A wafer flipping device for a silicon wafer screen printer

Abstract

The utility model discloses a kind of turning device for silicon wafer screen printing machine, including motor, drive shaft, carousel, buffer ring, a pair of patch and a pair of cushion block;Drive shaft is connected with motor, and the middle part of drive shaft is equipped with outer convex ring;The middle part of drive shaft is opened keyway shape direct current hole;Carousel includes two carousel pieces installed in the two end faces of outer convex ring, and carousel piece is made of upper and lower arc carousel piece;Buffer ring and cushion block are all made of polycarbonate, and buffer ring is made of upper and lower arc buffer ring;The axial portion of a pair of patch is inserted between chord between upper and lower arc buffer ring two sides, and the radial portion of a pair of patch is fixed on the outer end face of a carousel piece by two axial screws;A pair of cushion block is respectively installed on the outer side face of the axial portion of a pair of patch by two radial screws, so that the outer side face of a pair of cushion block and the camber surface of upper and lower arc buffer ring form whole round surface.The utility model can make the turning of silicon wafer or directly pass, and expand the use range of turning device.

Description

Technical Field

[0001] This utility model relates to a flipping device for a silicon wafer screen printing machine. Background Technology

[0002] Solar cells are made from silicon wafers through multiple processes including cleaning, texturing, diffusion, etching, coating, printing, and sintering. Before the solar cell manufacturing process, to prevent the printed surface (the light-receiving surface) from being scratched or contaminated during transportation, the silicon wafer is usually placed face down. However, before printing, the printed surface needs to be flipped to face up.

[0003] Screen printing is currently the most common production process for printing solar cells. During the printing process, the solar cells need to be rotated 180 degrees. For some silicon wafers that require double-sided printing, they also need to be rotated before or after certain inspections or specific processes.

[0004] Due to the characteristics and process requirements of silicon wafers, accurate and efficient flipping motion is required. Relying on manual labor would greatly reduce production efficiency and automation, and increase the risk of errors.

[0005] However, due to technological iterations, a new silicon wafer process has been introduced. Silicon wafers do not have a front and back side, so there is no need to flip them. Utility Model Content

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a flipping device for a silicon wafer screen printing machine. It can both flip the silicon wafer and allow the silicon wafer to pass through directly, thereby expanding the scope of application of the equipment.

[0007] The purpose of this utility model is achieved as follows: a flipping device for a silicon wafer screen printing machine, comprising a frame, a motor, a drive shaft, two turntables, two buffer rings, two pairs of pads and two pairs of spacers;

[0008] The motor is mounted on the base plate of the frame via a motor support;

[0009] The drive shaft spans between the rear bearing support and the front bearing support, and the rear end of the drive shaft is connected to the motor shaft via a coupling. Two external convex rings are spaced apart in the middle of the drive shaft. Two keyway-shaped DC holes are spaced apart in the middle of the drive shaft. The length of each DC hole is adapted to the length of the silicon wafer, and the width of each DC hole is greater than the thickness of the silicon wafer. The length center lines of the two DC holes overlap with the length center lines of the two external convex rings, so that the two external convex rings are each divided into upper and lower arc-shaped external convex rings.

[0010] Two turntables are mounted one-to-one on two outer convex rings; each turntable includes two turntable plates mounted one-to-one on the two end faces of the outer convex ring of the drive shaft and two sets of plastic fan ring plates. Each turntable plate is composed of upper and lower arc-shaped turntable plates fixed one-to-one on the end faces of the upper and lower arc-shaped outer convex rings, and the chord spacing of the upper and lower arc-shaped turntable plates is adapted to the width of the DC hole of the drive shaft. Multiple positioning grooves with a width adapted to the thickness of the silicon wafer are radially opened on each of the upper and lower arc-shaped turntable plates. Two sets of plastic fan ring plates are fixed one-to-one on the opposite back faces of the two turntable plates. Each set of plastic fan ring plates is fixed one-to-one between adjacent positioning grooves, and the spacing between adjacent plastic fan ring plates is adapted to the thickness of the silicon wafer.

[0011] The buffer ring is made of polycarbonate; the two buffer rings are installed on the two outer convex rings in a one-to-one correspondence; each buffer ring is composed of upper and lower bow-shaped buffer rings fixed on the arc surface of the upper and lower bow-shaped outer convex rings in a one-to-one correspondence, and the distance between the chords of the upper and lower bow-shaped buffer rings is greater than the width of the DC hole.

[0012] Two pairs of patch blocks are installed on two turntables in a one-to-one correspondence. Each patch block is T-shaped, consisting of a radial portion and an axial portion. The thickness of the radial portion of the patch block matches the thickness of the plastic fan ring. The radial portion of the patch block consists of a vertical section and a horizontal section, forming a horizontal T-shaped plate. Two axial countersunk mounting holes are provided on the vertical section of the radial portion of the patch block. The width of the horizontal section of the radial portion of the patch block matches the spacing between adjacent plastic fan rings on the turntable. The axial portion of the patch block is a long strip with a width that matches the spacing between the chords of the upper and lower arc-shaped buffer rings. The length of the axial portion of the patch block is equal to the sum of the length of the outer convex ring and the thickness of the two turntables. Two radial threaded holes are provided in the middle of the surface of the axial portion of the patch block. The axial portions of a pair of patch blocks are inserted one-to-one between the chords on both sides of the upper and lower arc-shaped buffer rings, so that the radial portions of a pair of patch blocks are located on the outer end face of a turntable, and each of the radial portions of a pair of patch blocks is fixed to the outer end face of the turntable by two axial screws.

[0013] The pad is made of polycarbonate; two pairs of pads are installed on two pairs of supplementary blocks in a one-to-one correspondence; the pad is a rectangular block with an arc surface on its outer side, and the sum of the thickness of the pad and the thickness of the axial part of the supplementary block is equal to the thickness of the buffer ring; two countersunk connection holes are opened on the outer side of the pad, which correspond one-to-one with the two radial threaded holes on the axial part of the supplementary block, so that each pair of pads is installed on the outer side of the axial part of the pair of supplementary blocks by two radial screws in a one-to-one correspondence, so that the outer side of the pair of pads and the arc surface of the upper and lower arc-shaped buffer rings form a complete circle, and the diameter of the complete circle is not less than the diameter of the circle where the bottom of the multiple positioning grooves on the turntable plate is located.

[0014] The aforementioned flipping device for a silicon wafer screen printing machine includes: both the front bearing support and the rear bearing support include a support plate and a bearing fixed to the top of the support plate; two threaded holes are respectively opened on both sides of the middle portion of the support plate of the front bearing support and on both sides of the middle portion of the support plate of the rear bearing support, corresponding one-to-one with the two axial countersunk mounting holes on the radial portion of the two patch blocks; after the two pairs of patch blocks are removed from the turntable, they are temporarily fixed one-to-one on the support plates of the front bearing support and the rear bearing support.

[0015] The features of this invention for a silicon wafer screen printing machine flipping device are:

[0016] 1. By opening a DC hole on the drive shaft and installing a patch and a pad on the DC hole, the silicon wafer can be flipped when the patch and the pad are present; when the patch and the pad are removed, the silicon wafer can pass directly through the drive shaft without flipping, thereby expanding the scope of application of the equipment.

[0017] 2. By installing a buffer ring on the drive shaft and a plastic fan ring on the turntable, it is possible to prevent the silicon wafer from contacting the metal turntable and causing chipping or microcracks. Attached Figure Description

[0018] Figure 1 This is a perspective view of the flipping device for a silicon wafer screen printing machine according to the present invention;

[0019] Figure 2 This is a front view of the flipping device for a silicon wafer screen printing machine according to the present invention;

[0020] Figure 3 yes Figure 2 AA direction view;

[0021] Figure 4 yes Figure 2 BB view in the middle;

[0022] Figure 5 This is a schematic diagram of the drive shaft in the flipping device of this utility model;

[0023] Figure 5a yes Figure 5 CC view in the middle;

[0024] Figure 6 This is a perspective view of the patch block in the flipping device of this utility model. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings.

[0026] Please see Figures 1 to 6The present invention relates to a flipping device for a silicon wafer screen printing machine, comprising a frame (not shown in the figure), a motor 1, a drive shaft 3, two turntables 4, two buffer rings 5, two pairs of pads 6, and two pairs of pads 7.

[0027] Motor 1 is mounted on the base plate of the frame via motor support 10.

[0028] The drive shaft 3 spans between the rear bearing support 32 and the front bearing support 31, and the rear end of the drive shaft 3 is connected to the rotating shaft of the motor 1 via a coupling 2. Both the front bearing support 31 and the rear bearing support 32 include a support plate and a bearing fixed to the top of the support plate. Two threaded holes are opened on both sides of the middle portion of the support plate of the front bearing support 31 and on both sides of the middle portion of the support plate of the rear bearing support 32. Two external convex rings 3A are provided at intervals in the middle portion of the drive shaft 3, and several radially distributed protrusions are evenly distributed on the outer circumference of each external convex ring 3A. The threaded blind holes are provided, and several threaded through holes are evenly distributed axially on the end face of each outer convex ring 3A. Two keyway-shaped DC holes 30 are provided at intervals in the middle of the drive shaft 3. Each DC hole 30 passes through the drive shaft 3, and the length center line of each DC hole 30 overlaps with the length center line of the outer convex ring 3A, so that the two outer convex rings 3A are divided into upper and lower bow-shaped outer convex rings 31a and 31b respectively. The length of each DC hole 30 is adapted to the length of the silicon wafer, and the width of each DC hole 30 is greater than the thickness of the silicon wafer.

[0029] Two turntables 4 are mounted one-to-one on two outer convex rings 3A; each turntable 4 includes two turntable plates 4A and two sets of plastic fan ring plates 4B; the two turntable plates 4A are mounted one-to-one on the two end faces of the outer convex rings 3A of the drive shaft 3, each turntable plate 4A is composed of upper and lower arc-shaped turntable plates, the upper and lower arc-shaped turntable plates are fixed one-to-one on the end faces of the upper and lower arc-shaped outer convex rings 31a and 31b, and the chord spacing of the upper and lower arc-shaped turntable plates is adapted to the width of the DC hole 30 on the drive shaft 3, and multiple positioning grooves 40 with widths adapted to the thickness of the silicon wafer are radially opened on the upper and lower arc-shaped turntable plates; the two sets of plastic fan ring plates 4B are fixed one-to-one on the opposite back faces of the upper and lower arc-shaped turntable plates; each set of plastic fan ring plates 4B is fixed one-to-one between adjacent positioning grooves 40, and the spacing between adjacent plastic fan ring plates 4B is adapted to the thickness of the silicon wafer. To prevent the silicon wafer from coming into direct contact with the metal turntable 4A during flipping, multiple plastic fan rings 4B are installed on each turntable 4A, so that the plastic fan rings 4B contact the silicon wafer, while the turntable 4A serves as a support and reinforcement plate for the plastic fan rings 4B.

[0030] The buffer ring 5 is made of polycarbonate; two buffer rings 5 ​​are installed on two external convex rings 3A in a one-to-one correspondence; each buffer ring 5 is composed of upper and lower arc-shaped buffer rings, which are fixed on the arc surfaces of the upper and lower arc-shaped external convex rings 31a and 31b in a one-to-one correspondence, and the distance between the chords of the upper and lower arc-shaped buffer rings is greater than the width of the DC hole 30.

[0031] Two pairs of patch blocks 6 are installed one-to-one on the two turntables 4; each patch block 6 includes a radial portion 61 and an axial portion 62 in a T-shape. The thickness of the radial portion 61 of the patch block 6 matches the thickness of the plastic fan ring plate 4B. The radial portion 61 of the patch block 6 includes a vertical section and a horizontal section, forming a horizontal T-shaped plate. Two axial countersunk mounting holes are opened on the vertical section 611 of the radial portion 61 of the patch block 6. The width of the horizontal section 612 of the radial portion 61 of the patch block 6 matches the spacing between adjacent plastic fan ring plates 4B. The axial portion 62 of the patch block 6 is a long strip with a width that matches the spacing between the chords of the upper and lower bow-shaped buffer rings. The length of the axial portion 62 of the patch block 6 is equal to the length of the outer convex ring 3A and the thickness of the two turntable plates 4A. Two radial threaded holes are opened in the middle of the surface of the axial part 62 of the patch 6; the axial parts 62 of a pair of patches 6 are inserted one-to-one between the chords on both sides of the upper and lower arc-shaped buffer rings, so that the radial parts 61 of a pair of patches 6 are located on the outer end face of a turntable plate 4A, and the radial parts 61 of a pair of patches 6 are each fixed to the outer end face of the turntable plate 4A by two axial screws, that is, the vertical section of the radial parts 61 of a pair of patches 6 spans between the upper and lower arc-shaped turntable plates of the turntable plate 4A, and the two axial screws of each patch 6 are fixed one-to-one on the upper and lower arc-shaped turntable plates, so that the transverse section of the radial parts 61 of a pair of patches 6 is sandwiched between the inner ends of two adjacent plastic fan ring plates 4B.

[0032] The pad 7 is made of polycarbonate; two pairs of pads 7 are installed on two pairs of supplementary blocks 6 in a one-to-one correspondence. Each pad is a rectangular block with an arc surface on its outer side. The sum of the thickness of the pad 7 and the thickness of the axial part 62 of the supplementary block 6 is equal to the thickness of the buffer ring 5. Two countersunk connection holes are opened on the outer side of the pad 6, which correspond one-to-one with the two radial threaded holes on the axial part 62 of the supplementary block. Each pair of pads 7 is installed on the outer side of the axial part 62 of the pair of supplementary blocks 6 by two radial screws in a one-to-one correspondence. The outer side of the pair of pads 7 and the arc surface of the upper and lower arc-shaped buffer rings form a complete circular surface. The diameter of the complete circular surface is not less than the diameter of the circle where the bottom of the multiple positioning grooves 40 on the turntable plate 4A is located.

[0033] In order to improve efficiency, the flipping device of this utility model for a silicon wafer screen printing machine is equipped with two turntables 4 on the drive shaft 3.

[0034] The working principle of the flipping device for a silicon wafer screen printing machine of this utility model is as follows: Two silicon wafers are fed one by one into the positioning slots 40 of two turntables 4 by two input belts installed on the frame. The control motor 1 drives the drive shaft 3 to rotate, and the drive shaft 3 drives the two turntables 4 to rotate. The two turntables 4 gradually flip the two silicon wafers, so that the silicon wafers are flipped 180°. The silicon wafers are output one by one from the two turntables 4 by two output belts installed on the frame.

[0035] When the silicon wafer is rotated to a vertical position by the turntable 4, the silicon wafer slides down to the bottom of the positioning groove 40 of the turntable plate 4A due to gravity. The buffer ring 5 made of polycarbonate material can prevent the silicon wafer from colliding with the bottom of the positioning groove 40 of the turntable plate 4A and causing chipping or microcracks.

[0036] When the silicon wafer does not need to be flipped and needs to pass directly through the flipping device, the control motor 1 stops rotating, and the two axial screws on each pair of patch blocks 6 are loosened. This allows each pair of patch blocks 6 and a pair of spacers 7 to be removed from the turntable 4A. Then, the drive shaft 3 is rotated to make the two DC holes 30 horizontal, allowing the two silicon wafers to pass through the two DC holes 30 of the drive shaft 3 one-to-one. The disassembled pairs of patch blocks 6, along with the two pairs of spacers 7, can be temporarily fixed to the support plates of the front bearing support 31 and the rear bearing support 32 to prevent loss.

[0037] The above embodiments are for illustrative purposes only and are not intended to limit the present invention. Those skilled in the art can make various changes or modifications without departing from the spirit and scope of the present invention. Therefore, all equivalent technical solutions should also fall within the scope of the present invention and should be defined by the claims.

Claims

1. A flipping device for a silicon wafer screen printing machine, comprising a frame, a motor, a drive shaft, and two turntables; the motor is mounted on the base plate of the frame via a motor support; the drive shaft spans between a rear bearing support and a front bearing support, and the rear end of the drive shaft is connected to the rotating shaft of the motor via a coupling; two externally protruding rings are spaced apart in the middle of the drive shaft; characterized in that... The flipping device also includes two buffer rings, two pairs of padding blocks, and two pairs of shims; Two keyway-shaped DC holes are spaced apart in the middle of the drive shaft. The length of each DC hole is adapted to the length of the silicon wafer, and the width of each DC hole is greater than the thickness of the silicon wafer. The center lines of the lengths of the two DC holes overlap with the center lines of the lengths of the two outer convex rings, so that the two outer convex rings are each divided into upper and lower bow-shaped outer convex rings. Two turntables are mounted one-to-one on two outer convex rings; each turntable includes two turntable plates mounted one-to-one on the two end faces of the outer convex ring of the drive shaft and two sets of plastic fan ring plates. Each turntable plate is composed of upper and lower arc-shaped turntable plates fixed one-to-one on the end faces of the upper and lower arc-shaped outer convex rings, and the chord spacing of the upper and lower arc-shaped turntable plates is adapted to the width of the DC hole of the drive shaft. Multiple positioning grooves with a width adapted to the thickness of the silicon wafer are radially opened on each of the upper and lower arc-shaped turntable plates. Two sets of plastic fan ring plates are fixed one-to-one on the opposite back faces of the two turntable plates. Each set of plastic fan ring plates is fixed one-to-one between adjacent positioning grooves, and the spacing between adjacent plastic fan ring plates is adapted to the thickness of the silicon wafer. The buffer ring is made of polycarbonate; the two buffer rings are installed on the two outer convex rings in a one-to-one correspondence; each buffer ring is composed of upper and lower bow-shaped buffer rings fixed on the arc surface of the upper and lower bow-shaped outer convex rings in a one-to-one correspondence, and the distance between the chords of the upper and lower bow-shaped buffer rings is greater than the width of the DC hole. Two pairs of patch blocks are installed on two turntables in a one-to-one correspondence. Each patch block is T-shaped, consisting of a radial portion and an axial portion. The thickness of the radial portion of the patch block matches the thickness of the plastic fan ring. The radial portion of the patch block consists of a vertical section and a horizontal section, forming a horizontal T-shaped plate. Two axial countersunk mounting holes are provided on the vertical section of the radial portion of the patch block. The width of the horizontal section of the radial portion of the patch block matches the spacing between adjacent plastic fan rings on the turntable. The axial portion of the patch block is a long strip with a width that matches the spacing between the chords of the upper and lower arc-shaped buffer rings. The length of the axial portion of the patch block is equal to the sum of the length of the outer convex ring and the thickness of the two turntables. Two radial threaded holes are provided in the middle of the surface of the axial portion of the patch block. The axial portions of a pair of patch blocks are inserted one-to-one between the chords on both sides of the upper and lower arc-shaped buffer rings, so that the radial portions of a pair of patch blocks are located on the outer end face of a turntable, and each of the radial portions of a pair of patch blocks is fixed to the outer end face of the turntable by two axial screws. The pad is made of polycarbonate; two pairs of pads are installed on two pairs of supplementary blocks in a one-to-one correspondence; the pad is a rectangular block with an arc surface on its outer side, and the sum of the thickness of the pad and the thickness of the axial part of the supplementary block is equal to the thickness of the buffer ring; two countersunk connection holes are opened on the outer side of the pad, which correspond one-to-one with the two radial threaded holes on the axial part of the supplementary block, so that each pair of pads is installed on the outer side of the axial part of the pair of supplementary blocks by two radial screws in a one-to-one correspondence, so that the outer side of the pair of pads and the arc surface of the upper and lower arc-shaped buffer rings form a complete circle, and the diameter of the complete circle is not less than the diameter of the circle where the bottom of the multiple positioning grooves on the turntable plate is located.

2. The flipping device for a silicon wafer screen printing machine according to claim 1, characterized in that; Both the front bearing support and the rear bearing support include a support plate and a bearing fixed to the top of the support plate; two threaded holes are respectively opened on both sides of the middle part of the support plate of the front bearing support and the support plate of the rear bearing support, which correspond one-to-one with the two axial countersunk mounting holes on the radial part of the two patches; when the two pairs of patches are removed from the turntable, they are temporarily fixed one-to-one on the support plates of the front bearing support and the rear bearing support.

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