Laser head assembly and laser processing apparatus

Abstract

The application discloses a laser head assembly and a laser processing device, wherein the laser head assembly comprises a first laser, a driving board and a heat dissipation structure, the heat dissipation structure comprises a mounting frame, a first air guide cover, a heat sink and a first air supply device, the first air guide cover is connected to the mounting frame, a first heat dissipation channel is formed between the first air guide cover and the mounting frame, the driving board is arranged on the mounting frame and located in the first heat dissipation channel; the heat sink is connected to the mounting frame, a second heat dissipation channel is formed between the heat sink and the mounting frame, the first laser is arranged on the heat sink and located in the second heat dissipation channel; the first air supply device is located at a channel opening of the first heat dissipation channel and the second heat dissipation channel, and the first air supply device is used for driving airflow in the first heat dissipation channel and the second heat dissipation channel to flow, so as to take away heat of the driving board and the first laser. The application can improve the heat dissipation effect of the laser and the driving board under the condition that the heat dissipation space is limited.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, specifically to a laser head assembly and laser processing equipment. Background Technology

[0002] Laser processing equipment requires heat dissipation for the laser and driver board during processing to ensure stable laser operation. In some related technologies, the heat dissipation space planning for the laser and driver board is inadequate, resulting in low utilization of the heat dissipation space. When the heat dissipation space is limited, the heat dissipation effect of the laser and driver board is poor. Utility Model Content

[0003] This application provides a laser head assembly and a laser processing device, which can improve the heat dissipation effect of the laser and the driver board under conditions of limited heat dissipation space.

[0004] In a first aspect, the laser head assembly provided in this application includes a first laser, a driver board, and a heat dissipation structure. The heat dissipation structure includes a mounting bracket, a first air guide shroud, a heat sink, and a first air supply device.

[0005] The first air guide shroud is connected to the mounting frame, and the first air guide shroud and the mounting frame enclose a first heat dissipation channel. The drive plate is disposed on the mounting frame and located within the first heat dissipation channel.

[0006] The heat sink is connected to the mounting bracket, and the heat sink and the mounting bracket enclose a second heat dissipation channel. The first laser is disposed on the heat sink and located within the second heat dissipation channel.

[0007] The first air supply device is connected to the mounting bracket and is located at the channel opening of the first heat dissipation channel and the second heat dissipation channel. The first air supply device is used to drive the airflow in the first heat dissipation channel and the second heat dissipation channel to remove the heat from the drive board and the first laser.

[0008] In an optional embodiment, the mounting bracket includes a mounting plate and a partition. The first air guide shroud, the mounting plate, and the partition form a first heat dissipation channel. One side edge of the mounting plate is connected to one side surface of the partition. The partition has a through hole. The first air supply device is used to drive airflow through the through hole into and out of the first heat dissipation channel and the second heat dissipation channel.

[0009] In an optional embodiment, the heat sink includes a heat sink base and a heat sink body disposed on one side of the heat sink base. The heat sink base, the mounting plate, and the partition plate form a second heat dissipation channel. The heat sink body is located within the second heat dissipation channel. The first laser is disposed on the heat sink base, and the heat of the first laser is transferred to the heat sink body through the heat sink base.

[0010] In an optional embodiment, the laser head assembly includes a heat-conducting element connected to the heat dissipation base, one side of the heat-conducting element being attached to at least one side of the first laser, and the heat-conducting element and the heat dissipation base surrounding the first laser.

[0011] In an optional embodiment, the laser head assembly includes a second air supply device connected to the other side of the heat-conducting component; and / or, the other side of the heat-conducting component is provided with a plurality of spaced heat dissipation teeth.

[0012] In an optional embodiment, the heat dissipation structure includes a second air guide shroud, a third heat dissipation channel is formed inside the second air guide shroud, one end of the second air guide shroud is connected to the first heat dissipation channel and the end of the second heat dissipation channel opposite to the first air guide shroud, and the third heat dissipation channel forms an angle with the second heat dissipation channel and the first heat dissipation channel.

[0013] In an optional embodiment, the end of the first air guide shroud facing the second air guide shroud has a first airflow guiding arc surface, which is used to guide the airflow in the first heat dissipation channel to the second air guide shroud; and / or, the end of the mounting plate facing the second air guide shroud has a second airflow guiding arc surface, which is used to guide the airflow in the second heat dissipation channel to the second air guide shroud.

[0014] In an optional embodiment, the number of the first air supply devices is at least two, and the at least two first air supply devices are arranged sequentially along the width direction of the first heat dissipation channel and the second heat dissipation channel; and / or, the heat dissipation structure includes a third air guide shroud, the third air guide shroud is disposed on the air inlet side of the first air supply device, and one end of the third air guide shroud is connected to the air inlet side of the first air supply device, and the other end is provided with a filter screen.

[0015] In an optional embodiment, the laser head assembly includes a field lens, a first camera, and a second camera. The laser emitted by the first laser is output after passing through the field lens, and the distance between the first camera and the field lens is less than the distance between the second camera and the field lens.

[0016] The field of view of the first camera is greater than that of the second camera, and / or,

[0017] The field of view of the first camera covers the processing range of the laser head assembly, and the field of view of the second camera covers the central area of ​​the processing range.

[0018] Secondly, the laser processing equipment provided in this application includes a fixed component, a second laser, and a laser head assembly as described in any one of the second aspects. The laser head assembly is slidably connected to the fixed component, the second laser is disposed within the fixed component, and the second laser is connected to the laser head assembly via a flexible optical fiber.

[0019] In this application, compared to related technologies, the laser head assembly includes a first laser, a driver board, and a heat dissipation structure. The heat dissipation structure includes a mounting frame, a first air guide shroud, a heat sink, and a first air supply device. The first air guide shroud is connected to the mounting frame, and the first air guide shroud and the mounting frame enclose a first heat dissipation channel. The driver board is mounted on the mounting frame and located within the first heat dissipation channel. The heat sink is connected to the mounting frame, and the heat sink and the mounting frame enclose a second heat dissipation channel. The first laser is mounted on the heat sink and located within the second heat dissipation channel. The first air supply device is connected to the mounting frame and located at the entrance of the first and second heat dissipation channels. The first air supply device is used to drive airflow within the first and second heat dissipation channels to remove heat from the driver board and the first laser. This application designs the heat dissipation channels of the first laser and the driver board side by side, sharing a heat dissipation space, which can effectively utilize the heat dissipation space and improve the heat dissipation effect of the laser and the driver board under limited heat dissipation space. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of one embodiment of the laser processing equipment provided in this application;

[0022] Figure 2 This is an exploded structural diagram of one embodiment of the laser processing equipment provided in this application;

[0023] Figure 3 yes Figure 1 A schematic diagram of the cross-sectional structure cut along section AA.

[0024] Figure 4 yes Figure 1A schematic diagram of the cross-sectional structure cut along section BB.

[0025] Figure 5 yes Figure 4 A schematic diagram of the cross-sectional structure cut along the CC section;

[0026] Figure 6 This is a schematic diagram of the structure of the fixing component in one embodiment of the laser processing equipment provided in this application;

[0027] Figure 7 This is a schematic diagram of the overall structure of one embodiment of the laser head assembly provided in this application;

[0028] Figure 8 This is an exploded structural diagram of one embodiment of the laser head assembly provided in this application.

[0029] Figure 9 yes Figure 4 A schematic diagram of a partial cross-sectional structure cut along the DD section. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0031] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0033] Please refer to Figures 1 to 6 This application provides a laser processing device 100. The laser processing device 100 can be a laser welding machine, a laser cutting machine, a laser engraving machine, etc. The laser processing device 100 includes a fixed component 1, a second laser 12, and a laser head assembly 2. The laser head assembly 2 includes a field lens 21 and is slidably connected to the fixed component 1. A drive component 11 is fixed to the fixed component 1 and is used to drive the laser head assembly 2 to move up and down. The second laser 12 is disposed inside the fixed component 1 and is connected to the laser head assembly 2 through an optical fiber 121, so that the laser output by the second laser 12 can be transmitted to the laser head assembly 2.

[0034] In some embodiments, the laser processing equipment further includes a protective cover 3, a fixing component 1, and the protective cover 3 enclosing a processing chamber 4, in which the workpiece is placed, and the protective cover 3 and the fixing component 1 are movably connected to open or close the processing chamber 4.

[0035] In some embodiments, the laser processing equipment further includes a drive assembly 11, which is connected to the laser head assembly 2 and drives the laser head assembly 2 to move up and down in the vertical direction, approaching or moving away from the workpiece to process workpieces of different thicknesses.

[0036] In this embodiment, the second laser 12 is flexibly connected to the laser head assembly 2 via a flexible optical fiber 121. This allows the laser light generated by the second laser 12 to be guided to the laser head assembly 2, passing through the internal optical module of the laser head assembly 2 before exiting through the field lens 21 and entering the processing chamber 4. When the laser head assembly 2 moves vertically, the optical fiber 121 bends or straightens within the cavity between the fixed assembly 1 and the laser head assembly 2, ensuring that the optical fiber 121 does not restrict the vertical movement of the laser head assembly 2, while also preventing excessive bending and damage. Because the second laser 12 is mounted on the fixed assembly 1, the driving assembly 11 does not need to consider the weight of the second laser 12 when driving the laser head assembly 2 up and down. The driving assembly 11, with its smaller driving torque, can drive the laser head assembly 2 up and down, thereby reducing the cost of the laser processing equipment 100. Furthermore, mounting the second laser 12 on the fixed assembly 1 lowers the center of gravity of the laser processing equipment 100, ensuring its stability.

[0037] The drive assembly 11 may include a cylinder or hydraulic cylinder or other device capable of providing linear driving force. The drive assembly 11 is directly connected to the laser head assembly 2 and drives the laser head assembly 2 to move in the vertical direction. The drive assembly 11 may also be a motor lead screw structure, a motor gear rack structure, etc., depending on the specific situation.

[0038] In this embodiment, the fixing component 1 includes a chassis 13, a support frame 14, and a frame 15. The support frame 14 is erected on one side edge of the chassis 13, and the frame 15 is connected to one side of the support frame 14, located above the chassis 13. The second laser 12 is disposed inside the support frame 14. A processing chamber 4 is formed between the frame 15 and the chassis 13. The frame 15 is hollow and encloses a receiving cavity, in which the laser head assembly 2 is disposed. An opening 16 is provided at the bottom of the frame 15, through which the laser emitted by the laser head assembly 2 enters the processing chamber 4. The opening 16 is rectangular; however, in other embodiments, the opening 16 can be circular or other shapes, depending on the specific circumstances.

[0039] In some embodiments, the second laser 12 is a laser that emits infrared light. Of course, in other embodiments, the second laser 12 may also be a laser that emits green light, blue light, violet light, or red light, depending on the specific circumstances.

[0040] In some embodiments, the laser head assembly 2 may be a galvanometer laser head, which may include a galvanometer assembly for deflecting the laser beam output from the laser, causing the laser beam to move on the workpiece to form a pattern. In other embodiments, the laser head assembly 2 may also be a non-galvanometer type laser head, which may be a laser head without a galvanometer inside.

[0041] In some embodiments, the laser processing equipment 100 further includes a motion frame, on which the laser head assembly 2 can be mounted to drive the laser head assembly 2 to move.

[0042] In some embodiments of this application, the laser head assembly 2 includes a field lens 21, a first camera 22, and a second camera 23. The laser emitted by the laser passes through the field lens 21 and is output, entering the processing chamber 4. The distance between the first camera 22 and the field lens 21 is less than the distance between the second camera 23 and the field lens 21, and the field of view of the first camera 22 is greater than that of the second camera 23. The field lens 21 is located at the center of the laser head assembly 2. The field of view of the first camera 22 covers the processing range of the laser head assembly 2, and the field of view of the second camera 23 covers the central area of ​​the processing range. Specifically, the first camera 22 is used for image positioning. The first camera 22 is close to the field lens 21 and has a large field of view, covering the entire processing chamber 4, for identifying the position of the workpiece. The second camera 23 is used for distance measurement. The distance between the first camera 22 and the field lens 21 is less than the distance between the second camera 23 and the field lens 21. The second camera 23 is farther from the field lens 21 and has a small field of view, covering the central area of ​​the processing range, for measuring the height of the workpiece.

[0043] The dual-camera setup allows the first camera 22 to achieve better positioning and recognition accuracy, ensuring accurate processing position. The second camera 23, positioned further away from the center, provides better measurement accuracy, resulting in more precise laser focusing during processing and guaranteeing optimal processing results. Compared to the traditional single-camera setup, this approach ensures both positioning and distance accuracy.

[0044] In some embodiments, see Figures 7 to 9 The laser head assembly 2 in this embodiment includes a first laser 25, a driver board 212, and a heat dissipation structure 20. The heat dissipation structure 20 is used to dissipate heat from the first laser 25 and the driver board 212, and includes a mounting bracket 24, a first air guide shroud 211, a heat sink 27, and a first air supply device 28.

[0045] In this embodiment, a first air guide shroud 211 is connected to a mounting frame 24, and a first heat dissipation channel 244 is formed between the first air guide shroud 211 and the mounting frame 24. A drive plate 212 is disposed on the mounting frame 24 and located within the first heat dissipation channel 244. A heat sink 27 is connected to the mounting frame 24, and a second heat dissipation channel 245 is formed between the heat sink 27 and the mounting frame 24. A first laser 25 is disposed on the heat sink 27 and located within the second heat dissipation channel 245. A first air supply device 28 is connected to the mounting frame 24 and is located at the entrance of the first heat dissipation channel 244 and the second heat dissipation channel 245. The first air supply device 28 is used to drive the airflow within the first heat dissipation channel 244 and the second heat dissipation channel 245 to remove heat from the drive plate 212 and the first laser 25.

[0046] In this embodiment, the mounting bracket 24 includes a mounting plate 241 and a partition plate 242. One edge of the mounting plate 241 is connected to one side surface of the partition plate 242, and a through hole 246 is provided on the partition plate 242. A first air guide shroud 211 is connected to the mounting plate 241, and the first air guide shroud 211, the mounting plate 241, and the partition plate 242 together form a first heat dissipation channel 244. A first air supply device 28 is used to drive airflow through the through hole 246 into and out of the first heat dissipation channel 244 and the second heat dissipation channel 245.

[0047] In this embodiment, the heat sink 27 includes a heat sink base 271 and a heat sink body 272 disposed on one side of the heat sink base 271. The heat sink base 271, the mounting plate 241, and the partition plate 242 enclose a second heat sink channel 245. The heat sink body 272 is located within the second heat sink channel 245. The heat sink 27 is used to dissipate heat from the first laser 25. The first laser 25 is disposed on the heat sink 27. The heat from the first laser 25 is transferred to the heat sink body 272 through the heat sink base 271. A first air supply device 28 is connected to the other side surface of the partition plate 242. When the first air supply device 28 drives the airflow, it simultaneously drives the airflow in the first heat sink channel 244 and the second heat sink channel 245 to remove the heat from the drive plate 212 and the first laser 25.

[0048] In some embodiments, the first laser 25 is a blue light emitting laser. Of course, in other embodiments, the first laser 25 can also be a green light emitting laser, a violet light emitting laser, or a red light emitting laser, depending on the specific circumstances. The driver board 212 can be electrically connected to the second laser 12 and the first laser 25. The driver board 212 is used to drive the second laser 12 and the first laser 25, or the driver board 212 can also drive one of the second laser 12 and the first laser 25.

[0049] In this embodiment, the heat dissipation channel of the first laser 25 and the heat dissipation channel of the driver board 212 are designed side by side and share the heat dissipation space. This can effectively utilize the heat dissipation space and improve the heat dissipation effect under the condition of a certain heat dissipation space. This can improve the heat dissipation effect of the driver board 212 and the first laser 25, improve the heat dissipation effect of the laser head assembly 2, and improve the heat dissipation effect of the laser processing equipment 100.

[0050] In this embodiment, the mounting bracket 24 includes two side plates 243. One side edge of each side plate 243 is connected to the two sides of the mounting plate 241, and one side edge of each side plate 243 is connected to the two sides of the partition plate 242. One side edge of each side plate 243 is connected to the two sides of the heat dissipation base 271. The heat dissipation base 271, the mounting plate 241, the partition plate 242, and the two side plates 243 enclose each other to form a second heat dissipation channel 245.

[0051] The drive board 212 is mounted on the mounting plate 241 of the heat dissipation structure 20, and the first laser 25 is mounted on the heat dissipation base 271 of the heat dissipation structure 20.

[0052] The partition 242 has through holes 246. The first air supply device 28 draws in cold air from the outside and sends it through the through holes in the partition 242 into the first heat dissipation channel 244 and the second heat dissipation channel 245 respectively. This dissipates heat from the drive plate 212 in the first heat dissipation channel 244 and from the heat dissipation body 272 in the second heat dissipation channel 245, thereby cooling the first laser 25. Alternatively, the first air supply device 28 can also draw away hot air from the first and second heat dissipation channels 244 and send it to the outside to dissipate heat from the drive plate 212 in the first heat dissipation channel 244 and from the heat dissipation body 272 in the second heat dissipation channel 245, thereby cooling the first laser 25.

[0053] In this embodiment, the heat dissipation structure 20 includes a second air guide shroud 214, within which a third heat dissipation channel 2141 is formed. One end of the second air guide shroud 214 connects to the ends of the first heat dissipation channel 244 and the second heat dissipation channel 245 that are away from the first air guide shroud 211. The third heat dissipation channel 2141 forms an angle with the second heat dissipation channel 245 and the first heat dissipation channel 244. The angle formed by the third heat dissipation channel 2141 with the second heat dissipation channel 245 and the first heat dissipation channel 244 is 90 degrees. Of course, the angle formed by the third heat dissipation channel 2141 with the second heat dissipation channel 245 and the first heat dissipation channel 244 can also be 30 degrees, 60 degrees, or other angles, depending on the specific situation. This application does not limit this. The other end of the second air guide shroud 214 faces the processing chamber 4, thereby sending air into the processing chamber 4.

[0054] In this embodiment, the number of first air supply devices 28 is at least two, and the at least two first air supply devices 28 are arranged sequentially along the width direction of the first heat dissipation channel 244 and the second heat dissipation channel 245. Specifically, the first air supply device 28 can be an axial flow fan or a vortex fan. An axial flow fan mainly consists of components such as an impeller, a housing, and a motor. The impeller is usually cylindrical, with blades mounted on a hub and arranged radially. The motor is generally located inside the fan body and is directly connected to the impeller, resulting in a relatively simple structure. A vortex fan relies on input mechanical energy to draw air in from the center using a high-speed rotating impeller. After gaining energy within the impeller, the air is discharged from the outer edge of the impeller due to centrifugal force, changing the flow direction of the medium in the duct. The gas undergoes centrifugal motion within the fan, forming a vortex. The number of first air supply devices 28 can be set according to specific circumstances. Arranging at least two first air supply devices 28 side by side can accelerate the airflow speed within the heat dissipation channel and speed up heat dissipation.

[0055] In this embodiment, the heat dissipation structure 20 includes a third air guide shroud 210, which is located on the air inlet side of the first air supply device 28. One end of the third air guide shroud 210 is connected to the air inlet side of the first air supply device 28, and the other end is provided with a filter screen 29. The first air supply device 28 draws in air from the third air guide shroud 210 and sends the air through the through holes 246 on the partition plate 242 into the first heat dissipation channel 244 and the second heat dissipation channel 245 respectively. The third air guide shroud 210 is connected to the air inlet hole provided on the side of the housing of the laser head assembly 2, so that the first air supply device 28 can draw air from the outside of the laser head assembly 2 for heat dissipation, driving airflow to carry away heat. The filter screen 29 can prevent large dust particles or debris such as screws from entering the fan and heat dissipation channels.

[0056] In this embodiment, the laser head assembly 2 includes a heat-conducting element 26. The heat-conducting element 26 is connected to the heat dissipation base 271, and one side of the heat-conducting element 26 is attached to at least one side of the first laser 25. The heat-conducting element 26 and the heat dissipation base surround the first laser 25. The heat-conducting element 26, the heat dissipation base 271 of the heat dissipation structure 20, and the second air guide shroud 214 of the heat dissipation structure 20 surround the first laser 25. In a specific embodiment, one side of the first laser 25 is attached to the side of the heat dissipation base 271 away from the heat dissipation body 272, and the other side of the first laser 25 is attached to the second air guide shroud 214. One side of the heat-conducting element 26 is attached to both the side of the first laser 25 away from the heat dissipation base 271 and the side of the first laser 25 away from the second air guide shroud 214, thereby simultaneously dissipating heat from the bottom and side surfaces of the first laser 25.

[0057] The heat dissipation body 272 may include a plurality of spaced-apart heat sinks. In some embodiments, the mounting bracket 24, the heat sink 27, and the heat conductor 26 may all be made of aluminum alloy, which can improve the heat dissipation effect.

[0058] In this embodiment, the laser head assembly 2 includes a second air supply device 213, which is connected to the other side of the heat-conducting component 26. The other side of the heat-conducting component 26 is provided with a plurality of spaced heat dissipation teeth 261. The second air supply device 213 can be an axial fan or a vortex fan.

[0059] In this embodiment, the laser head assembly 2 includes a housing 202 and a second base 201. The housing 202 and the second base 201 are connected to form a receiving space. A heat dissipation structure 20 is located within the receiving space, and a mounting bracket 24 is connected to the second base 201. Specifically, the mounting bracket 24 is connected to the second base 201 by means of bolts, snap-fit ​​connections, or other connection methods, which are not limited in this application.

[0060] In some embodiments, such as Figure 9 As shown, the end of the first air guide shroud 211 facing the second air guide shroud 214 has a first airflow guiding arc surface 2111, which is used to guide the airflow in the first heat dissipation channel 244 to the second air guide shroud 214. The end of the mounting plate 241 facing the second air guide shroud 214 has a second airflow guiding arc surface 2411, which is used to guide the airflow in the second heat dissipation channel 245 to the second air guide shroud 214. By setting the airflow guiding arc surface, on the one hand, the airflow in the first heat dissipation channel 244 and the airflow in the second heat dissipation channel 245 can be guided to the second air guide shroud 214. On the other hand, since right angles or abrupt cross sections are prone to causing eddies, which consume a lot of kinetic energy and generate noise, the airflow guiding arc surface can avoid eddies caused by right angles or abrupt cross sections, thereby reducing the kinetic energy consumed and reducing noise when the laser head assembly 2 dissipates heat.

[0061] In this application, compared to related technologies, the laser head assembly includes a first laser, a driver board, and a heat dissipation structure. The heat dissipation structure includes a mounting frame, a first air guide shroud, a heat sink, and a first air supply device. The first air guide shroud is connected to the mounting frame, and the first air guide shroud and the mounting frame enclose a first heat dissipation channel. The driver board is mounted on the mounting frame and located within the first heat dissipation channel. The heat sink is connected to the mounting frame, and the heat sink and the mounting frame enclose a second heat dissipation channel. The first laser is mounted on the heat sink and located within the second heat dissipation channel. The first air supply device is connected to the mounting frame and located at the entrance of the first and second heat dissipation channels. The first air supply device is used to drive airflow within the first and second heat dissipation channels to remove heat from the driver board and the first laser. This application designs the heat dissipation channels of the first laser and the driver board side by side, sharing a heat dissipation space, which can effectively utilize the heat dissipation space and improve the heat dissipation effect of the laser and the driver board under limited heat dissipation space.

[0062] The above provides a detailed description of a laser head assembly and laser processing equipment provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

[0063] It should be noted that when the above embodiments of this application are applied to specific products or technologies, user-related data is involved, and user permission or consent is required. Furthermore, the collection, use, and processing of such data must comply with the relevant laws, regulations, and standards of the relevant countries and regions.

Claims

1. A laser head assembly, characterized in that, The laser head assembly includes a first laser, a driver board, and a heat dissipation structure. The heat dissipation structure includes a mounting bracket, a first air guide shroud, a heat sink, and a first air supply device. The first air guide shroud is connected to the mounting frame, and the first air guide shroud and the mounting frame enclose a first heat dissipation channel. The drive plate is disposed on the mounting frame and located within the first heat dissipation channel. The heat sink is connected to the mounting bracket, and the heat sink and the mounting bracket enclose a second heat dissipation channel. The first laser is disposed on the heat sink and located within the second heat dissipation channel. The first air supply device is connected to the mounting bracket and is located at the channel opening of the first heat dissipation channel and the second heat dissipation channel. The first air supply device is used to drive the airflow in the first heat dissipation channel and the second heat dissipation channel to remove the heat from the drive board and the first laser.

2. The laser head assembly according to claim 1, characterized in that, The mounting bracket includes a mounting plate and a partition. The first air guide cover, the mounting plate, and the partition form the first heat dissipation channel. One side edge of the mounting plate is connected to one side surface of the partition. The partition has a through hole. The first air supply device is used to drive airflow through the through hole into and out of the first heat dissipation channel and the second heat dissipation channel.

3. The laser head assembly according to claim 2, characterized in that, The heat sink includes a heat sink base and a heat sink body disposed on one side of the heat sink base. The heat sink base, the mounting plate and the partition plate form a second heat sink channel. The heat sink body is located in the second heat sink channel. The first laser is disposed on the heat sink base. The heat of the first laser is transferred to the heat sink body through the heat sink base.

4. The laser head assembly according to claim 3, characterized in that, The laser head assembly includes a heat-conducting component connected to the heat dissipation base. One side of the heat-conducting component is attached to at least one side of the first laser, and the heat-conducting component and the heat dissipation base surround the first laser.

5. The laser head assembly according to claim 4, characterized in that, The laser head assembly includes a second air supply device connected to the other side of the heat-conducting component; and / or, The other side of the heat-conducting component is provided with multiple spaced heat dissipation teeth.

6. The laser head assembly according to any one of claims 2 to 5, characterized in that, The heat dissipation structure includes a second air guide shroud, in which a third heat dissipation channel is formed. One end of the second air guide shroud is connected to the first heat dissipation channel and the end of the second heat dissipation channel opposite to the first air guide shroud. The third heat dissipation channel forms an angle with the second heat dissipation channel and the first heat dissipation channel.

7. The laser head assembly according to claim 6, characterized in that, The end of the first air guide shroud facing the second air guide shroud has a first airflow guiding arc surface, which is used to guide the airflow in the first heat dissipation channel to the second air guide shroud; and / or, The end of the mounting plate facing the second air guide shroud has a second airflow guiding arc surface, which is used to guide the airflow in the second heat dissipation channel to the second air guide shroud.

8. The laser head assembly according to any one of claims 1 to 5, characterized in that, The number of the first air supply devices is at least two, and the at least two first air supply devices are arranged sequentially along the width direction of the first heat dissipation channel and the second heat dissipation channel; and / or, The heat dissipation structure includes a third air guide shroud, which is located on the air inlet side of the first air supply device. One end of the third air guide shroud is connected to the air inlet side of the first air supply device, and the other end is provided with a filter screen.

9. The laser head assembly according to any one of claims 1 to 5, characterized in that, The laser head assembly includes a field lens, a first camera, and a second camera. The laser emitted by the first laser is output after passing through the field lens. The distance between the first camera and the field lens is smaller than the distance between the second camera and the field lens. The field of view of the first camera is greater than that of the second camera, and / or, The field of view of the first camera covers the processing range of the laser head assembly, and the field of view of the second camera covers the central area of ​​the processing range.

10. A laser processing device, characterized in that, The laser processing equipment includes: Fixed components; A second laser, the second laser being disposed within the fixed assembly; and The laser head assembly according to any one of claims 1 to 9, wherein the laser head assembly is slidably connected to the fixed assembly, and the second laser is connected to the laser head assembly via an optical fiber.

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