Optical module and temperature control structure thereof

Abstract

The utility model discloses a kind of optical module and temperature control structure, and the temperature control structure includes MCU, thermistor, TEC;Optical module includes several COC units, thermistor is set on at least one COC unit, all COC units are set on the upper surface of TEC;Thermistor obtains the temperature of the COC unit where it is set and transmits to MCU, MCU sends temperature control signal to TEC, to adjust the temperature of all COC units on TEC.The utility model realizes the accurate monitoring of COC unit temperature in optical module, and lays foundation for accurate control COC unit temperature.

Description

Technical Field

[0001] This utility model relates to the field of optical module technology, specifically to an optical module and its temperature control structure. Background Technology

[0002] In existing optical module designs, due to the complexity of the heat sink surface circuitry in the COC unit and the lack of a dedicated mounting location for thermistors, thermistors used to monitor the COC unit temperature are typically placed on the TEC surface used to control the COC unit temperature. However, this placement results in the thermistor being located far from the COC unit, making it impossible to accurately monitor the COC unit temperature. Consequently, the optical module's feedback control and adjustment of the COC temperature are not accurate enough, and the luminous stability of the optical module is difficult to guarantee. Utility Model Content

[0003] The purpose of this invention is to provide an optical module and its temperature control structure to achieve accurate monitoring of the temperature of the COC unit in the optical module.

[0004] To solve the above-mentioned technical problems, this utility model provides a temperature control structure for an optical module, including an MCU, a thermistor, and a TEC; the optical module includes several COC units, the thermistor is disposed on at least one COC unit, and all COC units are disposed on the upper surface of the TEC; the thermistor obtains the temperature of the COC unit it is disposed on and transmits it to the MCU, the MCU sends a temperature control signal to the TEC to adjust the temperature of all COC units on the TEC.

[0005] According to the above scheme, the COC unit includes a heat sink and a semiconductor laser; both the semiconductor laser and the thermistor are mounted on the heat sink.

[0006] According to the above scheme, the optical module includes a metal substrate; the lower surface of the TEC is in contact with the metal substrate.

[0007] According to the above scheme, the TEC is electrically connected to the MCU via the PCB.

[0008] According to the above scheme, the TEC is electrically connected to the PCB via gold wire or flexible tape.

[0009] This utility model also provides an optical module with a temperature control structure, including a temperature control structure and a light-emitting structure; the temperature control structure includes an MCU, a thermistor, and a TEC; the light-emitting structure includes several COC units; A thermistor is placed on at least one COC unit, and all COC units are placed on the upper surface of the TEC. The thermistor obtains the temperature of the COC unit it is placed on and transmits it to the MCU. The MCU sends a temperature control signal to the TEC to adjust the temperature of all COC units on the TEC.

[0010] According to the above scheme, the COC unit includes a heat sink and a semiconductor laser; both the semiconductor laser and the thermistor are mounted on the heat sink.

[0011] According to the above scheme, it includes a metal substrate; the lower surface of the TEC is in contact with the metal substrate.

[0012] According to the above scheme, it includes a PCB; the metal substrate is connected to the PCB.

[0013] According to the above scheme, the TEC is electrically connected to the MCU through the PCB, and the TEC is electrically connected to the PCB through gold wire or flexible tape.

[0014] Beneficial effects This invention places the thermistor directly on the COC unit, bringing it closer to the COC unit. This allows for direct and accurate acquisition of the actual operating temperature of the COC unit, avoiding temperature monitoring errors caused by excessive distance. This lays the foundation for precise temperature control of the COC unit by the optical module.

[0015] Furthermore, by bringing the lower surface of the TEC into contact with the metal substrate, the excellent thermal conductivity of the metal substrate is utilized to rapidly conduct heat from the lower surface of the TEC to the outside of the optical module, ensuring the temperature control capability of the TEC and providing a guarantee for the precise temperature control of the COC unit. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the optical module structure according to an embodiment of the present invention; Figure 2 , Figure 3 All Figure 1 A magnified view of a portion of the image.

[0017] In the diagram: 1-Heat sink, 2-Thermistor, 3-Semiconductor laser, 4-TEC, 5-MCU, 6-PCB, 7-Gold finger, 8-OMUX, 9-Collimating lens, 10-Focusing lens, 11-Isolator, 12-Metal substrate. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0019] See Figures 1-3This embodiment discloses a temperature control structure for an optical module, including an MCU5, a thermistor 2, and a TEC4. The optical module includes several COC units, with the thermistor 2 disposed on at least one COC unit and all COC units disposed on the upper surface of the TEC4. The thermistor 2 acquires the temperature of the COC unit it is disposed on and transmits it to the MCU5. The MCU5 sends a temperature control signal to the TEC4 to adjust the temperature of all COC units on the TEC4.

[0020] Furthermore, the COC unit includes a heat sink 1 and a semiconductor laser 3; both the semiconductor laser 3 and the thermistor 2 are disposed on the heat sink 1.

[0021] Furthermore, the optical module includes a metal substrate 12; the lower surface of the TEC4 is in contact with the metal substrate 12; the upper surface of the TEC4 is used to control the temperature of the COC unit and ensure the consistency of the operating temperature of different COC units; and the lower surface of the TEC4 is used for heat dissipation.

[0022] Furthermore, TEC4 is electrically connected to MCU5 via PCB6. After receiving the temperature signal from thermistor 2, MCU5 controls the upper surface temperature of TEC4 according to the set target temperature and the temperature signal, ensuring that each COC unit on TEC4 reaches the target temperature (the actual purpose is to ensure that the semiconductor laser 3 in the COC unit reaches the target temperature), thereby achieving precise temperature control of all COC units and ensuring the stable emission of the semiconductor laser 3 in the COC unit. The temperature sensing principle of thermistor 2 is as follows: the resistance of thermistor 2 changes at different temperatures, and MCU5 can read the monitoring voltage of thermistor 2 to inversely calculate the temperature of thermistor 2.

[0023] Furthermore, TEC4 is electrically connected to PCB6 via gold wire or flexible tape.

[0024] This embodiment also provides an optical module with a temperature control structure, including a temperature control structure and a light-emitting structure; the temperature control structure includes an MCU5, a thermistor 2, and a TEC4; the light-emitting structure includes several COC units; Thermistor 2 is disposed on at least one COC unit, and all COC units are disposed on the upper surface of TEC4; thermistor 2 obtains the temperature of the COC unit it is disposed on and transmits it to MCU5, MCU5 sends a temperature control signal to TEC4 to adjust the temperature of all COC units on TEC4.

[0025] Furthermore, the COC unit includes a heat sink 1 and a semiconductor laser 3; both the semiconductor laser 3 and the thermistor 2 are disposed on the heat sink 1.

[0026] Furthermore, it includes a metal substrate 12; the lower surface of TEC4 is in contact with the metal substrate 12.

[0027] Furthermore, it includes PCB6; the metal substrate 12 is connected to PCB6.

[0028] Furthermore, TEC4 is electrically connected to MCU5 via PCB6, and TEC4 is electrically connected to PCB6 via gold wire or flexible tape.

[0029] Furthermore, a gold finger 7 is provided at one end of PCB6, and MCU5 is electrically connected to PCB6. Each COC unit is arranged in parallel on TEC4. In the COC unit, a collimating lens 9 and an OMUX8 are provided in the light output direction of semiconductor laser 3. The collimating lens 9 collimates the beam emitted by semiconductor laser 3, and the OMUX8 combines the four collimated beams into a parallel beam. A focusing lens 10 and an isolator 11 are connected to the end of metal substrate 12. The focusing lens 10 converges and couples the parallel light output by OMUX8, and then inputs it into the optical fiber connected to the outside after passing through isolator 11.

[0030] It should be noted that, depending on the implementation needs, the various steps / components described in this application can be broken down into more steps / components, or two or more steps / components or parts of the operation of steps / components can be combined into new steps / components to achieve the purpose of this utility model.

[0031] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A temperature control structure for an optical module, characterized in that, The system includes an MCU, a thermistor, and a TEC. The optical module includes several COC units, with a thermistor located on at least one COC unit. All COC units are located on the upper surface of the TEC. The thermistor acquires the temperature of the COC unit it is located in and transmits it to the MCU. The MCU sends a temperature control signal to the TEC to adjust the temperature of all COC units on the TEC.

2. The temperature control structure of the optical module according to claim 1, characterized in that, The COC unit includes a heat sink and a semiconductor laser; both the semiconductor laser and the thermistor are mounted on the heat sink.

3. The temperature control structure of the optical module according to claim 1, characterized in that, The optical module includes a metal substrate; the lower surface of the TEC is in contact with the metal substrate.

4. The temperature control structure of the optical module according to claim 1, characterized in that, The TEC is electrically connected to the MCU via the PCB.

5. The temperature control structure of the optical module according to claim 4, characterized in that, The TEC is electrically connected to the PCB via gold wire or flexible tape.

6. An optical module with a temperature control structure, characterized in that, It includes a temperature control structure and a light-emitting structure; the temperature control structure includes an MCU, a thermistor, and a TEC; the light-emitting structure includes several COC units; A thermistor is placed on at least one COC unit, and all COC units are placed on the upper surface of the TEC. The thermistor obtains the temperature of the COC unit it is placed on and transmits it to the MCU. The MCU sends a temperature control signal to the TEC to adjust the temperature of all COC units on the TEC.

7. The optical module with a temperature control structure according to claim 6, characterized in that, The COC unit includes a heat sink and a semiconductor laser; both the semiconductor laser and the thermistor are mounted on the heat sink.

8. The optical module with a temperature control structure according to claim 6, characterized in that, Includes a metal substrate; the lower surface of the TEC is in contact with the metal substrate.

9. The optical module with a temperature control structure according to claim 8, characterized in that, Includes PCB; metal substrate connected to PCB.

10. The optical module with a temperature control structure according to claim 9, characterized in that, The TEC is electrically connected to the MCU via the PCB, and the TEC is electrically connected to the PCB via gold wire or flexible tape.

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