Cold plate device with three-dimensional uniform heating structure

Abstract

The utility model discloses a cold plate device with three -dimensional heat soaking structure is provided with three -dimensional heat soaking structure in base, the harmonica pipe is in flat strip shape setting, the inside of harmonica pipe is hollow and forms phase change heat exchange chamber, and the bottom of harmonica pipe is open and forms phase change entrance, and phase change entrance communicates phase change heat exchange chamber, and each harmonica pipe is respectively inserted in corresponding positioning slot, and the sealing connection of harmonica pipe and positioning slot is through welding, and its phase change entrance communicates with the perforation to form the heat phase change flow path of vertical direction, and each harmonica pipe is placed in the cold liquid chamber, and forms heat transfer cooperation with cooling liquid, and the heat exchange efficiency is promoted through three -dimensional VC structure, breaks through the heat dissipation performance bottleneck, effectively solved the low problem of traditional cold plate heat conduction efficiency, satisfies the heat dissipation demand of high algorithm power, high power consumption chip.

Description

Technical Field

[0001] This utility model relates to the field of cold plate heat sink technology, and in particular to a cold plate device with a three-dimensional heat dissipation structure. Background Technology

[0002] With the rapid application of cloud computing and artificial intelligence, the computing power and power consumption of chips have increased significantly, posing a severe challenge to heat dissipation.

[0003] A cold plate is a highly efficient heat dissipation device that primarily absorbs and transfers heat through liquid circulation. It is widely used in electronic equipment, communications, and new energy vehicles. The heat generated by the equipment is absorbed and conducted through the base plate of the cold plate, then transferred to the coolant in the internal channels. The coolant circulates under the drive of a pump, absorbing heat and then transferring it to the external heat sink. However, the thermal conductivity of traditional copper cold plates is only about 380 W / (m·K), which is insufficient to meet the heat dissipation needs of chips with ever-increasing computing power and power consumption.

[0004] Traditional cold plate devices suffer from low thermal conductivity between the heat source and the base plate, and between the base plate and the coolant, which urgently needs to be overcome and improved. Utility Model Content

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide a cold plate device with a three-dimensional heat dissipation structure, thereby improving the heat exchange efficiency between the heat source and the circulating coolant and breaking through the performance bottleneck of cold plate radiators.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a cold plate device with a three-dimensional heat dissipation structure, comprising a base and a top cover, with a cold liquid chamber formed between the base and the top cover. One side of the top cover has a cold liquid inlet, and the other side has a cold liquid outlet. The cold liquid chamber is filled with coolant. The base has a three-dimensional heat dissipation structure, which includes a VC chamber, a support plate, a VC cover plate, and multiple harmonica tubes. The VC chamber is located on the upper surface of the base, and its edge is formed with positioning steps. The projected shape of the support plate matches the projected shape of the VC chamber. The support plate is embedded in the VC chamber and connected to the bottom surface of the VC chamber. The interior of the VC chamber is filled with a working medium liquid. The VC cover plate is snapped into a fixed... The VC cover plate and the positioning step are connected by welding and sealing. The bottom surface of the VC cover plate is connected to the top surface of the support plate. The upper surface of the VC cover plate is formed with multiple positioning grooves, which are distributed at intervals along a straight line. The bottom of the positioning groove is provided with a through hole, which is arranged vertically. The harmonica tube is arranged in a flat and long strip shape. The inside of the harmonica tube is hollowed out to form a phase change heat exchange chamber. The bottom of the harmonica tube is open to form a phase change inlet, which is connected to the phase change heat exchange chamber. Each harmonica tube is inserted into the corresponding positioning groove, and the harmonica tube and the positioning groove are connected by welding and sealing. Its phase change inlet is connected to the through hole to form a vertical heat phase change flow channel. Each harmonica tube is placed in the cold liquid chamber and forms a heat transfer cooperation with the coolant.

[0007] In a further technical solution, the support plate is configured with a folded structure, including multiple integrally formed upper support units and lower support units. The upper support units are located above the lower support units. Along the length of the support plate, the upper support units and the lower support units are alternately connected. Multiple side holes are punched at the connection points. Each upper support unit is welded to the bottom surface of the VC cover plate; each lower support unit is welded to the bottom surface of the VC chamber to form a support structure to prevent bulging.

[0008] In a further technical solution, the thickness of the harmonica tube is 1.4mm-25mm, and the width of its internal phase change heat exchange chamber is no more than 0.8mm.

[0009] In a further technical solution, the inner wall of the phase change heat exchange chamber is formed with a grooved surface structure.

[0010] In a further technical solution, a cold liquid baffle is provided on the upper part of the cold liquid chamber. The bottom edge of the cold liquid baffle is formed with an eave. The cold liquid baffle covers the top of each harmonica tube through its eave. A gap is formed between the cold liquid baffle and the top surface of the cold liquid chamber. The gap size is 2mm-8mm to ensure the flow rate of the coolant and at the same time improve the heat exchange efficiency between the coolant and the harmonica tube.

[0011] In a further technical solution, a fin-shaped separator is provided between two adjacent harmonica tubes. The fin-shaped separator includes two parallel side plates, and multiple fins are connected between the two side plates. Each fin is spaced apart in the vertical direction, and the outer side of the side plate is welded to the side of the corresponding harmonica tube.

[0012] In a further technical solution, a water nozzle is provided at both the cold liquid inlet and the cold liquid outlet, and the water nozzle is connected to the cold liquid inlet and the cold liquid outlet by laser welding.

[0013] In a further technical solution, the side of the top cover is formed with a recessed relief portion, and the bottom of the relief portion is provided with a connection port and a positioning hole; the side of the base is provided with through holes that match each connection port and positioning hole; the top cover and the base are sealed together by laser welding.

[0014] The advantages of this invention compared to the prior art after adopting the above structure are:

[0015] 1. By setting a three-dimensional heat dissipation structure on the base, and using the combination of VC cover plate, support plate and harmonica tube, a vertical heat phase change flow channel is formed. Compared with the traditional copper cold plate, it greatly improves the heat exchange efficiency between the heat source and the circulating coolant. It directly contacts the heat source and can evenly transfer the heat of the chip, avoiding the occurrence of local hot spots. It effectively breaks through the performance bottleneck of cold plate heat sink and meets the heat dissipation needs of chips with increasing computing power and power consumption.

[0016] 2. The VC chamber is equipped with an integrally molded, foldable support plate, which is welded to both the VC cover plate and the bottom surface of the VC chamber, forming an anti-bulging support structure. This design ensures heat transfer efficiency while enhancing the overall stability of the three-dimensional heat dissipation structure, effectively preventing structural deformation caused by pressure changes during heat exchange, and extending the service life of the cold plate device.

[0017] 3. The cold liquid baffle installed at the top of the cold liquid chamber forms a gap of 2mm-8mm with the top surface of the cold liquid chamber. This can not only ensure the flow rate of the coolant, but also optimize the flow path of the coolant in the cold liquid chamber, enhance the heat exchange efficiency between the coolant and the harmonica tube, and ensure that the heat can be carried away by the coolant in a timely and sufficient manner.

[0018] 4. The finned isolation components installed between adjacent harmonica tubes can effectively increase the heat dissipation area and further improve the heat dissipation performance of the cold plate device. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic diagram of the structure of this utility model.

[0021] Figure 2 This is a cross-sectional view of the present invention in the Y direction.

[0022] Figure 3 This is a cross-sectional view of the present invention along the X direction.

[0023] Figure 4 This is an exploded view of the present invention. Detailed Implementation

[0024] The following are merely preferred embodiments of the present invention and do not limit the scope of protection of the present invention.

[0025] like Figures 1 to 4 As shown, a cold plate device with a three-dimensional heat dissipation structure is disclosed. This cold plate device with a three-dimensional heat dissipation structure can be made of aluminum or pure copper, without limitation. It should be noted that the aluminum material selected in this embodiment improves the thermal conductivity through the three-dimensional heat dissipation structure, overcoming the bottleneck of heat dissipation performance caused by insufficient thermal conductivity of the material. When the same heat dissipation performance is required, using aluminum material can save material costs and achieve the heat dissipation performance of traditional pure copper cold plates.

[0026] Specifically, this cold plate device with a three-dimensional heat dissipation structure includes a base 6 and a top cover 1. A cold liquid chamber 10 is formed between the base 6 and the top cover 1. The top cover 1 has a cold liquid inlet on one side and a cold liquid outlet on the other side. The cold liquid chamber 10 is filled with coolant. The base 6 has a three-dimensional heat dissipation structure, which includes a VC chamber 60, a support plate 5, a VC cover plate 4, and multiple harmonica tubes 31. The VC chamber 60 is located on the upper surface of the base 6, and the edge of the VC chamber 60 is formed with a positioning step 61. The projected shape of the support plate 5 matches the projected shape of the VC chamber 60. The support plate 5 is embedded in the VC chamber 60 and connected to the bottom surface of the VC chamber 60. The interior of the VC chamber 60 is filled with a working medium liquid, which includes R134A refrigerant or R1233ZD refrigerant. The VC cover plate 4 is embedded in the positioning step. 61, and the VC cover plate 4 and the positioning step 61 are connected by welding seal. The bottom surface of the VC cover plate 4 is connected to the top surface of the support plate 5. The upper surface of the VC cover plate 4 is formed with multiple positioning grooves 41. Each positioning groove 41 is distributed at intervals along a straight line. The bottom of the positioning groove 41 is provided with a through hole, which is arranged vertically. The harmonica tube 31 is arranged in a flat and long strip shape. The inside of the harmonica tube 31 is hollowed out to form a phase change heat chamber 310. The bottom of the harmonica tube 31 is open to form a phase change inlet 40. The phase change inlet 40 is connected to the phase change heat chamber 310. Each harmonica tube 31 is inserted into the corresponding positioning groove 41, and the harmonica tube 31 and the positioning groove 41 are connected by welding seal. Its phase change inlet 40 is connected to the through hole to form a vertical heat phase change flow channel. Each harmonica tube 31 is placed in the cold liquid chamber 10 and forms a heat transfer cooperation with the coolant.

[0027] By setting a three-dimensional heat dissipation structure in the base 6, and using the combination of VC cover plate 4, support plate 5 and harmonica tube 31, a vertical heat phase change flow channel is formed. Compared with the traditional copper cold plate, it greatly improves the heat exchange efficiency between the heat source and the circulating coolant. It directly contacts the heat source and can evenly transfer the heat of the chip, avoiding local hot spots. It effectively breaks through the performance bottleneck of the cold plate heat sink and meets the chip heat dissipation needs of increasing computing power and power consumption.

[0028] Specifically, the support plate 5 is configured with a folded structure, including multiple integrally formed upper support units and lower support units. The upper support units are located above the lower support units. Along the length of the support plate 5, the upper support units and the lower support units are alternately connected. Multiple side holes are punched at the connection points. Each upper support unit is welded to the bottom surface of the VC cover plate 4. Each lower support unit is welded to the bottom surface of the VC chamber 60 to form a support structure to prevent bulging.

[0029] The VC chamber 60 is equipped with an integrally formed, foldable support plate 5, which is welded to the VC cover plate 4 and the bottom surface of the VC chamber 60 to form an anti-bulging support structure. This design enhances the overall stability of the three-dimensional heat dissipation structure while ensuring heat transfer efficiency, effectively preventing structural deformation caused by pressure changes during heat exchange and extending the service life of the cold plate device.

[0030] Specifically, the thickness of the harmonica tube 31 is 2 mm, and the width of its internal phase change heat chamber 310 is 0.7 mm. Limiting the width of the phase change heat chamber 310 can improve the phase change efficiency of deionized water, form a faster vertical phase change efficiency, and improve the heat exchange rate.

[0031] Specifically, the inner wall of the phase change heat exchange chamber 310 is formed with a grooved surface structure.

[0032] Specifically, a cold liquid baffle 2 is provided on the upper part of the cold liquid chamber 10. The bottom edge of the cold liquid baffle 2 is formed with an eave. The cold liquid baffle 2 covers the top of each harmonica tube 31 through its eave. A gap of 4mm is formed between the cold liquid baffle 2 and the top surface of the cold liquid chamber 10 to ensure the flow of coolant and improve the heat exchange efficiency between the coolant and the harmonica tube 31.

[0033] The coolant baffle installed at the top of the coolant chamber forms a gap of 2mm-8mm with the top surface of the coolant chamber. This not only ensures the flow rate of the coolant but also optimizes the flow path of the coolant within the coolant chamber, enhancing the heat exchange efficiency between the coolant and the harmonica tube, and ensuring that heat can be carried away by the coolant in a timely and sufficient manner.

[0034] Specifically, a fin-shaped separator 32 is provided between two adjacent harmonica tubes 31. The fin-shaped separator 32 includes two parallel side plates, and multiple fins are connected between the two side plates. Each fin is spaced apart in the vertical direction, and the outer side of the side plate is welded to the side of the corresponding harmonica tube 31.

[0035] The finned isolators 32 installed between adjacent harmonica tubes 31 can effectively increase the heat dissipation area and further improve the heat dissipation performance of the cold plate device.

[0036] Specifically, a water nozzle 11 is provided at the cold liquid inlet and the cold liquid outlet respectively, and the water nozzle 11 is connected to the cold liquid inlet and the cold liquid outlet by laser welding.

[0037] Specifically, the side of the upper cover 1 is formed with a recessed relief portion 12, and the bottom of the relief portion 12 is provided with a connection port 13 and a positioning hole 14; the side of the base 6 is provided with through holes that match each connection port 13 and positioning hole 14; the upper cover 1 and the base 6 are sealed together by laser welding.

[0038] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A cold plate device with a three-dimensional heat dissipation structure, comprising a base (6) and a top cover (1), wherein a cold liquid chamber (10) is formed between the base (6) and the top cover (1), a cold liquid inlet is provided on one side of the top cover (1) and a cold liquid outlet is provided on the other side, and the cold liquid chamber (10) is filled with coolant, characterized in that: The base (6) is provided with a three-dimensional heat dissipation structure, which includes a VC chamber (60), a support plate (5), a VC cover plate (4), and multiple harmonica tubes (31). The VC chamber (60) is located on the upper surface of the base (6), and the edge of the VC chamber (60) is formed with a positioning step (61). The interior of the VC chamber (60) is filled with working medium liquid. The projection shape of the support plate (5) matches the projection shape of the VC chamber (60). The support plate (5) is embedded in the VC chamber (60) and connected to the bottom surface of the VC chamber (60). The VC cover plate (4) is embedded in the positioning step (61), and the VC cover plate (4) and the positioning step (61) are connected by welding and sealing. The bottom surface of the VC cover plate (4) is connected to the top surface of the support plate (5). The upper surface of the VC cover plate (4) is formed with multiple positioning grooves (41). Each positioning groove (41) is distributed at intervals along a straight line. The bottom of the positioning groove (41) is provided with a through hole, which is arranged vertically. The harmonica tube (31) is arranged in a flat and long strip shape. The inside of the harmonica tube (31) is hollowed out to form a phase change heat chamber (310). The bottom of the harmonica tube (31) is open to form a phase change inlet (40). The phase change inlet (40) is connected to the phase change heat chamber (310). Each harmonica tube (31) is inserted into the corresponding positioning groove (41). The harmonica tube (31) and the positioning groove (41) are connected by welding and sealing. Its phase change inlet (40) is connected to the perforation to form a vertical heat phase change flow channel. Each harmonica tube (31) is placed in the cold liquid chamber (10) and forms a heat transfer cooperation with the coolant.

2. The cold plate device with a three-dimensional heat dissipation structure according to claim 1, characterized in that: The support plate (5) is configured with a folded structure, including multiple integrally formed upper support units and lower support units. The upper support units are located above the lower support units. Along the length of the support plate (5), the upper support units and the lower support units are alternately connected, and multiple side holes are punched at the connection points. Each upper support unit is welded to the bottom surface of the VC cover plate (4); each lower support unit is welded to the bottom surface of the VC chamber (60) to form a support structure to prevent bulging.

3. The cold plate device with a three-dimensional heat dissipation structure according to claim 2, characterized in that: The thickness of the harmonica tube (31) is 1.4mm-25mm, and the width of the phase change heat exchange chamber (310) inside it is no more than 0.8mm.

4. The cold plate device with a three-dimensional heat dissipation structure according to claim 3, characterized in that: The inner wall of the phase change heat chamber (310) is formed with a grooved surface structure.

5. The cold plate device with a three-dimensional heat dissipation structure according to claim 1, characterized in that: A cold liquid baffle (2) is also provided on the upper part of the cold liquid chamber (10). The bottom edge of the cold liquid baffle (2) is formed with an eave. The cold liquid baffle (2) covers the top of each harmonica tube (31) through its eave. A gap is formed between the cold liquid baffle (2) and the top surface of the cold liquid chamber (10). The gap size is 2mm-8mm to ensure the flow rate of the coolant and at the same time improve the heat exchange efficiency between the coolant and the harmonica tube (31).

6. The cold plate device with a three-dimensional heat dissipation structure according to claim 1, characterized in that: A fin-shaped isolator (32) is provided between two adjacent harmonica tubes (31). The fin-shaped isolator (32) includes two parallel side plates, and multiple fins are connected between the two side plates. Each fin is spaced apart in the vertical direction, and the outer side of the side plate is welded to the side of the corresponding harmonica tube (31).

7. The cold plate device with a three-dimensional heat dissipation structure according to claim 1, characterized in that: The cold liquid inlet and the cold liquid outlet are each provided with a water nozzle (11), and the water nozzle (11) is connected to the cold liquid inlet and the cold liquid outlet by laser welding.

8. The cold plate device with a three-dimensional heat dissipation structure according to claim 1, characterized in that: The upper cover (1) has a recessed clearance portion (12) formed on its side, and the bottom of the clearance portion (12) is provided with a connection port (13) and a positioning hole (14); the base (6) has through holes on its side that match each connection port (13) and positioning hole (14); the upper cover (1) and the base (6) are sealed together by laser welding.

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