A high-efficiency heat-dissipating LED optoelectronic device
The design of the threaded mounting sleeve and fixing screws solves the problem of the difficulty in disassembling the heat dissipation structure of LED optoelectronic devices, achieving convenient maintenance and efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG SIGNLINK TECH CO LTD
- Filing Date
- 2025-08-06
- Publication Date
- 2026-07-14
AI Technical Summary
The heat dissipation structure of existing LED optoelectronic devices is difficult to disassemble and maintain after long-term use, resulting in inconvenience in maintenance.
The design of the mounting sleeve and fixing screws with threaded connection allows for easy disassembly of heat dissipation components such as heat conduction plates and cooling fans, and the combination with the filter structure dissipates heat.
It enables convenient disassembly and maintenance of heat dissipation components, improves heat dissipation efficiency, and ensures long-term stable operation of optoelectronic devices.
Smart Images
Figure CN224503885U_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of optoelectronic device technology, specifically a high-efficiency heat dissipation LED optoelectronic device. Background Technology
[0002] Semiconductor optoelectronic devices are various functional devices made using the photo-electric conversion effect. These devices are ubiquitous in our lives. In order to ensure that these devices can maintain stable operation for a long time, it is necessary to design appropriate heat dissipation structures for them.
[0003] Meanwhile, a high-efficiency heat dissipation optoelectronic device with application number CN202221869280.6 includes a mounting cylinder, a blower mechanism, and a heat dissipation mechanism. Two sets of fixing plates are fixedly installed inside the mounting cylinder, and multiple sets of openings are opened on the outer side of the fixing plates. The blower mechanism is located inside the mounting cylinder and includes an optoelectronic device, a heat-conducting plate, and a heat dissipation plate. The optoelectronic device is fixedly installed inside the mounting cylinder, and the heat-conducting plate is fixedly installed on the outer side of the optoelectronic device. Multiple sets of heat dissipation plates are fixedly installed on the outer side of the heat-conducting plate. The heat dissipation mechanism is located outside the mounting cylinder and below the blower mechanism.
[0004] However, the following problems were found in the implementation of the relevant technologies: Although the existing equipment can provide efficient heat dissipation for optoelectronic devices, the related structures used for heat dissipation need to be maintained after long-term use. The inconvenience of disassembling the related structures used for heat dissipation during maintenance is due to the inability to disassemble them easily. Utility Model Content
[0005] To address the problems mentioned in the background art, this utility model provides an LED optoelectronic device with high-efficiency heat dissipation. The related structures used for heat dissipation can be easily disassembled for maintenance, making it more convenient to maintain the related structures used for heat dissipation.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-efficiency heat dissipation LED optoelectronic device, comprising a mounting housing, optoelectronic devices, and a heat dissipation assembly mounted inside the mounting housing. The heat dissipation assembly includes a mounting groove constructed on the right side of the mounting housing and a heat-conducting plate inserted into the inner side of the mounting groove. Multiple heat-conducting rods are connected in a ring shape on the left side of the heat-conducting plate. A mounting plate is mounted on the right side of the heat-conducting plate, and multiple optoelectronic devices are installed in a ring shape on the right side of the mounting plate. Fixing members are integrally formed on the top and bottom of the mounting plate, and fixing screws are screwed between the fixing members and the right side of the mounting housing. A connecting cylinder is fixedly inserted into the left side of the mounting housing, and a mounting cylinder is threadedly connected to the inner side of the connecting cylinder. A cooling fan is nested on the right side of the inner wall of the mounting cylinder, and a first filter screen is nested on the left side of the inner wall of the mounting cylinder.
[0007] Preferably, the bottom of the mounting housing has a slot located below the heat-conducting rod, and a second filter screen is nested at the bottom of the slot.
[0008] Preferably, a protective housing is provided on the right side of the mounting housing, and the protective housing is located outside the mounting plate.
[0009] Preferably, a fixing plate is connected to the top of the protective shell, and multiple sub-buckles are nested side by side on the left side of the fixing plate.
[0010] Preferably, the top of the mounting housing is connected to a connecting plate located on the left side of the fixing plate, and multiple female buckles are nested side by side on the right side of the connecting plate, with the female buckles fastened into the corresponding female buckles.
[0011] Preferably, two L-shaped fixing brackets are symmetrically connected to the left outer wall of the mounting housing, and multiple fixing holes are arranged side by side on the left side of the fixing brackets.
[0012] Preferably, a limiting ring is fixedly sleeved on the outer wall of the mounting cylinder, and the limiting ring abuts against the left outer wall of the mounting housing.
[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0014] 1. This utility model allows the mounting cylinder to be unscrewed from the inside of the connecting cylinder by turning the mounting cylinder. This allows the mounting cylinder, along with the first filter screen and the cooling fan inside, to be removed. After removing the fixing screws, the mounting plate, along with the heat-conducting plate and multiple heat-conducting rods, can be removed to the right. This makes it easier to remove the related structures used for heat dissipation and to maintain them.
[0015] 2. This utility model uses a heat-conducting plate to conduct the heat generated by the operation of the optoelectronic device to the surface of multiple heat-conducting rods. The cooling fan continuously blows air to the right to remove the heat from the surface of the multiple heat-conducting rods. The hot air is discharged downward from the second filter screen for heat dissipation, which can provide efficient heat dissipation for the optoelectronic device. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0017] Figure 2 This is a cross-sectional view of the overall structure of this utility model;
[0018] Figure 3 This is a schematic diagram of the structure of the heat-conducting plate of this utility model;
[0019] Figure 4 This is an exploded view of the mounting platform of this utility model;
[0020] Figure 5 This utility model Figure 1Enlarged view of the structure at point A in the middle.
[0021] In the diagram: 1. Mounting housing; 2. Mounting plate; 3. Optoelectronic device; 4. Heat-conducting plate; 5. Heat-conducting rod; 6. Connecting cylinder; 7. Mounting cylinder; 8. Cooling fan; 9. First filter screen; 10. Second filter screen; 11. Fixing component; 12. Fixing screw; 13. Protective housing; 14. Fixing plate; 15. Sub-buckle; 16. Connecting plate; 17. Fixing bracket; 18. Fixing hole; 19. Limiting ring. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] like Figures 1 to 5 As shown, this utility model provides a high-efficiency heat dissipation LED optoelectronic device, including a mounting housing 1, multiple optoelectronic devices 3, and a heat dissipation assembly installed inside the mounting housing 1. The heat dissipation assembly includes a mounting groove on the right side of the mounting housing 1 and a heat-conducting plate 4 inserted into the mounting groove. The heat-conducting plate 4 can be positioned through the mounting groove, and multiple heat-conducting rods 5 are welded in a ring shape on the left side of the heat-conducting plate 4. The heat-conducting plate 4 can conduct the heat generated by the multiple optoelectronic devices 3 to the surface of the multiple heat-conducting rods 5 to improve the efficiency of heat dissipation. A mounting plate 2 is bonded to the right side of the heat-conducting plate 4, and multiple optoelectronic devices 3 are installed in a ring shape on the right side of the mounting plate 2. The optoelectronic devices 3 can convert electrical energy into light energy to emit light of various colors using existing principles. The top and bottom of the mounting plate 2 are integrally injection molded with solid... The mounting plate 2 is fixed to the right side of the mounting housing 1 by screwing a fixing screw 12 between the fixing part 11 and the right side of the mounting housing 1. The mounting plate 2 can be removed by unscrewing the fixing screw 12. A connecting cylinder 6 is fixedly inserted into the left side of the mounting housing 1, and a mounting cylinder 7 is threadedly connected to the inner side of the connecting cylinder 6. The threaded connection makes it easy to install and remove the mounting cylinder 7. A cooling fan 8 is nested on the right side of the inner wall of the mounting cylinder 7. The cooling fan 8 on the right side is easy to maintain after the mounting cylinder 7 is removed. The cooling fan 8 can continuously blow air to dissipate the heat on the surface of the multiple heat-conducting rods 5. A first filter screen 9 is nested on the left side of the inner wall of the mounting cylinder 7. The first filter screen 9 can prevent dust from entering the mounting housing 1 through the mounting cylinder 7. The first filter screen 9 on the left side is easy to maintain after the mounting cylinder 7 is removed.
[0024] Specifically, the bottom of the mounting housing 1 has a slot located below the heat-conducting rod 5, and a second filter screen 10 is nested at the bottom of the slot. The hot air generated by blowing away the heat from the surfaces of the multiple heat-conducting rods 5 will be discharged from the mounting housing 1 through the second filter screen 10. The second filter screen 10 can prevent dust from entering the mounting housing 1.
[0025] Furthermore, a protective housing 13 is provided on the right side of the mounting housing 1, and the protective housing 13 is located outside the mounting plate 2, which can provide a certain degree of protection for multiple optoelectronic devices 3.
[0026] Furthermore, a fixing plate 14 is glued to the top of the protective shell 13, and multiple sub-buckles 15 are nested side by side on the left side of the fixing plate 14. The sub-buckles 15 are used in conjunction with the female buckle.
[0027] It is worth noting that a connecting plate 16 located on the left side of the fixing plate 14 is glued to the top of the mounting housing 1. Multiple female buckles (not shown in the figure) are nested side by side on the right side of the connecting plate 16, and the male buckles 15 are fastened in the corresponding female buckles. In this way, the fixing plate 14 can be easily fixed to the right side of the connecting plate 16, thereby installing the protective housing 13 on the right side of the mounting housing 1.
[0028] It is worth noting that two L-shaped mounting brackets 17 are symmetrically connected to the left outer wall of the mounting housing 1 by multiple sets of screws, and multiple fixing holes 18 are provided side by side on the left side of the mounting brackets 17. Screws can be screwed into the fixing holes 18 to fix the equipment to the right side of the external structure.
[0029] It is worth mentioning that the outer wall of the mounting cylinder 7 is fixedly fitted with a limiting ring 19, and the limiting ring 19 abuts against the left outer wall of the mounting housing 1. The mounting cylinder 7 is installed in place when the limiting ring 19 is turned until it abuts against the left side of the mounting housing 1.
[0030] Among them, optoelectronic device 3 and heat dissipation fan 8 are existing technologies and will not be described in detail; at the same time, this utility model also includes power supply, controller and switch, etc., which are not the main technical points of this patent and will not be described in detail; the "front, back, left and right" perspectives of this device are as follows: Figure 1 The direction shown in the diagram is the reference.
[0031] Working principle: When the device is working, the optoelectronic devices 3 will generate heat. The heat conduction plate 4 can conduct the heat generated by the multiple optoelectronic devices 3 to the surface of the multiple heat conduction rods 5. At the same time, the cooling fan 8 will continuously blow air to the right, thereby dissipating the heat on the surface of the multiple heat conduction rods 5. The hot air will be discharged downward from the second filter screen 10 for heat dissipation. The hot air formed by dissipating the heat on the surface of the multiple heat conduction rods 5 will be discharged from the second filter screen 10 to the mounting housing 1, thereby achieving efficient heat dissipation.
[0032] When maintenance of the heat dissipation-related structures is required, turn off the equipment and unscrew the mounting cylinder 7 to remove it from the inside of the connecting cylinder 6. This allows the first filter screen 9 and the cooling fan 8 inside the mounting cylinder 7 to be removed. The cooling fan 8 on the right side is easy to maintain after the mounting cylinder 7 is removed, as is the first filter screen 9 on the left side. After removing the fixing screw 12, the mounting plate 2, along with the heat-conducting plate 4 and multiple heat-conducting rods 5, can be removed to the right, making maintenance of the heat dissipation-related structures more convenient.
[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A high-efficiency heat dissipation LED optoelectronic device, comprising a mounting housing (1), a plurality of optoelectronic devices (3), and a heat dissipation assembly mounted inside the mounting housing (1), characterized in that: The heat dissipation assembly includes a mounting groove on the right side of the mounting housing (1) and a heat-conducting plate (4) inserted into the inside of the mounting groove. Multiple heat-conducting rods (5) are connected in a ring shape on the left side of the heat-conducting plate (4). A mounting plate (2) is installed on the right side of the heat-conducting plate (4). Multiple optoelectronic devices (3) are installed in a ring shape on the right side of the mounting plate (2). The top and bottom of the mounting plate (2) are integrally formed with fixing parts (11). Fixing screws (12) are screwed between the fixing parts (11) and the right side of the mounting housing (1). A connecting cylinder (6) is fixedly inserted into the left side of the mounting housing (1). A mounting cylinder (7) is threaded into the inner side of the connecting cylinder (6). A cooling fan (8) is nested on the right side of the inner wall of the mounting cylinder (7). A first filter screen (9) is nested on the left side of the inner wall of the mounting cylinder (7).
2. The high-efficiency heat dissipation LED optoelectronic device according to claim 1, characterized in that: The bottom of the mounting housing (1) has a slot located below the heat-conducting rod (5), and a second filter screen (10) is nested at the bottom of the slot.
3. The high-efficiency heat dissipation LED optoelectronic device according to claim 1, characterized in that: A protective housing (13) is provided on the right side of the mounting housing (1), and the protective housing (13) is located outside the mounting plate (2).
4. The high-efficiency heat dissipation LED optoelectronic device according to claim 3, characterized in that: The top of the protective housing (13) is connected to a fixing plate (14), and multiple sub-buckles (15) are nested side by side on the left side of the fixing plate (14).
5. The high-efficiency heat dissipation LED optoelectronic device according to claim 4, characterized in that: The top of the mounting housing (1) is connected to a connecting plate (16) located to the left of the fixing plate (14). Multiple female buckles are nested side by side on the right side of the connecting plate (16), and the female buckles (15) are fastened in the corresponding female buckles.
6. The LED optoelectronic device with high-efficiency heat dissipation according to claim 1, characterized in that: The left outer wall of the mounting housing (1) is symmetrically connected with two L-shaped fixing brackets (17), and multiple fixing holes (18) are arranged side by side on the left side of the fixing brackets (17).
7. The high-efficiency heat dissipation LED optoelectronic device according to claim 1, characterized in that: The outer wall of the mounting cylinder (7) is fixedly fitted with a limiting ring (19), and the limiting ring (19) abuts against the left outer wall of the mounting housing (1).