Electroplating apparatus for chip processing

Abstract

The utility model discloses a kind of electroplating equipment for chip processing, including shell, the top hinged cover plate of shell, the both sides of shell inside are fixedly connected with anode plate, the inside of shell is provided with storage rack, the front and back of storage rack inside are all set to limit slot, connecting mechanism, connecting mechanism includes the mounting bracket of fixed connection in the inside bottom of shell, the inside fixed connection of mounting bracket has magnet block one.The utility model is connected by setting mounting bracket, connecting block, magnet block one and magnet block two, storage rack is connected with shell, because it is connected using the magnetic force of magnet block one and magnet block two, worker is convenient to take out storage rack from shell, it is convenient for worker to replace in semiconductor, and because the bottom of connecting block is located in storage rack inside, avoid electroplating equipment when being impacted, storage rack collides with shell because of impact, finally improve the security of electroplating equipment.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, specifically to an electroplating device for chip processing. Background Technology

[0002] A chip is a miniature circuit that integrates a large number of electronic components onto tiny semiconductor materials using semiconductor technology. It performs functions such as data processing and signal control. Semiconductors are used in chip manufacturing. During chip processing, electroplating equipment is needed to deposit a metal film onto the semiconductor surface. For example, patent application number 201911072096.1, entitled "A Semiconductor Electroplating Equipment," describes an electroplating tank with an external circulation tank on one side, containing an external circulation component. A filter component is installed on the connecting pipe at the outlet. The electroplating tank also contains a clamping device with two sets of clamping devices. An airflow assembly is located at the top center. The clamping device includes a first clamping rod, a second clamping rod, a clamping groove, a connecting spring, and a limiting assembly. Magnetic sheets are symmetrically arranged within the clamping groove, with the center of the magnetic sheets used to fix the wafer. By symmetrically arranging magnetic sheets within the clamping groove, the wafer can be suspended and fixed within the clamping groove by the relative attraction of the magnetic sheets, allowing the wafer to suspend in the electroplating solution within the electroplating tank. By setting up an air pump and air guide pipe, air can be injected to make the wafer roll in the clamping groove, ensuring more thorough and uniform electroplating. An external circulation assembly allows for the recycling of the electroplating solution.

[0003] The aforementioned technologies have the following drawbacks: because the clamping device of the electroplating equipment is located inside the electroplating tank, workers need to replace the semiconductors inside the electroplating tank. Although workers wear gloves and other protective equipment, they are prone to making mistakes during the semiconductor replacement process, which can cause their skin to come into contact with the electroplating solution. The electroplating solution can cause harm to the human body, thus reducing the safety of the electroplating equipment.

[0004] Therefore, it is necessary to redesign and modify the electroplating equipment to effectively prevent safety issues. Utility Model Content

[0005] To address the problems mentioned in the background art, the purpose of this utility model is to provide an electroplating device for chip processing, which has the advantage of improving the safety of electroplating equipment and solves the problem of low safety of electroplating equipment.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an electroplating device for chip processing, comprising a housing, a cover plate hinged to the top of the housing, an anode plate fixedly connected to both sides inside the housing, a storage rack provided inside the housing, and a limiting groove provided on the front and back sides inside the storage rack.

[0007] The connecting mechanism includes a mounting bracket fixedly connected to the bottom of the inner shell. A first magnet block is fixedly connected inside the mounting bracket. A connecting block is fixedly connected to the bottom of the storage rack. The bottom of the connecting block extends into the inner shell of the mounting bracket. A second magnet block is fixedly connected inside the connecting block. The first magnet block and the second magnet block are magnetically connected. An auxiliary mechanism is provided on the surface of the mounting bracket. A purification mechanism is provided on the back of the outer shell.

[0008] As a preferred embodiment of this utility model, the auxiliary mechanism includes drainage holes respectively opened on both sides of the mounting frame, and an insulating film is fixedly connected inside both the mounting frame and the connecting block. The outer side of the insulating film is movably connected to the top of the first magnet block and the bottom of the second magnet block.

[0009] As a preferred embodiment of this utility model, the purification mechanism includes an auxiliary shell fixedly connected to the back of the outer shell, a ventilation opening on the back of the auxiliary shell, a partition fixedly connected inside the auxiliary shell, a fan fixedly connected to the back of the outer shell and located inside the auxiliary shell, the front of the fan extending into the interior of the outer shell, and an air intake mechanism provided on the top of the cover plate.

[0010] As a preferred embodiment of this utility model, the air intake mechanism includes an air intake pipe fixedly connected to the top of the cover plate. The bottom of the air intake pipe penetrates the cover plate and extends into the interior of the outer shell. A one-way valve is fixedly connected inside the air intake pipe, and the top of the one-way valve extends to the outside of the air intake pipe.

[0011] As a preferred embodiment of this utility model, a water baffle is provided on the front of the fan, and the interior of the water baffle is fixedly connected to the back of the interior of the outer casing.

[0012] As a preferred embodiment of this utility model, the lifting handle fixedly connected to the top of the storage rack has an anti-slip rubber sleeve fixedly connected to its surface.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model connects the storage rack to the outer shell by setting up a mounting bracket, a connecting block, a first magnet block, and a second magnet block. Because the connection is made by the magnetic force of the first magnet block and the second magnet block, it is convenient for workers to take the storage rack out of the outer shell, making it easy for workers to replace semiconductors. Furthermore, because the bottom of the connecting block is located inside the storage rack, it prevents the storage rack from colliding with the outer shell due to impact when the electroplating equipment is subjected to impact, thus ultimately improving the safety of the electroplating equipment.

[0015] 2. By setting a drainage hole, the electroplating liquid inside the mounting bracket will be discharged from the inside of the mounting bracket during the process of inserting the connecting block into the mounting bracket. The insulating film protects the first and second magnet blocks, preventing the first and second magnet blocks from coming into contact with the electroplating liquid and causing them to rust and be damaged due to moisture. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a perspective view of a partial part of the outer shell of this utility model;

[0018] Figure 3 This is a perspective view of a partial part of the storage rack of this utility model;

[0019] Figure 4 This is a perspective view of a portion of the mounting bracket of this utility model;

[0020] Figure 5 This is a perspective view of a partial part of the auxiliary shell of this utility model;

[0021] Figure 6 This is a perspective view of a partial component of the water baffle of this utility model;

[0022] Figure 7 This utility model Figure 2 Enlarged structural diagram at point A in the middle.

[0023] In the diagram: 1. Outer shell; 2. Cover plate; 3. Anode plate; 4. Storage rack; 5. Limiting groove; 6. Mounting bracket; 7. Magnet block one; 8. Connecting block; 9. Magnet block two; 10. Drain hole; 11. Insulating film; 12. Auxiliary shell; 13. Ventilation opening; 14. Partition plate; 15. Fan; 16. Air inlet pipe; 17. One-way valve; 18. Water baffle; 19. Lifting handle; 20. Anti-slip rubber sleeve. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] like Figures 1 to 7As shown, the present invention provides an electroplating device for chip processing, including a housing 1, a cover plate 2 hinged to the top of the housing 1, an anode plate 3 fixedly connected to both sides inside the housing 1, a storage rack 4 provided inside the housing 1, and a limiting groove 5 provided on the front and back sides inside the storage rack 4.

[0026] The connecting mechanism includes a mounting bracket 6 fixedly connected to the bottom of the inner shell 1. A magnet block 7 is fixedly connected inside the mounting bracket 6. A connecting block 8 is fixedly connected to the bottom of the storage rack 4. The bottom of the connecting block 8 extends into the interior of the mounting bracket 6. A magnet block 9 is fixedly connected inside the connecting block 8. The magnet block 7 and the magnet block 9 are magnetically connected. An auxiliary mechanism is provided on the surface of the mounting bracket 6. A purification mechanism is provided on the back of the outer shell 1.

[0027] refer to Figure 4 The auxiliary mechanism includes drainage holes 10 respectively opened on both sides of the mounting frame 6. The mounting frame 6 and the connecting block 8 are both fixedly connected with insulating films 11. The outer side of the insulating film 11 is movably connected to the top of the first magnet block 7 and the bottom of the second magnet block 9 respectively.

[0028] As a technical optimization of this utility model, by setting a drain hole 10, during the process of inserting the connecting block 8 into the mounting bracket 6, the electroplating liquid inside the mounting bracket 6 will be discharged from its interior through the drain hole 10. The insulating film 11 is used to protect the first magnet block 7 and the second magnet block 9, so as to prevent the first magnet block 7 and the second magnet block 9 from contacting the electroplating liquid, so that the first magnet block 7 and the second magnet block 9 will rust and be damaged due to moisture.

[0029] refer to Figure 5 The purification mechanism includes an auxiliary shell 12 fixedly connected to the back of the outer shell 1. A ventilation port 13 is provided on the back of the auxiliary shell 12. A partition 14 is fixedly connected inside the auxiliary shell 12. A fan 15 located inside the auxiliary shell 12 is fixedly connected to the back of the outer shell 1. The front of the fan 15 extends into the interior of the outer shell 1. An air intake mechanism is provided on the top of the cover plate 2.

[0030] As a technical optimization of this utility model, by setting up a fan 15, the exhaust gas generated in the outer shell 1 due to electroplating is drawn into the auxiliary shell 12, and the exhaust gas is absorbed and purified by the absorbent in the auxiliary shell 12, so as to prevent the exhaust gas from being discharged from the electroplating equipment and inhaled by the workers, which would affect the workers' health.

[0031] refer to Figure 7 The air intake mechanism includes an air intake pipe 16 fixedly connected to the top of the cover plate 2. The bottom of the air intake pipe 16 passes through the cover plate 2 and extends into the interior of the housing 1. A one-way valve 17 is fixedly connected inside the air intake pipe 16, and the top of the one-way valve 17 extends to the outside of the air intake pipe 16.

[0032] As a technical optimization of this utility model, by setting an air inlet pipe 16 and a one-way valve 17, external air is allowed to enter the outer shell 1, so that the air pressure inside the outer shell 1 is consistent with the external air pressure. This avoids the situation where the air pressure inside the outer shell 1 is too low, causing the fan 15 to be unable to draw the exhaust gas inside the outer shell 1 into the auxiliary shell 12, thus affecting the purification mechanism's treatment of exhaust gas.

[0033] refer to Figure 6 A water baffle 18 is provided on the front of the fan 15, and the interior of the water baffle 18 is fixedly connected to the back of the interior of the outer casing 1.

[0034] As a technical optimization of this utility model, a baffle plate 18 is set to protect the fan 15 and prevent the electroplating liquid from contacting the fan 15. At the same time, a gap is left between the top of the baffle plate 18 and the top of the inner shell 1 to prevent the baffle plate 18 from affecting the fan 15's extraction of exhaust gas.

[0035] refer to Figure 3 A lifting handle 19 is fixedly connected to the top of the storage rack 4, and an anti-slip rubber sleeve 20 is fixedly connected to the surface of the lifting handle 19.

[0036] As a technical optimization of this utility model, by setting a lifting handle 19, a force application position is provided for the worker to move the storage rack 4. Since the lifting handle 19 is long, it avoids the worker from contacting the electroplating liquid when taking the storage rack 4 out of the outer shell 1. At the same time, the anti-slip rubber sleeve 20 increases the surface friction of the lifting handle 19, preventing the worker from slipping and causing the storage rack 4 to fall to the ground.

[0037] The working principle and usage process of this utility model are as follows: When in use, first flip the cover plate 2 backward, then lift the handle 19 to move the storage rack 4 upward, so that the storage rack 4 is away from the outer shell 1, thereby taking the storage rack 4 out of the outer shell 1. Then replace the semiconductor in the storage rack 4, put the storage rack 4 back into the outer shell 1, and insert the connecting block 8 into the mounting bracket 6. At this time, the first magnet 7 and the second magnet 9 will attract each other due to the principle of opposite poles attracting each other, fixing the storage rack 4. Then flip the cover plate 2 forward, and finally energize the inside of the outer shell 1 to electroplat the semiconductor using the principle of electrolysis.

[0038] In summary, this electroplating equipment for chip processing connects the storage rack 4 to the outer casing 1 by setting up a mounting bracket 6, a connecting block 8, a first magnet block 7, and a second magnet block 9. Because the connection is made using the magnetic force of the first magnet block 7 and the second magnet block 9, it is convenient for workers to remove the storage rack 4 from the outer casing 1, facilitating replacement of semiconductors. Furthermore, since the bottom of the connecting block 8 is located inside the storage rack 4, it prevents the storage rack 4 from colliding with the outer casing 1 due to impact when the electroplating equipment is subjected to shock, ultimately improving the safety of the electroplating equipment.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electroplating device for chip processing, comprising a housing (1), a cover plate (2) hinged to the top of the housing (1), an anode plate (3) fixedly connected to both sides inside the housing (1), and a storage rack (4) provided inside the housing (1), wherein limiting grooves (5) are provided on the front and back sides inside the storage rack (4), characterized in that: The connecting mechanism includes a mounting bracket (6) fixedly connected to the bottom of the inner shell (1). A magnet block (7) is fixedly connected inside the mounting bracket (6). A connecting block (8) is fixedly connected to the bottom of the storage rack (4). The bottom of the connecting block (8) extends into the interior of the mounting bracket (6). A magnet block (9) is fixedly connected inside the connecting block (8). The magnet block (7) and the magnet block (9) are magnetically connected. An auxiliary mechanism is provided on the surface of the mounting bracket (6). A purification mechanism is provided on the back of the outer shell (1).

2. The electroplating equipment for chip processing according to claim 1, characterized in that: The auxiliary mechanism includes drainage holes (10) respectively opened on both sides of the mounting frame (6). The mounting frame (6) and the connecting block (8) are both fixedly connected with insulating films (11). The outer side of the insulating film (11) is movably connected to the top of the first magnet block (7) and the bottom of the second magnet block (9).

3. The electroplating equipment for chip processing according to claim 1, characterized in that: The purification mechanism includes an auxiliary shell (12) fixedly connected to the back of the outer shell (1). A ventilation port (13) is provided on the back of the auxiliary shell (12). A partition (14) is fixedly connected inside the auxiliary shell (12). A fan (15) located inside the auxiliary shell (12) is fixedly connected to the back of the outer shell (1). The front of the fan (15) extends into the interior of the outer shell (1). An air intake mechanism is provided on the top of the cover plate (2).

4. The electroplating equipment for chip processing according to claim 3, characterized in that: The air intake mechanism includes an air intake pipe (16) fixedly connected to the top of the cover plate (2). The bottom of the air intake pipe (16) passes through the cover plate (2) and extends into the interior of the outer shell (1). A one-way valve (17) is fixedly connected inside the air intake pipe (16). The top of the one-way valve (17) extends to the outside of the air intake pipe (16).

5. The electroplating equipment for chip processing according to claim 3, characterized in that: The front of the fan (15) is provided with a baffle plate (18), and the interior of the baffle plate (18) is fixedly connected to the back of the interior of the outer shell (1).

6. The electroplating equipment for chip processing according to claim 1, characterized in that: The lifting handle (19) is fixedly connected to the top of the storage rack (4), and the surface of the lifting handle (19) is fixedly connected with an anti-slip rubber sleeve (20).

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