A host computer with natural convection cooling structure

Abstract

The utility model relates to a kind of mainframe with natural convection heat dissipation structure, the mainframe includes bottom shell, PCB board and set on the SOC chip of the PCB board, mounting bracket, heat-conducting silica gel pad and mainframe upper shell, the mainframe upper shell is provided with heat dissipation structure, the heat dissipation structure is a plurality of longitudinal and transverse cross arrangement heat dissipation teeth, and the intersection of the heat dissipation teeth is located the just above of the SOC chip.The utility model passes through the optimization heat dissipation tooth, uses the arrangement of '' well '' character or '' rice '' character, by the change of heat dissipation tooth structure, it is further reduced in limited structural space within the temperature of chip.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, in particular to a host computer with a natural convection heat dissipation structure. Background Art

[0002] Generally, the heat dissipation of in-vehicle host computers is achieved through aluminum parts. Due to many limitations in the stamping aluminum process, it cannot be used for the appearance and can only be used for heat sinks. Die-cast aluminum is often used for appearance parts. While die-cast aluminum is used as both the shell and for heat dissipation, the layout of the heat dissipation fins often adopts one layout direction: horizontal layout or vertical layout, which makes the air flow only horizontally or vertically, and cannot achieve the flow of external air around, and cannot achieve more-directional air flow. To a certain extent, it restricts the dissipation of heat, resulting in a relatively high temperature inside the chip and affecting the performance of the chip. In the case of a relatively high thermal power consumption of the chip, a fan needs to be added for active heat dissipation, but this will also increase a lot of costs. Content of the Utility Model

[0003] The purpose of the utility model is to overcome the above problems existing in the prior art and provide a host computer with a natural convection heat dissipation structure.

[0004] To achieve the above technical purpose and reach the above technical effect, the utility model is realized through the following technical solutions: A host computer with a natural convection heat dissipation structure, the host computer includes a bottom case, a PCB board, a SOC chip, a mounting bracket, a thermal conductive silicone pad and a host upper case arranged on the PCB board. A heat dissipation structure is arranged on the host upper case. The heat dissipation structure is a plurality of heat dissipation fins arranged vertically and horizontally in a cross shape, and the intersection of the heat dissipation fins is directly above the SOC chip.

[0005] In an embodiment of the utility model, the bottom case and the host upper case are connected through the mounting bracket, and an installation cavity is formed between the host upper case and the bottom case.

[0006] In an embodiment of the utility model, the PCB board is arranged in the installation cavity, and the thermal conductive silicone pad is located between the SOC chip and the host upper case, and the thermal conductive silicone pad contacts the host upper case.

[0007] In an embodiment of the utility model, the heat dissipation fins all extend to the vertical surfaces around the host upper case.

[0008] In an embodiment of the utility model, the structure formed at the intersection of the heat dissipation fins is a "well" character structure.

[0009] In an embodiment of the utility model, the structure formed at the intersection of the heat dissipation fins is a "rice" character structure.

[0010] This invention provides a host with a natural convection heat dissipation structure, forming airflow channels in four directions: front, back, left, and right. When the SOC chip heats up during operation, the SOC chip conducts heat to the host's upper casing through thermally conductive silicone pads. The heat is then dissipated through the heat dissipation structure of the host's upper casing. The upper casing has "grid" or "rice" shaped heat dissipation fins arranged around the center of the SOC chip. This allows for increased airflow towards the central area while the central temperature rises, improving heat dissipation efficiency. By optimizing the heat dissipation fins and adopting a "grid" or "rice" shaped arrangement, the chip temperature can be further reduced within a limited structural space. Attached Figure Description

[0011] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is an exploded view of the overall structure of this utility model; Figure 3 This is a top view of the overall structure of this utility model.

[0012] The numbers in the diagram are explained as follows: 1-bottom shell, 2-mounting bracket, 3-PCB board, 4-SOC chip, 5-thermal conductive silicone pad, 6-main unit top shell, 7-heat dissipation fins, 71-intersection of heat dissipation fins. Detailed Implementation

[0013] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0014] Please see Figures 1 to 3 This utility model provides a host with a natural convection heat dissipation structure. By optimizing the heat dissipation teeth 7 and arranging them in a "well" or "rice" pattern, the temperature of the SOC chip 4 can be further reduced within a limited structural space through changes in the structure of the heat dissipation teeth 7. Specifically, the host includes a bottom shell 1, a PCB board 3, an SOC chip 4, a mounting bracket 2, a thermally conductive silicone pad 5, and a host upper shell 6. The bottom shell 1 and the host upper shell 6 are connected by the mounting bracket 2, and a mounting cavity is formed between the host upper shell 6 and the bottom shell 1. The mounting bracket 2 can be connected to the bottom shell 1 and the host upper shell 6 by fasteners or by snap-fit, but is not limited to these methods.

[0015] Please see Figures 1 to 3In one embodiment of this utility model, the PCB board 3 is disposed in the mounting cavity, the SOC chip 4 is disposed on the PCB board 3, and the thermal conductive silicone pad 5 is located between the SOC chip 4 and the host upper shell 6, and the thermal conductive silicone pad 5 is in contact with the host upper shell 6 to conduct the heat on the SOC chip 4 to the host upper shell 6.

[0016] Please see Figures 1 to 3 In one embodiment of this utility model, a heat dissipation structure is provided on the upper casing 6 of the host. The heat dissipation structure consists of multiple intersecting heat dissipation teeth 7, with the intersection 71 of the heat dissipation teeth located directly above the SOC chip 4. The heat dissipation teeth 7 extend to the four sides of the upper casing 6. This utility model does not limit the structure formed by the intersection 71 of the heat dissipation teeth; the structure can be a "well" structure or a "rice" structure. The horizontal and vertical intersections are interconnected to ensure airflow. The SOC chip 4 on the PCB board 3 is located directly below the intersection 71 of the heat dissipation teeth. The intersection 71 of the heat dissipation teeth is distributed and spreads outwards. Considering airflow, the channels formed by the intersecting heat dissipation teeth converge as close as possible to the SOC chip 4. The intersection 71 of the heat dissipation teeth extends to the four sides of the upper casing 6 on both the left and right sides and in both the front and back directions, guiding the airflow upwards and to the high-temperature position of the SOC chip 4 on the PCB board 3, further increasing the heat dissipation area. After reserving airflow channels on the side facade of the main unit's upper casing 6, certain fixing points can be reserved according to the shape of the mounting bracket 2. Due to physical properties, hot air flows upward, forming a low pressure in the area above the SOC chip 4 where the heat dissipation fins 7 are located. Because the surrounding air temperature is lower and the air is at high pressure, a pressure difference is formed between the surrounding air and the upper part of the SOC chip, causing the surrounding cool air to flow towards the central area. Through actual model simulation verification, the model of the main unit's heat dissipation structure with a grid pattern around the perimeter reduces the internal temperature of the SOC chip 4 by at least 1.5℃ compared to a model with only horizontal or vertical lines. Under the constraints of structural design dimensions and considering the absence of a fan, this optimized structure has a better heat dissipation effect, especially when the chip's heat dissipation is high and the simulation temperature is close to the chip's junction temperature. This increases the safety margin of the chip temperature and ensures the performance of the main unit. In one embodiment of this utility model, in order to increase heat radiation and heat dissipation area, the heat dissipation fins can be blackened or have a serrated structure added to them.

[0017] This invention provides a host with a natural convection heat dissipation structure, forming airflow channels in four directions: front, back, left, and right. When the SOC chip heats up during operation, the SOC chip conducts heat to the host's upper casing through thermally conductive silicone pads. The heat is then dissipated through the heat dissipation structure of the host's upper casing. The upper casing has "grid" or "rice" shaped heat dissipation fins arranged around the center of the SOC chip. This allows for increased airflow towards the central area while the central temperature rises, improving heat dissipation efficiency. By optimizing the heat dissipation fins and adopting a "grid" or "rice" shaped arrangement, the chip temperature can be further reduced within a limited structural space.

[0018] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0019] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A host computer with a natural convection heat dissipation structure, the host computer comprising a bottom shell, a PCB board, and a SOC chip, a mounting bracket, a thermally conductive silicone pad, and a top shell disposed on the PCB board, characterized in that, A heat dissipation structure is provided on the upper shell of the host. The heat dissipation structure is multiple heat dissipation teeth arranged vertically and horizontally in a crisscross pattern, and the intersection of the heat dissipation teeth is directly above the SOC chip.

2. The host computer according to claim 1, characterized in that, The bottom shell and the upper shell of the host are connected by the mounting bracket, and an installation cavity is formed between the upper shell of the host and the bottom shell.

3. The host computer according to claim 2, characterized in that, The PCB board is arranged in the installation cavity, and the thermal conductive silicone pad is located between the SOC chip and the upper shell of the host, and the thermal conductive silicone pad is in contact with the upper shell of the host.

4. The host computer according to claim 1, characterized in that, All the heat dissipation teeth extend to the vertical surfaces around the upper shell of the host.

5. The host computer according to claim 1, characterized in that, The structure formed at the intersection of the heat dissipation teeth is a "well" character structure.

6. The host computer according to claim 1, characterized in that, The structure formed at the intersection of the heat dissipation teeth is a "rice" character structure.

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