Electronic water pump applied to liquid cooling heat dissipation system of computing device

By designing a combination of potting layer and permanent magnet in the electronic water pump, the problems of large size and insufficient heat dissipation performance of electronic water pumps in liquid cooling heat dissipation systems of computing devices are solved, achieving a compact, efficient and long-life heat dissipation effect.

CN224550363UActive Publication Date: 2026-07-24广东深鹏科技股份有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
广东深鹏科技股份有限公司
Filing Date
2025-06-26
Publication Date
2026-07-24

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Abstract

The utility model discloses an electronic water pump applied to the liquid cooling heat dissipation system of computing device relates to electronic water pump technical field, it includes pump cover component, pump shell component, rotor -impeller subassembly, stator subassembly, drive circuit board and rear end cover component, the glue is filled in the drive chamber of pump shell component, forms the glue filling layer, the glue filling layer at least with rear end cover component contact, the glue filling layer still with at least one of stator subassembly and drive circuit board contact, to the heat conduction of stator subassembly and / or drive circuit board to rear end cover component. The utility model mainly solves how provides the problem of more suitable electronic water pump for the liquid cooling heat dissipation system of computing device, the glue is filled in the drive chamber of pump shell component, forms the glue filling layer, makes stator subassembly and / or drive circuit board obtain good waterproof sealing performance, and provides the heat dissipation performance for stator subassembly and / or drive circuit board, and has the characteristics of compact size, high efficiency and high life.
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Description

Technical Field

[0001] This utility model relates to the field of electronic water pump technology, specifically an electronic water pump used in liquid cooling heat dissipation systems for computing devices. Background Technology

[0002] With the continuous development of Internet and artificial intelligence technologies, the installed capacity of computing devices (such as servers, computing power servers, supercomputers, and communication equipment) is also constantly increasing.

[0003] Computing devices contain a large number of computing units (such as CPUs and GPUs). With the continuous development of semiconductor technology, the size of transistors in computing units is also increasing, making the performance of computing units higher and higher. As a result, the power consumption and heat generation of computing devices are also increasing. Traditional computer room temperature control and air cooling solutions are gradually becoming unable to meet the heat dissipation requirements of computing devices. Liquid cooling systems with higher heat dissipation performance are widely used in computing devices.

[0004] Liquid cooling systems require liquid cooling media, and the circulation of the liquid cooling media depends on a water pump. Electronic water pumps have high output efficiency and can achieve precise flow control, making them the preferred choice for liquid cooling systems.

[0005] However, existing electronic water pumps still present certain technical problems when applied to liquid cooling systems for computing devices: the electronic water pump itself is equipped with a drive circuit board and a stator assembly, which also generate a certain amount of heat. In order to ensure its own heat dissipation performance, existing electronic water pumps have a large volume, making it difficult to install them in the compact space of computing devices. In addition, liquid cooling systems require electronic water pumps to operate continuously for a long time, which makes the drive circuit board and stator assembly of the electronic water pump prone to heat accumulation.

[0006] Therefore, when electronic water pumps are used in liquid cooling systems for computing devices, they need to be compact, efficient, and have a long lifespan while ensuring heat dissipation performance.

[0007] In conclusion, how to provide electronic water pumps that are more suitable for liquid cooling systems of computing devices has become one of the urgent problems to be solved. Utility Model Content

[0008] The purpose of this invention is to provide an electronic water pump for use in liquid cooling systems of computing devices, which, while ensuring heat dissipation performance, is compact, highly efficient, and has a long lifespan.

[0009] To achieve the above objectives, this utility model provides the following technical solution: an electronic water pump applied to a liquid cooling system of a computing device, comprising a pump cover component, a pump housing component, a rotor-impeller assembly, a stator assembly, a drive circuit board, and a rear end cover component; an impeller chamber is formed on the inner side of the pump cover component, and an inlet and an outlet are respectively formed on the pump cover component, connecting the inner and outer sides of the impeller chamber; a rotor chamber is formed in the pump housing component, and a drive chamber isolated from the rotor chamber is also formed in the pump housing component; the pump cover component covers the pump housing component, so that the impeller chamber of the pump cover component and the rotor chamber of the pump housing component are interconnected; the rotor-impeller assembly is supported in the impeller chamber of the pump cover component and the rotor chamber of the pump housing component, so that the impeller chamber of the pump cover component and the rotor chamber of the pump housing component are interconnected. The rotor-impeller assembly is rotatable within the impeller chamber and the rotor chamber; the stator assembly is disposed within the drive chamber of the pump housing member, and the stator assembly and the rotor-impeller assembly are radially aligned with each other; the drive circuit board is disposed within the drive chamber of the pump housing member and electrically connected to the stator assembly; the rear end cover member is fixed to the other end of the pump housing member relative to the pump cover member to shield the drive chamber of the pump housing member; the drive chamber of the pump housing member is filled with adhesive to form an adhesive layer; the adhesive layer is in contact with at least the rear end cover member, and the adhesive layer is also in contact with at least one of the stator assembly and the drive circuit board to conduct heat from the stator assembly and / or the drive circuit board to the rear end cover member.

[0010] In the above technical solution, the rotor-impeller assembly includes a rotor support component, an impeller cover component, a permanent magnet component, and a bearing component; the rotor support component is provided with a blade platform portion, and a permanent magnet-bearing mounting portion coaxially connected to the blade platform portion; the blade platform portion of the rotor support component is provided with a plurality of blades; the impeller cover component is fixed to the blade platform portion of the rotor support component to cover the blades; the permanent magnet component is coaxially sleeved on the permanent magnet-bearing mounting portion of the impeller support component; the bearing component is coaxially embedded in the permanent magnet-bearing mounting portion of the rotor support component.

[0011] In the above technical solution, the combination of the rotor support component and the permanent magnet component is subjected to secondary injection molding to form a secondary plastic coating covering the surface of the permanent magnet component.

[0012] In the above technical solution, the impeller cover component of the rotor-impeller assembly is provided with an impeller water inlet; and the impeller water inlet of the rotor-impeller assembly is provided with a mating groove suitable for cooperating with the power unit.

[0013] In the above technical solution, the electronic water pump of this utility model applied to the liquid cooling heat dissipation system of computing equipment further includes a shaft core; a shaft core support is formed in the rotor chamber of the pump casing component, and a shaft core bracket is formed inside the water inlet of the pump cover component; the shaft core support of the pump casing component and the shaft core bracket of the pump cover component are aligned with each other; at least a portion of the shaft core is supported at the shaft core support of the pump casing component, and at least another portion of the shaft core is supported at the shaft core bracket of the pump cover component; the rotor-impeller assembly is sleeved on the shaft core, and the rotor-impeller assembly is adapted to rotate about the shaft core as an axis.

[0014] In the above technical solution, at least one of the inlet and outlet of the pump cover component is configured with a structure suitable for press-fitting with the liquid cooling plate.

[0015] In the above technical solution, the stator assembly includes a stator bracket, a stator winding wound on the stator bracket, and terminals fixedly disposed on the stator bracket; a hanging portion is formed on the terminal; the end of the stator winding is hung and soldered on the hanging portion of the terminal; the terminals of the stator assembly are inserted into and soldered to the drive circuit board.

[0016] In the above technical solution, the outer surface of the rear end cover component is provided with a number of protruding structures to increase the heat exchange surface area between the rear end cover component and the air.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. Adhesive is injected into the drive chamber of the pump housing component to form an adhesive layer. The adhesive layer is in contact with at least the rear end cover component and also with at least one of the stator assembly and the drive circuit board to conduct heat from the stator assembly and / or the drive circuit board to the rear end cover component. This provides good waterproof sealing performance for the stator assembly and / or the drive circuit board, and also provides heat dissipation performance, avoiding heat accumulation problems. Furthermore, it reduces the size of the heat dissipation structure of the electric water pump, making the overall structure more compact and ultimately effectively reducing the overall volume of the electric water pump, thus improving the service life of the stator assembly and / or the drive circuit board.

[0019] 2. A matching groove suitable for cooperating with the power unit is configured at the impeller inlet of the rotor-impeller assembly, so that each rotor-impeller assembly can be connected to the power unit of the testing fixture, which facilitates the motor back electromotive force test of each rotor-impeller assembly and improves the consistency of the rotor-impeller assembly.

[0020] 3. The end face of at least one of the inlet and outlet of the pump cover component is configured to be suitable for press-fitting with the liquid cooling plate, so as to reduce the installation structure volume of the electronic water pump and thus reduce the overall volume of the liquid cooling heat dissipation system of the computing equipment.

[0021] 4. The stator assembly terminals are equipped with hanging parts for hanging and soldering the ends of the stator windings, which can improve the manufacturing efficiency of the stator assembly. Attached Figure Description

[0022] Figure 1 This is a perspective view of the present invention.

[0023] Figure 2 This is an exploded view of the present invention.

[0024] Figure 3 This is an exploded view of the rotor-impeller assembly in this utility model.

[0025] Figure 4 This is a structural view of the stator assembly in this utility model.

[0026] Figure 5 This is a cross-sectional view of the present invention.

[0027] Figure 6 This is a cross-sectional view of the present invention after the glue layer has been formed.

[0028] Figure 7 This is a structural view of the rear end cover component in this utility model.

[0029] The attached figures are labeled as follows: 1. Pump cover component; 11. Impeller chamber; 12. Inlet; 13. Outlet; 14. Shaft support; 2. Pump casing component; 21. Rotor chamber; 22. Drive chamber; 23. Shaft support; 3. Rotor-impeller assembly; 31. Rotor support component; 311. Blade platform section; 311a. Blade; 312. Permanent magnet-bearing mounting section; 313. Secondary plastic coating; 32. Impeller cover component; 321. Impeller suction port; 321a. Mating groove; 33. Permanent magnet component; 34. Bearing component; 4. Stator assembly; 41. Stator support; 42. Stator winding; 43. Terminal; 431. Hanging part; 5. Drive circuit board; 6. Shaft; 7. Rear end cover component; 71. Protruding structure; 8. Potting layer. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] This embodiment provides an electronic water pump for use in a liquid cooling system of computing devices. It is used in the liquid cooling system of computing devices (such as servers, computing servers, supercomputers, and communication equipment) to drive the circulation of the liquid cooling medium in the liquid cooling system.

[0032] Please see Figures 1-7 The electronic water pump used in the liquid cooling system of computing devices in this embodiment includes a pump cover component 1, a pump housing component 2, a rotor-impeller assembly 3, a stator assembly 4, a drive circuit board 5, and a rear end cover component 7.

[0033] The pump cover component 1 is an integrally formed cover-shaped component made of engineering plastic or metal; the pump housing component 2 is an integrally formed half-shell component made of engineering plastic or metal, used to provide a structural support foundation for the electronic water pump applied to the liquid cooling heat dissipation system of computing equipment in this embodiment; the rear end cover component 7 is an integrally formed cover-shaped component made of metal, which has good thermal conductivity, such as aluminum alloy or stainless steel.

[0034] The drive circuit board 5 is a printed circuit board (PCB), which carries the main controller, power electronic devices for driving the stator assembly 4, and necessary peripheral circuits for driving the stator assembly 4.

[0035] An impeller chamber 11 is formed on the inner side of the pump cover component 1. Furthermore, an inlet 12 and an outlet 13 are formed on the pump cover component 1, which connect the inner and outer sides of the impeller chamber 11. Specifically, the impeller chamber 11 is a cavity inside the pump cover component 1, and the inlet 12 and the outlet 13 are both short tubular structures integrally formed on the pump cover component 1.

[0036] A rotor chamber 21 is formed in the pump casing component 2, and a drive chamber 22 that is isolated from the rotor chamber 21 is also formed in the pump casing component 2. In fact, both the rotor chamber 21 and the drive chamber 22 are cavity structures integrally formed with the pump casing component 2.

[0037] The pump cover component 1 covers the pump casing component 2, so that the impeller chamber 11 of the pump cover component 1 and the rotor chamber 21 of the pump casing component 2 are interconnected. It can be understood that the pump cover component 1 and the pump casing component 2 can be fixed together by means of screws or clips, and a sealing ring is set at the joint between the two to achieve sealing.

[0038] The rotor-impeller assembly 3 is supported in the impeller chamber 11 of the pump cover component 1 and the rotor chamber 21 of the pump casing component 2, so that the rotor-impeller assembly 3 can rotate in the impeller chamber 11 and the rotor chamber 21.

[0039] The stator assembly 4 is disposed in the drive chamber 22 of the pump casing component 2, and the stator assembly 4 and the rotor-impeller assembly 3 are aligned with each other in the radial direction.

[0040] The drive circuit board 5 is disposed in the drive chamber 22 of the pump housing component 2 and is electrically connected to the stator assembly 4.

[0041] It is understandable that both the stator assembly 4 and the drive circuit board 5 can be fixed in the drive chamber 22 of the pump housing component 2 by means of screws, clips or interference fit.

[0042] The rear end cover component 7 is fixed to the other end of the pump housing component 2 relative to the pump cover component 1 (specifically, by screws) to shield the drive chamber 22 of the pump housing component 2.

[0043] To ensure the electronic water pump used in the liquid cooling system of the computing device in this embodiment achieves good waterproof sealing performance and provides heat dissipation for the stator assembly 4 and / or drive circuit board 5, a potting compound is injected into the drive chamber 22 of the pump housing component 2 to form a potting compound layer 8. Specifically, after the electronic water pump used in the liquid cooling system of the computing device in this embodiment is assembled, an electronic potting compound (such as epoxy resin potting compound, polyurethane potting compound, silicone potting compound, and acrylic potting compound) is injected into the drive chamber 22 of the pump housing component 2, and then the rear end cover component 7 is installed. After the electronic potting compound cures, the potting compound layer 8 is obtained. The potting compound layer 8 is at least... The rear cover component 7 is in contact with the encapsulation layer 8, and the encapsulation layer 8 is also in contact with at least one of the stator assembly 4 and the drive circuit board 5, so as to conduct the heat of the stator assembly 4 and / or the drive circuit board 5 to the rear cover component 7. In this embodiment, the encapsulation layer 8 completely fills the drive chamber 22 of the pump housing component 2, so that the stator assembly 4 and the drive circuit board 5 are both wrapped in the encapsulation layer 8, and the entire inner surface of the rear cover component 7 is in contact with the encapsulation layer 8. On the one hand, this maximizes the waterproof sealing performance of the stator assembly 4 and the drive circuit board 5, and on the other hand, it maximizes the heat exchange efficiency between the stator assembly 4 and the drive circuit board 5 and the rear cover component 7.

[0044] It should be noted that the aforementioned electronic potting compound needs to have good thermal conductivity and also needs to provide a fastening effect for the stator assembly 4 and / or drive circuit board 5. Therefore, electronic potting compounds with excessive fluidity lack a fastening effect for the stator assembly 4 and / or drive circuit board 5, while electronic potting compounds that are too hard after curing will cause stress on the components on the drive circuit board 5, which may damage the drive circuit board 5. Therefore, it is necessary to select electronic potting compounds with moderate fluidity and rigidity (such as epoxy resin potting compounds, polyurethane potting compounds, silicone potting compounds, and acrylic potting compounds, etc.).

[0045] Please refer to the following in particular Figure 2 , Figure 3 and Figure 5 Specifically, the rotor-impeller assembly 3 includes a rotor support component 31, an impeller cover component 32, a permanent magnet component 33, and a bearing component 34. The rotor support component 31 is a one-piece injection-molded engineering plastic support component, providing the overall structural and functional support foundation for the rotor-impeller assembly 3. The impeller cover component 32 is a one-piece injection-molded engineering plastic cover component. The permanent magnet component 33 is a magnetic metal ring that can couple with the rotating magnetic field generated by the stator assembly 4 to drive the rotor-impeller assembly 3 to rotate. The bearing component 34 is one of a ceramic bearing, a graphite bearing, and a metal bushing, possessing self-lubricating properties. In this embodiment, the bearing component 34 is a ceramic bearing, which has good wear resistance to improve the service life of the electric water pump. A blade platform portion 311 is disposed at the rotor support component 31, and... The permanent magnet-bearing mounting portion 312 is coaxially connected. The blade platform portion 311 has a circular platform structure, while the permanent magnet-bearing mounting portion 312 has a cylindrical structure, both integrally injection molded. The blade platform portion 311 of the rotor support component 31 is equipped with a number of blades 311a. In fact, the blades 311a are several arc-shaped sheet structures integrally injection molded on the blade platform portion 311, which can drive the flow of liquid medium when rotating. The impeller cover component 32 is fixed to the blade platform portion 311 of the rotor support component 31 (specifically, it is fixed by ultrasonic welding) to cover the blades 311a. The permanent magnet component 33 is coaxially sleeved on the permanent magnet-bearing mounting portion 312 of the impeller support component. The bearing component 34 is coaxially embedded in the permanent magnet-bearing mounting portion 312 of the impeller support component.

[0046] Furthermore, the assembly of the rotor support component 31 and the permanent magnet component 33 is subjected to secondary injection molding to form a secondary plastic coating 313 covering the surface of the permanent magnet component 33.

[0047] In this embodiment, the rotor-impeller assembly 3 is manufactured by first prefabricating a permanent magnet component 33 and a bearing component 34; then placing the permanent magnet component 33 and the bearing component 34 into a molding mold of the rotor support component 31, injecting plastic material into the molding mold, and demolding after the plastic material cools and solidifies, thus obtaining an assembly of the rotor support component 31, the permanent magnet component 33, and the bearing component 34; subsequently, placing the assembly of the rotor support component 31, the permanent magnet component 33, and the bearing component 34 into a molding mold of a secondary plastic coating 313, injecting plastic material into the molding mold, and demolding after the plastic material cools and solidifies, thus obtaining a secondary plastic coating 313 covering the surface of the permanent magnet component 33; finally, using ultrasonic welding, the impeller cover component 32 is welded and fixed to the blade platform portion 311 of the rotor support component 31 (specifically, welded to the top surface of the blade 311a) to cover the blade 311a, thus completing the manufacturing process of the rotor-impeller assembly 3.

[0048] Using a high-performance permanent magnet component 33 can effectively improve the electromagnetic efficiency between the stator assembly 4 and the rotor-impeller assembly 3, thereby improving the overall efficiency of the electronic water pump applied to the liquid cooling system of the computing device in this embodiment, and thus achieving good energy consumption control performance. However, the high-performance permanent magnet component 33 is easily corroded / electrolyzed in the liquid cooling medium. Therefore, the combination of the rotor support component 31 and the permanent magnet component 33 is subjected to secondary injection molding to form a secondary plastic coating 313 covering the surface of the permanent magnet component 33. This can effectively prevent the high-performance permanent magnet component 33 from being corroded / electrolyzed, thereby improving the electromagnetic efficiency of the electronic water pump on the one hand, and increasing the service life of the electronic water pump on the other hand.

[0049] Furthermore, the impeller cover member 32 of the rotor-impeller assembly 3 is provided with an impeller inlet 321. In fact, the impeller inlet 321 is a circular hole-shaped structure integrally injection molded in the center of the impeller cover member 32. In addition, the impeller inlet 321 of the rotor-impeller assembly 3 is provided with a mating groove 321a suitable for cooperating with the power unit. The mating groove 321a is a square groove-shaped structure integrally injection molded in the impeller inlet 321.

[0050] The electronic water pump used in the liquid cooling system of computing equipment requires precise control of its flow rate per unit time. This places strict requirements on the consistency of the motor of the rotor-impeller assembly 3 at the factory. A matching groove 321a suitable for cooperating with the power unit is configured at the impeller suction port 321 of the rotor-impeller assembly 3, so that each rotor-impeller assembly 3 can be connected to the power unit of the testing fixture (for example, connected to the rotating shaft with a retaining tooth through the matching groove 321a), which facilitates the motor back electromotive force test of each rotor-impeller assembly 3 (instead of random inspection).

[0051] Please refer to the following in particular Figure 2 , Figure 3 and Figure 5 Specifically, the electronic water pump used in the liquid cooling system of a computing device in this embodiment also includes a shaft core 6, which is a cylindrical metal shaft; a shaft core support 23 is formed in the rotor chamber 21 of the pump housing component 2 (the shaft core support 23 is integrally formed at the bottom of the rotor chamber 21), and a shaft core bracket 14 is formed inside the water inlet 12 of the pump cover component 1 (the shaft core bracket 14 is integrally formed inside the pump cover component 1). The shaft core support 23 of the pump housing component 2 and the shaft core bracket 14 of the pump cover component 1 are aligned with each other; the shaft core 6, at least a portion of which is supported by the shaft core support of the pump housing component 2. At least one other part of the shaft core 6 is supported at the shaft core support 14 of the pump cover component 1. In this embodiment, the two ends of the shaft core 6 are respectively inserted and fixed in the shaft core support 23 of the pump housing component 2 and the shaft core support 14 of the pump cover component 1. The shaft core 6 is fixed in the circumferential direction by means of irregular fit. The rotor-impeller assembly 3 is sleeved on the shaft core 6. The rotor-impeller assembly 3 is adapted to rotate about the shaft core 6. In this embodiment, the bearing component 34 of the rotor-impeller assembly 3 is sleeved on the shaft core 6, so that the rotor-impeller assembly 3 is adapted to rotate about the shaft core 6.

[0052] Furthermore, a ceramic thrust washer (which has better wear resistance) can be added between the shaft support 14 of the pump cover component 1 and the rotor-impeller assembly 3 to improve the service life of the electric water pump.

[0053] Please refer to the following in particular Figure 1 and Figure 2 Furthermore, at least one of the end faces of the inlet 12 and outlet 13 of the pump cover component 1 is configured to be suitable for press-fitting with the liquid cooling plate. In this embodiment, the end faces of the inlet 12 and outlet 13 of the pump cover component 1 are both configured as planes, and the end faces of the inlet 12 and outlet 13 of the pump cover component 1 are both provided with annular sealing grooves, so that the inlet 12 and outlet 13 of the pump cover component 1 are suitable for press-fitting with the liquid cooling plate, and the sealing performance is obtained through the pressurized sealing ring, thereby improving the assembly efficiency of the liquid cooling heat dissipation system of the computing device.

[0054] Please refer to the following in particular Figure 4Furthermore, the stator assembly 4 includes a stator support 41, a stator winding 42 wound on the stator support 41, and a terminal 43 fixedly disposed on the stator support 41. It should be noted that the stator support 41 includes a stator core and a plastic shell covering the surface of the stator core, and the stator support 41 includes at least a yoke and a toothed portion. The stator winding 42 is specifically an electromagnetic coil obtained by winding enameled wire a certain number of turns on the toothed portion of the stator support 41. The terminal 43 is a copper terminal, which is inserted and fixed to the yoke of the stator support 41. A hanging part 431 is formed on the terminal 43. The hanging part 431 is a hook-shaped structure integrally formed on the side of the terminal 43. The end of the stator winding 42 is hung and soldered (specifically, tin soldered) on the hanging part 431 of the terminal 43. The terminal 43 of the stator assembly 4 is inserted and soldered to the drive circuit board 5. Specifically, the end of the terminal 43 of the stator assembly 4 is inserted and soldered to the solder hole of the drive circuit board 5. The hanging part 431 is arranged on the terminal 43 for the end of the stator winding 42 to be hung and soldered thereon, which can improve the manufacturing efficiency of the stator assembly 4.

[0055] Please refer to the following in particular Figure 7 Furthermore, the outer surface of the rear end cover component 7 is provided with a plurality of protruding structures 71 to increase the heat exchange surface area between the rear end cover component 7 and the air. In this embodiment, the protruding structure 71 can be a texture integrally formed on the outer surface of the rear end cover component 7. In other embodiments, the protruding structure 71 can be a protruding post integrally formed on the outer surface of the rear end cover component 7 or a fin integrally formed on the outer surface of the rear end cover component 7.

[0056] In this embodiment, the electronic water pump used in the liquid cooling system of a computing device presses its pump cover component 1, with the inlet 12 and outlet 13, onto the liquid cooling plate of the system. This allows the electronic water pump to be connected to the liquid cooling plate as a power unit, driving the circulation of the liquid medium. During use, an external power supply is connected to the drive circuit board 5, which energizes the stator winding 42 of the stator assembly 4. Energizing the stator winding 42 generates an alternating magnetic field. After being guided by the stator support 41 (stator core), a rotating magnetic field can be generated in the rotor chamber 21. This rotating magnetic field is located in the rotor chamber 21 in space. The permanent magnet component 33 of the rotor-impeller assembly 3 in the rotor chamber 21 is magnetically coupled with the rotating magnetic field, causing the entire rotor-impeller assembly 3 to start rotating. When the impeller body component in the impeller chamber 11 rotates, a directional pressure difference can be generated in the impeller chamber 11, thereby driving the liquid medium to be drawn into the impeller chamber 11 from the inlet 12 and discharged from the outlet 13, thus completing the function of the water pump.

[0057] The electronic water pump used in the liquid cooling system of a computing device in this embodiment has improvements including at least the following:

[0058] 1. Adhesive is injected into the drive chamber 22 of the pump housing component 2 to form an adhesive layer 8. The adhesive layer 8 is in contact with at least the rear end cover component 7, and also in contact with at least one of the stator assembly 4 and the drive circuit board 5, so as to conduct the heat of the stator assembly 4 and / or the drive circuit board 5 to the rear end cover component 7. In this way, the stator assembly 4 and / or the drive circuit board 5 obtain good waterproof sealing performance and provide heat dissipation performance for the stator assembly 4 and / or the drive circuit board 5, avoiding the heat accumulation problem of the stator assembly 4 and / or the drive circuit board 5, improving the service life of the stator assembly 4 and / or the drive circuit board 5, and also reducing the heat dissipation structure of the electronic water pump, making the overall structure of the electronic water pump more compact, and ultimately effectively reducing the overall volume of the electronic water pump.

[0059] 2. A fitting groove 321a suitable for cooperating with the power unit is provided at the impeller inlet 321 of the rotor-impeller assembly 3, so that each rotor-impeller assembly 3 can be connected to the power unit of the testing fixture, which facilitates the back electromotive force test of each rotor-impeller assembly 3 to ensure the consistency of the rotor-impeller assembly 3.

[0060] 3. The end face of at least one of the inlet 12 and outlet 13 of the pump cover component 1 is configured to be suitable for press-fitting with the liquid cooling plate, thereby reducing the installation structure volume of the electronic water pump and thus reducing the assembly efficiency of the liquid cooling heat dissipation system of the computing device.

[0061] 4. The stator assembly 4 has a hanging part 431 on the terminal 43 for hanging and welding the end of the stator winding 42, which can improve the manufacturing efficiency of the stator assembly 4.

[0062] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electronic water pump used in a liquid cooling system for computing devices, characterized in that, This includes pump cover components, pump casing components, rotor-impeller assembly, stator assembly, drive circuit board, and rear end cover components; An impeller chamber is formed on the inner side of the pump cover component, and an inlet and an outlet are respectively formed on the pump cover component to connect the inner and outer sides of the impeller chamber; a rotor chamber is formed in the pump casing component, and a drive chamber isolated from the rotor chamber is also formed in the pump casing component; the pump cover component covers the pump casing component, so that the impeller chamber of the pump cover component and the rotor chamber of the pump casing component are interconnected; The rotor-impeller assembly is supported in the impeller chamber of the pump cover member and the rotor chamber of the pump casing member, so that the rotor-impeller assembly can rotate in the impeller chamber and the rotor chamber; The stator assembly is disposed in the drive chamber of the pump casing member, and the stator assembly and the rotor-impeller assembly are aligned with each other in the radial direction; The drive circuit board is disposed in the drive chamber of the pump housing component and is electrically connected to the stator assembly. The rear end cover component is fixed to the other end of the pump housing component relative to the pump cover component to shield the drive chamber of the pump housing component; The pump housing component is filled with adhesive to form an adhesive layer. The potting layer is in contact with at least the rear end cover member, and the potting layer is also in contact with at least one of the stator assembly and the drive circuit board to conduct heat from the stator assembly and / or the drive circuit board to the rear end cover member.

2. The electronic water pump applied to a liquid cooling system for computing devices according to claim 1, characterized in that, The rotor-impeller assembly includes a rotor support component, an impeller cover component, a permanent magnet component, and a bearing component; The rotor support component is provided with a blade platform portion and a permanent magnet-bearing mounting portion coaxially connected to the blade platform portion; The rotor support component has a blade platform portion equipped with several blades. The impeller cover component is fixed at the blade platform portion of the rotor support component to cover the blade; The permanent magnet component is coaxially fitted onto the permanent magnet-bearing mounting portion of the impeller support component; The bearing component is coaxially embedded in the permanent magnet-bearing mounting portion of the rotor support component.

3. The electronic water pump applied to a liquid cooling system for computing devices according to claim 2, characterized in that, The assembly of the rotor support component and the permanent magnet component is subjected to secondary injection molding to form a secondary plastic coating covering the surface of the permanent magnet component.

4. The electronic water pump applied to a liquid cooling system for computing devices according to claim 2 or 3, characterized in that, The rotor-impeller assembly is provided with an impeller suction port at the impeller cover component; Furthermore, the impeller inlet of the rotor-impeller assembly is provided with a mating groove suitable for cooperation with the power unit.

5. The electronic water pump applied to a liquid cooling system for computing devices according to any one of claims 1-3, characterized in that, It also includes the shaft core; A shaft support is formed in the rotor chamber of the pump casing component, and a shaft bracket is formed inside the water inlet of the pump cover component. The shaft support of the pump casing component and the shaft bracket of the pump cover component are aligned with each other. The shaft core, at least a portion of which is supported at the shaft core support of the pump housing component, and at least another portion of which is supported at the shaft core bracket of the pump cover component; The rotor-impeller assembly is sleeved on the shaft core, and the rotor-impeller assembly is adapted to rotate about the shaft core as an axis.

6. The electronic water pump applied to a liquid cooling system for computing devices according to claim 1, characterized in that, The inlet and outlet of the pump cover component, at least one of the end faces, are configured to be suitable for press-fitting with the liquid cooling plate.

7. The electronic water pump applied to a liquid cooling system for computing devices according to claim 1, characterized in that, The stator assembly includes a stator support, a stator winding wound on the stator support, and terminals fixedly disposed on the stator support; A wire hanging portion is formed on the terminal; The ends of the stator windings are hung and welded to the hanging part of the terminal; The terminals of the stator assembly are plugged into and soldered onto the drive circuit board.

8. The electronic water pump applied to a liquid cooling system for computing devices according to claim 1, characterized in that, The outer surface of the rear end cover component is provided with a number of protruding structures to increase the heat exchange surface area between the rear end cover component and the air.