Electronic device

Abstract

The application relates to the technical field of electronic equipment, in particular to an electronic equipment, which comprises a fingerprint identification module, a buffer piece and a panel, wherein the fingerprint identification module and the panel are arranged in a laminated mode; the fingerprint identification module and the buffer piece are located on the same surface of the panel; and the buffer piece extends along the circumference of the fingerprint identification module. The application can reduce the occupation of space.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and particularly to electronic equipment. Background Technology

[0002] Electronic devices are products that relate to users' personal privacy, and they generally have measures such as fingerprint recognition modules to protect personal privacy.

[0003] In related technologies, fingerprint recognition modules require the user to press down to complete the recognition. Therefore, the area beneath the fingerprint recognition module needs sufficient space for its movement, thus occupying a considerable amount of space. Utility Model Content

[0004] In view of this, this application provides an electronic device to reduce space occupation.

[0005] Specifically, the following technical solutions are included:

[0006] This application provides an electronic device, which includes a fingerprint recognition module, a buffer, and a panel, wherein...

[0007] The fingerprint recognition module is stacked with the panel.

[0008] The fingerprint recognition module and the buffer are located on the same side of the panel.

[0009] The buffer extends circumferentially along the fingerprint recognition module.

[0010] In some possible implementations, the projection of the buffer onto the panel is separated from the projection of the fingerprint recognition module onto the panel.

[0011] With the above arrangement, the buffer can reduce interference with the fingerprint recognition module, and the gap formed by the separation between the two is conducive to the deformation of the fingerprint recognition module when pressed. At the same time, the buffer space at the above position also helps to share the pressure from the fingerprint recognition module when pressed, thereby reducing the deformation of the fingerprint recognition module.

[0012] In some possible implementations, the buffer includes a first buffer portion, a second buffer portion, and a third buffer portion, with the first buffer portion and the second buffer portion located on opposite sides of the fingerprint recognition module, respectively.

[0013] Through the above arrangement, the first, second, and third buffer sections can respectively provide reaction forces to the panel through deformation from different positions, thus cooperating with the fingerprint recognition module and balancing the pressure generated by pressing, thereby reducing the deformation of the fingerprint recognition module. In addition, these three components also help to improve the uniform distribution of the reaction force generated by the deformation of the buffers around the fingerprint recognition module, thereby reducing the weakening of the buffering effect when the pressing position deviates from the fingerprint recognition module.

[0014] In some possible implementations, the third buffer is located on one side of the fingerprint recognition module and is connected to the connection end of the first buffer and the connection end of the second buffer.

[0015] Through the above arrangement, the connection between the third buffer section and the first and second buffer sections can reduce the trouble of aligning the three sections separately in terms of position.

[0016] In some possible implementations, the fingerprint recognition module includes a wiring portion located between the open end of the first buffer portion and the open end of the second buffer portion.

[0017] With the above arrangement, the wiring section facilitates the transmission of recognition result-related signals from the fingerprint recognition module to other components, enabling the electronic device to determine whether the user is a legitimate user. Simultaneously, the wiring section located between the open ends of the first and second buffer sections improves the structural compactness of the electronic device, thereby reducing the space occupied by the fingerprint recognition module.

[0018] In some possible implementations, the open end of the first buffer portion has a first clearance portion, the open end of the second buffer portion has a second clearance portion, the first clearance portion and the second clearance portion are disposed opposite to each other, and the two sides of the wiring portion extend into the first clearance portion and the second clearance portion respectively.

[0019] With the above arrangement, the first and second buffer portions help to reduce interference with the wiring portion, and also help the first and second buffer portions to have a larger area so as to share the pressure generated when pressing with the fingerprint recognition module.

[0020] In some possible implementations, the panel includes a screen, and the fingerprint recognition module and the buffer are located on the side of the screen opposite to the display surface.

[0021] With the above arrangement, users can apply pressure to the fingerprint recognition module and the buffer by pressing the screen. This helps the buffer and the fingerprint recognition module to generate a reaction force through deformation and reach a state of equilibrium with the pressure. This reduces the deformation of the fingerprint recognition module and reduces the space occupied by the electronic device.

[0022] In some possible implementations, the electronic device includes a heat dissipation unit, with the fingerprint recognition module and the buffer respectively located above the heat dissipation unit, wherein the upper end of the buffer abuts against the screen and the lower end of the buffer abuts against the heat dissipation unit.

[0023] With the above arrangement, when the fingerprint recognition module is deformed, the buffering effect of the buffer can reduce the collision between the fingerprint recognition module and the heat dissipation unit. At the same time, the heat exchange unit and the fingerprint recognition module can maintain a relatively small distance, which helps to reduce the space occupied by the electronic device.

[0024] In some possible implementations, the distance between the heat dissipation unit and the fingerprint recognition module is less than or equal to 0.1 mm.

[0025] With the above arrangement, the space between the heat dissipation unit and the fingerprint recognition module is small enough to reduce the miniaturization of electronic devices, and also large enough for the fingerprint recognition module to deform sufficiently when pressed to complete fingerprint recognition.

[0026] In some possible implementations, the screen includes a recess, the fingerprint recognition module is located within the recess, and the buffer abuts against the bottom surface of the recess.

[0027] The aforementioned arrangement allows the grooves to facilitate the fingerprint recognition module's reception of signals reflected from the user's finger, thereby improving recognition accuracy. Simultaneously, the grooves also contribute to the compactness of the electronic device's internal structure, helping to reduce its overall size.

[0028] In some possible implementations, the cushioning element is foam.

[0029] With the above arrangement, the buffer component is easier to assemble on electronic devices and maintains a relatively stable positional relationship with the fingerprint recognition module, so as to share the pressure with the fingerprint recognition module. In addition, the foam also allows designers to arrange the amount that matches the design deformation of the fingerprint recognition module, thereby helping the buffer component to generate sufficient reaction force to reduce the deformation of the fingerprint recognition module.

[0030] The beneficial effects of the technical solution provided in this application include at least the following: the panel can be used to realize the functions of an electronic device. The fingerprint recognition module can complete fingerprint recognition by receiving pressure from the user through the panel. The buffer extends circumferentially along the fingerprint recognition module, which can be used to offset the pressure generated by the user's press, reducing the possibility of the fingerprint recognition module being damaged by excessive deformation due to pressure and contact with other components of the electronic device. At the same time, this also helps to reduce the space required for the fingerprint recognition module to move, thereby reducing the space occupied by the fingerprint recognition module in the electronic device. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a partial structural schematic diagram of an electronic device provided in an embodiment of this application;

[0033] Figure 2 This is a cross-sectional schematic diagram of a partial structure of an electronic device provided in an embodiment of this application;

[0034] Figure 3 This is a cross-sectional schematic diagram of an electronic device provided in an embodiment of this application.

[0035] The reference numerals in the figure indicate:

[0036] 1. Fingerprint recognition module; 11. Wiring unit;

[0037] 2. Buffer component; 21. First buffer section; 211. First clearance section; 22. Second buffer section; 221. Second clearance section; 23. Third buffer section;

[0038] 3. Panel; 31. Screen; 3101. Recess;

[0039] 4. Heat dissipation section.

[0040] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] In the embodiments of this application, directional terms such as "upper," "lower," and "side" are generally used in the following ways: Figure 1The relative positions shown are based on the given information, and these directional terms are used only to more clearly describe the relationships between structures, not to describe absolute positions. Positions may change when the product is placed in different orientations; for example, "up" and "down" may be interchanged.

[0043] Unless otherwise defined, all technical terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art.

[0044] To make the technical solutions and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0045] This application provides an electronic device, such as... Figure 1 As shown, the electronic device includes a fingerprint recognition module 1, a buffer 2, and a panel 3, wherein,

[0046] The fingerprint recognition module 1 and the buffer 2 are located on the same side of the panel 3.

[0047] The buffer 2 extends circumferentially along the fingerprint recognition module 1.

[0048] With the above arrangement, panel 3 can be used to realize the functions of electronic device. Fingerprint recognition module 1 can receive the user's pressure through panel 3 to complete fingerprint recognition. The buffer 2 extends circumferentially along the fingerprint recognition module 1, which can be used to offset the pressure generated by the user's pressure, reduce the damage caused by excessive deformation of the fingerprint recognition module 1 due to pressure and contact with other components of the electronic device. At the same time, this also helps to reduce the space required for the fingerprint recognition module 1 to move, thereby reducing the space occupied by the fingerprint recognition module 1 in the electronic device.

[0049] In this embodiment, during the pressing process, the pressure on the fingerprint recognition module 1 initially increases and then decreases. Under the same pressure, because the buffer 2 shares some of the pressure, the fingerprint recognition module 1 deforms less when the pressure reaches its maximum value. Specifically, the fingerprint recognition module 1 deforms less along the direction of pressure, thus saving space for fingerprint recognition deformation and reducing the space occupied by the fingerprint recognition module 1 in the electronic device.

[0050] In this embodiment, the buffer 2 can generate a reaction force opposite to the pressure by undergoing a certain degree of plastic or elastic deformation. The sum of this reaction force and the reaction force generated by the deformation of the fingerprint recognition module 1 can reach a state of equilibrium with the pressure. Due to the intervention of the reaction force of the buffer 2, the reaction force of the fingerprint recognition module 1 can be smaller, and thus the degree of deformation can be reduced accordingly, thereby reducing the space occupied.

[0051] In the embodiments of this application, panel 3 can be a light-transmitting panel 3 or an opaque panel 3.

[0052] In this embodiment, panel 3 can be a screen 31 stack, cover plate, mid-frame plate, or other panel 3.

[0053] In this embodiment of the application, the fingerprint recognition module 1 can be identified by ultrasonic fingerprint recognition, optical recognition, or other methods.

[0054] In this embodiment, since the contact area between the user and the panel 3 is often small when the user presses the panel 3, the buffer 2 extends circumferentially along the fingerprint recognition module 1. This helps to improve the cooperation between the buffer 2 and the fingerprint recognition module 1, thereby reducing the deformation of the fingerprint recognition module 1 and reducing the space occupied by the electronic device. The buffer 2 can either be in contact with the fingerprint recognition module 1 or form a gap with it.

[0055] In the embodiments of this application, the electronic device can be a smartphone, tablet computer, smartwatch, or laptop computer, etc.

[0056] In this embodiment, the fingerprint recognition module 1 can be connected to the panel 3 by means of adhesive bonding or other methods.

[0057] In this embodiment, the buffer 2 can be connected to the panel 3 by means of adhesive bonding or by means of abutment.

[0058] In this embodiment, the buffer 2 may be ring-shaped and extend circumferentially along the fingerprint recognition module 1.

[0059] In some embodiments of this application, such as Figure 1 As shown, the orthographic projection of the buffer 2 on the panel 3 is separated from the orthographic projection of the fingerprint recognition module 1 on the panel 3.

[0060] With the above arrangement, the buffer 2 can reduce interference with the fingerprint recognition module 1, and the gap formed by the separation between the two is conducive to the deformation of the fingerprint recognition module 1 when pressed. At the same time, the buffer space at the above position is also conducive to sharing the pressure from the fingerprint recognition module 1 when pressed, thereby reducing the deformation of the fingerprint recognition module 1.

[0061] In some embodiments of this application, such as Figure 1 As shown, the buffer 2 includes a first buffer 21, a second buffer 22 and a third buffer 23, with the first buffer 21 and the second buffer 22 located on opposite sides of the fingerprint recognition module 1.

[0062] Through the above arrangement, the first buffer 21, the second buffer 22, and the third buffer 23 can respectively provide reaction force to the panel 3 through deformation from different positions, thus cooperating with the fingerprint recognition module 1 and balancing the pressure generated by pressing, thereby reducing the deformation of the fingerprint recognition module 1. In addition, the three components also help to improve the uniform distribution of the reaction force generated by the deformation of the buffer 2 in the circumference of the fingerprint recognition module 1, thereby reducing the weakening of the buffering effect of the buffer 2 when the pressing position deviates from the fingerprint recognition module 1.

[0063] In the embodiments of this application, the first buffer part 21, the second buffer part 22 and the third buffer part 23 can be manufactured by an integral molding process, thereby achieving the connection of the three.

[0064] In the embodiments of this application, the first buffer portion 21 can extend along a straight line or along a curve.

[0065] In this embodiment, the second buffer portion 22 can extend in a straight line or in a curve.

[0066] In the embodiments of this application, the third buffer portion 23 can extend in a straight line or in a curve.

[0067] In some embodiments of this application, the third buffer 23 is located on one side of the fingerprint recognition module 1 and is connected to the connection end of the first buffer 21 and the connection end of the second buffer 22.

[0068] Through the above arrangement, the connection between the third buffer section 23 and the first buffer section 21 and the second buffer section 22 can reduce the trouble of aligning the three parts separately in terms of position.

[0069] In some embodiments of this application, such as Figure 1 As shown, the fingerprint recognition module 1 includes a wiring section 11, which is located between the open end of the first buffer section 21 and the open end of the second buffer section 22.

[0070] With the above arrangement, the wiring section 11 facilitates the transmission of recognition result-related signals from the fingerprint recognition module 1 to other components, enabling the electronic device to determine whether the user is a user. Simultaneously, the wiring section 11, located between the open ends of the first buffer section 21 and the second buffer section 22, helps improve the structural compactness of the electronic device, thereby reducing the space occupied by the fingerprint recognition module 1.

[0071] In some embodiments of this application, such as Figure 1As shown, the open end of the first buffer portion 21 has a first clearance portion 211, and the open end of the second buffer portion 22 has a second clearance portion 221. The first clearance portion 211 and the second clearance portion 221 are arranged opposite to each other, and the two sides of the wiring portion 11 extend into the first clearance portion 211 and the second clearance portion 221 respectively.

[0072] The wiring portion 11 generally has a large volume. Through the above arrangement, the first clearance portion 211 and the second clearance portion 221 help to reduce interference with the wiring portion 11, and at the same time, they also help the first buffer portion 21 and the second buffer portion 22 to have a large area so as to share the pressure generated when pressing with the fingerprint recognition module 1.

[0073] In some embodiments of this application, such as Figure 1 and Figure 2 As shown, panel 3 includes screen 31, and fingerprint recognition module 1 and buffer 2 are located on the side of screen 31 opposite to the display surface.

[0074] With the above arrangement, the user can apply pressure to the fingerprint recognition module 1 and the buffer 2 by pressing the screen 31, which helps the buffer 2 and the fingerprint recognition module 1 to generate a reaction force through deformation and reach a state of equilibrium with the pressure. This can reduce the deformation of the fingerprint recognition module 1 and reduce the space occupied by the electronic device.

[0075] In some embodiments of this application, such as Figure 2 and Figure 3 As shown, the electronic device includes a heat dissipation unit 4, a fingerprint recognition module 1 and a buffer 2 located above the heat dissipation unit 4, wherein the upper end of the buffer 2 abuts against the screen 31 and the lower end of the buffer 2 abuts against the heat dissipation unit 4.

[0076] With the above arrangement, when the fingerprint recognition module 1 is deformed, the buffer 2 can reduce the collision between the fingerprint recognition module 1 and the heat dissipation part 4. At the same time, the heat exchange part and the fingerprint recognition module 1 can maintain a relatively small distance, which helps to reduce the space occupied by the electronic device.

[0077] In some embodiments of this application, the distance between the heat dissipation part 4 and the fingerprint recognition module 1 is less than or equal to 0.1 mm.

[0078] With the above arrangement, the space between the heat dissipation part 4 and the fingerprint recognition module 1 is small enough to reduce the miniaturization of electronic devices, and also large enough for the fingerprint recognition module 1 to deform sufficiently when pressed to complete the fingerprint recognition.

[0079] In this embodiment of the application, the aforementioned distance may refer to the distance between the heat dissipation part 4 and the fingerprint recognition module 1 when the screen 31 is not pressed.

[0080] In this embodiment, the distance between the heat dissipation part 4 and the fingerprint recognition module 1 can be 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm or 0.1mm, or other values ​​less than 0.1mm.

[0081] In some embodiments of this application, such as Figure 1 As shown, the screen 31 includes a recess 3101, the fingerprint recognition module 1 is located in the recess 3101, and the buffer 2 abuts against the bottom surface of the recess 3101.

[0082] With the above arrangement, the groove 3101 facilitates the fingerprint recognition module 1 in receiving signals reflected from the user's finger, thereby improving the recognition effect. At the same time, the groove 3101 also helps to improve the compactness of the internal structure of the electronic device, which helps to reduce the size of the electronic device.

[0083] In some embodiments of this application, the buffer 2 is foam.

[0084] With the above arrangement, the buffer 2 is easier to assemble on the electronic device and maintain a relatively stable positional relationship with the fingerprint recognition module 1, so as to share the pressure with the fingerprint recognition module 1. In addition, the foam also allows designers to arrange the amount that matches the design deformation of the fingerprint recognition module 1, thereby helping the buffer 2 to generate sufficient reaction force to reduce the deformation of the fingerprint recognition module 1.

[0085] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0086] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only.

[0087] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. An electronic device, characterized in that, The electronic device includes a fingerprint recognition module (1), a buffer (2), and a panel (3), wherein, The fingerprint recognition module (1) and the panel (3) are stacked together; The buffer (2) and the fingerprint recognition module (1) are located on the same side of the panel (3); The buffer (2) extends circumferentially along the fingerprint recognition module (1).

2. The electronic device according to claim 1, characterized in that, The projection of the buffer (2) onto the panel (3) is separated from the projection of the fingerprint recognition module (1) onto the panel (3).

3. The electronic device according to claim 2, characterized in that, The buffer (2) includes a first buffer (21), a second buffer (22) and a third buffer (23), with the first buffer (21) and the second buffer (22) located on opposite sides of the fingerprint recognition module (1).

4. The electronic device according to claim 3, characterized in that, The third buffer (23) is located on one side of the fingerprint recognition module (1) and is connected to the connection end of the first buffer (21) and the connection end of the second buffer (22).

5. The electronic device according to claim 3, characterized in that, The fingerprint recognition module (1) includes a wiring section (11), which is located between the open end of the first buffer section (21) and the open end of the second buffer section (22).

6. The electronic device according to claim 5, characterized in that, The first buffer part (21) has a first clearance part (211) at its open end, and the second buffer part (22) has a second clearance part (221) at its open end. The first clearance part (211) and the second clearance part (221) are arranged opposite to each other, and the two sides of the wiring part (11) extend into the first clearance part (211) and the second clearance part (221) respectively.

7. The electronic device according to claim 1, characterized in that, The panel (3) includes a screen (31), and the fingerprint recognition module (1) and the buffer (2) are located on the side of the screen (31) opposite to the display surface.

8. The electronic device according to claim 7, characterized in that, The electronic device includes a heat dissipation unit (4), the fingerprint recognition module (1) and the buffer (2) are respectively located above the heat dissipation unit (4), wherein the upper end of the buffer (2) abuts against the screen (31) and the lower end of the buffer (2) abuts against the heat dissipation unit (4).

9. The electronic device according to claim 8, characterized in that, The distance between the heat dissipation part (4) and the fingerprint recognition module (1) is less than or equal to 0.1 mm.

10. The electronic device according to claim 7, characterized in that, The screen (31) includes a groove (3101), the fingerprint recognition module (1) is located in the groove (3101), and the buffer (2) abuts against the bottom surface of the groove (3101).

11. The electronic device according to any one of claims 1 to 10, characterized in that, The buffer (2) is foam.

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