A tinning copper wire hot-dipping process equipment

Abstract

The utility model discloses a kind of tinned copper wire hot-dip process equipment, it is located on base, for the copper wire hot-dip tinning, comprising: limiting unit, it is located on base, for the size limit of copper wire;Hot-dip tank, hot-dip tank is located on base, for the copper wire is carried out hot-dip tinning process;Drying mechanism, it is located on limiting unit, for the copper wire after hot-dip tinning is dried.The tinned copper wire hot-dip process equipment, both solve the problem that tin liquid drop is difficult to handle and material waste in background art, through the reflux tank of drying mechanism bottom receives copper line drop tin liquid, then realizes tin liquid reflux reuse by the reflux hole of hot-dip tank, effectively recycles tin material;And can promote tinning quality and stability, hot-dip tank ultrasonic wave strengthens tinning effect, limiting rod optimizes copper line moving track, heating plate guarantees tin liquid not solidification, cooperate first limiting plate string guide hole and ensure copper line movement stability, second limiting plate string guide hole scrapes extra tin liquid, so that tinning layer is more uniform.

Description

Technical Field

[0001] This utility model relates to the field of copper wire tinning hot-dip technology, specifically to a tin-plating copper wire hot-dip process equipment. Background Technology

[0002] Hot-dip tin plating of copper wire is a common metal surface treatment process. It typically involves immersing cleaned, pre-treated copper wire into molten tin, allowing a uniform tin layer to adhere to the surface before cooling. This tin layer effectively isolates the copper wire from air and moisture, preventing oxidation and corrosion. Furthermore, tin's excellent conductivity ensures the wire's conductivity remains unaffected. Additionally, tin-plated copper wire is easier to solder, simplifying subsequent electrical connection processes.

[0003] According to the utility model patent disclosed in patent application number CN200920279995.4, a copper wire shaping device for a hot-dip tin-plated copper wire production line includes a frame, a drawing die, a first positioning plate, and a second positioning plate. The drawing die, the first positioning plate, and the second positioning plate are fixed above the frame. The copper wire passes horizontally through the drawing die after passing through the center holes of the second positioning plate and the first positioning plate. An air jet mechanism is provided on the frame. This air jet mechanism includes an air jet pipe, a flexible hose, and an air chamber connected to an air source. The air jet pipe is a tube with two or more nozzles arranged at intervals, closed at one end. The other end of the air jet pipe is connected to the air chamber through a flexible hose. The air chamber is fixed to the side of the second positioning plate above the frame. The gas blown from each nozzle of the air jet pipe is directed towards the copper wire. This utility model's copper wire shaping device for a hot-dip tin-plated copper wire production line adopts this structure, which can ensure consistent and stable quality of the tin-plated copper wire and reduce production costs.

[0004] The copper wire shaping device in this hot-dip tin-plated copper wire production line does not have the function of recovering dripping molten tin, which leads to problems such as difficulty in handling the molten tin after it solidifies and waste of materials. Utility Model Content

[0005] The purpose of this invention is to provide a hot-dip tinning process equipment for copper wire to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a hot-dip tinning process device for copper wire, mounted on a base, for hot-dip tinning of copper wire, comprising:

[0007] A limiting unit, which is disposed on the base, is used to limit the size of the copper wire;

[0008] A hot-dip tin plating bath is provided on the base and is used to perform a hot-dip tin plating process on the copper wire.

[0009] A drying mechanism, which is located on the limiting unit, is used to dry the copper wire after hot-dip tin plating.

[0010] Preferably, the hot-dip immersion tank is filled with molten tin, and the hot-dip immersion tank is equipped with ultrasonic waves to enhance the tin plating effect. The hot-dip immersion tank is also equipped with a limiting rod to change the movement trajectory of the copper wire.

[0011] Preferably, the hot dipping bath is further provided with a heating plate to ensure that the molten tin in the hot dipping bath does not solidify.

[0012] Preferably, the limiting unit includes a first limiting plate and a second limiting plate, and both the first limiting plate and the second limiting plate are provided with threading holes;

[0013] The lead-in hole on the first limiting plate is used to ensure the stable movement of the copper wire;

[0014] The lead hole on the second limiting plate is used to scrape off excess molten solder from the copper wire.

[0015] Preferably, the lead hole has rounded corners to facilitate the lead-in connection of the copper wires.

[0016] Preferably, the drying mechanism is located outside the lead-in hole of the second limiting plate.

[0017] Preferably, the drying mechanism is used to dry the copper wire after tin plating. The drying mechanism is equipped with a hot air blower for blowing air onto the copper wire in the drying mechanism. The bottom of the drying mechanism is equipped with a return trough for receiving the molten tin dripping from the copper wire.

[0018] Preferably, the hot immersion tank is further provided with a reflux hole, which is connected to the reflux trough.

[0019] Preferably, the base is further provided with a feeding rod, the feeding rod is provided with a feeding tray, and the copper wire to be hot-dip tinned is wound in the feeding tray.

[0020] Preferably, the base is further provided with a feeding rod, and the feeding rod is provided with a feeding tray, which is used to collect the copper wire after hot-dip tin plating.

[0021] Compared with the prior art, the beneficial effects of this utility model are as follows: This hot-dip tinning process equipment for copper wire not only solves the problems of difficult handling of molten tin dripping and material waste in the prior art, but also improves the quality and stability of tinning. The molten tin dripping from the copper wire is received by the return tank at the bottom of the drying mechanism, and then the molten tin is recycled and reused through the return hole of the hot-dip tank, effectively recovering the tin material. In addition, it can improve the tinning quality and stability. The ultrasonic waves in the hot-dip tank enhance the tinning effect, the limiting rod optimizes the movement trajectory of the copper wire, the heating plate ensures that the molten tin does not solidify, and the first limiting plate stringing hole ensures the stable movement of the copper wire. The second limiting plate stringing hole scrapes off excess molten tin, making the tinning layer more uniform. At the same time, the rounded corners of the stringing hole facilitate the stringing of the copper wire. The loading tray and unloading tray realize the loading and storage of the copper wire respectively. The hot air fan accelerates the drying of the copper wire after tinning. Overall, it improves the production efficiency and convenience, and ensures the stable and consistent quality of the tinned copper wire. Attached Figure Description

[0022] Figure 1 This is a top view of the structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the internal structure of the drying mechanism of this utility model.

[0024] In the diagram: 1. Base; 2. Feeding rod; 21. Feeding tray; 3. First limiting plate; 31. Threading hole; 4. Hot soaking tank; 41. Return hole; 42. Limiting rod; 5. Second limiting plate; 6. Drying mechanism; 61. Hot air blower; 62. Return tank; 7. Discharge rod; 71. Discharge tray; 8. Copper wire. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figures 1-2 This utility model provides a technical solution: a hot-dip tinning process device for copper wire, which is mounted on a base 1. The base 1 also has a feeding rod 2, and a feeding tray 21 on the feeding rod 2. The feeding tray 21 contains copper wire 8 to be hot-dip tinned. The feeding tray 21 can rotate on the feeding rod 2, thereby releasing the copper wire 8 into the hot-dip tinning bath 4 for the hot-dip tinning process. The base 1 also has a discharging rod 7, and a discharging tray 71 on the discharging rod 7. The discharging tray 71 rotates to wind and collect the tinned copper wire 8, thus completing convenient feeding and discharging. The discharging tray 71 is used to collect the tinned copper wire 8 for hot-dip tinning. Includes:

[0027] First, the loading tray 21 placed on the loading rod 2 rotates to release the copper wire 8 coiled in it for hot-dip tinning. The released copper wire 8 enters the hot-dip pool 4 set on the base 1 to complete the hot-dip tinning process. After that, the tin-plated copper wire 8 is conveyed to the unloading rod 7. The unloading tray 71 on the unloading rod 7 rotates to wind the tin-plated copper wire 8, thereby collecting the copper wire 8 and completing the entire loading, tinning and unloading process.

[0028] A limiting unit, located on the base 1, is used to limit the size of the copper wire 8. The limiting unit includes a first limiting plate 3 and a second limiting plate 5. Both the first limiting plate 3 and the second limiting plate 5 are provided with lead-in holes 31. The first limiting plate 3 is used to guide the copper wire 8, thereby ensuring that the subsequent copper wire 8 can enter the hot-dip tin-plating bath 4 stably and smoothly. The lead-in holes 31 on the first limiting plate 3 are used to ensure the stable movement of the copper wire 8. The lead-in holes 31 on the second limiting plate 5 are used to scrape off excess tin liquid on the copper wire 8. After the copper wire 8 completes the hot-dip tin-plating process, the second limiting plate 5 scrapes off the excess tin liquid on the copper wire 8 through the lead-in holes 31, thereby making the copper wire 8 evenly covered with tin liquid. The lead-in holes 31 are rounded to facilitate the lead-in connection of the copper wire 8.

[0029] The limiting unit plays a crucial role: it is mounted on the base 1 and consists of a first limiting plate 3 and a second limiting plate 5. Both plates have lead-in holes 31, which are rounded to facilitate the lead-in of copper wires 8. The copper wires 8 released from the loading tray 21 first pass through the lead-in holes 31 of the first limiting plate 3. The first limiting plate 3 guides the copper wires 8, and the lead-in holes 31 ensure stable movement of the copper wires 8, allowing them to smoothly enter the hot dipping bath 4 for tin plating. After tin plating, the copper wires 8 then pass through the lead-in holes 31 of the second limiting plate 5. These lead-in holes 31 scrape off excess molten tin from the copper wires 8, ensuring that the surface of the copper wires 8 is evenly coated with molten tin. Subsequently, the copper wires 8 are conveyed to the unloading tray 71 for storage.

[0030] Hot dipping tank 4 is located on base 1 and is used for hot dipping copper wire 8 to perform tin plating. Hot dipping tank 4 is filled with molten tin and is equipped with ultrasonic waves to enhance the tin plating effect. After the copper wire 8 passes through the first limiting plate 3, it is guided to the limiting rod 42 and then molten tin is poured into hot dipping tank 4. The hot dipping tank 4 is also equipped with the limiting rod 42 to change the movement trajectory of the copper wire 8 so that the copper wire 8 can be immersed in the molten tin for a long distance. The hot dipping tank 4 is also equipped with a heating plate to ensure that the molten tin in the hot dipping tank 4 does not solidify.

[0031] After the copper wire 8 passes through the first limiting plate 3, it is led onto the limiting rod 42, and then molten tin is poured into the hot immersion bath 4. The heating plate inside the hot immersion bath 4 can ensure that the molten tin in the hot immersion bath 4 will not solidify. After the copper wire 8 passes through the first limiting plate 3, it is led onto the limiting rod 42 in the hot immersion bath 4. The limiting rod 42 can change the movement trajectory of the copper wire 8, so that the copper wire 8 can be immersed in the molten tin for a long distance. At the same time, the ultrasonic waves in the hot immersion bath 4 can play a role in enhancing the tin plating effect on the copper wire 8.

[0032] The drying mechanism 6, located on the limiting unit, is used to dry the copper wire 8 after hot-dip tinning. The drying mechanism 6 is located outside the lead-in hole 31 of the second limiting plate 5. When the copper wire 8 after hot-dip tinning enters the drying mechanism 6 through the lead-in hole 31, the drying mechanism 6 is used to dry the copper wire 8 after tinning. The drying mechanism 6 is equipped with a hot air blower 61, which is used to blow air onto the copper wire 8 in the drying mechanism 6. The bottom of the drying mechanism 6 is equipped with a return tank 62, which is used to receive the molten tin dripping from the copper wire 8. The hot-dip tank 4 is also equipped with a return hole 41, which is connected to the return tank 62 to ensure that the dripping molten tin can flow back into the hot-dip tank 4 for reuse. The bottom of the return tank 62 is equipped with a heating plate to prevent the dripping molten tin from solidifying and sticking in the return tank 62, which could cause blockage after long-term use.

[0033] The drying mechanism 6 is located outside the lead-in hole 31 of the second limiting plate 5 of the limiting unit. After the copper wire 8 is hot-dip tinned, it enters the drying mechanism 6 after passing through the lead-in hole 31. The hot air blower 61 on the drying mechanism 6 blows air into the copper wire 8 inside to dry the tinned copper wire 8. During the drying process, the molten tin dripping from the copper wire 8 is received by the return tank 62 at the bottom of the drying mechanism 6. The heating plate at the bottom of the return tank 62 can prevent the molten tin from solidifying and sticking in the tank, causing blockage. The return tank 62 is connected to the return hole 41 on the hot-dip tank 4, so that the received molten tin can flow back to the hot-dip tank 4 for reuse. The heating plate at the bottom of the return tank 62 can prevent the dripping molten tin from solidifying and sticking in the return tank 62, causing blockage after long-term use.

[0034] When using the hot-dip tinning equipment for copper wire, the copper wire 8 is first connected and arranged. The copper wire 8 to be tinned is coiled in the feeding tray 21 on the feeding rod 2 and sequentially threaded through the threading hole 31 of the first limiting plate 3, the limiting rod 42 in the hot-dip tank 4, the threading hole 31 of the second limiting plate 5, and the drying mechanism 6, finally connecting to the unloading tray 71 on the unloading rod 7, completing the overall path connection of the copper wire from the feeding tray 21 to the unloading tray 71. After the copper wire 8 is connected, molten tin is poured into the hot-dip tank 4, and the heating plate in the hot-dip tank 4 ensures that the tin does not solidify. Then, the feeding tray 21 releases the copper wire 8 by rotating, and the copper wire 8 is placed in the first limiting plate 3. The guide and lead-in hole 31, with rounded corners, facilitates lead-in and moves stably under the action. After the trajectory is changed by the limit rod 42, it is immersed in the molten tin for a long distance. The ultrasonic waves in the hot immersion tank 4 enhance the tin plating effect. The tin-plated copper wire 8 passes through the lead-in hole 31 of the second limit plate 5. Excess molten tin is scraped off to ensure uniform adhesion. Then it enters the drying mechanism 6. The hot air blower 61 blows air to dry it. The molten tin dripping during drying is received by the return tank 62. The heating plate at the bottom of the return tank 62 prevents solidification and blockage. It is also connected to the hot immersion tank 4 through the return hole 41 to realize the reuse of molten tin. Finally, the processed copper wire 8 is rotated and wound by the unloading tray 71 to collect it, completing the whole process.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A hot-dip tinning process device for copper wire, mounted on a base (1), for hot-dip tinning of copper wire (8), characterized in that, include: A limiting unit, which is disposed on the base (1), is used to limit the size of the copper wire (8); Hot dipping tank (4), which is located on the base (1), is used to perform hot dipping tin plating on the copper wire (8); A drying mechanism (6), which is located on the limiting unit, is used to dry the copper wire (8) after hot-dip tin plating.

2. The equipment for hot-dip tinning of copper wire according to claim 1, characterized in that: The hot dip tank (4) is filled with molten tin liquid. The hot dip tank (4) is equipped with ultrasonic waves, which are used to enhance the tin plating effect. The hot dip tank (4) is also equipped with a limiting rod (42), which is used to change the movement trajectory of the copper wire (8).

3. The hot-dip tinning equipment for copper wire according to claim 2, characterized in that: The hot immersion tank (4) is also equipped with a heating plate to ensure that the molten tin in the hot immersion tank (4) does not solidify.

4. The hot-dip tinning equipment for copper wire according to claim 1, characterized in that: The limiting unit includes a first limiting plate (3) and a second limiting plate (5), and both the first limiting plate (3) and the second limiting plate (5) are provided with threading holes (31); The lead hole (31) on the first limiting plate (3) is used to ensure the stable movement of the copper wire (8); The lead hole (31) on the second limiting plate (5) is used to scrape off excess molten tin from the copper wire (8).

5. The hot-dip tinning equipment for copper wire according to claim 4, characterized in that: The lead hole (31) has rounded corners to facilitate the lead connection of the copper wire (8).

6. The equipment for hot-dip tinning of copper wire according to claim 4 or 5, characterized in that: The drying mechanism (6) is located outside the lead hole (31) of the second limiting plate (5).

7. The hot-dip tinning equipment for copper wire according to claim 6, characterized in that: The drying mechanism (6) is used to dry the copper wire (8) after tin plating. The drying mechanism (6) is equipped with a hot air blower (61) for blowing air onto the copper wire (8) in the drying mechanism (6). The bottom of the drying mechanism (6) is equipped with a return trough (62) for receiving the molten tin dripping from the copper wire (8).

8. The hot-dip tinning equipment for copper wire according to claim 7, characterized in that: The hot immersion tank (4) is also provided with a reflux hole (41), which is connected to the reflux trough (62).

9. The equipment for hot-dip tinning of copper wire according to claim 1, characterized in that: The base (1) is also provided with a feeding rod (2), and the feeding rod (2) is provided with a feeding tray (21), in which the copper wire (8) to be hot-dip tinned is coiled.

10. The equipment for hot-dip tinning of copper wire according to claim 1, characterized in that: The base (1) is also provided with a feeding rod (7), and the feeding rod (7) is provided with a feeding tray (71), which is used to collect the copper wire (8) after hot-dip tin plating.

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