A mold for preventing a chip runner from collapsing during a hot press process
By designing a mold that injects airflow into the microfluidic chip channel, the problem of channel collapse during hot pressing is solved, ensuring the integrity and precision of the channel and achieving efficient hot pressing processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG YANGQING CHIP TECH CO LTD
- Filing Date
- 2025-06-18
- Publication Date
- 2026-07-17
Smart Images

Figure CN224510398U_ABST
Abstract
Claims
1. A mold for preventing a chip runner from collapsing during a hot press process, characterized by, include: Mold 1 (1), one side surface of mold 1 (1) has cavity 1 (11), and the interior of mold 1 (1) has gas supply channel (12) and exhaust channel (13); The air inlet (121) of the air supply channel (12) is located on the outer wall of the mold (1), and the air outlet (122) of the air supply channel (12) is located on the inner wall of the cavity (11); the exhaust outlet (131) of the exhaust channel (13) is located on the outer wall of the mold (1), and the air inlet (132) of the exhaust channel (13) is located on the inner wall of the cavity (11); Mold 2 (2), one side surface of mold 2 (2) has cavity 2 (21), mold 1 (1) and mold 2 (2) can be adapted to fit each other, and cavity 1 (11) and cavity 2 (21) are engaged to jointly construct a chip forming cavity (3) for placing the chip to be hot-pressed (4); The air outlet (122) and the air inlet (132) can be connected one-to-one to the chip inlet (41) and the chip outlet (42) of the chip to be heated and pressed arranged in the chip forming cavity (3).
2. The mold for preventing the chip flow channel from collapsing during the hot press process according to claim 1, wherein, The air inlet (121) is a threaded port that can be adapted to connect to a quick-connect air pipe connector.
3. The mold for preventing the chip flow channel from collapsing during the hot press process according to claim 2, wherein, The air inlet (121) is connected to and communicates with a quick-connect fitting for connecting the air compressor supply line.
4. The mold for preventing the chip flow channel from collapsing during the hot press process according to claim 1, wherein, The exhaust port (131) is a threaded port that can be adapted to connect to a quick connector.
5. The mold for preventing the chip flow channel from collapsing during the hot press process according to claim 4, wherein, The exhaust port (131) is connected to and communicates with a quick-connect fitting for connecting an exhaust pipe.
6. The mold for preventing the chip flow channel from collapsing during the hot press process according to claim 1, wherein, The air inlet (121) and the exhaust outlet (131) are arranged on opposite side walls of the mold (1).
7. The mold for preventing the chip flow channel from collapsing during the hot press process according to claim 1, wherein, The air outlet (122) and the air inlet (132) are both located on the bottom wall of the concave cavity (11).
8. The mold for preventing the chip flow channel from collapsing during the hot press process according to claim 1, wherein, A guide positioning post (14) is fixed on one side surface of the mold one (1) corresponding to the outer periphery of the cavity one (11); a guide positioning hole (22) is opened on one side surface of the mold two (2) corresponding to the outer periphery of the cavity two (21); when the mold one (1) and the mold two (2) are closed, the guide positioning post (14) can be adapted to be inserted into the guide positioning hole (22) for mold closing guidance.
9. The mold for preventing the chip flow channel from collapsing during the hot press process according to claim 1, wherein, Both mold one (1) and mold two (2) are stainless steel molds.
10. The mold for preventing the chip flow channel from collapsing during the hot press process according to claim 1, wherein, There is a hot-pressing deformation gap between the inner peripheral wall of the chip forming cavity (3) and the outer peripheral wall of the chip to be hot-pressed (4).