. A buzzer sounds after cooling is complete, indicating the soldering is finished. The PCB board is fixed to the board holder 5. The upper camera 10 uses its navigation and recognition functions to determine the PCB board pad positions. The upper camera 10 uses the upper light source 11, and the placement nozzle descends along the Z3 axis to pick up the material. The upper X-axis 3 and upper Y-axis 4 move, moving the placement nozzle above the lower camera for recognition. Then, the upper X-axis 3 and upper Y-axis 4 move it above the PCB pads for placement. Afterward, the lower heating head moves along the X-axis 18, Y-axis 17, and Z-axis 16 to position the lower heating head. The upper X-axis 3 and upper Y-axis 4 then move the nozzle to the correct position. The upper Y-axis 4 moves, positioning the upper heating head and initiating heating. The upper heating wire 12 and lower heating wire 14 in the heating mechanism 6 operate, while the upper temperature control probe 13 and lower temperature control probe 19 monitor the temperature. The heating element 22 in the infrared heating zone 7 operates, and the heating zone probe 21 monitors the temperature. After heating, the upper fan 15 and the heating box cooling fan 23 turn on for cooling. A prompt is given to remove the PCB board for precise soldering. The PCB board is then fixed to the board holder 5. The upper camera 10 selects the BGA location on the PCB board. After selecting the set temperature curve, heating is initiated. The upper heating wire 12 and lower heating wire 14 in the heating mechanism 6 operate, while the upper temperature control probe 13 and lower temperature control probe 19 monitor the temperature. The heating element 22 in the infrared heating zone 7 operates.The heating zone probe 21 monitors the temperature. At this time, the lower heating head Z-axis 16 and the upper heating head Z1-axis descend to the heating height. After heating ends, the high temperature is maintained for a period of time. The disassembly nozzle Z2-axis descends to pick up the material. The negative pressure of the material is detected by the negative pressure gauge 9. After rising to a certain height, air is blown. Finally, the upper X-axis 3 and upper Y-axis 4 move, moving the disassembly nozzle above the unloading tray, indicating that disassembly is complete. The chip disassembly is finished. From the automatic return of each component and the automatic control of heating temperature to the automatic recognition and positioning of the camera, a large number of automated operations reduce labor costs and improve the continuity and stability of production. For example, in the soldering process, the automatic control of heating and cooling avoids errors and time delays that may occur with manual operation. In the alignment soldering process, the upper camera 10 first uses the navigation function to determine the position of the PCB board pads. After the placement nozzle picks up the material, it moves above the lower camera. The lower camera recognizes the BGA pads, providing a basis for accurate placement, minimizing chip placement position errors, effectively improving soldering quality, reducing problems such as cold solder joints and misalignment, and ensuring the electrical performance and stability of electronic products.
[0056] Finally, it should be noted that the above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.
Claims
1. A BGA automatic soldering device based on multi-angle image positioning, comprising a worktable (1), characterized in that, A protective shell (2) is provided above the workbench (1). An upper camera (10) and an upper heating wire (12) are provided inside the protective shell (2). An upper temperature control probe (13) is provided below the upper heating wire (12). An upper fan (15) is provided above the upper heating wire (12). An upper X-axis (3) and an upper Y-axis (4) are provided above the workbench (1). The workbench (1) is provided with an infrared heating zone (7), and the infrared heating zone (7) is provided with a lower heating head Z-axis (16), a lower heating head Y-axis (17) and a lower heating head X-axis (18); a heating mechanism (6) is provided above the infrared heating zone (7), the heating mechanism (6) includes a lower heating wire (14) and a lower temperature control probe (19), and a set of heating tubes (22) is provided in the infrared heating zone (7).
2. The BGA automatic soldering equipment based on multi-angle image positioning as described in claim 1, characterized in that: Two negative pressure gauges (9) are installed above the upper light source (11).
3. The BGA automatic soldering equipment based on multi-angle image positioning as described in claim 1, characterized in that: Two limiting blocks (8) are provided inside the upper X-axis (3).
4. The BGA automatic soldering equipment based on multi-angle image positioning as described in claim 1, characterized in that: A plate frame (5) is provided above the infrared heating zone (7).
5. The BGA automatic soldering equipment based on multi-angle image positioning as described in claim 1, characterized in that: A heating zone probe (21) is provided in the infrared heating zone (7).
6. The BGA automatic soldering equipment based on multi-angle image positioning as described in claim 1, characterized in that: A set of heating box cooling fans (23) is provided on the surface of the infrared heating zone (7).
7. The BGA automatic soldering equipment based on multi-angle image positioning as described in claim 1, characterized in that: The heating mechanism (6) has a lower air pipe (20) fixedly connected to its surface.
8. The BGA automatic soldering equipment based on multi-angle image positioning as described in claim 1, characterized in that: An upper light source (11) is provided below the upper camera (10).