Wafer measurement and sorting apparatus

Abstract

The utility model relates to wafer measurement sorting technical field, concretely is a kind of wafer measurement sorting device, including workbench, the inner side of the workbench top is fixedly provided with wafer limiting groove, the inner side of the workbench top is evenly distributed with wafer limiting groove, the utility model wafer limiting groove setting, can be used to place wafer, the setting of dust cover, can be unqualified product storage groove shelter dust, the setting of unqualified product storage groove, for storing unqualified wafer, servo motor one starts, drives ball screw one rotation, so that ball nut one and fixed frame one left and right movement, in turn, drive mechanical claw left and right movement, servo motor two starts, drives ball screw two rotation, so that ball nut two and fixed frame two move back and forth, in turn, drive mechanical claw move back and forth, high-definition camera can distinguish wafer limiting groove, meet unqualified product, by electric push rod to promote mechanical claw to be grabbed, again place to unqualified product storage groove and store.

Description

Technical Field

[0001] This utility model relates to the field of wafer measurement and sorting technology, and in particular to a wafer measurement and sorting device. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, then slowly pulled out to form a cylindrical single-crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer, which is a crystal.

[0003] Common challenges in wafer measurement and sorting include: Inspecting thin wafers: Current power semiconductors are primarily manufactured on 200mm wafers with a thickness of 50 to 100 μm, but the blueprint is for wafers as thin as 1 μm. These wafers are thinned by mechanically polishing their backside, a process that introduces defects including grinding marks, edge fragments from grinding failures, star-shaped cracks and debris, and other imperfections. Testing advanced nodes: As semiconductor manufacturers move to 3nm and below process nodes, accurately measuring electrical characteristics becomes increasingly difficult. Smaller dimensions lead to higher leakage currents, greater variability, and more stringent process control requirements. Improving test throughput: With soaring semiconductor demand, there is a need to increase test throughput without compromising accuracy. Multi-probe, parallel testing, and automation play a crucial role in enabling semiconductor factories to efficiently test large volumes of wafers. Testing new semiconductor architectures: New semiconductor architectures, such as chiplets and 3D, present additional wafer testing challenges. Unlike traditional monolithic designs, chiplet-based architectures require testing at multiple stages. This includes wafer-level, middleware-level, and packaging-level testing, and testing in extreme environments: Because semiconductors are deployed in extreme environments ranging from deep space exploration to quantum computing, testing must be performed under specialized conditions. Cryogenic probing stations allow wafer-level testing at temperatures as low as a few milliseconds, enabling the verification of superconducting qubits and other cryogenic applications. Conversely, high-temperature probing systems support automotive and industrial semiconductor testing, where equipment must operate reliably at temperatures exceeding 150°C. Testing high-speed devices: Modern semiconductor applications require high-frequency operation, particularly in 5G, 7G, and satellite. RF solutions must provide accurate signal characterization at millimeter-wave and terahertz frequencies. AI-driven wafer testing: Artificial intelligence is changing the way we test semiconductors. AI-driven analytics can optimize test sequences, reduce test time, and identify defect patterns that traditional methods may miss. Predictive analytics enables wafer fabs to adjust process parameters in real time, thereby improving yield and efficiency. Millisecond and terahertz testing: These challenges need to be overcome through technological innovation and process improvements to ensure the quality and efficiency of wafer measurement and sorting.

[0004] In existing technologies, manual measurement and sorting of wafers makes it difficult to guarantee the consistency and accuracy of each sorting, which may lead to unstable product quality. Furthermore, direct human contact with wafers poses a risk of wafer damage or personnel injury due to improper operation.

[0005] To address this, we propose a wafer measurement and sorting device. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies by proposing a wafer measurement and sorting device.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A wafer measurement and sorting device includes a worktable, characterized in that: a wafer limiting groove is fixedly provided on the inner side of the top of the worktable, the wafer limiting grooves are evenly distributed on the inner side of the top of the worktable, a dust cover is provided on the top of one side of the worktable, a defective product collection groove is fixedly provided below the dust cover, a sorting component is provided on the top of the worktable, and an installation groove is fixedly provided on the inner side of the top of the worktable.

[0009] The device includes a servo motor fixedly mounted inside the mounting slot, with its transmission end fixedly connected to a ball screw. A ball nut is mounted on the outer side of the ball screw. A circular limiting groove is provided for placing wafers. A dust cover is provided to shield the defective product storage slot from dust. The defective product storage slot is used to store defective wafers, effectively improving the practicality of the device.

[0010] The ball nut is fixedly mounted on the top of a fixed frame, and a fixed frame is fixedly mounted on one side of the fixed frame. When the servo motor is started, it drives the ball screw to rotate, causing the ball nut and the fixed frame to move left and right, which in turn drives the mechanical claw to move left and right.

[0011] The inner end of the fixed frame 2 is fixedly provided with a positioning block, and a servo motor 2 is fixedly provided on one side of the positioning block. The transmission end of the servo motor 2 is fixedly connected to the ball screw 2. The side of the ball screw 2 away from the servo motor 2 is rotatably connected to the fixed frame 2. When the servo motor 2 is started, it drives the ball screw 2 to rotate.

[0012] The ball screw is provided with a ball nut on its outer side, and a positioning frame is fixedly provided at the bottom of the ball nut. An electric push rod is provided at the bottom of the positioning frame. When the ball screw rotates, the ball nut and the fixed frame move back and forth, which in turn drives the mechanical claw to move back and forth.

[0013] The electric push rod is equipped with a mechanical claw at its bottom, and the positioning frame is equipped with a high-definition camera at its bottom. The high-definition camera can identify wafer limiting slots. When a defective product is encountered, the electric push rod pushes the mechanical claw to grab it and then place it into the defective product storage slot for storage.

[0014] Compared with the prior art, the present invention provides a wafer measurement and sorting device, which has the following advantages:

[0015] This invention, through the installation of sorting components, activates a servo motor that drives a ball screw to rotate, causing a ball nut and a fixed frame to move left and right, which in turn moves a mechanical claw left and right. Simultaneously, a second servo motor activates, driving a ball screw to rotate, causing a ball nut and a fixed frame to move back and forth, which in turn moves a mechanical claw back and forth. A high-definition camera can identify wafers in the wafer positioning slot. When a defective wafer is encountered, an electric push rod pushes the mechanical claw to grab it and place it in a defective wafer storage slot for safekeeping, effectively improving the device's practicality.

[0016] This invention features a circular limiting groove for placing wafers and a dust cover to shield the defective product storage slot from dust. The defective product storage slot is used to store defective wafers, effectively improving the practicality of the device.

[0017] The parts of this device not covered herein are the same as or can be implemented using existing technologies. This utility model has a simple structure and is easy to operate. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of a wafer measurement and sorting device proposed in this utility model;

[0019] Figure 2 This is a schematic diagram of the overall structure of a wafer measurement and sorting device proposed in this utility model;

[0020] Figure 3 This is a schematic diagram of the two cross-sectional structures of the fixing frame of the wafer measurement and sorting device proposed in this utility model;

[0021] Figure 4 This is a partial three-dimensional structural diagram of a wafer measurement and sorting device proposed in this utility model.

[0022] In the diagram: 1. Workbench; 2. Wafer limiting groove; 3. Dust cover; 4. Defective product storage groove; 5. Mounting groove; 6. Servo motor one; 7. Ball screw one; 8. Ball nut one; 9. Fixing bracket one; 10. Fixing bracket two; 11. Positioning block; 12. Servo motor two; 13. Ball screw two; 14. Ball nut two; 15. Positioning frame; 16. Electric push rod; 17. Mechanical gripper; 18. High-definition camera. Detailed Implementation

[0023] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0024] Please see Figures 1-4 A wafer measurement and sorting device includes a worktable 1, a wafer limiting groove 2 fixedly provided on the inner side of the top of the worktable 1, the wafer limiting grooves 2 being evenly distributed on the inner side of the top of the worktable 1, a dust cover 3 being provided on the top of one side of the worktable 1, a defective product collection groove 4 being fixedly provided below the dust cover 3, a sorting component being provided on the top of the worktable 1, and an installation groove 5 being fixedly provided on the inner side of the top of the worktable 1.

[0025] A servo motor 6 is fixedly installed inside the mounting slot 5. The transmission end of the servo motor 6 is fixedly connected to a ball screw 7. A ball nut 8 is installed outside the ball screw 7. A mounting bracket 9 is fixedly installed on the top of the ball nut 8. A mounting bracket 10 is fixedly installed on one side of the mounting bracket 9. A positioning block 11 is fixedly installed at the inner end of the mounting bracket 10. A servo motor 12 is fixedly installed on one side of the positioning block 11. The transmission end of the servo motor 12 is fixedly connected to a ball screw 13. The side of the ball screw 13 away from the servo motor 12 is rotatably connected to the mounting bracket 10. A ball nut 14 is installed outside the ball screw 13. A positioning bracket 15 is fixedly installed at the bottom of the ball nut 14. An electric push rod 16 is installed at the bottom of the positioning bracket 15. A mechanical claw 17 is installed at the bottom of the electric push rod 16. A high-definition camera 18 is installed at the bottom of the positioning frame 15. When using the wafer measurement and sorting device, the wafer limiting groove 2 can be used to place the wafers, and the dust cover 3 can protect the defective product storage slot 4 from dust. The defective product storage slot 4 is used to store defective wafers. Servo motor 6 starts and drives ball screw 7 to rotate, causing ball nut 8 and fixing frame 9 to move left and right, which in turn drives mechanical claw 17 to move left and right. Servo motor 12 starts and drives ball screw 13 to rotate, causing ball nut 14 and fixing frame 10 to move back and forth, which in turn drives mechanical claw 17 to move back and forth. The high-definition camera 18 can identify wafers in the wafer limiting groove 2. When a defective product is encountered, the electric push rod 16 pushes the mechanical claw 17 to grab it and then place it into the defective product storage slot 4 for storage.

[0026] Working principle: When using the wafer measurement and sorting device, the wafer limiting groove 2 is used to place wafers, and the dust cover 3 can protect the defective product collection groove 4 from dust. The defective product collection groove 4 is used to collect defective wafers. Servo motor 6 starts and drives ball screw 7 to rotate, causing ball nut 8 and fixing frame 9 to move left and right, which in turn drives mechanical claw 17 to move left and right. Servo motor 12 starts and drives ball screw 13 to rotate, causing ball nut 14 and fixing frame 10 to move back and forth, which in turn drives mechanical claw 17 to move back and forth. The high-definition camera 18 can identify wafers in the wafer limiting groove 2. When a defective product is encountered, the electric push rod 16 pushes the mechanical claw 17 to grab it and place it into the defective product collection groove 4 for storage.

[0027] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A wafer measurement and sorting device, comprising a worktable (1), characterized in that; A wafer positioning groove (2) is fixedly provided on the inner side of the top of the workbench (1). The wafer positioning grooves (2) are evenly distributed on the inner side of the top of the workbench (1). A dust cover (3) is provided on the top of one side of the workbench (1). A defective product storage groove (4) is fixedly provided below the dust cover (3). A sorting component is provided on the top of the workbench (1). An installation groove (5) is fixedly provided on the inner side of the top of the workbench (1).

2. The wafer measurement and sorting device according to claim 1, characterized in that; A servo motor (6) is fixedly installed on the inner side of the mounting groove (5). The transmission end of the servo motor (6) is fixedly connected to the ball screw (7). A ball nut (8) is installed on the outer side of the ball screw (7).

3. The wafer measurement and sorting device according to claim 2, characterized in that; A fixing bracket 1 (9) is fixedly installed on the top of the ball nut 1 (8), and a fixing bracket 2 (10) is fixedly installed on one side of the fixing bracket 1 (9).

4. The wafer measurement and sorting device according to claim 3, characterized in that; A positioning block (11) is fixedly installed at the inner end of the second fixed frame (10). A servo motor (12) is fixedly installed on one side of the positioning block (11). The transmission end of the servo motor (12) is fixedly connected to the ball screw (13). The side of the ball screw (13) away from the servo motor (12) is rotatably connected to the second fixed frame (10).

5. A wafer measurement and sorting device according to claim 4, characterized in that; A ball nut (14) is provided on the outer side of the ball screw (13), and a positioning frame (15) is fixedly provided at the bottom of the ball nut (14). An electric push rod (16) is provided at the bottom of the positioning frame (15).

6. The wafer measurement and sorting device according to claim 5, characterized in that; The bottom of the electric push rod (16) is provided with a mechanical claw (17), and the bottom of the positioning frame (15) is provided with a high-definition camera (18).

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