A fixture for BGA package chip disassembly and modification welding

Abstract

The utility model discloses a kind of clamps for BGA encapsulation chip disassembly and improvement welding, including adjusting assembly and welding assembly;Welding assembly is set on adjusting assembly, adjusting assembly is used to adjust according to the size of workpiece to be welded, fixed workpiece;Welding assembly is used to weld workpiece.The utility model is through setting adjusting assembly, it can be convenient to adjust clamp according to the size of BGA encapsulation chip, it is convenient to clamp and fix BGA encapsulation chip simultaneously, prevent from when disassembly and improvement welding to BGA encapsulation chip, BGA encapsulation chip occurs deviation, to affect the welding quality of BGA encapsulation chip, in addition, by setting welding assembly, it can be convenient to weld BGA encapsulation chip, it is convenient to adjust the welding position of BGA encapsulation chip simultaneously, to solve the problem that existing technology needs manual disassembly encapsulation, and there is no suitable clamping fixture, leading to very inconvenient operation, improve the efficiency and success rate of disassembly and improvement welding.

Description

Technical Field

[0001] This utility model belongs to the field of chip disassembly and soldering, specifically relating to a fixture for disassembling and soldering BGA packaged chips. Background Technology

[0002] The vast majority of integrated circuits and expensive electronic components on the market use high-performance and reliable ball grid array (BGA) packaged chips due to certain special performance requirements. However, these chips also have some drawbacks, such as a large number of solder pins, tight soldering, and increased power consumption. This often leads to malfunctions requiring disassembly and resoldering, a process that requires manual disassembly and resoldering, which is time-consuming, labor-intensive, and prone to damaging other components on the integrated circuit. General fixtures only facilitate the clamping and fixing of BGA packaged chips; manual soldering is still required, thus reducing the efficiency of BGA chip soldering. Currently, the mainstream operation still requires manual disassembly and resoldering. However, due to the lack of suitable tooling fixtures, operators simultaneously hold a soldering gun and tweezers, requiring stable and strong horizontal clamping tools to ensure the successful disassembly and resoldering of BGA devices. The lack of suitable clamping fixtures makes the operation very inconvenient and directly affects the success rate of disassembly and resoldering. Summary of the Invention

[0003] In order to overcome the above-mentioned technical defects in the prior art, this utility model proposes a fixture for disassembling, modifying and soldering BGA packaged chips.

[0004] The technical solution to achieve the purpose of this utility model is as follows:

[0005] A fixture for disassembling, modifying, and soldering BGA packaged chips includes an adjustment component and a soldering component;

[0006] The welding assembly is mounted on the adjustment assembly;

[0007] The adjustment component is used to adjust and fix the workpiece according to its size;

[0008] The welding assembly is used to weld the workpiece.

[0009] Furthermore, the adjustment assembly includes a worktable, a movable plate, a driving component, a fixed plate, a first limiting rod, a second limiting rod, a placement frame, and a clamping component;

[0010] The movable plates are symmetrically arranged on the inner walls of both sides of the workbench, and fixed plates are respectively arranged on the inner side of the movable plates on both sides.

[0011] A driving component is provided between the two fixed plates, and the output end of the driving component passes through the fixed plate and is connected to the two movable plates on both sides.

[0012] A second limiting rod is provided between the movable plates on both sides, and a first limiting rod is provided between the fixed plate and the movable plate on the same side;

[0013] Multiple placement frames are provided on the inner side of the movable plate, and clamping components are provided in the placement frames.

[0014] Furthermore, the driving component includes a first cylinder, a gear plate, a gear, and a forward and reverse threaded rod;

[0015] The first cylinder is mounted on the workbench. The output end of the first cylinder is equipped with a toothed plate that meshes with a gear. The gear is equipped with a positive and negative threaded rod, and the other end of the positive and negative threaded rod passes through a fixed plate and a movable plate.

[0016] Furthermore, the clamping component includes a housing, a second cylinder, a first movable block, a clamping arm, a push rod, and a first clamping plate;

[0017] The outer shell is set inside the placement frame, and a second cylinder is set inside the outer shell. The output end of the second cylinder is connected to a first movable block, and a push rod is set on the first movable block.

[0018] A clamping arm is rotatably connected to the outer casing, and the push rod is connected to the clamping arm;

[0019] The clamping arm is provided with a first clamping plate.

[0020] Furthermore, the welding assembly includes a bracket, a third cylinder, a movable frame, a fixing component, a second threaded rod, a second turntable, a protective shell, and a movable component;

[0021] The bracket is set on the workbench, and a third cylinder is set on the bracket. The output end of the third cylinder is connected to the movable frame.

[0022] The movable frame is mounted on the bracket, and a fixing component is mounted on the movable frame. A second threaded rod is mounted inside the movable frame, and a second turntable is mounted on the other end of the second threaded rod. A protective shell is mounted on the second threaded rod, and a movable component is mounted inside the protective shell.

[0023] Furthermore, the fixing component includes a limiting plate, a first threaded rod, a first turntable, and a second clamping plate;

[0024] The limiting plate is fixed to the outside of the movable frame. A first threaded rod is provided on the limiting plate. A first turntable is provided at one end of the first threaded rod, and a second clamping plate is provided at the other end of the first threaded rod.

[0025] Furthermore, the moving component includes a motor, a third threaded rod, a second movable block, and a welding head;

[0026] The motor is housed inside the protective casing, and its output end is connected to the third threaded rod.

[0027] The third threaded rod is threadedly connected to a second movable block, and a welding head is provided on the second movable block.

[0028] Compared with the prior art, the advantages of this utility model are as follows:

[0029] This invention addresses these issues by incorporating an adjustment component that allows for easy adjustment of the clamp according to the size of the BGA packaged chip. This facilitates clamping and securing the BGA packaged chip, preventing displacement during disassembly, modification, and soldering, which could affect the soldering quality. Furthermore, the soldering component facilitates soldering the BGA packaged chip and allows for adjustment of its soldering position. This solves the problems of manual disassembly and reassembly in existing technologies, which require suitable clamping fixtures and result in inconvenient operations. Ultimately, it improves the efficiency and success rate of disassembly, modification, and soldering.

[0030] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of the fixture for disassembling, modifying, and soldering BGA packaged chips according to this utility model.

[0032] Figure 2 This is a partial structural diagram of the fixture for disassembling, modifying, and soldering BGA packaged chips according to this utility model.

[0033] Figure 3 This is a schematic diagram of the adjustment component structure of the fixture for disassembling, modifying, and soldering BGA packaged chips according to this utility model.

[0034] Figure 4 This is a partial structural diagram of the adjustment component of the fixture for disassembling, modifying, and soldering BGA packaged chips according to this utility model.

[0035] Figure 5 This is a schematic diagram of the welding assembly structure of the fixture for disassembling and reassembling BGA packaged chips according to this utility model. Detailed Implementation

[0036] It is readily understood that, based on the technical solution of this utility model, various embodiments of this utility model can be conceived by those skilled in the art without altering its essential spirit. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative examples of the technical solution of this invention and should not be considered as the entirety of this utility model or as a limitation or restriction on its technical solution. Rather, these embodiments are provided to enable those skilled in the art to gain a more thorough understanding of this utility model. Preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings, which constitute a part of this application and, together with the embodiments of this utility model, serve to illustrate the innovative concept of this invention.

[0037] Example

[0038] Combination Figures 1 to 5 A fixture for disassembling, modifying, and soldering BGA packaged chips includes an adjustment component 100 and a soldering component 200.

[0039] The welding assembly 200 is mounted on the adjusting assembly 100;

[0040] The adjustment component 100 is used to adjust and fix the workpiece according to the size of the workpiece to be welded;

[0041] The welding assembly 200 is used for welding the workpiece.

[0042] The adjustment assembly 100 includes a worktable 101, a movable plate 102, a driving component 103, a fixed plate 104, a first limiting rod 105, a second limiting rod 106, a placement frame 107, and a clamping component 108.

[0043] The movable plates 102 are symmetrically arranged on the inner walls of both sides of the workbench 101, and fixed plates 104 are respectively arranged on the inner side of the movable plates 102 on both sides.

[0044] A driving component 103 is provided between the two fixed plates 104. The output end of the driving component 103 passes through the fixed plate 104 and is connected to the two movable plates 102.

[0045] A second limiting rod 106 is provided between the two movable plates 102 on both sides, and a first limiting rod 105 is provided between the fixed plate 104 and the movable plate 102 on the same side;

[0046] Multiple placement frames 107 are provided on the inner side of the movable plate 102, and clamping members 108 are provided in the placement frames 107.

[0047] In use, by setting the movable plate 102, the clamping member 108 can be moved easily; by setting the driving member 103, the movable plate 102 can be moved easily.

[0048] The fixing plate 104 can support the first limiting rod 105 and limit the driving component 103. By setting the first limiting rod 105 and the second limiting rod 106, the movable plate 102 can be limited. By setting the placement frame 107, the clamping component 108 can be fixed. Finally, the chip is clamped and fixed by the clamping component 108.

[0049] The driving component 103 includes a first cylinder 103a, a toothed plate 103b, a gear 103c, and a forward and reverse threaded rod 103d;

[0050] The first cylinder 103a is mounted on the workbench 101. The output end of the first cylinder 103a is provided with a toothed plate 103b, which meshes with a gear 103c. The gear 103c is provided with a positive and negative threaded rod 103d, and the other end of the positive and negative threaded rod 103d passes through the fixed plate 104 and the movable plate 102.

[0051] Furthermore, the clamping member 108 includes a housing 108a, a second cylinder 108b, a first movable block 108c, a clamping arm 108d, a push rod 108e, and a first clamping plate 108f;

[0052] The outer shell 108a is disposed inside the placement frame 107, and the second cylinder 108b is disposed inside the outer shell 108a. The output end of the second cylinder 108b is connected to the first movable block 108c, and a push rod 108e is disposed on the first movable block 108c.

[0053] A clamping arm 108d is rotatably connected to the outer shell 108a, and the push rod 108e is connected to the clamping arm 108d.

[0054] The clamping arm 108d is provided with a first clamping plate 108f.

[0055] In use, the push rod 108e is moved by the second cylinder 108b and the first movable block 108c, and the chip to be welded is clamped and fixed by the first clamping plate 108f.

[0056] The welding assembly 200 includes a bracket 201, a third cylinder 202, a movable frame 203, a fixing component 204, a second threaded rod 205, a second turntable 206, a protective shell 207, and a movable component 208;

[0057] The bracket 201 is mounted on the workbench 101, and a third cylinder 202 is mounted on the bracket 201. The output end of the third cylinder 202 is connected to the movable frame 203.

[0058] The movable frame 203 is mounted on the bracket 201. A fixing part 204 is mounted on the movable frame 203. A second threaded rod 205 is mounted inside the movable frame 203. A second turntable 206 is mounted at the other end of the second threaded rod 205. A protective shell 207 is mounted on the second threaded rod 205. A movable part 208 is mounted inside the protective shell 207.

[0059] In use, the movable frame 203 is moved by the third cylinder 202. By setting the movable frame 203, the second threaded rod 205 can be protected, and the protective shell 207 can be limited. The fixing part 204 is used to fix the movable frame 203.

[0060] In addition, the protective shell 207 is moved by the second threaded rod 205. The protective shell 207 is used to protect the moving part 208, thereby adjusting the welding position.

[0061] More specifically, the fixing member 204 includes a limiting plate 204a, a first threaded rod 204b, a first turntable 204c, and a second clamping plate 204d;

[0062] The limiting plate 204a is fixed to the outside of the movable frame 203. A first threaded rod 204b is provided on the limiting plate 204a. A first turntable 204c is provided at one end of the first threaded rod 204b, and a second clamping plate 204d is provided at the other end of the first threaded rod 204b.

[0063] By setting the limiting plate 204a, the first threaded rod 204b can be limited, and the protective shell 207 can be driven by the first threaded rod 204b.

[0064] The first turntable 204c can drive the first threaded rod 204b to rotate, and at the same time fix the movable frame 203 through the second clamping plate 204d.

[0065] The movable component 208 includes a motor 208a, a third threaded rod 208b, a second movable block 208c, and a welding head 208d;

[0066] The motor 208a is housed inside the protective shell 207, and its output end is connected to the third threaded rod 208b.

[0067] The third threaded rod 208b is threadedly connected to a second movable block 208c, and a welding head 208d is provided on the second movable block 208c.

[0068] Motor 208a drives the third threaded rod 208b to rotate, which in turn drives the second movable block 208c to move, thereby adjusting the position of the welding head 208d.

[0069] When using this solution, the chip to be soldered is first placed on the workbench 1. According to the size of the chip, the first cylinder 103a is started. The first cylinder 103a drives the toothed plate 103b to move. The toothed plate 103b drives the gear 103c to move. The gear 103c drives the positive and negative threaded rod 103d to rotate. The positive and negative threaded rod 103d drives the movable plate 102 to move.

[0070] Then the second cylinder 108b is activated, which drives the first movable block 108c to move. The first movable block 108c drives the push rod 108e to move, and the clamping arm 108d drives the first clamping plate 108f to clamp and fix the chip.

[0071] Then, by rotating the second turntable 206, the second turntable 206 drives the second threaded rod 205 to move, and the second threaded rod 205 drives the protective shell 207 to move, thereby adjusting the welding position of the chip on the Y-axis. By starting the motor 208a, the motor 208a drives the third threaded rod 208b to rotate, and the third threaded rod 208b drives the second movable block 208c to move. The second movable block 208c drives the welding head 208d to move, and the welding head 208d welds the chip, thereby adjusting the welding position of the chip on the X-axis.

[0072] Finally, the third cylinder 202 is activated, which moves the movable frame 203, thereby driving the welding head 208d to weld the chip.

[0073] The above embodiments illustrate and describe the basic principles and main features of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from the spirit and scope of the invention, and all such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A fixture for disassembling, modifying, and soldering BGA packaged chips, characterized in that, Includes an adjustment assembly (100) and a welding assembly (200); The welding assembly (200) is mounted on the adjustment assembly (100); The adjustment component (100) is used to adjust and fix the workpiece according to the size of the workpiece to be welded; The welding assembly (200) is used to weld the workpiece.

2. The fixture for disassembling, modifying, and soldering BGA packaged chips according to claim 1, characterized in that, The adjustment assembly (100) includes a worktable (101), a movable plate (102), a drive component (103), a fixed plate (104), a first limiting rod (105), a second limiting rod (106), a placement frame (107), and a clamping component (108). The movable plates (102) are symmetrically arranged on the inner walls of both sides of the workbench (101), and fixed plates (104) are respectively arranged on the inner sides of the movable plates (102) on both sides; A driving component (103) is provided between the two fixed plates (104), and the output end of the driving component (103) passes through the fixed plate (104) and is connected to the two movable plates (102). A second limiting rod (106) is provided between the movable plates (102) on both sides, and a first limiting rod (105) is provided between the fixed plate (104) and the movable plate (102) on the same side; Multiple placement frames (107) are provided on the inner side of the movable plate (102), and clamping members (108) are provided in the placement frames (107).

3. The fixture for disassembling, modifying, and soldering BGA packaged chips according to claim 2, characterized in that, The drive unit (103) includes a first cylinder (103a), a gear plate (103b), a gear (103c), and a positive and negative threaded rod (103d); The first cylinder (103a) is mounted on the workbench (101). The output end of the first cylinder (103a) is provided with a toothed plate (103b). The toothed plate (103b) meshes with a gear (103c). The gear (103c) is provided with a positive and negative threaded rod (103d). The other end of the positive and negative threaded rod (103d) passes through the fixed plate (104) and the movable plate (102).

4. The fixture for disassembling, modifying, and soldering BGA packaged chips according to claim 2, characterized in that, The clamping member (108) includes a housing (108a), a second cylinder (108b), a first movable block (108c), a clamping arm (108d), a push rod (108e), and a first clamping plate (108f); The outer shell (108a) is disposed inside the placement frame (107), and a second cylinder (108b) is disposed inside the outer shell (108a). The output end of the second cylinder (108b) is connected to a first movable block (108c), and a push rod (108e) is disposed on the first movable block (108c). A clamping arm (108d) is also rotatably connected to the outer casing (108a), and the push rod (108e) is connected to the clamping arm (108d); A first clamping plate (108f) is provided on the clamping arm (108d).

5. The fixture for disassembling, modifying, and soldering BGA packaged chips according to claim 2, characterized in that, The welding assembly (200) includes a bracket (201), a third cylinder (202), a movable frame (203), a fixing component (204), a second threaded rod (205), a second turntable (206), a protective shell (207), and a moving component (208); The bracket (201) is set on the workbench (101), and a third cylinder (202) is set on the bracket (201). The output end of the third cylinder (202) is connected to the movable frame (203). The movable frame (203) is set on the bracket (201), the movable frame (203) is set with a fixing part (204), the movable frame (203) is set with a second threaded rod (205), the other end of the second threaded rod (205) is set with a second turntable (206), the second threaded rod (205) is set with a protective shell (207), and the protective shell (207) is set with a movable part (208).

6. The fixture for disassembling, modifying, and soldering BGA packaged chips according to claim 5, characterized in that, The fixing member (204) includes a limiting plate (204a), a first threaded rod (204b), a first turntable (204c), and a second clamping plate (204d); The limiting plate (204a) is fixed on the outside of the movable frame (203). A first threaded rod (204b) is provided on the limiting plate (204a). A first turntable (204c) is provided at one end of the first threaded rod (204b), and a second clamping plate (204d) is provided at the other end of the first threaded rod (204b).

7. The fixture for disassembling, modifying, and soldering BGA packaged chips according to claim 5, characterized in that, The moving part (208) includes a motor (208a), a third threaded rod (208b), a second movable block (208c), and a welding head (208d); The motor (208a) is housed inside the protective casing (207), and its output end is connected to the third threaded rod (208b); The third threaded rod (208b) is threadedly connected to a second movable block (208c), and a welding head (208d) is provided on the second movable block (208c).

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