Semiconductor logistics automation control device, docking equipment and semiconductor process system
By introducing communication modules, protocol modules, and radio frequency identification modules into semiconductor process equipment, the problem of the inability of semiconductor process equipment and logistics automation equipment to communicate and interact has been solved, realizing stable information exchange and safe control between equipment, and improving the efficiency and safety of automated production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN JINGWEI KAIWU INSTR CO LTD
- Filing Date
- 2026-06-05
- Publication Date
- 2026-07-21
AI Technical Summary
The lack of automated logistics capabilities in semiconductor process equipment prevents the equipment from communicating and interacting, leading to collisions and safety accidents.
The system employs a communication module, a protocol module, and a radio frequency identification (RFID) module to enable wired communication between semiconductor process equipment and logistics automation equipment via an RJ45 interface. It also executes the SEMI E84 transmission protocol and RFID to complete information exchange.
It enables stable information exchange between semiconductor process equipment and logistics automation equipment, avoids equipment collisions, and improves automation efficiency and safety.
Smart Images
Figure CN224536380U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of industrial automation control technology, and in particular to a semiconductor logistics automation control device, docking equipment, and semiconductor process system. Background Technology
[0002] In automated logistics systems, various logistics equipment, such as equipment (EQ), autonomous mobile robots (AMR), and overhead hoist transport (OHT), must be uniformly matched with standardized mechanical interfaces and common communication protocols to achieve fully automated flow and transportation. This is especially crucial in semiconductor manufacturing plants, where the quality requirements for transporting materials such as wafers and carriers are very high. Fully automated, unified, stable, and efficient flow and transportation are essential for the production efficiency of semiconductor products. Currently, the front end of the equipment (EQ) needs to be equipped with a loadport as a dedicated interactive workstation for connecting with various automated logistics equipment. Utility Model Content
[0003] The main purpose of this application is to propose a semiconductor logistics automation control device, docking equipment, and semiconductor process system, aiming to solve the technical problem of safety accidents caused by collisions due to the lack of logistics automation capabilities of semiconductor process equipment and the inability to complete communication and interaction between semiconductor process equipment and logistics automation equipment during semiconductor manufacturing.
[0004] To achieve the above objectives, this application proposes a semiconductor logistics automation control device, comprising: a communication module coupled to a logistics automation device, which communicates with the logistics automation device via an RJ45 interface; a protocol module coupled to the communication module, which executes the E84 transmission protocol; and a radio frequency identification (RFID) module coupled to the communication module, which acquires the identification information of the material carrier. The communication module listens to the status information reported by the semiconductor process equipment to the logistics automation device based on the protocol module and the RFID module, thereby completing information exchange between the semiconductor process equipment and the logistics automation device.
[0005] In one embodiment, one end of the communication module is coupled to the logistics automation equipment, and the other end of the communication module is coupled to the semiconductor process equipment. The communication module is connected in series between the logistics automation equipment and the semiconductor process equipment. Wired communication with the semiconductor process equipment is achieved through an RJ45 interface.
[0006] In one embodiment, the logistics automation equipment is coupled to the semiconductor process equipment, and the communication module is coupled to the logistics automation equipment. The communication module and the semiconductor process equipment are connected in parallel. The logistics automation equipment, the semiconductor process equipment, and the communication module all communicate with each other through the SECS protocol.
[0007] In one embodiment, the semiconductor logistics automation control device further includes: a connection module for fixing the communication module; wherein the communication module is matched with the logistics automation equipment and generates a standardized communication protocol; the standardized communication protocol is used to adapt to semiconductor process equipment.
[0008] In one embodiment, the protocol module includes an automatic mode and a manual mode; the communication module is used to switch the protocol module to automatic mode or manual mode, and to feed back the status mode information after switching to the logistics automation equipment.
[0009] In one embodiment, the semiconductor process equipment is coupled to the wafer loading port; the communication module is used to receive and confirm the wafer loading port status information output by the logistics automation equipment, and to provide feedback on the status mode information.
[0010] In one embodiment, the coupling interface between the semiconductor process equipment and the wafer loading port is a digital input / output interface.
[0011] In one embodiment, the coupling interface between the semiconductor process equipment and the wafer loading port is a serial data communication interface.
[0012] This application also proposes a docking device, which includes: a semiconductor logistics automation control device; a power supply device coupled to the semiconductor logistics automation control device; wherein the semiconductor logistics automation control device is the semiconductor logistics automation control device as described in any of the embodiments above.
[0013] This application also proposes a semiconductor process system, which includes: automated logistics equipment; docking equipment coupled to the automated logistics equipment; semiconductor process equipment coupled to the automated logistics equipment; and / or docking equipment; wherein the docking equipment is the docking equipment described in any of the above embodiments.
[0014] The semiconductor logistics automation control device provided in this application includes: a communication module coupled to the logistics automation equipment, which communicates with the equipment via an RJ45 interface; a protocol module coupled to the communication module, used to execute the E84 transmission protocol; and a radio frequency identification (RFID) module coupled to the communication module, used to acquire the identification information of the material carrier. The communication module, based on the protocol module and the RFID module, listens to the status information reported by the semiconductor process equipment to the logistics automation equipment, thus completing the information exchange between the semiconductor process equipment and the logistics automation equipment. By utilizing the protocol module for protocol communication and the RFID module for identification, and combining the communication module to complete the information exchange between the semiconductor process equipment and the logistics automation equipment, collision safety issues arising from equipment interaction are avoided. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the structure of the first embodiment of the semiconductor logistics automation control device provided in this application.
[0017] Figure 2 This is a schematic diagram of the second embodiment of the semiconductor logistics automation control device provided in this application.
[0018] Figure 3 This is a schematic diagram of the third embodiment of the semiconductor logistics automation control device provided in this application.
[0019] Figure 4 This is a schematic diagram of the fourth embodiment of the semiconductor logistics automation control device provided in this application.
[0020] Figure 5 This is a schematic diagram of the fifth embodiment of the semiconductor logistics automation control device provided in this application.
[0021] Figure 6 This is a schematic diagram of the sixth embodiment of the semiconductor logistics automation control device provided in this application.
[0022] Figure 7 This is a schematic diagram of an embodiment of the docking device provided in this application.
[0023] Figure 8This is a schematic diagram of the structure of an embodiment of the semiconductor process system provided in this application.
[0024] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0026] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.
[0027] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0028] Currently, in the semiconductor manufacturing field, equipment used in 6-inch and 8-inch semiconductor processes lacks logistics automation capabilities, mainly due to the following difficulties: 1. The EQ does not support the SEMI E84 standard, and the device cannot communicate and interface with the logistics automation equipment AMR to complete hardware interlocking, which poses a security risk.
[0029] 2. The EQ does not have an RFID module, so the device cannot automatically obtain the vehicle (SMIF POD, CST, FOUP, etc.) ID information and establish communication with the EAP system.
[0030] 3. If the EQ needs to simultaneously support both E84 and RFID modules, the equipment supplier may be unable to upgrade or the upgrade cost may be too high. Therefore, a solution is needed that does not require adding E84 and RFID interfaces to the machine.
[0031] Within a semiconductor manufacturing plant, once the Material Control System (MCS) dispatches logistics equipment to the equipment interface (EQ) docking station (i.e., after the automated logistics equipment arrives at the docking station of the semiconductor process equipment, it completes carrier positioning and locking, reads material identity and process information via RFID to verify material compliance; then, according to the protocol, completes inter-equipment communication, executes carrier loading and unloading transfer, synchronously updates material process status and storage data, and stands by or executes the next dispatching task after material handover), both parties rely on the SEMI E84 communication protocol to establish a safety interlock mechanism, exchanging the real-time operating status of the load port. If the load port or logistics equipment malfunctions, the material handling operation can be immediately terminated. Therefore, the load port must integrate both RFID reading and E84 communication functions to ensure the smooth implementation of fully automated material handling.
[0032] It should be noted that SEMI E84 is a standard communication protocol for wafer equipment and logistics interfacing, developed by the Semiconductor Equipment and Materials International (SEMI). It is used for signal handshaking, safety interlocking, and material handover between equipment and automated material handling systems (AGS). 6 & 8 inch EQ: 6-inch and 8-inch semiconductor process equipment (Equipment, EQ); MR (Autonomous Mobile Robot): unmanned automated material handling vehicle on the semiconductor workshop floor. RFID (Radio Frequency Identification): used to read the identification number of the material carrier. SMIF POD: Standard Mechanical Interface Wafer Crate; CST: Wafer Transfer and Storage Crate; FOUP: Front-opening Wafer Transport Crate; EAP (Equipment Automation Platform): the upper-level central control system for semiconductor workshop equipment, responsible for issuing process instructions, collecting data, coordinating scheduling, and interfacing with production line systems.
[0033] Therefore, this application proposes a semiconductor logistics automation control device, docking equipment, and semiconductor process system to solve the above problems.
[0034] Please see Figure 1 As shown, Figure 1This is a schematic diagram of the structure of the first embodiment of the semiconductor logistics automation control device provided in this application; the semiconductor logistics automation control device 100 includes: a communication module 10, which is coupled to the logistics automation equipment 210 and communicates with the logistics automation equipment 210 via an RJ45 interface; a protocol module 20, which is coupled to the communication module 10 and is used to execute the E84 transmission protocol; and a radio frequency identification (RFID) module 30, which is coupled to the communication module 10 and is used to obtain the identification information of the material carrier; wherein, the communication module 10 listens to the status information of the logistics automation equipment 210 reported by the semiconductor process equipment (not shown) based on the protocol module 20 and the RFID module 30, and completes the information interaction between the semiconductor process equipment and the logistics automation equipment 210.
[0035] Understandably, the protocol module 20 complies with the SEMI E84 standard transmission protocol. The RFID module 30 is used for non-contact, highly reliable automatic identification of the unique ID and batch information of wafer carriers (FOUP / SMIF) and high-value materials. It is compatible with the SEMI standard and SECS protocol and can operate stably in clean, metal-interference, and high-temperature environments. By reading data such as batch, size, process stage, and yield from the tags in real time, it integrates with MES, EAP, and AMHS systems to achieve automatic carrier registration, precise process matching, automatic program invocation, intelligent path scheduling, and error prevention verification. Simultaneously, it supports full lifecycle traceability, closed-loop data recording, and yield analysis, reducing manual intervention and contact contamination, improving automation efficiency, data accuracy, and traceability capabilities, and ensuring controllable precision manufacturing processes and stable product yield.
[0036] In one embodiment, the logistics automation equipment 210 refers to EAP (Equipment Automation Program) or CIM (Computer Integrated Manufacturing), the semiconductor process equipment refers to EQ (Equipment), the protocol module 20 refers to an E84 communication module, and the radio frequency identification module 30 refers to an RFID communication module. It should be noted that CIM is used to coordinate all equipment, materials, production, scheduling, and process data in the factory, uniformly issue production instructions, collect processing data, manage the overall production process in the workshop, and coordinate the collaborative operation of EAP, MES, and the logistics scheduling system. EAP is used to interface with the production system and machine equipment, issue process instructions, collect equipment operation data, and manage the automatic operation of equipment. EQ refers to the machine body that directly completes the actual processing steps such as wafer etching, deposition, and inspection.
[0037] The technical solution of this application utilizes the protocol module 20 to realize protocol communication and the radio frequency identification module 30 to realize material identification, and combines the communication module 10 to complete the information interaction between the semiconductor process equipment and the logistics automation equipment 210.
[0038] Specifically, in one embodiment, such as Figure 2 and Figure 3 As shown, Figure 2 This is a schematic diagram of the structure of the second embodiment of the semiconductor logistics automation control device provided in this application; Figure 3 This is a schematic diagram of the third embodiment of the semiconductor logistics automation control device provided in this application; one end of the communication module 10 is coupled to the logistics automation equipment 210, and the other end of the communication module 10 is coupled to the semiconductor process equipment. The communication module 10 is connected in series between the logistics automation equipment 210 and the semiconductor process equipment, and communicates with the semiconductor process equipment 220 via an RJ45 interface.
[0039] Understandably, a communication module 10 is connected in series between the semiconductor process equipment and the logistics automation equipment 210 via an RJ45 port. The communication module 10 includes a protocol module 20 and a radio frequency identification module 30. The communication module 10 listens for the status information reported by the semiconductor process equipment to the logistics automation equipment 210, enabling information exchange between the logistics automation equipment 210 and the semiconductor process equipment.
[0040] It should be noted that the RJ45 port, or standard Ethernet port, is used for wired network connection to enable network communication and data exchange between devices and systems.
[0041] By connecting a communication module 10 in series between the semiconductor process equipment and the logistics automation equipment 210, the semiconductor process equipment can simultaneously meet the requirements of the machine for SEMI E84 standard transmission protocol and material status identification of the radio frequency identification module 30, thereby reducing costs; and enabling the semiconductor process equipment to interface with the logistics automation equipment 210; the solution is universal and eliminates dependence on suppliers.
[0042] In one embodiment, such as Figure 4 and Figure 5 As shown, Figure 4 This is a schematic diagram of the structure of the fourth embodiment of the semiconductor logistics automation control device provided in this application; Figure 5 This is a schematic diagram of the fifth embodiment of the semiconductor logistics automation control device provided in this application; the logistics automation equipment 210 is coupled to the semiconductor process equipment, and the communication module 10 is coupled to the logistics automation equipment 210, and the communication module 10 and the semiconductor process equipment are arranged in parallel; wherein, the logistics automation equipment 210, the semiconductor process equipment 220 and the communication module 10 all communicate with each other through the SECS protocol.
[0043] Understandably, in the serial connection mode of the above scheme, a malfunction or interruption of the communication module 10 could cause connection problems between the semiconductor process equipment and the logistics automation equipment 210, requiring high stability from the communication module 10. Therefore, a parallel connection scheme is proposed. The communication module 10 and the machine are connected to the logistics automation equipment 210 via SECS.
[0044] It should be noted that SECE (Semiconductor Equipment Communication Interface) is a lightweight communication interface / protocol used in the semiconductor manufacturing field for data interaction between equipment (EQ) and upper-level systems (EAP / MES). It is often used as a simplified or alternative solution to SECS / GEM (E30 / E5 / E37), and is especially suitable for the retrofitting of 6 / 8-inch legacy equipment. It can transmit data via TCP / IP over an RJ45 network port to achieve basic communication such as equipment status reporting, carrier ID reading, and recipe distribution. It can connect to EAP without native support for SEMI E84, reducing the cost and difficulty of automating the upgrade of legacy equipment.
[0045] In this way, lossless information exchange between semiconductor process equipment and logistics automation equipment 210 can be achieved, avoiding packet loss and ensuring the stability of system operation.
[0046] In one embodiment, the semiconductor logistics automation control device 100 further includes a connection module (not shown), which is used to fix the communication module 10 in place; wherein the communication module 10 is matched with the logistics automation equipment 210 and generates a standardized communication protocol; the standardized communication protocol is used to adapt to semiconductor process equipment.
[0047] Understandably, the communication module 10's hardware is independent of the semiconductor process equipment. Its compatibility with the logistics automation equipment 210 allows for the development of customized standard communication protocols, adapting to different types of semiconductor process equipment and meeting the upgrade needs of various equipment types. Specifically, the communication module 10 is fixed in a preset position via a connection module to establish communication connections with the logistics automation equipment 210 and / or the semiconductor process equipment. This avoids data security issues caused by the haphazard placement of communication modules and data cables when wired connections are used.
[0048] Through the above methods, the semiconductor process equipment is equipped with the ability to interface with the logistics automation equipment 210, making the solution universal and eliminating dependence on suppliers. The communication module 10 is independent of the semiconductor process equipment. By combining the communication module 10 with the protocol module 20 and the radio frequency identification module 30, information exchange between the logistics automation equipment 210 and the semiconductor process equipment is realized.
[0049] In one embodiment, the protocol module 20 includes an automatic mode and a manual mode; the communication module 10 is used to switch the protocol module 20 to automatic mode or manual mode, and to feed back the switched status mode information to the logistics automation equipment 210.
[0050] The execution process of an embodiment based on the interaction between a communication module 10 and semiconductor process equipment is illustrated below: Step 1: Initialization The logistics automation equipment 210 needs to access the communication module 10 to establish a connection. First, the logistics automation equipment 210 confirms the current status of the communication module 10. After receiving the confirmation command, the communication module 10 replies with its current status, reads the ID and the SENSER status, and reports it to the logistics automation equipment 210. One communication module 10 corresponds to only one semiconductor process equipment. In some other embodiments, one logistics automation equipment 210 corresponds to multiple semiconductor process equipment; for example, one logistics automation equipment 210 corresponds to one thousand semiconductor process equipment.
[0051] Step 2: Change the mode of this protocol module 20 through the logistics automation equipment 210. The logistics automation equipment 210 sends two modes to the communication module 10. For example, 0 represents manual and 1 represents automatic. 1 means that it can interface with the logistics automation equipment 210. 0 represents completely manual feeding. The logistics automation equipment 210 changes its control status based on the actual situation.
[0052] Step 3: Reporting Errors The communication module 10 will actively collect error events and report them to the logistics automation equipment 210.
[0053] Step 4: The communication module 10 and the logistics automation equipment 210 establish an interlock setting for changes in state. The communication module 10 actively changes a mode state of the protocol module 20 and actively reports it to the logistics automation equipment 210; for example, CEID=99 means that the protocol module 20 has switched to auto mode and feeds back to the logistics automation equipment 210. After receiving the reply, the logistics automation equipment 210 confirms that the semiconductor process equipment can be loaded.
[0054] In one embodiment, a control flow corresponding to the above scheme is provided, as follows: The control process is based on the SEMI E84 standard and customized with practical experience in semiconductor logistics automation. Its core control logic is as follows: First, the automated logistics equipment 210 (EAP) sends the current operating status value of the wafer loading port 230 to the protocol module 20. After receiving this status value, the protocol module 20, according to the SEMI E84 standard and preset control logic, determines whether to send subsequent control signals to the autonomous mobile robot (AMR), completing the step-by-step transmission and verification of signals. In a specific loading operation scenario, after the autonomous mobile robot places the wafer carrier into the wafer loading port 230 according to instructions, it sends a signal to the protocol module 20 indicating that the carrier placement is complete. At this time, the protocol module 20 actively initiates a query request to the automated logistics equipment 210 to confirm whether the actual status of the wafer loading port 230 is consistent with the placement completion status reported by the autonomous mobile robot. After receiving a query request, the automated logistics equipment 210 feeds back the actual status of the wafer loading port 230 to the protocol module 20. Based on this feedback signal, the protocol module 20 returns a corresponding response signal to the autonomous mobile robot according to customized control logic, completing the closed-loop control of the entire loading process. This control process is a customized control scheme adapted to specific application scenarios, integrating the SEMI E84 standard with actual logistics handling experience.
[0055] In one embodiment, such as Figure 6 As shown, Figure 6 This is a schematic diagram of the fourth embodiment of the semiconductor logistics automation control device provided in this application; the semiconductor process equipment is coupled to the wafer loading port 230; the communication module 10 is used to receive and confirm the status information of the wafer loading port 230 output by the logistics automation equipment 210, and to provide feedback status mode information.
[0056] In one embodiment, wafer loading port 230 refers to Load Port. It should be noted that Load Port is a dedicated material docking station at the front end of semiconductor manufacturing equipment. It achieves data transmission through an RJ45 network interface, can be equipped with a radio frequency identification (RFID) module to read the identity information of the wafer carrier, and supports the SEMI E84 standard communication protocol. It can complete signal handshake and safety interlock with automated logistics equipment such as overhead rail transport vehicles (OHT) and autonomous mobile robots (AMR), automatically complete the positioning, opening and closing of the wafer carrier and material transfer operations. It is a core basic component for docking with the automated handling system in the factory and realizing unmanned loading and unloading.
[0057] In one embodiment, the coupling interface between the semiconductor process equipment and the wafer loading port 230 is a digital input / output interface. It is understood that, in one embodiment, the digital input / output interface specifically refers to an I / O interface. It should be noted that an input / output interface is a general-purpose interface for sending and receiving digital and status signals between devices. It is used to transmit discrete signals such as start / stop, status, fault, and interlock, enabling hardware-level status interaction and action linkage.
[0058] In one embodiment, the coupling interface between the semiconductor process equipment and the wafer loading port 230 is a serial data communication interface. It is understood that the serial data communication interface in this embodiment specifically refers to RS232. It should be noted that the RS232 serial communication interface standard uses asynchronous serial transmission, relying on level signals for serial data transmission and reception. It is commonly used for point-to-point data exchange between older industrial control equipment and instruments, and can transmit equipment parameters and message information. It was widely used in the early days for low-speed communication between semiconductor devices.
[0059] By setting different interfaces through the above two embodiments, the device can recognize the applications of different interfaces.
[0060] This application also proposes a docking device 200, such as... Figure 7 As shown, Figure 7 This is a schematic diagram of an embodiment of the docking device provided in this application; the docking device 200 includes a semiconductor logistics automation control device 100; a power supply device 240, the power supply device 240 being coupled to the semiconductor logistics automation control device 100; wherein, the specific structure of the semiconductor logistics automation control device 100 is as described in the above embodiment. Since this docking device 200 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.
[0061] This application also proposes a semiconductor process system 300, such as... Figure 8 As shown, Figure 8 This is a schematic diagram of a semiconductor process system according to an embodiment of the present application. The semiconductor process system 300 includes a logistics automation device 210; a docking device 200 coupled to the logistics automation device 210; a semiconductor process device coupled to the logistics automation device 210; and / or the docking device 200. The specific structure of the docking device 200 is as described in the above embodiments. Since the semiconductor process system 300 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.
[0062] The semiconductor logistics automation control device 100 provided in this application includes: a communication module 10, which is coupled to the logistics automation equipment 210; a protocol module 20, which is coupled to the communication module 10; and a radio frequency identification (RFID) module 30, which is coupled to the communication module 10. The RFID module 30 is used for material status identification. The communication module 10 is used to monitor the status information of the logistics automation equipment 210 reported by the semiconductor process equipment.
[0063] In the above manner, protocol module 20 is used to realize protocol communication and radio frequency identification module 30 to realize material identification, and communication module 10 is used to complete the information interaction between semiconductor process equipment and logistics automation equipment 210.
[0064] The above description is merely an exemplary embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the technical concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.
Claims
1. A semiconductor logistics automated control device, characterized in that, The control device includes: A communication module is coupled to the logistics automation equipment and communicates with the logistics automation equipment via an RJ45 interface. A protocol module, coupled to the communication module, is used to execute the E84 transmission protocol; An RFID module is coupled to the communication module; the RFID module is used to acquire material carrier identification information. The communication module listens to the status information of the logistics automation equipment reported by the semiconductor process equipment based on the protocol module and the radio frequency identification module, and completes the information interaction between the semiconductor process equipment and the logistics automation equipment.
2. The semiconductor logistics automated control device as described in claim 1, characterized in that, One end of the communication module is coupled to the logistics automation equipment, and the other end of the communication module is coupled to the semiconductor process equipment. The communication module is connected in series between the logistics automation equipment and the semiconductor process equipment; wherein, wired communication with the semiconductor process equipment is performed through an RJ45 interface.
3. The semiconductor logistics automated control device as described in claim 1, characterized in that, The automated logistics equipment is coupled to the semiconductor process equipment, and the communication module is coupled to the automated logistics equipment. The communication module and the semiconductor process equipment are connected in parallel. The automated logistics equipment, the semiconductor process equipment, and the communication module all communicate with each other via the SECS protocol.
4. The semiconductor logistics automated control device as described in claim 1, characterized in that, The semiconductor logistics automation control device also includes: A connection module is provided for fixing the communication module in place; wherein the communication module is matched with the logistics automation equipment and generates a standardized communication protocol; the standardized communication protocol is used to adapt to semiconductor process equipment.
5. The semiconductor logistics automated control device as described in claim 1, characterized in that, The protocol module includes an automatic mode and a manual mode; the communication module is used to switch the protocol module to automatic mode or manual mode, and to feed back the status mode information after switching to the logistics automation equipment.
6. The semiconductor logistics automated control device as described in claim 5, characterized in that, The semiconductor process equipment is coupled to the wafer loading port; the communication module is used to receive and confirm the wafer loading port status information output by the logistics automation equipment, and to feed back the status mode information.
7. The semiconductor logistics automated control device as described in claim 6, characterized in that, The coupling interface between the semiconductor process equipment and the wafer loading port is a digital input / output interface.
8. The semiconductor logistics automated control device as described in claim 6, characterized in that, The coupling interface between the semiconductor process equipment and the wafer loading port is a serial data communication interface.
9. A docking device, characterized in that, The docking equipment includes: Semiconductor logistics automation control devices; A power supply device coupled to the semiconductor logistics automation control device; The semiconductor logistics automation control device is the semiconductor logistics automation control device as described in any one of claims 1-8.
10. A semiconductor process system, characterized in that, The semiconductor process system includes: Logistics automation equipment; A docking device, wherein the docking device is coupled to the logistics automation equipment; Semiconductor process equipment, said semiconductor process equipment being coupled to said logistics automation equipment, and / or said docking equipment; The docking device is the docking device as described in claim 9.