A processing device for processing a wafer with double-side positioning

Abstract

The utility model discloses a kind of processing devices of double-sided positioning processing wafer, including pedestal, and laser processing mechanism, processing fixture, lower camera and upper camera being located on pedestal;The laser processing mechanism is used to carry out laser processing to the wafer to be processed placed on processing fixture;Wafer placement area is provided on the processing fixture, and multiple positioning through holes are provided in wafer placement area and are penetrated;The lower camera is used to shoot multiple positioning through holes from below;The upper camera is used to shoot wafer placement area from above;When the front of the wafer to be processed is placed downward, laser processing mechanism is used to carry out punching treatment to the wafer to be processed;When the front of the wafer to be processed is placed upward, laser processing mechanism is used to carry out slotting treatment to the wafer to be processed;This scheme can minimize the quality influence of laser ablation product on wafer chip circuit, solve the chip processing technology problem of this kind of special needs.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer processing, and in particular to a processing device for double-sided positioning wafer processing. Background Technology

[0002] When wafer fabs need to perform processes such as grooving and drilling on wafers, the laser cutting process will rapidly generate a large amount of ablation products. Before the wafer is penetrated, the ablation products will spray back and contaminate the wafer surface, and some ablation products may even stick to the wafer surface. This will bring huge losses and difficulties to wafer quality and subsequent processes.

[0003] Therefore, how to reduce the contamination of wafers by ablation products, improve wafer manufacturing process requirements, and enhance product quality has become an urgent problem to be solved. Utility Model Content

[0004] The purpose of this invention is to provide a processing device for double-sided positioning and processing of wafers, so as to solve the problem of ablation product contamination that is easily generated during wafer processing in the prior art.

[0005] To address the aforementioned technical problems, this utility model provides a processing apparatus for double-sided positioning wafer processing, including a base, a laser processing mechanism, a processing fixture, a lower camera, and an upper camera mounted on the base; the laser processing mechanism is located above the processing fixture and is used to perform laser processing on the wafer to be processed placed on the processing fixture; the processing fixture has a wafer placement area for placing the wafer to be processed with its front side facing up or down, and the wafer placement area has multiple positioning through holes, all of which penetrate the upper and lower surfaces of the wafer placement area. The lower camera is positioned below the wafer placement area and is used to capture images of the multiple positioning vias. The upper camera is positioned above the wafer placement area and is used to capture images of the wafer placement area. When the wafer to be processed is placed face down, the laser processing mechanism performs drilling on the wafer based on the image captured by the lower camera. When the wafer to be processed is placed face up, the laser processing mechanism performs grooving on the wafer based on the image captured by the upper camera.

[0006] In one embodiment, the laser processing mechanism includes a laser source and a laser reflector group; the laser emission direction of the laser source is horizontally aligned with the laser input end of the laser reflector group; the laser output direction of the laser reflector group is arranged vertically downwards.

[0007] In one embodiment, a lower reflector is provided below the wafer placement area, the lower reflector being used to reflect the image of the wafer placement area to the shooting position of the lower camera.

[0008] In one embodiment, an upper reflector is provided above the wafer placement area, the upper reflector being used to reflect the image of the wafer placement area to the shooting position of the upper camera.

[0009] In one embodiment, the base is provided with a moving mechanism for controlling the relative position movement of the laser processing mechanism and the processing fixture.

[0010] In one embodiment, the moving mechanism includes a first moving control unit and a second moving control unit; the first moving control unit is provided with the laser processing mechanism and is used to control the laser processing mechanism to move horizontally; the second moving control unit is provided with the processing fixture and is used to control the processing fixture to move horizontally, and the horizontal movement direction of the processing fixture is perpendicular to the horizontal movement direction of the laser processing mechanism.

[0011] The beneficial effects of this utility model are as follows:

[0012] This embodiment can minimize the impact of laser ablation products on the quality of wafer chip circuits, solve the chip processing technology problem with such special needs, and this device can improve the yield of such chips from the original 70% to 90%. It has high processing accuracy and good effect, which is more in line with the current production development needs. Attached Figure Description

[0013] To more clearly illustrate the technical solution of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0014] Figure 1 This is a structural schematic diagram provided by an embodiment of the present utility model;

[0015] Figure 2 yes Figure 1 A schematic diagram of the side view structure;

[0016] Figure 3 yes Figure 1 A partial structural diagram;

[0017] Figure 4 yes Figure 3A top view of the machining fixture.

[0018] The attached figures are labeled as follows:

[0019] 100. Base;

[0020] 200. Laser processing mechanism; 210. Laser source; 220. Laser reflector assembly; 230. Laser emission path;

[0021] 300. Machining fixture; 310. Wafer placement area; 311. Positioning via;

[0022] 400. Lower camera; 410. Lower camera path;

[0023] 500. Install the camera; 510. Install the camera path;

[0024] 600. Lower reflecting mirror;

[0025] 700. Add a reflector;

[0026] 800, Moving mechanism; 810, First moving control unit; 820, Second moving control unit. Detailed Implementation

[0027] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0028] This utility model provides a processing apparatus for double-sided positioning and processing wafers, the implementation of which is as follows: Figures 1 to 4 As shown, the system includes a base 100, a laser processing mechanism 200, a processing fixture 300, a lower camera 400, and an upper camera 500 mounted on the base 100. The laser processing mechanism 200 is positioned above the processing fixture 300 and is used to perform laser processing on the wafer to be processed placed on the processing fixture 300. The processing fixture 300 has a wafer placement area 310 for placing the wafer to be processed with its front side facing up or down. The wafer placement area 310 has multiple positioning through holes 311, which penetrate the upper and lower surfaces of the wafer placement area 310. The lower camera... The lower camera 400 is positioned below the wafer placement area 310 and is used to capture images of multiple positioning through holes 311. The upper camera 500 is positioned above the wafer placement area 310 and is used to capture images of the wafer placement area 310. When the wafer to be processed is placed face down, the laser processing mechanism 200 performs drilling on the wafer based on the image captured by the lower camera 400. When the wafer to be processed is placed face up, the laser processing mechanism 200 performs grooving on the wafer based on the image captured by the upper camera 500.

[0029] When applying the application, please refer to the following steps:

[0030] Step 1: Place the wafer to be processed face down in the wafer placement area 310. At this time, the positioning marks on the front of the wafer to be processed will be exposed in multiple positioning through holes 311. Therefore, the lower camera 400 can be used to take pictures of the multiple positioning marks in the multiple positioning through holes 311 to achieve high-precision positioning of the wafer to be processed. Then, the laser processing mechanism 200 can be used to drill holes on the back of the wafer to be processed until all the required drilling areas have been drilled. Then, the next step can be carried out.

[0031] Step 2: After all the drilling operations on the wafer to be processed are completed, place the wafer to be processed back into the wafer placement area 310 with the front side facing up.

[0032] Step 3: Use the upper camera 500 to take pictures of the wafer to be processed in the wafer placement area 310 to obtain the position information of multiple positioning marks on the front of the wafer to be processed, so as to achieve high-precision positioning of the wafer to be processed.

[0033] Step 4: Use the laser processing mechanism 200 to perform grooving on the front side of the wafer to be processed. The grooving position is between the holes formed by the aforementioned drilling process.

[0034] Compared to existing technologies that directly perform laser drilling and grooving from the front side of the wafer, the first step of this embodiment involves drilling from the back side of the wafer to be processed. Therefore, even if ablation products are generated, their main distribution location is on the back side of the wafer to be processed, thereby reducing the impact on the front side of the wafer to be processed during drilling.

[0035] Moreover, since all the required machining holes of the wafer to be processed have been formed at this time, by adopting the operation method of step four, even if the grooving operation is performed on the wafer to be processed from the front, the impact of the ablation products on the front of the wafer to be processed will be greatly reduced.

[0036] It should be noted that this embodiment uses both an upper camera 500 and a lower camera 400 for shooting and positioning, which ensures that the original single-sided processing operation can be transformed into a double-sided processing operation. Therefore, to improve the accuracy of shooting and positioning, the upper camera 500 and the lower camera 400 can preferably be designed using a CCD + high-definition lens.

[0037] In summary, this embodiment can minimize the impact of laser ablation products on the quality of wafer chip circuits, solve the chip processing technology problem with such special needs, and improve the yield of such chips from 70% to 90%. It has high processing accuracy, good effect, and is more in line with the current production development needs.

[0038] like Figure 3 As shown, in this embodiment, the laser processing mechanism 200 includes a laser source 210 and a laser reflector group 220; the laser emission direction of the laser source 210 is horizontally aligned with the laser input end of the laser reflector group 220; the laser output direction of the laser reflector group 220 is arranged vertically downwards.

[0039] exist Figure 3 In the direction shown, the laser source 210 of this embodiment emits laser light horizontally from left to right, while the laser reflector group 220 is composed of multiple reflectors, thereby ultimately changing the laser emission path 230 to emit light downwards.

[0040] For example, the first mirror of the laser reflector group 220 can reflect the horizontally incident laser in a vertical downward manner, then the second mirror reflects the vertically incident laser horizontally from left to right, and finally the third mirror reflects the horizontally incident laser vertically downward onto the wafer to be processed, thereby realizing laser processing of the wafer to be processed.

[0041] like Figure 3 and Figure 4 As shown, in this embodiment, a lower reflector 600 is provided below the wafer placement area 310. The lower reflector 600 is used to reflect the image of the wafer placement area 310 to the shooting position of the lower camera 400.

[0042] exist Figure 3 and Figure 4 In the indicated direction, the image of the wafer placement area 310 can be projected downwards into the lower reflector 600, and then the lower reflector 600 can reflect the image from right to left to the lower camera 400, thereby forming the lower camera path 410, which enables the lower camera 400 to capture the wafer placement area 310.

[0043] like Figure 3 and Figure 4 As shown, in this embodiment, an upper reflector 700 is provided above the wafer placement area 310. The upper reflector 700 is used to reflect the image of the wafer placement area 310 to the shooting position of the upper camera 500.

[0044] exist Figure 3 and Figure 4In the indicated direction, the image of the wafer placement area 310 can be projected upwards into the upper reflector 700, and then the upper reflector 700 can reflect the image from right to left to the upper camera 500, thereby forming the upper camera path 510, which enables the upper camera 500 to capture the wafer placement area 310.

[0045] like Figure 1 and Figure 2 As shown, in this embodiment, the base 100 is provided with a moving mechanism 800. The moving mechanism 800 is used to control the relative position movement of the laser processing mechanism 200 and the processing fixture 300, thereby realizing the processing requirements of the laser processing mechanism 200 for different parts of the wafer to be processed.

[0046] Specifically, such as Figure 1 and Figure 2 As shown, in this embodiment, the moving mechanism 800 includes a first moving control unit 810 and a second moving control unit 820. The first moving control unit 810 is equipped with a laser processing mechanism 200 and is used to control the laser processing mechanism 200 to move horizontally. The second moving control unit 820 is equipped with a processing fixture 300 and is used to control the processing fixture 300 to move horizontally, and the horizontal movement direction of the processing fixture 300 is perpendicular to the horizontal movement direction of the laser processing mechanism 200.

[0047] Therefore, by adopting this configuration, the needs of the laser processing mechanism 200 and the processing fixture 300 for various processing position changes can be met.

[0048] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.

Claims

1. A processing apparatus for double-sided positioning and processing wafers, characterized in that, Includes a base, and a laser processing mechanism, a processing fixture, a lower camera, and an upper camera mounted on the base; The laser processing mechanism is located above the processing fixture, and the laser processing mechanism is used to perform laser processing on the wafer to be processed placed on the processing fixture; The processing fixture is provided with a wafer placement area for placing the wafer to be processed in a face-up or face-down manner. The wafer placement area is provided with a plurality of positioning through holes, and the plurality of positioning through holes penetrate the upper and lower surfaces of the wafer placement area. The lower camera is positioned below the wafer placement area and is used to capture images of the multiple positioning vias. The upper camera is positioned above the wafer placement area and is used to capture images of the wafer placement area. When the wafer to be processed is placed face down, the laser processing mechanism is used to perform drilling on the wafer to be processed based on the shooting results of the lower camera; When the wafer to be processed is placed with its front side facing up, the laser processing mechanism performs grooving on the wafer based on the image captured by the upper camera.

2. The processing apparatus according to claim 1, characterized in that, The laser processing mechanism includes a laser source and a laser reflector assembly; The laser emission direction of the laser source is horizontally aligned with the laser input end of the laser reflector assembly; The laser output direction of the laser reflector group is arranged vertically downwards.

3. The processing apparatus according to claim 1, characterized in that, A lower reflector is provided below the wafer placement area, and the lower reflector is used to reflect the image of the wafer placement area to the shooting position of the lower camera.

4. The processing apparatus according to claim 1, characterized in that, An upper reflector is provided above the wafer placement area, and the upper reflector is used to reflect the image of the wafer placement area to the shooting position of the upper camera.

5. The processing apparatus according to claim 1, characterized in that, The base is provided with a moving mechanism, which is used to control the relative position movement of the laser processing mechanism and the processing fixture.

6. The processing apparatus according to claim 5, characterized in that, The moving mechanism includes a first moving control unit and a second moving control unit; The first motion control unit is equipped with the laser processing mechanism, and the first motion control unit is used to control the laser processing mechanism to move horizontally; The second motion control unit is equipped with the processing fixture, and the second motion control unit is used to control the processing fixture to move horizontally, and the horizontal movement direction of the processing fixture is perpendicular to the horizontal movement direction of the laser processing mechanism.

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