A fragmentation mechanism
By designing the slicing drive component and water spray component of the slicing mechanism to work together, the problems of unfriendly operation and high cost in the silicon wafer separation process were solved, achieving stable separation and space optimization, and reducing failure rate and labor costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LIANZHI (DALIAN) INTELLIGENT TECH CO LTD
- Filing Date
- 2025-07-02
- Publication Date
- 2026-07-24
AI Technical Summary
Existing technologies for silicon wafer separation suffer from problems such as being unfriendly to operators, high costs, large space requirements, and high failure rates.
A wafer-splitting mechanism was designed, comprising a wafer-splitting drive component and a water spray component. The wafer-splitting component and the water spray component work together through a cylinder to achieve stable separation of silicon wafers.
This achieved stable separation of silicon wafers, reduced the failure rate, shortened the work cycle, reduced labor costs and scrap rate, and optimized the utilization of workshop space.
Smart Images
Figure CN224547352U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of photovoltaic technology, and relates to a wafer-separating mechanism. Specifically, it relates to a mechanism for separating silicon wafers, and more specifically, to the separation of silicon wafers after they have been retrieved. Background Technology
[0002] Currently, after the silicon wafers are debonded and cleaned, and then neatly arranged, they need to be transferred to the next process. However, when using them in the next process, there are too many silicon wafers in a single debonding frame. The actual number required is generally several hundred, depending on the working conditions. At this point, they are usually separated manually. However, this separation method has two problems: firstly, the working environment is not friendly to the operators; secondly, due to the special properties of silicon wafers, it is difficult for humans to control the force applied. Excessive force will cause breakage, while insufficient force will cause them to fall off. If existing robots equipped with robotic arms are used for separation, the cost is high. More importantly, there is a large loss in the workshop. In addition, the workshop occupies a large area, which is difficult to set up and has high costs. Utility Model Content
[0003] The purpose of this invention is to overcome the shortcomings of the aforementioned background technology and provide a wafer-splitting mechanism that is compact in structure, simple to operate, reduces the space required in the workshop, ensures stable silicon wafer separation, maintains stable operating conditions, and has a low failure rate. It also shortens the overall work cycle, reduces labor costs, and decreases the scrap rate.
[0004] The technical solution adopted by this utility model to solve its technical problem is as follows: a segmented mechanism, wherein the segmented driving component of the segmented mechanism is mounted on a fixed base plate. The water spray component B of the segmented mechanism is mounted below the segmented driving component. The segmented mechanism includes a segmented driving component and a water spray component B. The segmented driving component is mounted above the water spray component B. The segmented driving component includes a cylinder. The front end of the cylinder rod is connected to a cylinder connecting plate through a cylinder connector. A guide shaft is connected to each end of the bottom surface of the cylinder connecting plate. The bottom of the guide shaft extends out of the fixed base plate B. A vertical rod is mounted on the inner side of the bottom of the two guide shafts. A segmented component is mounted between the two vertical rods. A water spray block A is mounted on the bottom surface of the fixed base plate.
[0005] The cylinder is fixed to the base plate via a fixed connecting plate. A mounting seat is provided on the base plate, and a cylinder limit pin is provided on the mounting seat. The cylinder limit pin is located below the cylinder connecting plate.
[0006] The water spray block A has several nozzles, which are equidistant from each other and are commercially available products. The water spray block A is connected to the water inlet pipe via a quick connector, and a water pump is installed on the water inlet pipe.
[0007] The segmenting component is a segmenting line or a segmenting plate, with the segmenting line preferably being a fishing line. The segmenting plate is preferably a plastic plate or a flexible plate, and two segmenting components are preferably provided.
[0008] A linear bearing is installed at the connection between the guide shaft and the fixed base plate.
[0009] The water spray assembly B includes two opposing water spray groups. Each water spray group includes a water spray support. The bottom of the water spray support is set on the ground. A water spray block B is set on the upper part of the water spray support. The water spray block B is set at an angle. A long water spray nozzle is set on the top surface of the water spray block B, with the nozzle facing inward. The water spray block B is connected to a water inlet pipe through a quick connector. A water pump is set on the water inlet pipe.
[0010] An adjustment groove is provided on the upper part of the water spray support. The water spray block B is set on the water spray support by bolts and the adjustment groove, and the position of the water spray block B is adjusted by the adjustment groove and bolts.
[0011] The slitting mechanism is used to stably separate the silicon wafers that need to be retrieved from the remaining silicon wafers.
[0012] When the slitting mechanism slits the silicon wafers, the bottom water spray component B and the upper water spray block in the slitting mechanism are opened. The water pump sets the pressure to spray water onto the silicon wafers. The silicon wafers at the spray points are separated under the pressure of the water. At the same time, the upper cylinder drives the slitting component or dividing plate to separate the separated silicon wafers, preventing the silicon wafers from sticking together and separating the silicon wafers that need to be separated from the remaining silicon wafers. The water spraying and the cylinder are carried out synchronously to achieve stable separation of the silicon wafers.
[0013] The advantages of this utility model compared with the prior art are:
[0014] This utility model provides a wafer-separation mechanism with a compact structure and simple operation, reducing the space required in the workshop. Due to the specially designed position of the water spray component B and the combined structural design with the wafer-separation components, stable wafer separation is achieved. Stable wafer separation results in stable operating conditions and a low failure rate. This shortens the overall work cycle, reduces labor costs, and lowers the scrap rate. Attached Figure Description
[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0016] Figure 1 This is a three-dimensional view of the segmentation mechanism of this utility model.
[0017] Figure 2 This is a rear view of the segmentation mechanism of this utility model.
[0018] Figure 3 This is a schematic diagram of the bottom water spray component of the segmented mechanism of this utility model.
[0019] In the diagram: 1. Segmented drive assembly, 2. Water spray assembly B, 101. Cylinder, 102. Guide shaft, 103. Upright pole, 104. Segmented piece, 105. Cylinder connecting plate, 106. Fixed connecting plate, 107. Water spray block A, 108. Mounting base, 109. Linear bearing, 110. Cylinder limit pin, 201. Water spray support, 202. Water spray block B, 203. Adjustment groove, 204. Water spray nozzle. Detailed Implementation
[0020] The present invention will be further described below with reference to the accompanying drawings, but the present invention is not limited to the following embodiments.
[0021] Example 1
[0022] A slicing mechanism, such as Figure 1-3 As shown, the segmentation mechanism includes a segmentation drive assembly 1 and a water spray assembly B2. The segmentation drive assembly 1 is positioned above the water spray assembly B2 and is mounted on a fixed base plate. The segmentation drive assembly 1 includes a cylinder 101. The front end of the cylinder rod of the cylinder 101 is connected to a cylinder connecting plate 105 via a cylinder connector. A guide shaft 102 is connected to each end of the bottom surface of the cylinder connecting plate 105. The bottom of the guide shaft 102 extends out of the fixed base plate. A vertical rod 103 is provided on the inner side of the bottom of the two guide shafts 102. A segmentation component 104 is provided between the two vertical rods 103. A water spray block A107 is provided on the bottom surface of the fixed base plate.
[0023] The segmentation drive assembly 1 of the segmentation mechanism is mounted on a fixed base plate. The segmentation drive assembly 1 is fixed by the fixed base plate and can be fixed above the corresponding conveyor line. The water spray assembly B2 of the segmentation mechanism 4 is located below the segmentation drive assembly 1.
[0024] The cylinder 101 is fixed to the base plate via a fixed connecting plate 106. A mounting base 108 is provided on the base plate, and a cylinder limit pin 110 is provided on the mounting base 108. The cylinder limit pin 110 is located below the cylinder connecting plate 105.
[0025] The water spray block A107 is equipped with several nozzles, which are equidistant from each other and are commercially available products. The water spray block A107 is connected to the water inlet pipe via a quick connector, and a water pump is installed on the water inlet pipe.
[0026] The segment 104 is preferably a fishing line. Two segments 104 are preferably provided.
[0027] A linear bearing 109 is installed at the connection between the guide shaft 102 and the fixed base plate.
[0028] The water spray assembly B2 includes two opposing water spray groups. Each water spray group includes a water spray support 201. The bottom of the water spray support 201 is set on the ground. A water spray block B202 is set on the upper part of the water spray support 201. The water spray block B202 is set at an angle. A long strip water nozzle 204 is set on the top surface of the water spray block B202. The water nozzle 204 is set inward. The water spray block B202 is connected to the water inlet pipe through a quick connector. A water pump is set on the water inlet pipe.
[0029] An adjustment groove 203 is provided on the upper part of the water spray support 201. The water spray block B202 is set on the water spray support 201 by bolts and the adjustment groove 203, and the position of the water spray block B202 is adjusted by the adjustment groove 203 and bolts.
[0030] The distance between the two water spray groups is greater than the width of the channel through which the silicon wafers pass. The height of both water spray groups is lower than the height of the silicon wafer conveyor line or conveyor roller conveyor.
[0031] In operation, the silicon wafers to be separated are conveyed to the separating position of the separating mechanism via an existing conveyor line. The bottom water spray assembly B2 and the upper water spray block A107 are activated, and water at a set pressure from the water pump sprays water onto the silicon wafers. Under the pressure of the water, the wafers separate. At this time, the upper cylinder 101 drives the separating component 104 to further separate the wafers, preventing them from sticking together. Due to the specific positioning and structure of the water spray assembly B2 combined with the positioning of the separating component 104, stable separation of the silicon wafers is achieved. This results in stable wafer separation, stable operation, and a low failure rate.
[0032] Although the present invention has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.
Claims
1. A segmentation mechanism, characterized in that, segmentation The mechanism includes a segmented drive assembly (1) and a water spray assembly B (2). The segmented drive assembly (1) is located above the water spray assembly B (2) and is mounted on a fixed base plate. The segmented drive assembly (1) includes a cylinder (101). The front end of the cylinder rod of the cylinder (101) is connected to the cylinder connecting plate (105) through a cylinder connector. A guide shaft (102) is connected to each end of the bottom surface of the cylinder connecting plate (105). The bottom of the guide shaft (102) extends out of the fixed base plate. A vertical rod (103) is set on the inner side of the bottom of the two guide shafts (102). A segmented piece (104) is set between the two vertical rods (103). A water spray block A (107) is set on the bottom surface of the fixed base plate. The water spray assembly B(2) includes two water spray groups arranged opposite to each other. Each water spray group includes a water spray support (201). The bottom of the water spray support (201) is set on the ground. A water spray block B(202) is set on the upper part of the water spray support (201). The water spray block B(202) is set at an angle. A long water spray nozzle (204) is set on the top surface of the water spray block B(202). The water spray nozzle (204) is set facing inward.
2. The segmentation mechanism as described in claim 1, characterized in that, The segmentation drive component (1) of the segmentation mechanism is set on the fixed base plate.
3. The segmentation mechanism as described in claim 1, characterized in that, The cylinder (101) is fixed to the base plate by a fixed connecting plate (106).
4. The segmentation mechanism as described in claim 1, characterized in that, Several nozzles are set on the water spray block A (107), and the nozzles are set at equal intervals.
5. A segmentation mechanism as described in claim 1, characterized in that, An adjustment groove (203) is provided on the upper part of the water spray support (201). The water spray block B (202) is set on the water spray support (201) by bolts and adjustment groove (203), and the position of the water spray block B (202) is adjusted by adjustment groove (203) and bolts.
6. A segmentation mechanism as described in claim 2, characterized in that, A mounting base (108) is provided on the fixed base plate, and a cylinder limit pin (110) is provided on the mounting base (108). The cylinder limit pin (110) is located below the cylinder connecting plate (105).
7. A segmentation mechanism as described in claim 2, characterized in that, A linear bearing (109) is provided at the connection between the guide shaft (102) and the fixed base plate.
8. A segmentation mechanism as described in claim 4, characterized in that, The water spray block A (107) is connected to the water inlet pipe via a quick connector, and a water pump is installed on the water inlet pipe.
9. A segmentation mechanism as described in claim 4, characterized in that, The water spray block B (202) is connected to the water inlet pipe via a quick connector, and a water pump is installed on the water inlet pipe.