Automatic voltage boosting device of magnetron sputtering vacuum coating machine

Abstract

The utility model discloses an automatic voltage boosting device of magnetron sputtering vacuum coating machine, including the bottom plate, the bottom plate top is fixed with the backplate, the bottom plate top is fixed with the mounting seat, and the mounting seat top is installed with the voltage boosting sensor, and the voltage boosting sensor top is installed with the circuit board, and the backplate inboard wall is provided with the protective cover, and the protective cover outboard wall four corners all are set up with the round hole, and the backplate outboard wall four corners all are provided with the fixed mechanism for fixing the protective cover, and the protective cover top is provided with the connection box. The utility model discloses through the combination use of blowing mechanism and cooling mechanism, can effectively reduce the temperature of voltage boosting sensor and circuit board, ensures the equipment to keep good heat dissipation effect when working, prevents overheating, and in the process of heat dissipation, cooperation filtering mechanism can effectively remove the dust and moisture in air, avoids these impurities to cause the influence to internal element, thereby guarantees the normal operation of equipment, prolongs the life.

Description

Technical Field

[0001] This utility model relates to the field of magnetron sputtering vacuum coating machine technology, and in particular to an automatic pressure boosting device for a magnetron sputtering vacuum coating machine. Background Technology

[0002] A magnetron sputtering vacuum coating machine is a device that uses magnetron sputtering technology to perform coating in a vacuum environment. The target material is heated in the sputtering chamber to reach its evaporation temperature, and plasma is formed under the influence of a magnetic field. This plasma impacts or sputters atoms or molecules from the target material, which are then deposited on the substrate surface to form the desired thin film. This improves the surface properties of the substrate, enhances its optical performance, provides functional modification, promotes environmental protection and energy saving, and enhances its aesthetic appeal. It is widely used in construction, automotive, electronics, optics, and aerospace industries. In practical applications, the pressure boosting process is a crucial step in the startup and operation of the magnetron sputtering machine. The efficiency and stability of the pressure boosting process directly affect the coating quality and production efficiency; therefore, an automatic pressure boosting device for the magnetron sputtering vacuum coating machine is required.

[0003] Traditional magnetron sputtering vacuum coating machines require heat dissipation during automatic boosting of the device. However, existing boosting devices are usually equipped with cooling fans to assist in heat dissipation. This approach not only results in poor heat dissipation, but the cooling fans also draw in ambient air during operation. This can bring dust, moisture, and other impurities from the air into the boosting device. These contaminants may accumulate on the surface of components, affecting their normal operation and even causing short circuits. This shortens the overall lifespan of the equipment and increases maintenance and replacement costs. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an automatic pressure boosting device for a magnetron sputtering vacuum coating machine.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An automatic pressure boosting device for a magnetron sputtering vacuum coating machine includes a base plate, a U-shaped plate fixed to the top of the base plate, a mounting base fixed to the top of the base plate, a pressure boosting sensor mounted on the top of the mounting base, a circuit board mounted on the top of the pressure boosting sensor, a protective cover provided on the inner side wall of the U-shaped plate, round holes formed at the four corners of the outer side wall of the protective cover, and fixing mechanisms for fixing the protective cover provided at the four corners of the outer side wall of the U-shaped plate, a connecting box provided on the top of the protective cover, an air blowing mechanism for blowing air into the connecting box, and an air filter provided inside the connecting box. The device features a filtration mechanism. An air inlet is located on one side of the outer wall of the protective cover, and a connecting cover is fixed to the same side. Inside the connecting cover is a cooling mechanism for cooling the air. During use, the combination of the air blowing mechanism and the cooling mechanism effectively reduces the temperature of the boost sensor and circuit board, ensuring good heat dissipation and preventing overheating. In conjunction with the filtration mechanism, the device effectively removes dust and moisture from the air, preventing these impurities from affecting internal components, thus ensuring normal operation and extending the device's lifespan.

[0007] As a further embodiment of this utility model, the fixing mechanism includes a sleeve, which is disposed through one corner of the outer wall of the U-shaped plate. An annular slider is slidably connected to the inner wall of the sleeve. A column is fixed to one end of the annular slider, and one end of the column passes through the outer wall of one end of the sleeve. The column is adapted to one of the circular holes. A pull rod is fixed to the other end of the annular slider, and one end of the pull rod passes through the outer wall of the other end of the sleeve. A spring is fixed to the side wall of the pull rod. Pulling the four pull rods causes the four annular sliders to move along the inner walls of the four sleeves respectively until the four columns are retracted into the four sleeves. At this time, the four columns and the four circular holes are disengaged. At this time, the protective cover can be removed from the inside of the U-shaped plate. The operation is simple and convenient for the maintenance or replacement of the components inside the U-shaped plate, which improves the practicality of the device.

[0008] As a further embodiment of this utility model, the air blowing mechanism includes a fan, which is fixed to the top of the protective cover, and the air outlet of the fan is connected to the connecting box. Multiple connecting pipes are installed through the outer wall of the connecting box at the end away from the fan, and one end of each connecting pipe is connected to the connecting cover. The filtering mechanism includes multiple filter layers, which are fixed at equal intervals on the inner wall of the connecting box, and are located between the fan and the multiple connecting pipes. The cooling mechanism includes a semiconductor cooling chip, and a mounting hole is provided on the outer wall of the connecting cover. The semiconductor cooling chip is fixed to the inner wall of the mounting hole, and multiple first fins are fixed at equal intervals on the cold end of the semiconductor cooling chip. Multiple second fins are fixed at equal intervals on the hot end of the cooling chip. An air outlet is opened on the outer wall of the other end of the protective cover. A dustproof net is fixed on the inner wall of the air outlet. When the semiconductor cooling chip is energized, its cold end temperature drops rapidly, which in turn causes the surface temperature of the multiple first fins to drop rapidly to a set value. This drives the fan to draw outside air into the connecting box. After filtering out dust, moisture and other impurities from the air through multiple filter layers, the dry air enters the connecting cover through multiple connecting pipes and contacts the surface of the multiple first fins to cool the air. The cooled, dry air enters the protective cover through the round hole and blows towards the boost sensor and circuit board. Finally, it is blown into the outside environment through the air outlet and the dustproof net.

[0009] The beneficial effects of this utility model are as follows:

[0010] 1. During use, this device, through the combined use of the air blowing mechanism and the cooling mechanism, can effectively reduce the temperature of the boost sensor and circuit board, ensuring good heat dissipation during operation and preventing overheating. During the heat dissipation process, the filter mechanism can effectively remove dust and moisture from the air, preventing these impurities from affecting the internal components, thereby ensuring the normal operation of the equipment and extending its service life.

[0011] 2. The design of the fixing mechanism allows for quick disassembly of the protective cover, making the maintenance and replacement of internal components simpler and more convenient, reducing maintenance time and costs, and improving the practicality of the device. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the automatic pressure boosting device for a magnetron sputtering vacuum coating machine proposed in this utility model;

[0013] Figure 2 This is a schematic diagram of the top of the base plate of the automatic pressure boosting device of the magnetron sputtering vacuum coating machine proposed in this utility model;

[0014] Figure 3 This is a schematic cross-sectional view of the sleeve of the automatic pressure boosting device for a magnetron sputtering vacuum coating machine proposed in this utility model;

[0015] Figure 4 A cross-sectional schematic diagram of the protective cover of the automatic pressure boosting device of the magnetron sputtering vacuum coating machine proposed in this utility model;

[0016] Figure 5 This is a cross-sectional schematic diagram of the connecting cover and connecting box of the automatic pressure boosting device for a magnetron sputtering vacuum coating machine proposed in this utility model.

[0017] In the diagram: 1. Base plate; 2. U-shaped plate; 3. Protective cover; 4. Connecting cover; 5. Sleeve; 6. Fan; 7. Connecting box; 8. Connecting pipe; 9. Mounting base; 10. Boost sensor; 11. Circuit board; 12. Annular slider; 13. Column; 14. Pull rod; 15. Spring; 16. Circular hole; 17. Air outlet; 18. Dustproof net; 19. Air inlet; 20. Filter layer; 21. Semiconductor cooling chip; 22. First fin; 23. Second fin. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Reference Figure 1 - Figure 5 An automatic pressure boosting device for a magnetron sputtering vacuum coating machine includes a base plate 1, a U-shaped plate 2 fixed to the top of the base plate 1, a mounting base 9 fixed to the top of the base plate 1, a pressure boosting sensor 10 mounted on the top of the mounting base 9, a circuit board 11 mounted on the top of the pressure boosting sensor 10, a protective cover 3 provided on the inner side wall of the U-shaped plate 2, round holes 16 opened at the four corners of the outer side wall of the protective cover 3, a fixing mechanism for fixing the protective cover 3 provided at the four corners of the outer side wall of the U-shaped plate 2, a connecting box 7 provided on the top of the protective cover 3, an air blowing mechanism for blowing air into the connecting box 7, and a filter for air inside the connecting box 7. The air filtration mechanism has an air inlet 19 on one side of the outer wall of the protective cover 3, and a connecting cover 4 is fixed to one side of the outer wall of the protective cover 3. The connecting cover 4 is equipped with a cooling mechanism for cooling the air. During use, the combination of the air blowing mechanism and the cooling mechanism can effectively reduce the temperature of the boost sensor 10 and the circuit board 11, ensuring that the equipment maintains good heat dissipation during operation and preventing overheating. During the heat dissipation process, the filtration mechanism can effectively remove dust and moisture from the air, preventing these impurities from affecting the internal components, thereby ensuring the normal operation of the equipment and extending its service life.

[0020] In this embodiment, the fixing mechanism includes a sleeve 5, which is disposed through one corner of the outer wall of the spiral plate 2. An annular slider 12 is slidably connected to the inner wall of the sleeve 5. A column 13 is fixed to one end of the annular slider 12, and one end of the column 13 passes through the outer wall of one end of the sleeve 5. The column 13 is adapted to one of the circular holes 16. A pull rod 14 is fixed to the other end of the annular slider 12, and one end of the pull rod 14 passes through the outer wall of the other end of the sleeve 5. A spring 15 is fixed to the side wall of the pull rod 14. Pulling the four pull rods 14 causes the four annular sliders 12 to move along the inner walls of the four sleeves 5 respectively until the four columns 13 are retracted into the four sleeves 5 respectively. At this time, the four columns 13 and the four circular holes 16 are disengaged. At this time, the protective cover 3 can be removed from the inside of the spiral plate 2. The operation is simple and convenient for the maintenance or replacement of the components inside the spiral plate 2, which improves the practicality of the device.

[0021] In this embodiment, the blowing mechanism includes a fan 6, which is fixed to the top of the protective cover 3. The air outlet of the fan 6 is connected to the connecting box 7. Multiple connecting pipes 8 are installed through the outer wall of the connecting box 7 away from the fan 6, and one end of each connecting pipe 8 is connected to the connecting cover 4. The filtering mechanism includes multiple filter layers 20, which are fixed at equal intervals on the inner wall of the connecting box 7. The multiple filter layers 20 are located between the fan 6 and the multiple connecting pipes 8. The cooling mechanism includes a semiconductor cooling chip 21. The outer wall of the connecting cover 4 has a mounting hole. The semiconductor cooling chip 21 is fixed to the inner wall of the mounting hole. Multiple first fins 22 are fixed at equal intervals on the cold end of the semiconductor cooling chip 21, and multiple first fins 22 are fixed at equal intervals on the hot end of the semiconductor cooling chip 21. The second fin 23 and the outer wall of the protective cover 3 are provided with an air outlet 17. The inner wall of the air outlet 17 is fixed with a dustproof net 18. When the semiconductor cooling chip 21 is powered on, its cold end temperature drops rapidly, which in turn causes the surface temperature of the multiple first fins 22 to drop rapidly to the set value. This drives the fan 6 to draw outside air into the connecting box 7. After filtering out dust, moisture and other impurities in the air through multiple filter layers 20, the dry air enters the connecting cover 4 through multiple connecting pipes 8 and comes into contact with the surface of the multiple first fins 22 to cool the air. The cooled dry air enters the protective cover 3 through the round hole 16 and blows towards the boost sensor 10 and the circuit board 11. Finally, it is blown into the outside environment through the air outlet 17 and the dustproof net 18.

[0022] Working Principle: During use, when heat dissipation is required, the power switches of the fan 6 and the thermoelectric cooler 21 are connected. When the thermoelectric cooler 21 is powered on, its cold end temperature drops rapidly, causing the surface temperature of the multiple first fins 22 to drop rapidly to the set value. This drives the fan 6 to draw outside air into the connecting box 7. After passing through multiple filter layers 20 to remove dust, moisture, and other impurities from the air, the dry air enters the connecting cover 4 through multiple connecting pipes 8 and comes into contact with the surfaces of the multiple first fins 22, cooling the air. The cooled, dry air then enters the protective cover 3 through the round hole 16 and blows towards the boost sensor 10 and the circuit board 11. Finally, it is blown out into the outside environment through the air outlet 17 and the dust filter 18. This process effectively cools the boost sensor 10 and the circuit board 11, etc. The heat generated by the components during operation is carried out of the protective cover 3. This operation method not only improves the heat dissipation effect, but also filters out impurities such as dust and moisture in the air, avoiding affecting the normal operation of the internal components of the booster device, thereby increasing the overall service life of the equipment and reducing maintenance and replacement costs. When it is necessary to repair or replace the internal components of the booster device, pull the four levers 14 to move the four annular sliders 12 along the inner walls of the four sleeves 5 until the four columns 13 are retracted into the four sleeves 5. At this time, the four columns 13 and the four round holes 16 are disengaged. Then, the protective cover 3 can be removed from the inside of the U-shaped plate 2. The operation is simple and convenient for repairing or replacing the internal components of the U-shaped plate 2, which improves the practicality of the device.

[0023] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An automatic pressure boosting device for a magnetron sputtering vacuum coating machine, comprising a base plate (1), characterized in that, The base plate (1) is fixed with a U-shaped plate (2) at the top, the base plate (1) is fixed with a mounting base (9) at the top, the mounting base (9) is mounted with a boost sensor (10) at the top, the boost sensor (10) is mounted with a circuit board (11) at the top, the inner side wall of the U-shaped plate (2) is provided with a protective cover (3), the outer side wall of the protective cover (3) is provided with round holes (16) at the four corners, the outer side wall of the U-shaped plate (2) is provided with a fixing mechanism for fixing the protective cover (3) at the four corners, the top of the protective cover (3) is provided with a connecting box (7), the top of the protective cover (3) is provided with an air blowing mechanism for blowing air into the connecting box (7), the connecting box (7) is provided with a filtering mechanism for filtering air inside, one end of the outer side wall of the protective cover (3) is provided with an air inlet (19), one end of the outer side wall of the protective cover (3) is fixed with a connecting cover (4), the connecting cover (4) is provided with a cooling mechanism for cooling the air inside.

2. The automatic pressure boosting device for the magnetron sputtering vacuum coating machine according to claim 1, characterized in that, The fixing mechanism includes a sleeve (5), which is disposed through one corner of the outer wall of the spiral plate (2). An annular slider (12) is slidably connected to the inner wall of the sleeve (5). A column (13) is fixed to one end of the annular slider (12), and one end of the column (13) passes through the outer wall of one end of the sleeve (5). The column (13) is adapted to one of the circular holes (16). A pull rod (14) is fixed to the other end of the annular slider (12), and one end of the pull rod (14) passes through the outer wall of the other end of the sleeve (5). A spring (15) is fixed to the side wall of the pull rod (14).

3. The automatic pressure boosting device for the magnetron sputtering vacuum coating machine according to claim 1, characterized in that, The blowing mechanism includes a blower (6), which is fixed to the top of the protective cover (3). The outlet of the blower (6) is connected to the connecting box (7). Multiple connecting pipes (8) are provided through the outer wall of the connecting box (7) away from the blower (6), and one end of each of the multiple connecting pipes (8) is connected to the connecting cover (4).

4. The automatic pressure boosting device for the magnetron sputtering vacuum coating machine according to claim 1, characterized in that, The filtration mechanism includes multiple filter layers (20), which are fixed at equal intervals on the inner wall of the connecting box (7), and the multiple filter layers (20) are located between the fan (6) and the multiple connecting pipes (8).

5. The automatic pressure boosting device for the magnetron sputtering vacuum coating machine according to claim 1, characterized in that, The cooling mechanism includes a semiconductor cooling chip (21). The outer wall of the connecting cover (4) is provided with an installation hole. The semiconductor cooling chip (21) is fixed on the inner wall of the installation hole. Multiple first fins (22) are fixed at equal distances on the cold end of the semiconductor cooling chip (21), and multiple second fins (23) are fixed at equal distances on the hot end of the semiconductor cooling chip (21).

6. The automatic pressure boosting device for the magnetron sputtering vacuum coating machine according to claim 1, characterized in that, An air outlet (17) is provided on the outer side wall of the other end of the protective cover (3), and a dustproof net (18) is fixed on the inner wall of the air outlet (17).

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