Cooling device for low-carbon silicon-chromium alloy to reduce phosphorus

Abstract

The utility model discloses a cooling device for low carbon silicon chromium alloy reduces phosphor, including rectangular copper board, the outside of rectangular copper board is equipped with hollow rectangular sleeve, the outer wall of rectangular copper board and the inner wall of hollow rectangular sleeve form liquid alloy flow guide interlayer cavity, the both ends of liquid alloy flow guide interlayer cavity are provided with annular plugging board, the number of annular plugging board is two groups, and two groups annular plugging board are fixed between the outer wall of rectangular copper board both ends and the left and right ends of hollow rectangular sleeve inner wall. The utility model discloses a cooling device for low carbon silicon chromium alloy reduces phosphor, through the synergies of multilayer reverse cooling, spiral flow guide heat transfer intensification, has improved the cooling efficiency and the effect of reducing phosphor of low carbon silicon chromium alloy, has solved the problem of low efficiency, poor uniformity of traditional cooling device.

Description

Technical Field

[0001] This utility model relates to the field of phosphorus reduction technology for low-carbon silicon-chromium alloys, specifically to a cooling device for phosphorus reduction of low-carbon silicon-chromium alloys. Background Technology

[0002] In the metallurgical industry, low-carbon silicon-chromium alloys are important alloy materials, widely used in the production of stainless steel, heat-resistant steel, and other special alloys. However, phosphorus (P), as a harmful impurity element, easily segregates in alloys, especially during slow cooling, where it accumulates in grain boundaries and other areas that are the last to solidify, severely affecting the alloy's mechanical properties and corrosion resistance. Therefore, effectively reducing phosphorus content and suppressing its segregation is one of the key technical challenges in producing high-quality low-carbon silicon-chromium alloys.

[0003] Currently, the industry commonly uses rapid cooling technologies (such as water-cooled copper molds) to shorten the solidification time of alloys, thereby reducing phosphorus segregation. However, existing cooling devices have the following problems:

[0004] 1. Low cooling efficiency: Traditional cooling methods usually adopt a single-layer cooling structure, which has a limited heat exchange area between the cooling medium and the liquid alloy, resulting in insufficient cooling rate and difficulty in achieving ideal rapid cooling.

[0005] 2. Uneven heat exchange: Due to the single flow path of the cooling medium, local overheating or insufficient cooling is easily formed, which affects the uniformity of the alloy structure.

[0006] Therefore, we propose a cooling device for reducing phosphorus in low-carbon silicon-chromium alloys. Utility Model Content

[0007] (a) Technical problems to be solved

[0008] To address the shortcomings of existing technologies, this utility model provides a cooling device for reducing phosphorus in low-carbon silicon-chromium alloys. Through the synergistic effect of multi-layer reverse cooling and spiral flow to enhance heat exchange, it improves the cooling efficiency and phosphorus reduction effect of low-carbon silicon-chromium alloys, solving the problems of low efficiency and poor uniformity of traditional cooling devices, and effectively addressing the problems in the background technology.

[0009] (II) Technical Solution

[0010] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a cooling device for reducing phosphorus in low-carbon silicon-chromium alloys, comprising a rectangular copper plate, a hollow rectangular sleeve fitted around the outer side of the rectangular copper plate, a liquid alloy flow guiding interlayer cavity formed between the outer wall of the rectangular copper plate and the inner wall of the hollow rectangular sleeve, and annular sealing plates provided at both ends of the liquid alloy flow guiding interlayer cavity, the number of which is two sets, the two sets of annular sealing plates being fixed between the outer walls at both ends of the rectangular copper plate and the left and right ends of the inner wall of the hollow rectangular sleeve. A first valve is installed at the middle of the outer surface of both ends of the rectangular copper plate. A second valve is installed at the bottom of the outer surface of one side of the annular sealing plate. A third valve is fixedly installed at both ends of the outer surface of one side of the hollow rectangular sleeve. A hollow flow guiding interlayer is provided inside the hollow rectangular sleeve. A first spiral flow guiding plate is installed in the hollow flow guiding interlayer. A second spiral flow guiding plate is provided inside the liquid alloy flow guiding interlayer cavity. A coolant flow guiding cavity is provided inside the rectangular copper plate. Turbulence protrusions are provided in the coolant flow guiding cavity.

[0011] Preferably, there are two sets of the first valve, the second valve, and the third valve. One end of the first valve in each set extends through both ends of the coolant guide cavity, one end of the second valve in each set extends through both ends of the liquid alloy guide jacket cavity, and one end of the third valve in each set extends through both sides of the hollow guide jacket.

[0012] Preferably, the spiral directions of the first spiral guide plate and the second spiral guide plate are opposite to increase the efficiency of reverse heat exchange between the cooling medium and the liquid alloy.

[0013] Preferably, the turbulence protrusions are hemispherical or pyramidal protrusions, evenly distributed on the inner wall of the coolant guide cavity.

[0014] Preferably, the annular sealing plate is sealed and fixedly connected to the contact surface of the rectangular copper plate and the hollow rectangular sleeve to prevent leakage of the liquid alloy medium.

[0015] Preferably, the first valve, the second valve, and the third valve are electromagnetic regulating valves used to control the flow rate.

[0016] (III) Beneficial Effects

[0017] Compared with the prior art, this utility model provides a cooling device for reducing phosphorus in low-carbon silicon-chromium alloys, which has the following beneficial effects:

[0018] 1. This cooling device for reducing phosphorus in low-carbon silicon-chromium alloys uses a double-layer cooling design of a rectangular copper plate and a hollow rectangular sleeve. This design allows the coolant to simultaneously envelop and cool the alloy in the liquid alloy guide jacket cavity both inside (coolant guide cavity) and outside (hollow guide jacket), significantly increasing the heat exchange area, shortening the cooling time, and effectively suppressing phosphorus segregation.

[0019] 2. The cooling device for reducing phosphorus in low-carbon silicon-chromium alloys has a first spiral guide plate and a second spiral guide plate arranged in opposite spiral directions, so that the cooling medium and the liquid alloy form a counterflow, prolonging the contact time and improving the heat exchange efficiency, ensuring rapid and uniform cooling of the alloy.

[0020] 3. The cooling device for reducing phosphorus in low-carbon silicon-chromium alloys has turbulence protrusions (hemispherical or pyramidal) in the coolant guide cavity that can disrupt laminar flow, enhance turbulence, and fully agitate the coolant to avoid local overheating or insufficient cooling, thereby improving the overall cooling uniformity. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the cooling device for reducing phosphorus in low-carbon silicon-chromium alloys according to this utility model.

[0022] Figure 2 This is a partial structural schematic diagram of the cooling device for reducing phosphorus in low-carbon silicon-chromium alloys according to this utility model.

[0023] Figure 3 This is a side cross-sectional view of the cooling device for reducing phosphorus in low-carbon silicon-chromium alloys according to this invention.

[0024] Figure 4 This invention relates to a cooling device for reducing phosphorus in low-carbon silicon-chromium alloys. Figure 3 Enlarged view of point A in the middle.

[0025] In the figure: 1. Rectangular copper plate; 2. Hollow rectangular sleeve; 3. Annular sealing plate; 4. First valve; 5. Second valve; 6. Third valve; 7. Liquid alloy guide jacket cavity; 8. Coolant guide cavity; 9. Turbulence protrusion; 10. Hollow guide jacket; 11. First spiral guide plate; 12. Second spiral guide plate. Detailed Implementation

[0026] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0027] This embodiment is a cooling device for reducing phosphorus in low-carbon silicon-chromium alloys.

[0028] like Figure 1-4As shown, the device includes a rectangular copper plate 1, with a hollow rectangular sleeve 2 fitted around the outside of the rectangular copper plate 1. A liquid alloy flow guiding interlayer cavity 7 is formed between the outer wall of the rectangular copper plate 1 and the inner wall of the hollow rectangular sleeve 2. Two sets of annular sealing plates 3 are provided at both ends of the liquid alloy flow guiding interlayer cavity 7, fixed between the outer walls of both ends of the rectangular copper plate 1 and the left and right ends of the inner walls of the hollow rectangular sleeve 2. A first valve is installed at the center of the outer surface of both ends of the rectangular copper plate 1. 4. A second valve 5 is installed at the bottom of one side of the outer surface of the annular sealing plate 3. A third valve 6 is fixedly installed at both ends of one side of the outer surface of the hollow rectangular sleeve 2. A hollow flow guiding interlayer 10 is provided inside the hollow flow guiding interlayer 2. A first spiral flow guiding plate 11 is installed in the hollow flow guiding interlayer 10. A second spiral flow guiding plate 12 is provided inside the liquid alloy flow guiding interlayer cavity 7. A coolant flow guiding cavity 8 is provided inside the rectangular copper plate 1. A turbulence protrusion 9 is provided in the coolant flow guiding cavity 8.

[0029] The number of first valves 4, second valves 5, and third valves 6 are all in two sets. One end of each set of first valves 4 extends to both ends of the coolant guide cavity 8, one end of each set of second valves 5 extends to both ends of the liquid alloy guide jacket cavity 7, and one end of each set of third valves 6 extends to both sides of the hollow guide jacket 10. The spiral directions of the first spiral guide plate 11 and the second spiral guide plate 12 are opposite to increase the reverse heat exchange efficiency between the coolant and the liquid alloy. The turbulence protrusions 9 are hemispherical or pyramidal protrusions, evenly distributed on the inner wall of the coolant guide cavity 8. The annular sealing plate 3 is sealed and fixedly connected to the contact surface of the rectangular copper plate 1 and the hollow rectangular sleeve 2 to prevent leakage of the liquid alloy medium. The first valves 4, second valves 5, and third valves 6 are electromagnetic regulating valves used to control the flow rate.

[0030] It should be noted that this utility model is a cooling device for reducing phosphorus in low-carbon silicon-chromium alloys. The first valve 4 and the third valve 6 are both externally connected to a coolant circulation device, and the second valve 5 is externally connected to a liquid alloy pumping device. The liquid alloy is sent into the interior of the liquid alloy guide jacket cavity 7 through the second valve 5, and is guided by the second spiral guide plate 12 inside the liquid alloy guide jacket cavity 7. The first valve 4 and the third valve 6 pump coolant into the coolant guide cavity 8 inside the rectangular copper plate 1 and the hollow guide jacket 10 inside the hollow rectangular sleeve 2. The coolant inside the coolant guide cavity 8 cools the liquid alloy inside, and the coolant in the hollow guide jacket 10 cools the liquid alloy outside, thereby improving the cooling efficiency. Turbulence protrusions 9 are provided in the coolant guide cavity 8 to increase the turbulence effect inside the coolant guide cavity 8 and improve the heat exchange efficiency.

[0031] It should be noted that, in this document, relational terms such as first and second (number one, number two), etc., are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A cooling device for reducing phosphorus in low-carbon silicon-chromium alloys, comprising a rectangular copper plate (1), characterized in that: A hollow rectangular sleeve (2) is fitted around the rectangular copper plate (1). A liquid alloy flow guiding interlayer cavity (7) is formed between the outer wall of the rectangular copper plate (1) and the inner wall of the hollow rectangular sleeve (2). Annular sealing plates (3) are provided at both ends of the liquid alloy flow guiding interlayer cavity (7). There are two sets of annular sealing plates (3). The two sets of annular sealing plates (3) are fixed between the outer walls of both ends of the rectangular copper plate (1) and the left and right ends of the inner wall of the hollow rectangular sleeve (2). A first valve (4) is installed in the middle of the outer surface of both ends of the rectangular copper plate (1). A second valve (5) is installed at the bottom of the outer surface of one side of the blocking plate (3). A third valve (6) is fixedly installed at both ends of the outer surface of one side of the hollow rectangular sleeve (2). A hollow flow guide jacket (10) is provided inside the hollow rectangular sleeve (2). A first spiral flow guide plate (11) is installed in the hollow flow guide jacket (10). A second spiral flow guide plate (12) is provided inside the liquid alloy flow guide jacket cavity (7). A coolant flow guide cavity (8) is provided inside the rectangular copper plate (1). A turbulence protrusion (9) is provided in the coolant flow guide cavity (8).

2. The cooling device for reducing phosphorus in low-carbon silicon-chromium alloys according to claim 1, characterized in that: The number of the first valve (4), the second valve (5) and the third valve (6) are all two sets. One end of the first valve (4) of the two sets extends to both ends of the coolant guide cavity (8), one end of the second valve (5) of the two sets extends to both ends of the liquid alloy guide jacket cavity (7), and one end of the third valve (6) of the two sets extends to both sides of the hollow guide jacket (10).

3. The cooling device for reducing phosphorus in low-carbon silicon-chromium alloys according to claim 2, characterized in that: The first spiral guide plate (11) and the second spiral guide plate (12) have opposite spiral directions to increase the efficiency of reverse heat exchange between the cooling medium and the liquid alloy.

4. The cooling device for reducing phosphorus in low-carbon silicon-chromium alloys according to claim 3, characterized in that: The turbulence protrusions (9) are hemispherical or pyramidal protrusions, evenly distributed on the inner wall of the coolant guide cavity (8).

5. The cooling device for reducing phosphorus in low-carbon silicon-chromium alloys according to claim 4, characterized in that: The annular sealing plate (3) is sealed and fixedly connected to the contact surfaces of the rectangular copper plate (1) and the hollow rectangular sleeve (2) to prevent leakage of liquid alloy or cooling medium.

6. The cooling device for reducing phosphorus in low-carbon silicon-chromium alloys according to claim 5, characterized in that: The first valve (4), the second valve (5), and the third valve (6) are electromagnetic regulating valves used to control the flow rate.

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