A heat dissipation unit and a heat sink

Abstract

The utility model relates to the technical field of heat dissipation device, specifically disclose a kind of heat dissipation unit and radiator.The heat dissipation unit includes first heat conduction component, second heat conduction component and fin group.First heat conduction component is used to and heat element heat conduction connection, second heat conduction component is installed on the upper surface of first heat conduction component, i.e.second heat conduction component is installed between first heat conduction component and fin group, and second heat conduction component is used to transfer the heat at first heat conduction component to fin group.First heat conduction component and second heat conduction component spatial three-dimensional layout, so that more heat conduction copper pipe can be accommodated on unit area, and then make the heat transfer efficiency of heat dissipation unit higher.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a heat dissipation unit and a heat sink. Background Technology

[0002] A computer host contains core components such as the CPU (Central Processing Unit), GPU (Graphics Card), and memory. These components generate a lot of heat during operation, and excessively high temperatures can lead to performance degradation, system instability, or even hardware damage. Different electronic components require different cooling solutions. Among these, tower coolers are widely used for cooling desktop computer CPUs due to their high efficiency.

[0003] Current tower coolers primarily improve heat dissipation performance by increasing the number of heat pipes. However, the contact area between the CPU and the cooler base is fixed, directly limiting the number of copper pipes that can effectively fit that contact surface. Therefore, tower coolers have an inherent physical upper limit to their cooling efficiency. For the high heat generated by flagship high-power CPUs, existing tower coolers often struggle to meet their cooling requirements, and such CPUs typically require liquid cooling for effective heat dissipation.

[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content

[0005] This utility model discloses a heat dissipation unit and heat sink, which addresses the shortcomings of the existing technology by providing a solution that can integrate more heat pipes for heat dissipation, making it particularly suitable for heat dissipation of high-power CPUs.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A heat dissipation unit, comprising:

[0008] The first heat-conducting component includes:

[0009] The first thermally conductive block is used for thermally conductive bonding of heating elements.

[0010] The first U-shaped heat pipe assembly has a horizontal section as the first part and a vertical section as the second part. The first part is fixed to the upper surface of the first heat-conducting block, and the second part extends perpendicular to the first part.

[0011] A second heat-conducting block that covers the first part;

[0012] A heat sink assembly parallel to the first heat-conducting block is inserted into the second part;

[0013] The second heat-conducting component is located on the upper surface of the second heat-conducting block and is used to conduct heat to the heat sink assembly.

[0014] Preferably, the second heat-conducting component includes a U-shaped second heat-conducting pipe group, the horizontal section of which is the third part and the vertical section is the fourth part, the third part being fixed to the upper surface of the second heat-conducting block;

[0015] The projection of the third part onto the horizontal plane intersects with the projection of the first part onto the horizontal plane.

[0016] Preferably, the second thermally conductive component further includes a third thermally conductive block covering the third portion.

[0017] Preferably, the first heat pipe assembly comprises multiple first U-shaped heat pipes arranged side by side along the longitudinal centerline of the first heat-conducting block, with adjacent first U-shaped heat pipes projected alternately onto a projection plane parallel to the longitudinal centerline.

[0018] Preferably, the horizontal projection of the third part is perpendicular to the horizontal projection of the first part.

[0019] Preferably, the heat sink assembly comprises multiple stacked heat sink fins, each of which is disposed in the second part.

[0020] Preferably, the fourth part is inserted through the heat dissipation fins.

[0021] Preferably, the first heat pipe assembly is a pure copper pipe assembly.

[0022] Preferably, both the first heat-conducting block and the second heat-conducting block are pure copper heat-conducting blocks.

[0023] This utility model also discloses a heat sink for mounting on heat-generating electronic components, comprising:

[0024] Such as the heat dissipation unit mentioned above;

[0025] The fan is installed on the exhaust side of the heatsink assembly.

[0026] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0027] The present invention discloses a heat dissipation unit, which includes a first heat-conducting component, a second heat-conducting component, and a heat sink assembly. By setting the second heat-conducting component on the upper surface of the first heat-conducting component, the number of heat-conducting pipe assemblies in contact with the heat-generating electronic components per unit area is increased, thereby enabling the heat at the heat-generating electronic components to be conducted to the heat sink assembly more efficiently, resulting in a better heat dissipation effect of the heat dissipation unit.

[0028] In addition, this utility model also discloses a radiator that includes the above-mentioned heat dissipation unit and has all its advantages, and the radiator has a better heat dissipation effect than the traditional tower radiator. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of a heat dissipation unit provided in an embodiment of the present invention;

[0030] Figure 2 This is a front view of a heat dissipation unit provided in an embodiment of the present invention;

[0031] Figure 3 A cross-sectional view of a heat dissipation unit provided in an embodiment of the present invention;

[0032] Figure 4 A cross-sectional view of a heat dissipation unit provided in an embodiment of the present invention;

[0033] Figure 5 A cross-sectional view of a heat dissipation unit provided in an embodiment of the present invention;

[0034] Figure 6 This is a schematic diagram of the structure of a heat sink assembly provided in an embodiment of the present invention;

[0035] Figure 7 for Figure 6 Enlarged view of the structure of section A in the middle.

[0036] In the attached diagram: 100 - First heat-conducting component; 110 - First heat-conducting block; 111 - First groove; 120 - First heat-conducting pipe assembly; 121 - First part; 122 - Second part; 130 - Second heat-conducting block; 131 - Second groove; 132 - Third groove; 200 - Heat sink assembly; 210 - Heat sink fins; 300 - Second heat-conducting component; 310 - Second heat-conducting pipe assembly; 311 - Third part; 312 - Fourth part; 320 - Third heat-conducting block; 321 - Fourth groove; 400 - First U-shaped heat-conducting pipe; 500 - Second U-shaped heat-conducting pipe. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0039] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0040] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0041] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0042] The technical solution of this utility model will be further described below with reference to the embodiments and accompanying drawings.

[0043] Example

[0044] Common tower heat sinks mainly improve heat dissipation efficiency by increasing the number of heat-conducting copper pipes connected to the heat-generating electronic components. Since the heat-generating components are of similar size, the number of heat-conducting copper pipes that can be accommodated per unit area in a plane is limited. Therefore, common tower heat sinks can only be used on some heat-generating components with relatively low power.

[0045] Therefore, this application discloses a heat dissipation unit and a heat sink, referring to... Figure 1-3The heat dissipation unit includes a first thermally conductive component 100, a second thermally conductive component 300, and a heat sink assembly 200. The first thermally conductive component 100 is used for thermally conductive connection with the heat-generating element. The second thermally conductive component 300 is mounted on the upper surface of the first thermally conductive component 100, that is, the second thermally conductive component 300 is installed between the first thermally conductive component 100 and the heat sink assembly 200, and the second thermally conductive component 300 is used to transfer heat from the first thermally conductive component 100 to the heat sink assembly 200. The spatial three-dimensional arrangement of the first thermally conductive component 100 and the second thermally conductive component 300 allows for more thermally conductive copper pipes to be accommodated per unit area, thereby improving the heat transfer efficiency of the heat dissipation unit.

[0046] Specifically, refer to Figure 2-3 The first heat-conducting component 100 includes a first heat-conducting block 110 for thermally bonding with a heating element. A U-shaped first heat-conducting pipe assembly 120 is fixedly attached to the first heat-conducting block 110. The horizontal section of the first heat-conducting pipe assembly 120 is a first part 121, and the vertical section of the first heat-conducting pipe assembly 120 is a second part 122. The first part 121 is fixed to the upper surface of the first heat-conducting block 110, and the second part 122 extends upward perpendicular to the horizontal first part 121. The first part 121 is used for heat exchange with the first heat-conducting block 110. After being heated, the first part 121 transfers heat to the second part 122. The second part 122 is inserted into a heat sink assembly 200. The heat at the heating element is transferred to the outside through the heat sink assembly 200, thereby reducing the temperature at the heating element.

[0047] In one embodiment of this utility model, reference is made to Figure 3 The first heat-conducting component 100 further includes a second heat-conducting block 130, which covers the upper surface of the first portion 121. The first heat-conducting block 110 and the second heat-conducting block 130 enclose the first portion 121, and the enclosed first portion 121 can fully exchange heat with the first heat-conducting block 110 and the second heat-conducting block 130, that is, the first portion 121 can more fully exchange heat with the heating element.

[0048] Furthermore, in one embodiment of this utility model, referring to Figure 3 It also includes a second heat-conducting component 300, which is installed on the upper surface of the second heat-conducting block 130. By providing the second heat-conducting component 300, the heat generated by the heating element can be transferred to the heat sink assembly 200 in addition to the heat generated by the first heat-conducting pipe assembly 120. By increasing the heat transfer channel in a limited space, the heat transfer efficiency of the heat dissipation unit is improved.

[0049] Specifically, refer to Figure 3In one embodiment of this utility model, the second heat-conducting component 300 includes a U-shaped second heat-conducting pipe assembly 310, with a horizontal section of the second heat-conducting pipe assembly 310 being a third part 311 and a vertical section of the second heat-conducting pipe assembly 310 being a fourth part 312. The third part 311 is fixedly connected to the upper surface of the second heat-conducting block 130. The connection between the third part 311 and the second heat-conducting block 130 further enhances the heat transfer efficiency of the heat dissipation unit.

[0050] It should be noted that in one embodiment of this utility model, the projection of the third part 311 on the horizontal plane and the projection of the first part 121 on the horizontal plane intersect. By staggering the first heat pipe group 120 and the second heat pipe group 310, heat accumulation caused by the aggregation of the first heat pipe group 120 and the second heat pipe group 310 is avoided.

[0051] Preferably, in one embodiment of the present invention, reference is made to... Figure 4 The second heat-conducting component 300 also includes a third heat-conducting block 320 covering the third part 311. The second heat-conducting block 130 and the third heat-conducting block 320 surround the third part 311. The surrounded third part 311 can fully exchange heat with the second heat-conducting block 130 and the third heat-conducting block 320. That is, the third part 311 can more fully exchange heat with the heat-generating element, further improving the heat exchange efficiency of the heat dissipation unit.

[0052] Specifically, refer to Figure 3 and Figure 5 The first heat pipe assembly 120 includes multiple first U-shaped heat pipes 400 arranged side-by-side along the longitudinal centerline of the first heat-conducting block 110, and adjacent first U-shaped heat pipes 400 are staggered in their projection onto a projection plane parallel to the longitudinal centerline. By staggering the first U-shaped heat pipes 400, as... Figure 3 The vertical and horizontal portions of the first U-shaped heat pipe 400 shown are staggered to avoid heat transfer between the vertical portions of the first U-shaped heat pipe 400. At the same time, the area of ​​the horizontal portion of the first U-shaped heat pipe 400 in contact with the first heat-conducting block 110 on the horizontal surface is increased, resulting in a better heat exchange effect between the first heat pipe assembly 120 and the first heat-conducting block 110.

[0053] In one embodiment of this utility model, reference is made to Figure 3 The second heat pipe group 310 includes multiple second U-shaped heat pipes 500 arranged in parallel along the transverse center line of the first heat pipe 110.

[0054] It should be noted that the number of second U-shaped heat pipes 500 included in the second heat pipe assembly 310 is determined according to the length of the first portion 121. In one embodiment of this utility model, the first portion 121 is shorter, as shown in the reference... Figure 3The second heat pipe group 310 is equipped with two second U-shaped heat pipes 500.

[0055] Preferably, in one embodiment of the present invention, reference is made to... Figure 4 The horizontal projection of the third part 311 is perpendicular to the horizontal projection of the first part 121. When the horizontal projections of the third part 311 and the first part 121 are perpendicular, the area of ​​the overlapping region of the first part 121 and the third part 311 is minimized, the distance between the second part 122 and the fourth part 312 is maximized, and the heat transfer interference between the first heat pipe group 120 and the second heat pipe group 310 is minimized, further improving the heat transfer efficiency of the heat dissipation unit.

[0056] Furthermore, in one embodiment of this utility model, referring to Figure 3 A first groove 111 is provided on the upper surface of the first heat-conducting block 110. Multiple first U-shaped heat-conducting pipes 400 of the first heat-conducting pipe group 120 are installed in the first groove 111. The shape of the first groove 111 fits the shape of the first U-shaped heat-conducting pipe 400, so that the contact area between the first heat-conducting pipe group 120 and the first heat-conducting block 110 is larger, thereby improving the heat exchange efficiency.

[0057] Furthermore, referring to Figure 3 In one embodiment of this utility model, a second groove 131 and a third groove 132 are respectively provided on the lower and upper surfaces of the second heat-conducting block 130. The shape of the second groove 131 is adapted to the shape of the first U-shaped heat-conducting pipe 400, and the first heat-conducting block 110 and the second heat-conducting block 130 cooperate to surround the first part 121, so that the lower half of the first part 121 is closely attached to and fixed with the first heat-conducting block 110, and the upper half of the first part 121 is closely attached to and fixed with the second heat-conducting block 130, thereby improving the heat exchange efficiency of the heat dissipation unit.

[0058] Furthermore, in one embodiment of this utility model, referring to Figure 3 and Figure 4 The shape of the third groove 132 is adapted to the shape of the second U-shaped heat pipe 500. The third heat-conducting block 320 is installed on the upper surface of the second heat-conducting block 130, and a fourth groove 321 is provided on the lower surface of the third heat-conducting block 320. The shape of the fourth groove 321 is adapted to the shape of the second U-shaped heat pipe 500. The second heat-conducting block 130 and the third heat-conducting block 320 cooperate to surround the third part 311, so that the lower half of the third part 311 is closely attached and fixed to the second heat-conducting block 130, and the upper half of the third part 311 is closely attached and fixed to the third heat-conducting block 320, thereby improving the heat exchange efficiency of the heat dissipation unit.

[0059] Certainly, in an embodiment of the present utility model, the second heat conduction component 300 may further include more heat conduction tube groups and more heat conduction blocks. At the same time, the number and installation method of the heat conduction tube groups that the second heat conduction component 300 can include have a high degree of freedom, and the number of heat conduction tube groups and heat conduction blocks can be selected according to the space between the fin group 200 and the second heat conduction block 130.

[0060] Referring to Figure 6 , the fin group 200 includes multiple stacked heat dissipation fins 210, and through holes are provided on each heat dissipation fin 210. The second part 122 and the fourth part 312 are respectively inserted into different through holes. There are multiple heat dissipation fins 210, so that the first heat conduction tube group 120 and the second heat conduction tube group 310 can be cooled faster.

[0061] It should be noted that the heat dissipation fins 210 at the top and bottom are fixedly connected to the second part 122, so that the connection between the fin group 200 and the first U-shaped heat conduction tube 400 and the second U-shaped heat conduction tube 500 is stable.

[0062] In an embodiment of the present utility model, referring to Figure 7 , both sides of the heat dissipation fin 210 are bent to form a "C"-shaped fin, and the bent parts at both ends abut against the upper surface of a heat dissipation fin 210 located below the heat dissipation fin 210, ensuring that there is a gap between adjacent heat dissipation fins 210, so as to facilitate the fan to blow air flow to dissipate heat from the heat dissipation fins 210.

[0063] In an embodiment of the present utility model, referring to Figure 1 , the fourth part 312 also passes through all the heat dissipation fins 210, and the entire fin group 200 is connected to the fourth part 312, thereby improving the heat exchange efficiency of the heat dissipation unit.

[0064] In an embodiment of the present utility model, referring to Figure 3 or Figure 4 , the first U-shaped heat conduction tube 400 is a hollow pure copper heat conduction tube, and the second U-shaped heat conduction tube 500 is also a hollow pure copper heat conduction tube group, so that the heat conduction tube has a high heat transfer speed. At the same time, a heat exchange medium is provided in the heat conduction tube, and heat exchange is carried out through the medium, and the overall heat exchange effect is significantly better than that of a solid pure copper tube.

[0065] In an embodiment of the present utility model, referring to Figure 4 , the first heat conduction block 110, the second heat conduction block 130 and the third heat conduction block 320 are all pure copper heat conduction blocks. Copper has a high heat transfer coefficient, thereby improving the heat exchange efficiency of the heat dissipation unit.

[0066] This utility model also discloses a heat sink for dissipating heat from electronic components mounted on them. The heat sink further includes the heat dissipation unit and fan as described above. The fan is mounted on the heat sink assembly 200 and is positioned directly opposite the gap between the heat sink fins 210, allowing the heat from the heat sink fins 210 and the first U-shaped heat pipe 400 and the second U-shaped heat pipe 500 to be quickly transferred to the air medium by the airflow, thus enabling the electronic components to cool down more quickly.

[0067] It is understood that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of this utility model, and all such substitutions or changes should fall within the protection scope of this utility model.

Claims

1. A heat dissipation unit, characterized in that, include: The first heat-conducting component includes: The first thermally conductive block is used for thermally conductive bonding of heating elements. The first U-shaped heat pipe assembly has a horizontal section as the first part and a vertical section as the second part. The first part is fixed to the upper surface of the first heat-conducting block, and the second part extends perpendicular to the first part. A second heat-conducting block that covers the first part; A heat sink assembly parallel to the first heat-conducting block is inserted into the second part; The second heat-conducting component is located on the upper surface of the second heat-conducting block and is used to conduct heat to the heat sink assembly.

2. The heat dissipation unit according to claim 1, characterized in that, The second heat-conducting component includes a U-shaped second heat-conducting pipe group, with a horizontal section as the third part and a vertical section as the fourth part, the third part being fixed to the upper surface of the second heat-conducting block; The projection of the third part onto the horizontal plane intersects with the projection of the first part onto the horizontal plane.

3. The heat dissipation unit according to claim 2, characterized in that, The second thermally conductive component also includes a third thermally conductive block that covers the third part.

4. The heat dissipation unit according to claim 1, characterized in that, The first heat pipe group includes multiple first U-shaped heat pipes arranged in parallel along the longitudinal center line of the first heat-conducting block, and adjacent first U-shaped heat pipes are staggered in projection on a projection plane parallel to the longitudinal center line.

5. The heat dissipation unit according to claim 2, characterized in that, The horizontal projection of the third part is perpendicular to the horizontal projection of the first part.

6. The heat dissipation unit according to claim 2, characterized in that, The heat sink assembly includes multiple stacked heat sink fins, each of which is inserted into the second part.

7. The heat dissipation unit according to claim 6, characterized in that, The fourth part is inserted through the heat dissipation fins.

8. The heat dissipation unit according to claim 2, characterized in that, The first heat pipe assembly is a pure copper pipe assembly.

9. The heat dissipation unit according to claim 1, characterized in that, Both the first and second heat-conducting blocks are pure copper heat-conducting blocks.

10. A heat sink for mounting on a heat-generating electronic component, characterized in that, include: The heat dissipation unit as described in any one of claims 1-9; The fan is installed on the exhaust side of the heatsink assembly.

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