Endoscope interface device and endoscope
The heat dissipation design of the endoscope interface device solves the problem of temperature rise in the light guide plug caused by high-energy light beams, thus achieving stability of light guiding performance and operational safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MEDCAPTAIN MEDICAL TECH
- Filing Date
- 2025-04-30
- Publication Date
- 2026-07-24
AI Technical Summary
The light guide plug of existing endoscopes experiences a temperature rise due to the convergence of high-energy light beams, which affects the light guiding performance and poses a risk of burns.
Design an endoscope interface device, including a connector and a heat dissipation spring. The heat dissipation spring elastically abuts against the peripheral wall of the light guide, so as to conduct heat to the outside of the connector and the endoscope main unit housing in a timely manner. Heat dissipation is combined with heat dissipation fins and a fan.
It effectively reduces the instability of light guiding performance caused by overheating of the light guide component, reduces the risk of burns to medical staff, and improves the heat dissipation efficiency of the light guide component.
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Figure CN224540187U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of medical device technology, and in particular relates to an endoscope interface device and an endoscope. Background Technology
[0002] Endoscopes are an important tool in modern medicine, widely used in clinical diagnosis, treatment, and surgery due to their minimally invasive nature, precision, and versatility. Endoscopes allow observation of target organs or tissues. Entering the body through natural openings or small incisions, they provide real-time images of the target organs or tissues to medical personnel, enabling them to observe their condition in real time.
[0003] An endoscope typically consists of an endoscope main unit and an endoscope body, which are connected via a light guide plug. The endoscope main unit emits a high-brightness, highly focused beam of light, which is conducted through the catheter plug to illuminate the endoscope body. However, this high-brightness, highly focused beam also carries concentrated high energy. This high-energy beam converges at the end of the light guide plug closest to the endoscope main unit, causing the temperature of that end to rise continuously. This can affect the light guiding performance of the light guide plug, and there is also a risk of burns for medical personnel who touch it. Utility Model Content
[0004] To address the shortcomings of existing technologies, this application provides an endoscope interface device and endoscope that can ensure the light guiding performance of the light guide plug and reduce the risk of burns to medical personnel.
[0005] On one hand, this application provides an endoscope interface device for connecting to an endoscope body assembly, the endoscope interface device comprising:
[0006] A connector, mounted on the housing of the endoscope main unit, includes a light guide channel for the light guide component of the endoscope body assembly to pass through; and
[0007] A heat dissipation spring is installed on the connecting seat and is used to elastically abut against the peripheral sidewall of the light guide.
[0008] In one possible implementation, the heat dissipation spring includes a mounting portion and an abutment portion connected together. The mounting portion is fixed to the connecting seat, and the abutment portion is bent relative to the mounting portion. The abutment portion is used to elastically abut against the peripheral sidewall of the light guide.
[0009] In one possible implementation, the end of the abutting portion away from the mounting portion is bent in an axial direction away from the light guide channel.
[0010] In one possible implementation, the connector includes a first end face and a second end face, the entrance of the light guide channel is located on the first end face for the light guide to pass through, and the exit of the light guide channel is located on the second end face for the light guide to exit; the mounting portion is mounted on the second end face, and the abutting portion extends in a direction away from the first end face.
[0011] In one possible implementation, when the light guide is not inserted into the light guide channel, at least a portion of the abutment portion is located in the light guide channel in the orthographic projection of the connector.
[0012] In one possible implementation, the wall surface of the abutment portion facing the axial direction of the light guide channel includes an arc surface, which is used to contact the peripheral wall surface of the light guide.
[0013] In one possible implementation, there are multiple heat dissipation springs, each of which is mounted on the connector. The multiple heat dissipation springs are arranged circumferentially around the light guide channel and form an interface that communicates with the light guide channel.
[0014] In one possible implementation, the diameter of the end of the abutment furthest from the connector is smaller than the diameter of the end of the abutment closest to the connector; when the light guide is not inserted into the light guide channel, the diameter of the end of the abutment furthest from the connector is smaller than the outer diameter of the light guide.
[0015] In one possible implementation, the endoscope interface device further includes heat dissipation fins disposed on the connector, with the heat dissipation fins located between any two adjacent heat dissipation springs in the circumferential direction of the light guide channel.
[0016] In one possible implementation, the endoscope interface device further includes a thermally conductive coating that fills the connection between the heat dissipation spring and the connector, and / or, the thermally conductive coating that fills the connection between the heat dissipation fin and the connector.
[0017] In one possible implementation, the endoscope interface device further includes a cooling fan mounted on the housing of the endoscope main unit, the cooling fan being used to generate airflow.
[0018] In one possible implementation, there are multiple heat dissipation fins, and a heat dissipation channel is formed between any two adjacent heat dissipation fins, with multiple heat dissipation fins forming multiple heat dissipation channels; each heat dissipation channel extends in the same direction, and the airflow generated by the cooling fan is in the same direction as the extension of the heat dissipation channel.
[0019] On the other hand, this application also provides an endoscope, comprising:
[0020] An endoscope main unit, the endoscope main unit including the aforementioned endoscope interface device; and
[0021] An endoscope body assembly, which can be plugged into the endoscope interface device.
[0022] The endoscope interface device and endoscope provided in this application elastically abut against the peripheral wall of the light guide through a heat dissipation spring. This allows heat from the light guide to be promptly conducted to the connector and the endoscope housing via the heat dissipation spring, thus facilitating heat dissipation from the light guide. This reduces the instability of the light guide's performance due to overheating and lowers the risk of burns to medical personnel during use. Attached Figure Description
[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are merely some implementation methods provided by the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 This is a partial assembly structure diagram of an endoscope provided in one embodiment of this application;
[0025] Figure 2 This is a partial assembly structure diagram of another endoscope provided in one embodiment of this application;
[0026] Figure 3 This is a structural diagram of an endoscope host provided in one embodiment of this application;
[0027] Figure 4 This is a front view of an endoscope host provided in one embodiment of this application;
[0028] Figure 5 This is an exploded structural diagram of an endoscope provided in one embodiment of this application;
[0029] Figure 6 This is a partial structural diagram of an endoscope provided in one embodiment of this application;
[0030] Figure 7 This is a partial cross-section of an endoscope provided in one embodiment of this application. Figure 1 ;
[0031] Figure 8 This is a partial cross-section of an endoscope provided in one embodiment of this application. Figure 2 .
[0032] Explanation of reference numerals in the attached figures:
[0033] Endoscope-1000, Endoscope main unit-100, Housing-101, Through hole-103, Endoscope interface device-10, Connector-11, First end face-11a, Second end face-11b, Light guide channel-111, Heat dissipation spring-13, Mounting part-131, Abutting part-133, Abutting interface-135, Protruding curved surface-1331, Heat dissipation fins-15, Heat dissipation channel-151, Cooling fan-17, Endoscope body assembly-300, Endoscope body-301, Light guide-303. Detailed Implementation
[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0035] It should be noted that when a component is described as "fixed to" another component, it can be directly on the other component or it can be in a component in between. When a component is described as "mounted to" another component, it can be directly on the other component or it can be in a component in between. When a component is described as "connected to" another component, it can be directly connected to the other component or it can be in a component in between.
[0036] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in the specification of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items. Directional terms mentioned in the description of this application, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "top surface," "side surface," "bottom surface," "top wall," "side wall," "bottom wall," "inner wall," "outer wall," "axial," "radial," "circumferential," "length direction," "width direction," "height direction," etc., are merely for reference to the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of this application, and do not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the application. In the description of this application, terms such as "first," "second," "third," "fourth," etc., are only used to distinguish the described objects and do not have any sequential or technical meaning.
[0037] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0038] Please see Figures 1 to 5 , Figure 1 This is a partial assembly structure diagram of an endoscope provided in one embodiment of this application. Figure 2 This is a partial assembly structure diagram of another endoscope provided in one embodiment of this application. Figure 3 This is a structural diagram of an endoscope host provided in one embodiment of this application. Figure 4 This is a front view of an endoscope host provided in one embodiment of this application. Figure 5 This is an exploded structural diagram of an endoscope provided in one embodiment of this application.
[0039] This application provides an endoscope 1000, which includes an endoscope main unit 100 and an endoscope body assembly 300. The endoscope main unit 100 includes an endoscope interface device 10, and the endoscope body assembly 300 can be plugged into the endoscope interface device 10 to assemble the endoscope 1000. The endoscope body assembly 300 can enter the body through a natural opening or a small incision to observe the condition of a target organ or tissue. The endoscope main unit 100 can present real-time images of the target organ or tissue to medical personnel via a display device, allowing medical personnel to observe the condition of the target organ or tissue in real time.
[0040] Specifically, the endoscope host 100 and the endoscope body assembly 300 are connected via the endoscope interface device 10. The endoscope host 100 emits a high-brightness, highly focused light beam, which, after being conducted, enables the endoscope body assembly 300 to perform illumination and imaging functions. Finally, the endoscope host 100 acquires and displays the images or videos captured by the endoscope body assembly 300 in real time for analysis by medical personnel.
[0041] In some embodiments, the endoscope host 100 has a zoom function, allowing medical personnel to observe fine structures in target tissues or organs by adjusting the magnification of the endoscope host 100, thus enabling more accurate assessment of the condition of the target tissues or organs. The endoscope host 100 also has a light source control function, allowing medical personnel to adjust the brightness, color temperature, and illumination direction of the light source, enabling the endoscope 1000 to be used flexibly in different environments. The endoscope host 100 also has image transmission and storage functions, enabling it to transmit acquired images or videos to other devices for remote application; it can also store acquired images or videos for later playback and review. The endoscope host 100 can be integrated into the endoscope 1000 handle, with preset buttons on the handle for various quick operations by medical personnel.
[0042] Please see Figures 3 to 8 , Figure 6 This is a partial structural diagram of an endoscope provided in one embodiment of this application. Figure 7 This is a partial cross-section of an endoscope provided in one embodiment of this application. Figure 1 , Figure 8 This is a partial cross-section of an endoscope provided in one embodiment of this application. Figure 2 .
[0043] This application provides an endoscope interface device 10, which is disposed on the housing 101 of the endoscope host 100. The endoscope interface device 10 is used to connect with the endoscope body assembly 300 so that the endoscope host 100 and the endoscope body assembly 300 can be connected.
[0044] The endoscope interface device 10 includes a connector 11 and a heat dissipation spring 13. The connector 11 is mounted on the housing 101 of the endoscope host 100 and has a light guide channel 111. The housing 101 of the endoscope host 100 has a through hole 103, and the light guide channel 111 communicates with the through hole 103. The endoscope body assembly 300 includes a body 301 and a light guide 303. The through hole 103 and the light guide channel 111 are used for the light guide 303 of the endoscope body assembly 300 to pass through. The heat dissipation spring 13 is mounted on the connector 11 and is used to elastically abut against the peripheral wall of the light guide 303 of the endoscope body assembly 300.
[0045] The endoscope interface device 10 provided in this embodiment enables the endoscope body assembly 300 and the endoscope host 100 to be assembled into an endoscope 1000 when the light guide 303 of the endoscope body assembly 300 passes through the light guide channel 111 of the connector 11. During operation, the endoscope host 100 emits a high-brightness, highly focused beam of light, which is transmitted through the light guide 303 to the endoscope body 301, enabling the endoscope body 301 to achieve illumination. Because the high-brightness, highly focused beam of light emitted by the endoscope host 100 is accompanied by high energy, the light guide 303 is prone to energy concentration, causing its temperature to rise continuously. The heat dissipation spring 13 elastically abuts against the peripheral wall of the light guide 303, allowing heat from the light guide 303 to be promptly conducted to the connecting seat 11 and the housing 101 of the endoscope main unit 100, thus facilitating heat dissipation from the light guide 303. This reduces the instability of the light guiding performance caused by overheating of the light guide 303 and lowers the risk of burns to medical personnel during use.
[0046] Please see Figures 5 to 8 In one specific embodiment, the heat dissipation spring 13 of the endoscope interface device 10 includes a mounting portion 131 and an abutment portion 133 connected together, and the mounting portion 131 and the abutment portion 133 are an integral structure. The mounting portion 131 is fixed to the connecting seat 11, and the abutment portion 133 is bent relative to the mounting portion 131, and the abutment portion 133 is used to elastically abut against the peripheral sidewall of the light guide 303.
[0047] The endoscope interface device 10 provided in this embodiment includes a heat dissipation spring 13 with a relatively bent abutment portion 133 and a mounting portion 131, which facilitates the installation and fixation between the heat dissipation spring 13 and the connecting seat 11, and also facilitates the elastic abutment between the heat dissipation spring 13 and the peripheral sidewall of the light guide 303. Moreover, the mounting portion 131 and the abutment portion 133 of the heat dissipation spring 13 are an integral structure, which helps to improve the heat conduction efficiency of the heat dissipation spring 13 on the light guide 303, thereby improving the heat dissipation efficiency of the light guide 303.
[0048] In this embodiment, the mounting part 131 and the connecting seat 11 are fixed together by screws. As a result, the heat on the light guide 303 is conducted to the connecting seat 11 in sequence through the abutment part 133, the mounting part 131 and the screws. After the screws fix the mounting part 131 and the connecting seat 11, they can provide both a fixing function and a heat conduction function.
[0049] It is understood that in some other embodiments, the mounting part 131 and the connecting seat 11 can be fixedly connected by welding, snap-fitting or other means, and this application does not limit this.
[0050] Please see Figures 5 to 8In one specific embodiment, the end of the endoscope interface device 10 that abuts 133 away from the mounting portion 131 is bent toward the axial direction away from the light guide channel 111.
[0051] The endoscope interface device 10 provided in this embodiment bends the end of the abutment portion 133 away from the mounting portion 131 in an axial direction away from the light guide channel 111. When the light guide 303 is inserted into the light guide channel 111 and pulled out of the light guide channel 111, the peripheral sidewall of the light guide 303 will not rub against the end face of the abutment portion 133 away from the mounting portion 131. This helps to ensure the integrity of the light guide 303 during the insertion into and extraction from the light guide channel 111, thereby ensuring the light guiding performance of the light guide 303.
[0052] In this embodiment, the abutment portion 133 has a protruding curved surface 1331 on the side near the light guide member 303. The protruding curved surface 1331 is disposed at the end of the abutment portion 133 away from the mounting portion 131. The protruding curved surface 1331 is used to elastically abut against the peripheral wall of the light guide member 303 when the light guide member 303 passes through and enters the light guide channel 111. Thus, during the process of the light guide member 303 passing through and being pulled out of the light guide channel 111, the peripheral wall of the light guide member 303 slides in contact with the protruding curved surface, and the peripheral wall of the light guide member 303 will not rub against the end face of the abutment portion 133 away from the mounting portion 131.
[0053] Understandably, in some other embodiments, the friction between the peripheral sidewall of the light guide 303 and the abutment portion 133 can also be reduced by making the end face of the abutment portion 133 away from the mounting portion 131 rounded.
[0054] Please see Figures 5 to 8 In one specific embodiment, the connector 11 of the endoscope interface device 10 includes a first end face 11a and a second end face 11b. The entrance of the light guide channel 111 is located on the first end face 11a for the light guide 303 to pass through, and the exit of the light guide channel 111 is located on the second end face 11b for the light guide 303 to exit. The mounting part 131 is mounted on the second end face 11b, and the abutment part 133 extends from the second end face 11b in a direction away from the first end face 11a.
[0055] It should be understood that the high-brightness, highly focused beam emitted by the endoscope host 100 will be concentrated at one end of the light guide 303 that exits the light guide channel 111, and then transmitted to the endoscope body 301 through the light guide 303, so that the endoscope body 301 of the endoscope 1000 can realize the illumination function.
[0056] The endoscope interface device 10 provided in this embodiment has a mounting part 131 mounted on the second end face 11b, and an abutment part 133 extending in a direction away from the first end face 11a. That is, the mounting part 131 is mounted on one end of the light guide 303 that extends out of the light guide channel 111, and the abutment part 133 extends in the direction from the light guide 303 entering the light guide channel 111 to exiting the light guide channel 111. As a result, the heat generated by the high-brightness, high-convergence light beam emitted by the endoscope host 100 onto the light guide 303 can be promptly conducted to the outside of the light guide 303 by the heat dissipation spring 13 formed by the abutment part 133 and the mounting part 131, which is beneficial for timely heat dissipation of the light guide 303.
[0057] It is understood that in some other embodiments, the heat dissipation spring 13 may elastically abut against the peripheral sidewall of the light guide 303 at other locations on the light guide 303, and this application does not limit this. Exemplarily, the mounting portion 131 is mounted on the first end face 11a, and the abutment portion 133 extends in a direction away from the second end face 11b, that is, the position where the heat dissipation spring 13 elastically abuts against the light guide 303 may be located on the side of the light guide channel 111 facing the endoscope body assembly 300.
[0058] Please see Figures 5 to 8 In one specific embodiment, when the light guide 303 is not inserted into the light guide channel 111, at least a portion of the abutment portion 133 of the endoscope interface device 10 is located in the light guide channel 111 in the orthographic projection of the connector 11.
[0059] In this embodiment, the endoscope interface device 10, when the light guide 303 is not inserted into the light guide channel 111, has at least a portion of the abutment portion 133 projected onto the connector 11 located within the light guide channel 111. Therefore, when the light guide 303 is inserted into the light guide channel 111, the peripheral wall of the light guide 303 presses the abutment portion 133 outward from the axis of the light guide channel 111. The portion of the abutment portion 133 projected onto the connector 11 within the light guide channel 111 elastically abuts against the light guide 303, resulting in a tighter contact between the abutment portion and the light guide 303, and improved heat conduction by the abutment portion. Furthermore, when the light guide 303 is not inserted into the light guide channel 111, the abutment portion 133 will cover at least part of the light guide channel 111. The abutment portion 133 will partially block the light guide channel 111, which can prevent some light from being emitted through the light guide channel 111 and causing pollution to the environment or harm to the operator.
[0060] Please see Figures 5 to 8In one specific embodiment, the abutment portion 133 of the endoscope interface device 10 has an arc-shaped wall surface (not shown) facing the axial direction of the light guide channel 111. The arc-shaped surface is used to contact the peripheral wall surface of the light guide 303. The arc-shaped surface is a concave arc surface, and the degree of concavity of the arc surface matches the curvature of the peripheral wall of the light guide 303, that is, the arc surface can fit against the peripheral wall of the light guide 303.
[0061] The endoscope interface device 10 provided in this embodiment has an arc surface on the wall of the abutment portion 133 facing the light guide channel 111 in the axial direction. The arc surface is used to fit and contact the peripheral wall of the light guide 303. Therefore, when the light guide 303 passes through into the light guide channel 111, the arc surface of the abutment portion 133 fits against the peripheral wall of the light guide 303, which can increase the contact area between the abutment portion 133 and the light guide 303, and help improve the heat dissipation efficiency of the light guide 303.
[0062] Please see Figures 5 to 8 In one embodiment, the endoscope interface device 10 has multiple heat dissipation springs 13, each of which is mounted on the connector 11. The multiple heat dissipation springs 13 are arranged circumferentially around the light guide channel 111 and form an abutment interface 135 that communicates with the light guide channel 111. When the light guide 303 passes through the light guide channel 111, each heat dissipation spring 13 elastically abuts against the light guide 303, and the light guide 303 passes through the abutment interface 135 formed by the multiple heat dissipation springs 13.
[0063] The endoscope interface device 10 provided in this embodiment uses multiple heat dissipation springs 13 arranged circumferentially around the light guide channel 111 to form an abutment 135 communicating with the light guide channel 111. When the light guide element 303 passes through the light guide channel 111, each heat dissipation spring 13 elastically abuts against the light guide element 303. Thus, each heat dissipation spring 13 can transfer heat from the light guide element 303, which helps to improve the heat dissipation efficiency of the light guide element 303.
[0064] In this embodiment, the endoscope interface device 10 has three heat dissipation springs 13, all of which are mounted on the connector 11. The three heat dissipation springs 13 are evenly arranged around the circumference of the light guide channel 111, that is, one heat dissipation spring 13 is arranged at 120° intervals around the circumference of the light guide channel 111. It is understood that in some other embodiments, the number of heat dissipation springs 13 in the endoscope interface device 10 can be one, two, four, five, etc., and this application does not impose any limitation on this.
[0065] In this embodiment, each heat dissipation spring 13 of the endoscope interface device 10 is an independent component, that is, each heat dissipation spring 13 includes a mounting part 131 and an abutment part 133, and each mounting part 131 is mounted on the connecting seat 11. It is understood that in some other embodiments, multiple heat dissipation springs 13 can share a ring-shaped mounting part 131, that is, multiple abutment parts 133 of multiple heat dissipation springs 13 are connected to a ring-shaped mounting part 131. It is only necessary to install and fix a ring-shaped mounting part 131 to the connecting seat 11, which can reduce the assembly complexity. This application does not limit this.
[0066] Please see Figures 5 to 8 In one specific embodiment, the diameter of the end of the contact interface 135 formed by the multiple heat dissipation springs 13 wound around the connector 11 is smaller than the diameter of the end of the contact interface 135 close to the connector 11. Moreover, when the light guide 303 is not inserted into the light guide channel 111, the diameter of the end of the contact interface 135 away from the connector 11 is smaller than the outer diameter of the light guide 303.
[0067] The endoscope interface device 10 provided in this embodiment has an abutment 135 formed by multiple heat dissipation springs 13. The diameter of the end of the abutment 135 away from the connector 11 is smaller than the diameter of the end of the abutment 135 near the connector 11, so that the light guide 303 can continue to be inserted along the axial direction of the light guide channel 111 after passing through the light guide channel 111. Moreover, when the light guide 303 is not inserted into the light guide channel 111, the diameter of the end of the abutment 135 away from the connector 11 is smaller than the outer diameter of the light guide 303, so that after the light guide 303 passes through the light guide channel 111, the multiple heat dissipation springs 13 can elastically abut against the light guide 303. That is, there is an interference fit between the multiple heat dissipation springs 13 and the light guide 303, which is beneficial to improving the heat dissipation efficiency of the light guide 303.
[0068] Please see Figures 5 to 8 In one specific embodiment, the endoscope interface device 10 further includes heat dissipation fins 15 disposed on the connector 11. Heat dissipation fins 15 are provided between any two adjacent heat dissipation springs 13 in the circumferential direction of the light guide channel 111. When the endoscope 1000 is in operation, the endoscope host 100 emits a high-brightness, highly focused beam of light to the light guide 303, causing the temperature of the light guide 303 to rise. The heat from the light guide 303 is transferred to the connector 11 via the heat dissipation springs 13, and then to the heat dissipation fins 15 on the connector 11.
[0069] The endoscope interface device 10 provided in this embodiment is mounted on the connector 11 with heat dissipation fins 15, which helps to further improve the heat dissipation efficiency of the connector 11, heat dissipation spring 13 and light guide 303, thereby reducing the risk of burns to medical staff during operation.
[0070] In this embodiment, heat dissipation fins 15 are provided between any two adjacent heat dissipation springs 13, so that the heat conducted by the heat dissipation springs 13 can be dissipated more quickly through the heat dissipation fins 15. It is understood that in some other embodiments, the heat dissipation fins 15 can be disposed at other suitable locations on the mounting base, and this application does not limit this.
[0071] Please see Figures 5 to 8 In one specific embodiment, the endoscope interface device 10 further includes a thermally conductive coating (not shown in the figure), which is used to improve the heat conduction efficiency. The thermally conductive coating fills the connection between the heat dissipation spring 13 and the connector 11, and / or, the thermally conductive coating fills the connection between the heat dissipation fin 15 and the connector 11.
[0072] The endoscope interface device 10 provided in this embodiment fills the connection between the heat dissipation spring 13 and the connecting seat 11, and / or the connection between the heat dissipation fin 15 and the connecting seat 11 with a thermally conductive coating, so as to improve the heat dissipation effect on the heat dissipation path of the light guide 303 and improve the heat dissipation efficiency of the light guide 303.
[0073] Understandably, in one embodiment, the thermally conductive coating is only applied to the connection between the heat sink spring 13 and the connector 11 or the connection between the heat sink fin 15 and the connector 11. In another embodiment, both the connection between the heat sink spring 13 and the connector 11 and the connection between the heat sink fin 15 and the connector 11 are filled with the thermally conductive coating, and this application does not impose any limitations on this.
[0074] Please see Figure 1 and Figures 3 to 8 In one specific embodiment, the endoscope interface device 10 further includes a cooling fan 17, which is mounted on the housing 101 of the endoscope host 100 and is used to generate airflow. The airflow generated by the cooling fan 17 is used to cool down the heat generated by the endoscope 1000, so as to dissipate heat from both the endoscope interface device 10 and the endoscope 1000 as a whole.
[0075] The endoscope interface device 10 provided in this embodiment, through the setting of the cooling fan 17, enables the endoscope 1000 to have air cooling function, which is conducive to further improving the heat dissipation efficiency of the endoscope interface device 10 and the endoscope 1000 as a whole.
[0076] Please see Figure 1 and Figures 3 to 6In one specific embodiment, the endoscope interface device 10 has multiple heat dissipation fins 15. Any two adjacent heat dissipation fins 15 are spaced apart to form a heat dissipation channel 151. Each heat dissipation channel 151 extends in the same direction. The airflow generated by the cooling fan 17 is in the same direction as the extension of each heat dissipation channel 151. The airflow generated by the cooling fan 17 can flow within the multiple heat dissipation channels 151 formed by the multiple heat dissipation fins 15.
[0077] The endoscope interface device 10 provided in this embodiment has the airflow direction generated by the cooling fan 17 being the same as the extension direction of each heat dissipation channel 151, so that the airflow generated by the cooling fan 17 can flow quickly within the multiple heat dissipation channels 151 formed by multiple heat dissipation fins 15, which is beneficial to improving the heat dissipation efficiency of the heat dissipation fins 15, thereby improving the heat dissipation efficiency of the light guide 303.
[0078] In this embodiment, the airflow direction generated by the cooling fan 17 is the same as the extension direction of each heat dissipation channel 151, so that the airflow generated by the cooling fan 17 flows at a higher speed within the multiple heat dissipation channels 151 formed by the multiple heat dissipation fins 15, and can remove heat from the heat dissipation fins 15 more quickly. It is understood that in some other embodiments, the airflow direction generated by the cooling fan 17 may intersect with the extension direction of a portion of the heat dissipation channels 151 formed by the heat dissipation fins 15, and this application does not impose any limitations on this.
[0079] Furthermore, after the endoscope interface device 10 is installed in the endoscope host 100, the endoscope interface device 10 is located inside the housing 101 of the endoscope host 100, and at least a portion of the light guide 303 of the endoscope body assembly 300 is located inside the housing 101 of the endoscope host 100. The high-brightness, highly focused light beam emitted from the endoscope host 100 is conducted to the light guide 303 within the housing 101 of the endoscope host 100, thereby enabling the endoscope body 301 to perform illumination and imaging functions. At the same time, the housing 101 of the endoscope host 100 has an air inlet and an air outlet. The cooling fan 17 generates airflow through the air inlet, which flows within the multiple heat dissipation channels 151 formed by multiple heat dissipation fins 15, so as to conduct the heat on the heat dissipation fins 15 to the outside of the endoscope host 100 through the air outlet. Furthermore, the cooling fan 17 can also generate airflow through the air inlet onto the surface of the light guide 303, and can also directly exhaust some of the heat from the light guide 303 to the outside of the endoscope host 100 through the air outlet. The cooling fan 17 can also generate airflow through the air inlet onto the surface of the heat sink 13, and can also directly exhaust some of the heat from the heat sink 13 to the outside of the endoscope host 100 through the air outlet. Therefore, the degree of heat accumulation in the endoscope host 100 can be reduced, which is beneficial to improving the safety of operating the endoscope 1000.
[0080] The air inlet can share some mounting holes on the housing 101 of the endoscope host 100, or it can be designed as a separate through hole. The air outlet can share some mounting holes on the housing 101 of the endoscope host 100, or it can be designed as a separate through hole; this application does not impose any restrictions on this.
[0081] Please see Figures 1 to 8 When the endoscope 1000 is in operation, the endoscope host 100 emits a high-brightness, highly focused light beam, which is conducted to the endoscope body 301 via the light guide 303, enabling the endoscope body 301 of the endoscope 1000 to achieve the illumination function. The high-brightness, highly focused light beam emitted by the endoscope host 100 is accompanied by high energy, and the beam forms energy convergence at the light guide 303, causing the temperature to rise. Through the endoscope interface device 10 and the endoscope 1000 provided in this application, some of the heat accumulated in the light guide 303 is directly conducted to the outside of the endoscope 1000 through the airflow of the cooling fan 17 from the surface of the light guide 303 through the air outlet on the housing 101 of the endoscope host 100, and some of the heat is conducted to the heat dissipation spring 13 that elastically abuts against the light guide 303. Some of the heat transferred to the heat sink 13 will be directly transferred to the outside of the endoscope 1000 via the airflow from the surface of the heat sink 13 through the air outlet on the housing 101 of the endoscope host 100, and some heat will be transferred to the connector 11. Some of the heat transferred to the connector 11 will also be directly transferred to the outside of the endoscope 1000 via the airflow from the surface of the connector 11 through the air outlet on the housing 101 of the endoscope host 100, and some heat will be transferred to the heat sink 15. The heat transferred to the heat sink 15 will be directly transferred to the outside of the endoscope 1000 via the airflow from the heat sink 15 through the heat dissipation channel 151 formed by the heat sink 15 through the air outlet on the housing 101 of the endoscope host 100. Therefore, the endoscope interface device 10 and endoscope 1000 provided in this application facilitate heat dissipation of the light guide 303, which can reduce the instability of the light guiding performance caused by overheating of the light guide 303 and reduce the risk of burns to medical personnel during use.
[0082] The above are some embodiments of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.
Claims
1. An endoscope interface device, characterized in that, For connection to an endoscope body assembly, the endoscope interface device includes: A connector, mounted on the housing of the endoscope main unit, includes a light guide channel for the light guide component of the endoscope body assembly to pass through; and A heat dissipation spring is installed on the connecting seat and is used to elastically abut against the peripheral sidewall of the light guide.
2. The endoscope interface device as described in claim 1, characterized in that, The heat dissipation spring includes a mounting part and an abutment part connected together. The mounting part is fixed to the connecting seat, and the abutment part is bent relative to the mounting part. The abutment part is used to elastically abut against the peripheral sidewall of the light guide.
3. The endoscope interface device as described in claim 2, characterized in that, The end of the abutting portion away from the mounting portion is bent in an axial direction away from the light guide channel.
4. The endoscope interface device as described in claim 2, characterized in that, The connector includes a first end face and a second end face. The entrance of the light guide channel is located on the first end face for the light guide to pass through, and the exit of the light guide channel is located on the second end face for the light guide to exit. The mounting part is mounted on the second end face, and the abutting part extends in a direction away from the first end face.
5. The endoscope interface device as described in claim 2, characterized in that, When the light guide is not inserted into the light guide channel, at least a portion of the abutment portion is located in the light guide channel in the orthographic projection of the connector.
6. The endoscope interface device as described in claim 2, characterized in that, The wall surface of the abutment portion facing the axial direction of the light guide channel includes an arc surface, which is used to contact the peripheral wall surface of the light guide.
7. The endoscope interface device as described in claim 1, characterized in that, The number of heat dissipation springs is multiple, and each heat dissipation spring is installed on the connecting seat. The multiple heat dissipation springs are arranged around the circumference of the light guide channel and form an abutment that is connected to the light guide channel.
8. The endoscope interface device as described in claim 7, characterized in that, The diameter of the end of the abutment furthest from the connector is smaller than the diameter of the end of the abutment closest to the connector. When the light guide is not inserted into the light guide channel, the diameter of the end of the abutment away from the connector is smaller than the outer diameter of the light guide.
9. The endoscope interface device as described in claim 7, characterized in that, The endoscope interface device also includes heat dissipation fins disposed on the connector, and the heat dissipation fins are disposed between any two adjacent heat dissipation springs in the circumferential direction of the light guide channel.
10. The endoscope interface device as described in claim 9, characterized in that, The endoscope interface device further includes a thermally conductive coating, which fills the connection between the heat dissipation spring and the connector, and / or, the thermally conductive coating fills the connection between the heat dissipation fin and the connector.
11. The endoscope interface device as described in claim 9, characterized in that, The endoscope interface device also includes a cooling fan, which is mounted on the housing of the endoscope main unit and is used to generate airflow.
12. The endoscope interface device as described in claim 11, characterized in that, The number of heat dissipation fins is multiple, and a heat dissipation channel is formed between any two adjacent heat dissipation fins. Multiple heat dissipation fins form multiple heat dissipation channels. Each heat dissipation channel extends in the same direction, and the airflow generated by the cooling fan is in the same direction as the extension of the heat dissipation channel.
13. An endoscope, characterized in that, include: An endoscope host, the endoscope host comprising the endoscope interface device as described in any one of claims 1 to 12; as well as An endoscope body assembly, which can be plugged into the endoscope interface device.