Circuit board and injection molding machine shell hot riveting fixture

Abstract

This utility model discloses a hot riveting fixture for circuit boards and injection molding machine housings, relating to the field of hot riveting processing technology. It includes a lower adapter base plate, with a part base clamped to the top of the lower adapter base plate. A part body is placed inside the part base plate. An upper adapter base plate is positioned above the lower adapter base plate, with a side connecting plate fixedly connected to one side of the upper adapter base plate. Two positioning rods are fixedly connected to the top of the part base plate, and the two positioning rods are clamped to the part body. An upper power source connecting plate is fixedly connected to the top of the upper adapter base plate. This hot riveting fixture for circuit boards and injection molding machine housings has a reasonable structural design, allowing multiple riveting posts on the plastic housing to be formed in one step, improving assembly efficiency and facilitating simultaneous forming of multiple riveting posts. The plastic posts can naturally cover the solder pads after melting, eliminating mechanical stress concentration points and preventing stripping or excessive tightening and cracking of the circuit board due to improper operation.

Description

Technical Field

[0001] This utility model relates to the field of hot riveting technology, specifically a hot riveting fixture for circuit boards and injection molding machine housings. Background Technology

[0002] The circuit board and injection molding machine housing hot riveting fixture is a specialized assembly tooling used for the efficient and precise fixing of plastic housings and PCBs. Its core principle is to achieve mechanical interlocking through hot-press deformation. This fixture typically consists of a heating system, a positioning mechanism, a pressure control module, and a cooling device. During operation, a high-temperature riveting head (adjustable from 200 to 400°C) is used to locally heat the pre-installed plastic pillars on the injection molding machine housing, softening them. Guided by a precision guide mechanism, these pillars are then pressed and shaped to form a rivet head structure, thus creating a secure connection with the through-holes on the circuit board. Key components are made of high-temperature resistant alloy steel or ceramic materials, and equipped with high-precision positioning pins (error ≤ 0.05mm) to ensure perfect alignment of the holes on the PCB and the housing. A pressure sensor (50~500N) and a PID temperature control system enable digital management of process parameters. Compared to traditional screw or adhesive bonding processes, thermal riveting fixtures offer advantages such as high connection strength (tensile strength exceeding 200N), no additional parts, and fast assembly speed (3-8 seconds for single-point riveting). They are particularly suitable for fields with high requirements for sealing and lightweighting, such as consumer electronics and medical devices. Modern intelligent fixtures also integrate PLC control, pressure-temperature curve monitoring, and anomaly alarm functions, supporting MES system integration and enabling full traceability of the assembly process. In automated production lines, they significantly improve product consistency and production efficiency.

[0003] Existing hot riveting fixtures for circuit boards and injection molding machine housings mostly adopt a single-point sequential hot riveting method. This serial operation mode not only has low assembly efficiency, but also makes it difficult to achieve synchronous molding of multiple riveting posts, which seriously restricts the cycle efficiency of the production line. Furthermore, the large screw fastening process used in existing hot riveting fixtures for circuit boards and injection molding machine housings has obvious reliability risks. In actual operation, it is easy to cause problems such as stripping and thread failure due to improper torque control, and even the circuit board may be crushed and damaged due to overtight fastening. These process defects directly affect the product yield and production cost. Therefore, it is necessary to design new technical solutions to address these issues. Summary of the Invention

[0004] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a hot riveting fixture for a circuit board and an injection molding machine housing, comprising a lower adapter base plate, a part base plate being snapped onto the top of the lower adapter base plate, a part body plate being placed on the inner side of the part base plate, an upper adapter base plate being provided above the lower adapter base plate, and a side connecting plate being fixedly connected to one side of the upper adapter base plate. Through a multi-riveting mechanism, multiple riveting posts on the plastic housing can be formed at one time, improving assembly efficiency and facilitating the simultaneous forming of multiple riveting posts, thereby increasing the output per unit time. Through a melt-wrapping mechanism, the plastic posts can be melted and naturally wrapped around the solder pads, eliminating mechanical stress concentration points and preventing stripping or cracking of the circuit board due to improper operation.

[0006] Preferably, two positioning rods are fixedly connected to the top of the part base. The two positioning rods are engaged with the part body to limit and fix the part body and prevent the part from shaking.

[0007] Preferably, an upper power source connecting plate is fixedly connected to the top of the upper adapter base plate, and a power source connecting rod is fixedly connected to the bottom of the upper power source connecting plate, thereby fixing the power source connecting rod through the upper power source connecting plate.

[0008] Preferably, the bottom end of the power source connecting rod passes through the upper adapter base plate and extends to the bottom of the upper adapter base plate, and is connected to the lower pressure seat through the power source connecting rod.

[0009] Preferably, a pressure seat is inserted into the inner side of the power source connecting rod, and a locking rod is engaged with the outer side of the power source connecting rod. One end of the locking rod passes through the power source connecting rod and the pressure seat and extends to the outer side of the power source connecting rod. The power source connecting rod is fixed by passing through the pressure seat with one end of the locking rod.

[0010] Preferably, a heat-conducting seat is snapped into the bottom of the lower pressure seat, and three hot riveting posts are fixedly connected to the bottom of the heat-conducting seat. The three hot riveting posts are evenly distributed. The heat is absorbed and conducted through the heat-conducting seat, so that the hot riveting posts are heated to perform hot riveting on the parts. The hot riveting posts melt and soften, and at the same time, they flow naturally under pressure and evenly cover the solder pads and surrounding areas. The natural wrapping characteristics of the molten plastic ensure uniform stress distribution.

[0011] Preferably, a heat insulation plate is fixedly connected to the inner wall of the lower pressure seat, and a heating plate is fixedly connected to the inner wall of the lower pressure seat. The heating plate is located below the heat insulation plate and is in contact with the heat-conducting seat. The heat insulation plate isolates the temperature of the heating plate.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. The circuit board and injection molding machine housing hot riveting fixture, through a multi-riveting mechanism, can form multiple rivet posts on the plastic housing at one time, improving assembly efficiency, facilitating the synchronous forming of multiple rivet posts, and increasing the output per unit time.

[0014] 2. The circuit board and the injection molding machine housing are connected by a hot riveting fixture. Through the melting and wrapping mechanism, the plastic column melts and naturally wraps the solder pads, eliminating mechanical stress concentration points and preventing stripping or cracking of the circuit board due to improper operation. Attached Figure Description

[0015] Figure 1 This is a front three-dimensional structural diagram of a hot riveting fixture for a circuit board and an injection molding machine housing proposed in this utility model;

[0016] Figure 2 This is a front sectional three-dimensional structural diagram of a hot riveting fixture for a circuit board and an injection molding machine housing proposed in this utility model;

[0017] Figure 3 This is a three-dimensional structural diagram of the base of a hot riveting fixture for a circuit board and an injection molding machine housing proposed in this utility model.

[0018] Figure 4 This is a cross-sectional view of the power source connecting rod of a hot riveting fixture for a circuit board and an injection molding machine housing proposed in this utility model.

[0019] In the diagram: 100, lower adapter base plate; 110, part base; 120, part body; 130, positioning rod; 200, upper adapter base plate; 210, side connecting plate; 220, upper power source connecting plate; 230, power source connecting rod; 240, lower pressure seat; 250, locking rod; 260, heat-conducting seat; 261, hot riveting column; 270, heat insulation plate; 280, heating plate. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1: Please refer to again Figure 1-4This utility model provides a hot riveting fixture for a circuit board and an injection molding machine housing, including a lower adapter base plate 100, a part base 110 snapped onto the top of the lower adapter base plate 100, a part body 120 placed inside the part base 110, two positioning rods 130 fixedly connected to the top of the part base 110, the two positioning rods 130 snapped onto the part body 120, an upper power source connecting plate 220 fixedly connected to the top of the upper adapter base plate 200, and a power source connecting rod 230 fixedly connected to the bottom of the upper power source connecting plate 220.

[0022] Specifically, the heating element is heated to a certain temperature to heat the heat-conducting seat 260 below. At the same time, the heat insulation plate 270 blocks the heat from the heating element. Then, the upper power source connecting plate 220 applies downward pressure to lower the power source connecting rod 230, so that multiple hot riveting posts 261 on the heat-conducting seat 260 below the power source connecting rod 230 simultaneously contact the surface of the part body 120 to perform hot riveting processing on the surface of the part body 120.

[0023] For example, most existing hot riveting fixtures adopt a single-point sequential hot riveting method, which leads to low assembly efficiency and makes it difficult to achieve simultaneous forming of multiple rivet posts, resulting in limited output per unit time. However, this application uses a multi-riveting mechanism to form multiple rivet posts on the plastic shell at one time, improving assembly efficiency, facilitating simultaneous forming of multiple rivet posts, and increasing output per unit time.

[0024] Example 2: Please refer to again Figure 1-4 An upper adapter base plate 200 is provided above the lower adapter base plate 100. A side connecting plate 210 is fixedly connected to one side of the upper adapter base plate 200. The bottom end of the power source connecting rod 230 passes through the upper adapter base plate 200 and extends to the bottom of the upper adapter base plate 200. A lower pressure seat 240 is inserted into the inner side of the power source connecting rod 230, and a locking rod 250 is snapped into the outer side of the power source connecting rod 230. One end of the locking rod 250 passes through the power source connecting rod 230 and the lower pressure seat. 240 extends to the outside of the power source connecting rod 230. The bottom of the lower pressure seat 240 is snapped with a heat-conducting seat 260. The bottom of the heat-conducting seat 260 is fixedly connected with three hot riveting posts 261, which are evenly distributed. The inner cavity wall of the lower pressure seat 240 is fixedly connected with a heat insulation plate 270. The inner cavity wall of the lower pressure seat 240 is fixedly connected with a heating plate 280. The heating plate 280 is located below the heat insulation plate 270 and is in contact with the heat-conducting seat 260.

[0025] Specifically, when the hot riveting post 261 comes into contact with the surface of the circuit board pad, the plastic post is melted and softened by precise temperature control. Under pressure, it flows naturally and evenly covers the pad and surrounding area. The natural wrapping characteristics of the molten plastic ensure uniform stress distribution, completely eliminating the problem of local stress concentration caused by screw tightening. After the plastic cools and solidifies, it forms a molecular-level bond with the pad, which not only has high mechanical strength but also excellent vibration resistance. It avoids the risk of electrochemical corrosion that may be caused by metal fasteners. The stress-dispersed connection method is particularly suitable for the assembly of high-precision electronic components and can effectively prevent problems such as microcracks or solder joint failure caused by stress concentration.

[0026] For example, the screw fastening of existing hot riveting fixtures is prone to stripping or cracking of circuit boards due to improper operation. However, this application uses a melt-wrapping mechanism to naturally wrap the pads after the plastic column melts, eliminating mechanical stress concentration points and preventing stripping or cracking of circuit boards due to improper operation.

[0027] Working principle: The heating element heats the heat to a certain temperature, which in turn heats the heat-conducting seat 260 below. At the same time, the heat insulation plate 270 blocks the heat from the heating element. Then, the upper power source connecting plate 220 applies downward pressure, causing the power source connecting rod 230 to descend. This causes multiple hot riveting posts 261 on the heat-conducting seat 260 below the power source connecting rod 230 to simultaneously contact the surface of the part body 120, performing hot riveting processing on the surface of the part body 120.

[0028] When the hot riveting post 261 comes into contact with the surface of the circuit board pad, the plastic post is melted and softened by precise temperature control. Under pressure, it flows naturally and evenly covers the pad and surrounding area. The natural wrapping characteristics of the molten plastic ensure uniform stress distribution, completely eliminating the problem of local stress concentration caused by screw tightening. After the plastic cools and solidifies, it forms a molecular-level bond with the pad, which not only has high mechanical strength but also excellent vibration resistance. It avoids the risk of electrochemical corrosion that may be caused by metal fasteners. The stress-dispersed connection method is particularly suitable for the assembly of high-precision electronic components and can effectively prevent problems such as microcracks or solder joint failure caused by stress concentration.

[0029] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A hot riveting fixture for a circuit board and an injection molding machine housing, comprising a lower adapter base plate (100), characterized in that, The top of the lower adapter plate (100) is snapped with a part base (110), and the part body (120) is placed inside the part base (110). An upper adapter plate (200) is provided above the lower adapter plate (100), and a side connecting plate (210) is fixedly connected to one side of the upper adapter plate (200).

2. The hot riveting fixture for a circuit board and an injection molding machine housing as described in claim 1, characterized in that, Two positioning rods (130) are fixedly connected to the top of the part base (110), and the two positioning rods (130) are engaged with the part body (120).

3. The hot riveting fixture for a circuit board and an injection molding machine housing as described in claim 1, characterized in that, The top of the upper adapter base plate (200) is fixedly connected to an upper power source connecting plate (220), and the bottom of the upper power source connecting plate (220) is fixedly connected to a power source connecting rod (230).

4. The hot riveting fixture for a circuit board and an injection molding machine housing as described in claim 3, characterized in that, The bottom end of the power source connecting rod (230) passes through the upper adapter base plate (200) and extends to the bottom of the upper adapter base plate (200).

5. The hot riveting fixture for a circuit board and an injection molding machine housing as described in claim 4, characterized in that, A lower pressure seat (240) is inserted into the inner side of the power source connecting rod (230), and a locking rod (250) is snapped into the outer side of the power source connecting rod (230). One end of the locking rod (250) passes through the power source connecting rod (230) and the lower pressure seat (240) and extends to the outer side of the power source connecting rod (230).

6. The hot riveting fixture for a circuit board and an injection molding machine housing as described in claim 5, characterized in that, The bottom of the pressure seat (240) is snapped with a heat-conducting seat (260), and the bottom of the heat-conducting seat (260) is fixedly connected with three heat-conducting posts (261), and the three heat-conducting posts (261) are evenly distributed.

7. A hot riveting fixture for a circuit board and an injection molding machine housing as described in claim 6, characterized in that, A heat insulation plate (270) is fixedly connected to the inner wall of the lower pressure seat (240), and a heating plate (280) is fixedly connected to the inner wall of the lower pressure seat (240). The heating plate (280) is located below the heat insulation plate (270), and the heating plate (280) is in contact with the heat-conducting seat (260).

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