Intelligent temperature control computing power storage case

By using an intelligent temperature control system to monitor the temperature and manage the airflow of the computing and storage chassis in real time, the problems of cooling blind spots and overcooling are solved, achieving efficient heat dissipation and low energy consumption, and improving hardware stability and maintenance convenience.

CN224536697UActive Publication Date: 2026-07-21ZHEJIANG WULUO SMART CITY TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHEJIANG WULUO SMART CITY TECHNOLOGY CO LTD
Filing Date
2025-10-22
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing computing storage chassis cannot distribute airflow according to real-time, dynamic changes in the internal thermal field, resulting in cooling blind spots and over-cooling, leading to low heat dissipation efficiency and high energy consumption.

Method used

It adopts an intelligent temperature control system, which monitors the hardware temperature in real time and independently controls multiple airflow adjustment units to achieve precise air delivery to different heat load areas. It also utilizes air pumps, flow control components, and air filter components for dynamic airflow management.

Benefits of technology

It significantly improves heat dissipation efficiency, reduces energy consumption, ensures stable operation and lifespan of hardware, and simplifies maintenance procedures.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model discloses intelligent temperature control's computing power storage machine case, including the cabinet, the cabinet inner chamber is installed with a plurality of pull -out board, and the cabinet rear end face is installed with the heat dissipation net of inlaying, still including the pipe network of installation in the pull -out board lower end surface, and the pipe network lower end surface equidistance is installed with a plurality of air hole, install the air pump in the lower end of the cabinet inner chamber, and the air pump output installs the air pipe, and the air pump input installs the air inlet pipe, in the utility model, through real -time monitoring hardware temperature, and independent control multiple airflow regulation unit, can be needed, accurate air supply to the different heat load area in the cabinet, completely solved the traditional heat dissipation mode energy consumption high, low efficiency, the pain point of uneven cooling, not only improved the heat dissipation efficiency significantly, effectively guaranteed the stable operation and service life of high -performance computing hardware, also because avoided the overall forced heat dissipation and reduced the energy consumption greatly, and the modular design and quick -release filter screen structure also greatly simplified the daily cleaning and maintenance process.
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Description

Technical Field

[0001] This utility model relates to the field of computing power storage equipment technology, and in particular to a computing power storage chassis with intelligent temperature control. Background Technology

[0002] In the field of computing power and storage equipment technology, with the continuous increase in the computing density of data centers, the heat generated by servers and storage units is becoming increasingly concentrated. Their heat dissipation efficiency is directly related to the stability, reliability and lifespan of hardware operation. Efficient and precise thermal management has become one of the key technical bottlenecks to ensure the continuous output of core computing power performance. Traditional heat dissipation solutions often fall short when facing high-density and uneven heat loads, making it difficult to achieve fine temperature control.

[0003] Traditional computing storage chassis generally use fixed air ducts or overall forced air cooling for heat dissipation. However, their air volume and airflow distribution cannot be adjusted according to the real-time and dynamic changes in the thermal field inside the chassis, resulting in both cooling blind spots and over-cooling. This not only leads to low heat dissipation efficiency but also results in huge fan energy consumption and noise. Therefore, we propose a computing storage chassis with intelligent temperature control to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to solve the problems of existing computing power storage chassis, which cannot adjust airflow distribution according to real-time and dynamic changes in the internal thermal field, resulting in cooling blind spots and over-cooling.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A smart temperature-controlled computing and storage chassis includes a cabinet, the cabinet's interior cavity having multiple pull-out panels, and a heat dissipation mesh fitted onto the rear end of the cabinet. It also includes:

[0007] The pipe network is installed on the lower end face of the pull-out plate, and the lower end face of the pipe network has multiple air holes installed at equal intervals.

[0008] An air pump is installed at the lower end of the cabinet cavity. The air pump output end is equipped with an air guide pipe, and the air pump input end is equipped with an air inlet pipe. Multiple flow control components are installed on the rear end face of the air guide pipe. The flow control components include a connecting pipe fixed to the rear end face of the air inlet pipe. A valve body is installed at the other end of the connecting pipe. An airflow valve seat is fixed at the upper end of the valve body cavity. A connecting seat is fitted and fixed at the lower end face of the valve body. A sealing ring is installed at the connection between the valve body and the connecting seat. A telescopic cylinder is fitted and installed at the lower end face of the connecting seat. A valve core is fixed at the telescopic end of the telescopic cylinder. A flexible hose is inserted into the upper end of the valve body.

[0009] An air filter assembly installed at the inlet end of the air intake pipe includes an air intake hopper fixed to the front end face of the air intake pipe. The surface of the air intake hopper has a slot, and an air filter screen is inserted into the inner cavity of the air intake hopper. Handles are fixed to both ends of the air filter screen.

[0010] As a further description of the above technical solution:

[0011] The air intake pipe is sleeved through one side of the cabinet, and the input end of the connecting pipe communicates with the inner cavity of the air intake pipe.

[0012] As a further description of the above technical solution:

[0013] The valve core is sleeved through the inner cavity of the sealing ring, and the valve core is located below the airflow valve seat.

[0014] As a further description of the above technical solution:

[0015] The valve core forms a telescopic structure with the connecting seat via a telescopic cylinder.

[0016] As a further description of the above technical solution:

[0017] The outlet end of the hose is fixedly connected to the inlet end of the pipeline network and is used to deliver gas into the pipeline network.

[0018] As a further description of the above technical solution:

[0019] The handle engages with the slot, and the air filter forms an assemblable structure through the handle and the slot.

[0020] As a further description of the above technical solution:

[0021] The extended end of the valve core and the inner cavity channel of the airflow valve seat are both designed in a tapered shape, and the tapered angles of the two are matched.

[0022] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0023] In this invention, by monitoring hardware temperature in real time and independently controlling multiple airflow adjustment units, it is possible to deliver air to different heat load areas within the cabinet precisely and on demand. This completely solves the pain points of high energy consumption, low efficiency, and uneven cooling in traditional heat dissipation methods. It not only significantly improves heat dissipation efficiency and effectively ensures the stable operation and lifespan of high-performance computing hardware, but also greatly reduces energy consumption by avoiding overall forced cooling. At the same time, the modular design and quick-release filter structure greatly simplify the daily cleaning and maintenance process. In summary, this invention solves the problems in the background technology. Attached Figure Description

[0024] Figure 1This is a front view structural diagram of the intelligent temperature-controlled computing and storage chassis of this utility model;

[0025] Figure 2 This is a rear view structural diagram of the intelligent temperature-controlled computing and storage chassis of this utility model;

[0026] Figure 3 This is a schematic diagram of the internal structure of the expansion component and the integration box in this utility model;

[0027] Figure 4 This is a schematic diagram of the temperature control component in this utility model;

[0028] Figure 5 This is a schematic diagram of the temperature control component in this utility model.

[0029] Legend:

[0030] 1. Cabinet; 2. Pull-out panel; 3. Heat dissipation mesh; 4. Piping network; 5. Air vents; 6. Air pump; 7. Air guide pipe; 8. Air inlet pipe; 9. Flow control assembly; 901. Connecting pipe; 902. Valve body; 903. Airflow valve seat; 904. Connecting seat; 905. Sealing ring; 906. Telescopic cylinder; 907. Valve core; 908. Hose; 10. Air filter assembly; 1001. Air inlet hopper; 1002. Slot; 1003. Air filter screen; 1004. Handle. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figures 1-5 The intelligent temperature-controlled computing and storage chassis includes a cabinet 1, with multiple pull-out panels 2 installed inside the cabinet 1, and a heat dissipation mesh 3 fitted onto the rear end of the cabinet 1. It also includes:

[0033] The pipe network 4 is installed on the lower end face of the pull-out plate 2, and multiple air holes 5 are installed at equal intervals on the lower end face of the pipe network 4.

[0034] The chassis 1 has a built-in control board, and the motherboard has a pre-set airflow management temperature control system. This system calculates and stores the temperature data fed back by the hardware, and intelligently controls the delivery and distribution of cooling airflow to provide targeted and precise heat dissipation for the computing and storage hardware installed on the pull-out plate 2.

[0035] An air pump 6 is installed at the lower end of the inner cavity of the cabinet 1. An air guide pipe 7 is installed at the output end of the air pump 6, and an air inlet pipe 8 is installed at the input end of the air pump 6. Multiple flow control components 9 are installed on the rear end face of the air guide pipe 7. The flow control components 9 include a connecting pipe 901 fixed to the rear end face of the air inlet pipe 8. A valve body 902 is installed at the other end of the connecting pipe 901. An airflow valve seat 903 is fixed at the upper end of the inner cavity of the valve body 902. A connecting seat 904 is fitted and fixed at the lower end face of the valve body 902. A sealing ring 905 is installed at the connection between the valve body 902 and the connecting seat 904. A telescopic cylinder 906 is fitted and installed at the lower end face of the connecting seat 904. A valve core 907 is fixed at the telescopic end of the telescopic cylinder 906. A flexible hose 908 is inserted into the upper end of the valve body 902.

[0036] The flow control component 9 controls the lifting stroke of the telescopic cylinder 906 to drive the gap between the conical valve core 907 and the airflow valve seat 903 to change linearly, thereby precisely adjusting the airflow output through the hose 908. Multiple flow control components 9 can be controlled independently to achieve differentiated air supply to different heat load areas.

[0037] The air filter assembly 10 is installed at the input end of the air intake pipe 8. The air filter assembly 10 includes an air intake hopper 1001 fixed to the front end face of the air intake pipe 8. A slot 1002 is provided on the surface of the air intake hopper 1001. An air filter screen 1003 is inserted into the inner cavity of the air intake hopper 1001, and handles 1004 are fixed on both ends of the air filter screen 1003.

[0038] This design allows the air filter 1003 to be quickly disassembled and cleaned without tools, facilitating daily maintenance and ensuring clean air intake and efficient heat dissipation.

[0039] Furthermore, the air intake pipe 8 is connected to one side of the cabinet 1 through a sleeve, and the input end of the connecting pipe 901 is connected to the inner cavity of the air intake pipe 8.

[0040] Furthermore, the valve core 907 is sleeved through the inner cavity of the sealing ring 905, and the valve core 907 is located below the airflow valve seat 903.

[0041] Furthermore, the valve core 907 forms a telescopic structure with the connecting seat 904 via the telescopic cylinder 906.

[0042] Furthermore, the output end of the hose 908 is fixedly connected to the input end of the pipeline network 4 for supplying gas into the pipeline network 4.

[0043] Furthermore, the handle 1004 engages with the slot 1002, and the filter screen 1003 forms an assemblable structure through the handle 1004 and the slot 1002.

[0044] Furthermore, both the extended end of the valve core 907 and the inner cavity channel of the airflow valve seat 903 adopt a tapered design, and the tapered angles of the two are matched.

[0045] Working principle: The working principle of this intelligent temperature-controlled computing power storage chassis is a closed-loop dynamic airflow management system based on temperature feedback. Its core is to intelligently sense the heat distribution of the equipment and accurately adjust the cooling airflow to achieve high-efficiency and low-energy heat dissipation.

[0046] After the system starts up, the control board built into the chassis continuously monitors the real-time temperature data of the computing and storage hardware installed on the pull-out plate 2. The built-in airflow management temperature control system analyzes and processes this data and generates control commands accordingly.

[0047] When the temperature of a certain piece of hardware rises, the control system first starts the air pump 6 located at the bottom of the cabinet. After the air pump starts working, external cold air is drawn in and flows through the air filter screen 1003 and the air inlet pipe 8 in the air filter assembly 10 in sequence. Then the airflow is distributed to each flow control assembly 9 through the connecting pipe 901.

[0048] The flow control component is a key component for precise airflow control: the control system sends a command to the corresponding telescopic cylinder 906 based on the temperature rise in a specific area. The telescopic cylinder 906 extends and retracts, precisely pushing the conical extension end of the valve core 907 closer to or further away from the inner cavity channel of the equally conical airflow valve seat 903. Because the tapers of the two are matched, the slight displacement of the valve core can linearly change the opening of the airflow gap, thereby steplessly adjusting the flow of cold air to the area like a faucet. This completes the working principle of this utility model.

[0049] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A smart temperature-controlled computing and storage chassis, comprising a cabinet (1), characterized in that, The cabinet (1) has multiple pull-out panels (2) installed inside its cavity, and a heat dissipation mesh (3) is fitted onto the rear end face of the cabinet (1). It also includes: The pipe network (4) is installed on the lower end face of the pull-out plate (2), and the lower end face of the pipe network (4) is equidistantly equipped with multiple air holes (5); An air pump (6) is installed at the lower end of the inner cavity of the cabinet (1). An air guide pipe (7) is installed at the output end of the air pump (6), and an air inlet pipe (8) is installed at the input end of the air pump (6). Multiple flow control components (9) are installed on the rear end face of the air guide pipe (7). The flow control component (9) includes a connecting pipe (901) fixed to the rear end face of the air inlet pipe (8). A valve body (902) is installed at the other end of the connecting pipe (901). The valve body (902) contains... An airflow valve seat (903) is fixed at the upper end of the cavity, a connecting seat (904) is fitted and fixed at the lower end face of the valve body (902), a sealing ring (905) is installed at the connection between the valve body (902) and the connecting seat (904), a telescopic cylinder (906) is fitted and installed at the lower end face of the connecting seat (904), a valve core (907) is fixed at the telescopic end of the telescopic cylinder (906), and a flexible hose (908) is inserted into the upper end of the valve body (902). An air filter assembly (10) is installed at the input end of the air intake pipe (8). The air filter assembly (10) includes an air intake hopper (1001) fixed to the front end face of the air intake pipe (8). A slot (1002) is provided on the surface of the air intake hopper (1001). An air filter screen (1003) is inserted into the inner cavity of the air intake hopper (1001), and handles (1004) are fixed on both ends of the air filter screen (1003).

2. The intelligent temperature-controlled computing and storage chassis according to claim 1, characterized in that, The air intake pipe (8) is sleeved through one side of the cabinet (1), and the input end of the connecting pipe (901) is connected to the inner cavity of the air intake pipe (8).

3. The intelligent temperature-controlled computing and storage chassis according to claim 1, characterized in that, The valve core (907) is sleeved through the inner cavity of the sealing ring (905), and the valve core (907) is located below the airflow valve seat (903).

4. The intelligent temperature-controlled computing and storage chassis according to claim 1, characterized in that, The valve core (907) forms a telescopic structure with the connecting seat (904) via the telescopic cylinder (906).

5. The intelligent temperature-controlled computing and storage chassis according to claim 1, characterized in that, The output end of the hose (908) is fixedly connected to the input end of the pipeline (4) for supplying gas into the pipeline (4).

6. The intelligent temperature-controlled computing and storage chassis according to claim 1, characterized in that, The handle (1004) engages with the slot (1002), and the air filter (1003) forms an assemblable structure through the handle (1004) and the slot (1002).

7. The intelligent temperature-controlled computing and storage chassis according to claim 1, characterized in that, The extended end of the valve core (907) and the inner cavity channel of the airflow valve seat (903) are both designed in a tapered shape, and the tapered angles of the two are matched.