Heat dissipation structure and lamp

Abstract

The utility model provides a kind of heat dissipation structure and lamps and lanterns, wherein heat dissipation structure includes: heat pipe, heat pipe includes first heat pipe section and with the second heat pipe section of first heat pipe section connection, the extension direction of first heat pipe section is perpendicular to thickness direction X, first heat pipe section is equipped with the first heat pipe face for with heat-generating element connection, first heat pipe face is perpendicular to thickness direction X;The extension direction of second heat pipe section is perpendicular to thickness direction X, and second heat pipe section is equipped with second heat pipe face, and second heat pipe face is parallel to thickness direction X.By using the above technical solution, the traditional heat pipe long-distance extension mode is changed, the occupied space in the thickness direction is reduced, so that the strict restriction of compact electronic equipment on radiator thickness can be met, and the thinness of the heat dissipation structure is realized.In addition, by reasonably setting the structure and connection mode of heat pipe, sufficient heat dissipation area and good heat conduction path are ensured, and thinness and heat dissipation efficiency are considered.

Description

Technical Field

[0001] This utility model relates to the technical field of lighting fixtures, and more specifically, to a heat dissipation structure and a lighting fixture. Background Technology

[0002] In the field of high-power LED heat dissipation systems and electronic device thermal management, tower heat sinks are currently the mainstream heat dissipation solution, but both face significant technical bottlenecks in practical applications:

[0003] Traditional tower heatsinks typically employ a multi-layered heatsink design and long heat pipes to achieve efficient heat dissipation, resulting in a generally large overall thickness. In the design of compact electronic devices, where strict limitations are placed on heatsink thickness, traditional tower structures are unsuitable due to their excessive thickness. Furthermore, reducing thickness leads to a decrease in the number of heatsinks or a shortening of heat pipe length, further resulting in insufficient heat dissipation area and limited heat conduction paths, making it difficult to balance the dual requirements of thinness and heat dissipation efficiency. Utility Model Content

[0004] The purpose of this utility model is to provide a heat dissipation structure and a lamp to solve the technical problem that lamps in the prior art are difficult to balance thinness and high heat dissipation efficiency.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] Firstly, a heat dissipation structure is provided, comprising:

[0007] A heat pipe includes a first heat pipe segment and a second heat pipe segment connected to the first heat pipe segment. The first heat pipe segment extends perpendicularly to the thickness direction X and has a first heat pipe surface for connecting to a heating element, the first heat pipe surface being perpendicular to the thickness direction X. The second heat pipe segment extends perpendicularly to the thickness direction X and has a second heat pipe surface being parallel to the thickness direction X.

[0008] By adopting the above technical solution:

[0009] Achieving a thinner design: Traditional tower heat sinks are thick due to the stacking of multiple heat sink fins and the extension of long heat pipes, making them difficult to adapt to compact electronic devices. In this solution, the first and second heat pipe sections extend perpendicular to the thickness direction. This design changes the traditional method of long-distance heat pipe extension, reducing the space occupied in the thickness direction. This allows the design to meet the strict limitations on heat sink thickness in compact electronic devices, achieving a thinner heat dissipation structure.

[0010] Ensuring efficient heat dissipation: Despite the slim design, the rational arrangement of the heat pipe structure and connection method ensures sufficient heat dissipation area and a good heat conduction path. The first heat pipe section has a first heat pipe surface perpendicular to the thickness direction, connected to the heating element, which can efficiently absorb the heat generated by the heating element with a large contact area. The second heat pipe section has a second heat pipe surface parallel to the thickness direction, connected to the heat dissipation module, which helps to evenly and effectively transfer heat to the heat dissipation module. This compensates for the problems of insufficient heat dissipation area and limited heat conduction path that may be caused by a reduction in the number of heat sinks or a shortening of the heat pipe length due to the slim design. It achieves both slimness and high heat dissipation efficiency, thus balancing slimness and heat dissipation efficiency.

[0011] In one embodiment, the first heat pipe segment and the second heat pipe segment are flat in shape, with the first heat pipe surface formed on the larger surface area of ​​the first heat pipe segment and the second heat pipe surface formed on the larger surface area of ​​the second heat pipe segment.

[0012] In one embodiment, the first heat pipe segment and the second heat pipe segment are arranged parallel to each other and spaced apart along the thickness direction X; the heat pipe further includes a third heat pipe segment connecting the first heat pipe segment and the second heat pipe segment.

[0013] In one embodiment, the first heat pipe segment, the second heat pipe segment, and the third heat pipe segment are connected in sequence and form a heat-conducting channel for containing the heat-conducting medium.

[0014] In one embodiment, the heat dissipation structure further includes a heat spreader, which is connected to the first heat pipe surface and is disposed perpendicular to the thickness direction X.

[0015] In one embodiment, the heat dissipation structure further includes a plurality of heat dissipation fins arranged parallel to each other along the length direction Y perpendicular to the thickness direction X, with a heat dissipation gap formed between two adjacent heat dissipation fins, the heat dissipation fins being parallel to the thickness direction X, and the second heat pipe surface being connected to the heat dissipation fins.

[0016] In one embodiment, the extension direction of the second heat pipe surface is perpendicular to the heat sink, and the second heat pipe segment is disposed through a plurality of the heat sinks.

[0017] In one embodiment, the heat dissipation structure further includes a cooling element located on the side of the heat sink away from the heat spreader, the cooling element being used to reduce the temperature of the heat sink.

[0018] Secondly, a lighting fixture is provided, including a light source module and the aforementioned heat dissipation structure, wherein the light source module is connected to the heat dissipation structure.

[0019] By adopting the above technical solution, the lamp in this embodiment not only has the advantages of heat dissipation structure in the above embodiments, but also takes into account the advantages of miniaturization and high-efficiency heat dissipation.

[0020] In one embodiment, the light source module includes a heating element, which is disposed parallel to and connected to the heat spreader. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural diagram of the heat dissipation structure provided in an embodiment of this utility model.

[0023] Figure 2 This is an exploded view of the heat dissipation structure provided in an embodiment of this utility model.

[0024] Figure 3 This is a three-dimensional structural diagram of the heat pipe provided in one embodiment of the present invention.

[0025] Figure 4 This is a three-dimensional structural diagram of the heat pipe provided in another embodiment of the present invention.

[0026] The labels for the attached figures are as follows:

[0027] 1. Heat pipe; 11. First heat pipe section; 12. Second heat pipe section; 2. Heating element; 111. First heat pipe surface; 121. Second heat pipe surface; 13. Third heat pipe section; 3. Heat spreader; 4. Heat sink; 5. Cooling element. Detailed Implementation

[0028] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0029] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be located directly on or indirectly on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component.

[0030] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and do not indicate that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or the number of technical features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. The specific implementation of this utility model is described in more detail below with reference to specific embodiments:

[0032] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a heat dissipation structure, comprising:

[0033] Heat pipe 1 includes a first heat pipe section 11 and a second heat pipe section 12 connected to the first heat pipe section 11. The extension direction of the first heat pipe section 11 is perpendicular to the thickness direction X. The first heat pipe section 11 is provided with a first heat pipe surface 111 for connecting to the heating element 2. The first heat pipe surface 111 is perpendicular to the thickness direction X. The extension direction of the second heat pipe section 12 is perpendicular to the thickness direction X. The second heat pipe section 12 is provided with a second heat pipe surface 121. The second heat pipe surface 121 is parallel to the thickness direction X.

[0034] Please refer to the following: Figure 3 and Figure 4 Specifically, heat pipe 1 is a highly efficient heat transfer element, typically composed of a shell, a wick, and a heat transfer medium. The shell is generally made of metal, and after being evacuated, it is filled with an appropriate amount of heat transfer medium, such as pure water or ethanol. The wick is distributed on the inner wall of the shell and is used to guide the return flow of the working fluid. This heat pipe 1 is divided into a first heat pipe section 11 and a second heat pipe section 12, which are interconnected to form a complete heat pipe 1 structure.

[0035] The first heat pipe section 11 extends perpendicularly to the thickness direction X and has a first heat pipe surface 111 perpendicular to the thickness direction X. This first heat pipe surface 111 is used to connect with the heating element 2. The first heat pipe section 11 can be close to the heating element 2, increasing the contact area with the heating element 2, thereby more effectively absorbing the heat generated by the heating element 2. For example, in some thin electronic devices, if the thickness direction X is the thickness direction of the device, the first heat pipe section 11 can be arranged laterally below the heating element 2, with the first heat pipe surface 111 in contact with the heating element 2, quickly transferring heat to the interior of the heat pipe 1.

[0036] The second heat pipe section 12 also extends perpendicular to the thickness direction X, but its second heat pipe surface 121 is parallel to the thickness direction X. This arrangement is to better transfer the heat absorbed by the first heat pipe section 11 to the heat dissipation area, or to adapt to specific internal space layouts of equipment. For example, the second heat pipe surface 121 of the second heat pipe section 12 can be attached to heat dissipation components such as heat sinks to facilitate heat conduction to the heat sinks, thereby increasing the heat dissipation area and accelerating heat dissipation into the surrounding air; in addition, within a limited space, the heat transfer path is guided in a specific way to avoid interference with other components.

[0037] By adopting the above technical solution:

[0038] Achieving a thinner design: Traditional tower heat sinks are thick due to the stacking of multiple heat sink fins and the extension of long heat pipes 1, making them difficult to adapt to compact electronic devices. In this solution, the first heat pipe segment 11 and the second heat pipe segment 12 of the heat pipe 1 extend perpendicular to the thickness direction. This design changes the traditional long-distance extension of the heat pipe 1, reducing the space occupied in the thickness direction, thereby meeting the strict limitations on heat sink thickness in compact electronic devices and achieving a thinner heat dissipation structure.

[0039] Ensuring heat dissipation efficiency: Despite the slim design, sufficient heat dissipation area and a good heat conduction path are ensured through the reasonable arrangement of the structure and connection method of heat pipe 1. The first heat pipe section 11 has a first heat pipe surface 111 perpendicular to the thickness direction and connected to the heating element, which can efficiently absorb the heat generated by the heating element with a large contact area; the second heat pipe section 12 has a second heat pipe surface 121 parallel to the thickness direction and connected to the heat dissipation module, which helps to evenly and effectively transfer heat to the heat dissipation module. This compensates for the problems of insufficient heat dissipation area and limited heat conduction path caused by the reduction in the number of heat sinks or the shortening of the length of heat pipe 1 due to the slim design. It ensures high heat dissipation efficiency while achieving a slim design, balancing the dual requirements of slim design and heat dissipation efficiency.

[0040] In one embodiment, the first heat pipe section 11 and the second heat pipe section 12 are flat in shape, the first heat pipe surface 111 is formed on the larger surface of the first heat pipe section 11, and the second heat pipe surface 121 is formed on the larger surface of the second heat pipe section 12.

[0041] Specifically, compared to the traditional circular heat pipe 1, the flat first heat pipe section 11 and the second heat pipe section 12 can increase the contact area with the heating element 2 or the heat dissipation component, thereby absorbing and transferring heat more efficiently. At the same time, the flat design can better adapt to some space-constrained scenarios, making it easier to arrange within flat or compact devices and improving space utilization.

[0042] It needs to be further explained that the flat first heat pipe section 11 and the second heat pipe section 12 have two large opposing surfaces (wide surfaces) and a smaller surface (narrow surface) surrounding them. The first heat pipe surface 111 and the second heat pipe surface 121 are formed on the larger surface (wide surface).

[0043] The first heat pipe surface 111 is formed on the larger surface area of ​​the first heat pipe section 11, which facilitates more thorough contact with the heating element 2 and allows the heat generated by the heating element 2 to be quickly conducted into the interior of the heat pipe 1. Similarly, the second heat pipe surface 121 is formed on the larger surface area of ​​the second heat pipe section 12, which enables the second heat pipe section 12 to more effectively transfer heat to subsequent heat dissipation components, such as heat sinks, or to dissipate heat into the surrounding environment, thus helping to improve the heat dissipation efficiency of the entire heat dissipation structure.

[0044] In one embodiment, the first heat pipe segment 11 and the second heat pipe segment 12 are arranged parallel to each other along the thickness direction X; the heat pipe 1 also includes a third heat pipe segment 13 connecting the first heat pipe segment 11 and the second heat pipe segment 12.

[0045] Specifically, the first heat pipe section 11 and the second heat pipe section 12 are arranged parallel to each other along the thickness direction X. This increases the contact area between the heat pipe 1 and the surrounding environment or heat dissipation components, which is beneficial to improving heat dissipation efficiency. At the same time, the parallel spacing can better adapt to the internal spatial layout of the equipment. Especially in some thin equipment with strict requirements on the thickness direction dimension, the heat pipe 1 can be reasonably arranged in a limited space, avoiding interference with other components, and also making the heat more evenly distributed in the thickness direction, reducing local overheating.

[0046] The third heat pipe section 13 connects the first heat pipe section 11 and the second heat pipe section 12, and its main function is to facilitate the transfer of heat between the different heat pipe sections 1. It can conduct the heat absorbed by the first heat pipe section 11 from the heating element 2 to the second heat pipe section 12, and then dissipate the heat or transfer it to other heat dissipation components through the second heat pipe section 12. In addition, the presence of the third heat pipe section 13 can also enhance the stability and integrity of the entire heat pipe 1 structure, making the heat pipe 1 less prone to breakage or damage when subjected to external forces or equipment vibration.

[0047] In one embodiment, the first heat pipe section 11, the second heat pipe section 12, and the third heat pipe section 13 are connected in sequence and form a heat-conducting channel for containing the heat-conducting medium.

[0048] Specifically, the third heat pipe section 13 connects the first heat pipe section 11 and the second heat pipe section 12, and can be designed as a bent or folded structure (such as "L" shape or "U" shape). The first heat pipe section 11, the second heat pipe section 12 and the third heat pipe section 13 are connected in sequence to form a closed heat conduction channel.

[0049] In one embodiment, the heat dissipation structure further includes a heat spreader 3, which is connected to the first heat pipe surface 111 and is arranged perpendicular to the thickness direction X.

[0050] Specifically, the heat spreader 3 is a new component of the heat dissipation structure, usually in the form of a flat plate, and is mostly made of metals with good thermal conductivity such as copper. It is connected to the first heat pipe surface 111 of the first heat pipe section 11. The heat spreader 3 is attached to the larger surface area of ​​the first heat pipe section 11. Since the first heat pipe surface 111 is perpendicular to the thickness direction X, the heat spreader 3 is also set perpendicular to the thickness direction X. The two form a tight thermally conductive whole, which together constitutes part of the heat dissipation structure and is used to receive and conduct heat.

[0051] The working principle of the heat spreader 3 is based on phase change heat transfer. When the heating element 2 generates heat, the heat is first transferred to the heat spreader 3 in contact with it, and the heat is evenly distributed on the surface of the heat spreader 3. At the same time, the heat spreader 3 conducts heat to the first heat pipe surface 111 connected to it. The heat-conducting medium in the first heat pipe section 11 then transfers the heat to other heat pipe sections 1 through processes such as evaporation and condensation, thereby achieving rapid heat dissipation.

[0052] By adopting the above technical solution, the heat spreader 3 can quickly and evenly disperse the local high heat of the heating element 2, so that the heat is distributed over a large area, reducing hot spots, lowering the temperature gradient, and avoiding the impact of local overheating on the performance and lifespan of electronic components. The heat spreader 3, in conjunction with the first heat pipe section 11, can accelerate the transfer of heat from the heating element 2 to the heat pipe 1, and the heat pipe 1 can carry away the heat more efficiently. Since the heat spreader 3 is set perpendicular to the thickness direction X, it can better adapt to specific spatial layouts. Especially in some electronic devices with strict thickness requirements, it can achieve efficient heat dissipation in a limited space without occupying too much lateral space, which is conducive to the thinner and lighter design of the device.

[0053] In one embodiment, the heat dissipation structure further includes a plurality of heat sinks 4 arranged in parallel and spaced along the length direction Y perpendicular to the thickness direction X, with a heat dissipation gap formed between two adjacent heat sinks 4, the heat sinks 4 being parallel to the thickness direction X, and the second heat pipe surface 121 being connected to the heat sinks 4.

[0054] Specifically, multiple heat sinks 4 are arranged in parallel intervals along the length direction Y, where the length direction Y is perpendicular to the thickness direction X. The heat sinks 4 are parallel to the thickness direction, meaning their planes are aligned with the thickness direction X. Gaps are left between adjacent heat sinks 4 to form heat dissipation gaps for air circulation. The heat sinks 4 are connected to the second heat pipe surface 121, which is formed on the larger surface area of ​​the second heat pipe section 12. In other words, the heat sinks 4 are attached to the flat surface of the second heat pipe section 12, forming a heat conduction path.

[0055] The heat from the heating element 2 is homogenized by the heat spreader 3, and then conducted through the first heat pipe section 11, the third heat pipe section 13, and the second heat pipe section 12, finally being transferred to the heat sink 4 via the second heat pipe surface 121. The heat sink 4 acts as a "heat exchange interface," transferring heat from the heat pipe 1 into the air.

[0056] By adopting the above technical solution, the heat sink 4 combined with the heat pipe 1 can disperse concentrated heat over a larger area. Combined with the airflow through the heat dissipation gaps, this significantly accelerates heat dissipation. The parallel spacing of multiple heat sinks 4 prevents heat accumulation in localized areas. Even if the temperature of a certain area of ​​the heat sink 4 is high, airflow can diffuse the heat to other areas through the gaps, reducing the temperature gradient. The heat sinks 4 are arranged along the length direction Y and parallel to the thickness direction X, maximizing the heat dissipation area within a limited thickness and length space.

[0057] In one embodiment, the extension direction of the second heat pipe surface 121 is perpendicular to the heat sink 4, and the second heat pipe segment 12 is disposed through multiple heat sinks 4.

[0058] Specifically, the extension direction of the second heat pipe surface 121 is perpendicular to the plane direction of the heat sink 4, and the second heat pipe segment 12 passes through multiple heat sinks 4 in a through manner to form an integrated heat dissipation structure. Specifically, if the heat sink 4 is arranged parallel to the thickness direction X, then the extension direction of the second heat pipe surface 121 is perpendicular to the plane, so that the second heat pipe surface 121 and the heat sink 4 form a perpendicularly intersecting layout; at the same time, the second heat pipe segment 12 passes through each heat sink 4, that is, the heat pipe 1 passes from one side of the heat sink 4 to the other side, and the heat pipe 1 and the heat sink 4 are tightly connected through the combination of mechanical connection and heat conduction path.

[0059] By adopting the above technical solution, on the one hand, the vertical extension and through-hole setting of the second heat pipe section 12 can significantly reduce thermal resistance and improve the heat conduction efficiency of heat pipe 1 and heat sink 4; on the other hand, the structure is more compact and suitable for heat dissipation modules of ultra-thin devices, further improving heat dissipation uniformity and system reliability.

[0060] In one embodiment, the heat dissipation structure further includes a cooling element 5, which is located on the side of the heat sink 4 away from the heat spreader 3, and is used to reduce the temperature of the heat sink 4.

[0061] Specifically, the cooling component 5 is located on the side of the heat sink 4 away from the heat spreader 3. That is, if the heat spreader 3 is on one side of the heat dissipation structure, then the cooling component 5 is on the other side of the heat sink 4 (away from the heat source side), and is arranged opposite to the heat spreader 3.

[0062] The cooling component 5, together with the heat sink 4 and the heat pipe section 1, forms a series heat dissipation path: heat from the heat source is conducted through the heat spreader 3, the heat pipe section 1, and the heat sink 4, and then further dissipated by the cooling component 5. For example, if the cooling component 5 is a fan, the fan's airflow direction is directly opposite the heat dissipation gap of the heat sink 4, enhancing air convection.

[0063] Secondly, a lighting fixture is provided, including a light source module and the aforementioned heat dissipation structure, wherein the light source module is connected to the heat dissipation structure.

[0064] By adopting the above technical solution, the lamp in this embodiment not only has the advantages of heat dissipation structure in the above embodiments, but also takes into account the advantages of miniaturization and high-efficiency heat dissipation.

[0065] In one embodiment, the light source module includes a heating element 2, which is arranged parallel to and connected to the heat spreader 3.

[0066] Specifically, the light source module includes a heating element 2, which is positioned parallel to the heat spreader 3. The heating element 2 and the heat spreader 3 are located in the same plane or parallel planes, a layout that facilitates heat conduction and uniform distribution. For example, in some LED light source modules, the LED chip, acting as the heating element 2, can be placed parallel above the heat spreader, allowing for full contact between the two to improve thermal conductivity.

[0067] The heating element 2 is connected to the heat spreader 3. There may be various connection methods, such as bonding with thermally conductive adhesive, welding, or using screws or other fasteners, or even using auxiliary materials such as thermally conductive pads. Regardless of the connection method, the goal is to form a good heat conduction path to ensure that the heat generated by the heating element 2 can be effectively transferred to the heat spreader 3.

[0068] The heat spreader 3 has the characteristic of uniformly distributing heat. The heat generated by the heating element 2 is transferred to the heat spreader 3 through the connection part, and the heat spreader 3 then rapidly diffuses the heat to its entire surface, making the heat distribution more uniform and preventing local overheating of the heating element 2. Subsequently, the heat can be further dissipated into the surrounding environment through other heat dissipation components (such as heat sink 4, heat pipe 1, etc.) connected to the heat spreader 3, thereby achieving effective heat dissipation of the light source module.

[0069] By adopting the above technical solutions, the heat dissipation efficiency of the light source module can be improved, thereby enhancing its performance and stability. For light source components such as light-emitting diodes that generate significant heat, good heat dissipation can reduce their operating temperature, decrease light decay, and extend their service life. It can also ensure that the light source module maintains stable luminous performance during long-term operation, improving product quality and reliability.

[0070] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation structure, characterized in that, include: A heat pipe (1) includes a first heat pipe segment (11) and a second heat pipe segment (12) connected to the first heat pipe segment (11). The extension direction of the first heat pipe segment (11) is perpendicular to the thickness direction X. The first heat pipe segment (11) is provided with a first heat pipe surface (111) for connecting to a heating element (2). The first heat pipe surface (111) is perpendicular to the thickness direction X. The extension direction of the second heat pipe segment (12) is perpendicular to the thickness direction X. The second heat pipe segment (12) is provided with a second heat pipe surface (121). The second heat pipe surface (121) is parallel to the thickness direction X.

2. The heat dissipation structure as described in claim 1, characterized in that, The first heat pipe section (11) and the second heat pipe section (12) are flat in shape. The first heat pipe surface (111) is formed on the larger surface of the first heat pipe section (11), and the second heat pipe surface (121) is formed on the larger surface of the second heat pipe section (12).

3. The heat dissipation structure as described in claim 1, characterized in that, The first heat pipe segment (11) and the second heat pipe segment (12) are arranged parallel to each other along the thickness direction X; the heat pipe (1) further includes a third heat pipe segment (13) connecting the first heat pipe segment (11) and the second heat pipe segment (12).

4. The heat dissipation structure as described in claim 3, characterized in that, The first heat pipe section (11), the second heat pipe section (12) and the third heat pipe section (13) are connected in sequence and form a heat-conducting channel for containing the heat-conducting medium.

5. The heat dissipation structure as described in claim 1, characterized in that, The heat dissipation structure further includes a heat spreader (3), which is connected to the first heat pipe surface (111) and is arranged perpendicular to the thickness direction X.

6. The heat dissipation structure as described in claim 5, characterized in that, The heat dissipation structure also includes a plurality of heat sinks (4) arranged in parallel and spaced along the length direction Y perpendicular to the thickness direction X. A heat dissipation gap is formed between two adjacent heat sinks (4). The heat sinks (4) are parallel to the thickness direction X. The second heat pipe surface (121) is connected to the heat sinks (4).

7. The heat dissipation structure as described in claim 6, characterized in that, The second heat pipe surface (121) extends perpendicularly to the heat sink (4), and the second heat pipe segment (12) is disposed through multiple heat sinks (4).

8. The heat dissipation structure as described in claim 6, characterized in that, The heat dissipation structure also includes a cooling component (5), which is located on the side of the heat sink (4) away from the heat spreader (3). The cooling component (5) is used to reduce the temperature of the heat sink (4).

9. A lamp, characterized in that, It includes a light source module and a heat dissipation structure as described in any one of claims 1 to 8, wherein the light source module is connected to the heat dissipation structure.

10. The lamp as described in claim 9, characterized in that, The light source module includes a heating element (2), which is arranged parallel to the heat spreader (3) and connected to the heat spreader (3).

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