Display module and electronic device

Abstract

A display module and an electronic device, the display module comprising a display panel, a support assembly and a flexible circuit board assembly, the display panel comprising a panel main body portion, a bending portion and an electrical connection portion connected in sequence, the support assembly supporting the panel main body portion, the flexible circuit board assembly comprising a support structure and a flexible circuit board; the support structure is located between the panel main body portion and the electrical connection portion, the support assembly comprises a first portion, a first surface is included in the first portion away from one side of the panel main body portion, a second surface is included in the support structure close to one side of the panel main body portion, and the second surface is closer to the panel main body portion than the first surface. The distance between the electrical connection portion and the panel main body portion is relatively small, the size of the position of the display module where the flexible circuit board assembly is located can be thinned, the arc radius of the bending portion is reduced, and the impact resistance of the position of the display module where the flexible circuit board assembly is located can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module and electronic device. Background Technology

[0002] In the display module, the display panel is supported by a support assembly. To facilitate electrical connection between the display panel and the flexible printed circuit (FPC) assembly, the display panel is bent and folded to the back of the support assembly near the edge of the display module. The portion of the display panel folded to the back of the support assembly is electrically connected to the FPC assembly. This results in a thicker dimension at the location of the FPC assembly in the display module, and it is difficult to balance impact resistance and thinness near the edge of the display module. Utility Model Content

[0003] This application provides a display module and electronic device that can reduce the thickness of a portion of the display module and improve its overall impact resistance.

[0004] In a first aspect, this application provides a display module, which includes a display panel, a support assembly, and a flexible circuit board assembly. The flexible circuit board assembly includes a support structure and a flexible circuit board. The display panel includes a panel body portion, a curved portion, and an electrical connection portion connected in sequence. The panel body portion and the electrical connection portion are spaced apart along the thickness direction of the display module. The support structure is located between the panel body portion and the electrical connection portion. The flexible circuit board is connected to the side of the electrical connection portion away from the support structure. The support assembly is used to support the panel body portion. The support assembly includes a first part. The projection of the electrical connection portion on the panel body portion and the projection of the first part on the panel body portion do not overlap. The side of the first part away from the panel body portion is a first surface. The side of the support structure closer to the panel body portion is a second surface. The second surface is closer to the panel body portion than the first surface.

[0005] In this design, the second surface is closer to the main body of the panel than the first surface. At least a portion of the support assembly is thinned or removed to avoid obstructing the support structure. This allows the area of ​​the display module containing the circuit board assembly to have a smaller thickness, contributing to a thinner and lighter display module. The support structure supports both the electrical connection portion and the main body of the panel. The thinning of the area containing the flexible circuit board assembly in the display module does not negatively impact the display module's impact resistance. However, reducing the distance between the electrical connection portion and the main body of the panel reduces the radius of curvature of the bent portion. A smaller radius of curvature makes the bent portion less prone to deformation, thereby improving the impact resistance of the location of the flexible circuit board assembly in the display module.

[0006] In conjunction with the first aspect, in one possible implementation, the support component further includes a second part. This second part is located between the support structure and the panel body. The side of the second part furthest from the panel body is a third surface, which is closer to the panel body than the first surface. The support component is thinned at the second part to avoid the support structure, making the second surface closer to the panel body than the first surface. This results in a smaller distance between the electrical connection and the panel body, allowing for a smaller thickness in the display module area where the support structure is located. This facilitates thinning of the area containing the flexible circuit board assembly within the display module. The support structure supports both the electrical connection and the panel body, and the thinning of the display module area containing the flexible circuit board assembly does not negatively impact the display module's impact resistance. However, the reduced distance between the electrical connection and the panel body reduces the radius of curvature of the bent portion. A smaller radius of curvature makes the bent portion less prone to deformation, thereby improving the impact resistance of the flexible circuit board assembly location within the display module.

[0007] In conjunction with the first aspect, in one possible implementation, the second part is integrally formed with the first part, which is beneficial for the forming of the support component.

[0008] In conjunction with the first aspect, in one possible implementation, the projection of the support structure onto the main body of the panel and the projection of the support component onto the main body of the panel do not overlap. The support component completely avoids the flexible circuit board component, allowing the area where the flexible circuit board component is located in the display module to be thinner and reducing the radius of curvature of the bent portion, thus improving the impact resistance of the area where the flexible circuit board component is located. The support structure can support both the main body of the panel and the electrical connection portion. Thinning the area where the flexible circuit board component is located in the display module does not reduce the impact resistance of that area. The reduced distance between the electrical connection portion and the main body of the panel reduces the radius of curvature of the bent portion. The smaller the radius of curvature of the bent portion, the less likely it is to deform, further improving the impact resistance of the area where the flexible circuit board component is located in the display module.

[0009] In conjunction with the first aspect, in one possible implementation, the display module further includes a metal film located on the side of the support assembly away from the main panel body, with the flexible circuit board grounded through the metal film. The metal film can replace copper foil, and grounding the flexible circuit board through the metal film reduces the thickness of the display module.

[0010] In conjunction with the first aspect, in one possible implementation, the flexible circuit board includes a first circuit board, a second circuit board, and a third circuit board, with the third circuit board connecting the first and second circuit boards. The display module also includes a metal film located on the side of the first portion away from the main panel body, and the first circuit board located on the side of the metal film away from the first portion, with the first circuit board grounded through the metal film. The second circuit board is located on the side of the electrical connection portion away from the supporting structure. Grounding the first circuit board of the flexible circuit board through the metal film shortens the grounding path of the flexible circuit board and simplifies the structure of the display module.

[0011] In conjunction with the first aspect, in one possible implementation, the flexible circuit board includes a first circuit board, a second circuit board, and a third circuit board, with the third circuit board connecting the first and second circuit boards. The first circuit board is located between the panel body and the electrical connection portion, and its material includes conductive metal, polyimide, and silicone. The first circuit board serves as at least part of a support structure. The second circuit board is located on the side of the electrical connection portion away from the first circuit board. The first circuit board in the flexible circuit board can support the panel body and the electrical connection portion. Since the first circuit board is not located on the side of the first portion away from the panel body, the size of the flexible circuit board in the first direction can be shortened, thereby shortening the size of the flexible circuit board assembly in the first direction, improving the appearance competitiveness of the display module applied to electronic devices, and reducing the thickness of the area of ​​the display module where the flexible circuit board assembly is located. Applying a thinner display module to electronic devices allows for adaptive thinning of the electronic device, or the reduced size of the display module can be utilized in the electronic device to increase the space occupied by the battery and improve the battery capacity of the electronic device.

[0012] In conjunction with the first aspect, in one possible implementation, the thickness of the first circuit board is greater than the thickness of the second circuit board. By increasing the thickness of the first circuit board, the overall rigidity of the first circuit board can be improved, and since the first circuit board serves as at least a part of the support structure, the supporting capacity of the support structure is thus enhanced.

[0013] In conjunction with the first aspect, in one possible implementation, the thickness of the first circuit board is between 0.25mm and 0.4mm, and the thickness of the second circuit board is between 0.05mm and 0.1mm. The relatively thick thickness of the first circuit board (0.25mm-0.4mm) allows for higher overall rigidity, and as at least a part of the support structure, it enhances the support capacity of the support structure.

[0014] In conjunction with the first aspect, in one possible implementation, the support structure includes a support layer located between the panel body and the electrical connection portion. The support layer is made of polyimide and silicone. The support layer can be a gasket, and because it is made of polyimide and silicone, it possesses support capabilities. The inclusion of the support layer in the support structure enhances its support capacity.

[0015] In conjunction with the first aspect, in one possible implementation, the display module further includes a shielding layer disposed on the side of the second circuit board away from the electrical connection portion, and the second circuit board is grounded through the shielding layer. The shielding layer can be used to shield signals from the flexible circuit board, thereby improving the electromagnetic interference immunity of the flexible circuit board assembly. The shielding layer also enables the flexible circuit board to be grounded, shortening the grounding path of the flexible circuit board and simplifying the overall structure of the display module.

[0016] In conjunction with the first aspect, in one possible implementation, the second circuit board includes a first insulating layer, a wiring layer, and a second insulating layer sequentially stacked along the thickness direction of the display module. The first insulating layer is located between the electrical connection portion and the wiring layer, and the second insulating layer is located between the wiring layer and the shielding layer. The second insulating layer has through-holes, through which the wiring layer is electrically connected to the shielding layer. The shielding layer can contact the wiring layer through the through-holes to achieve grounding of the wiring layer.

[0017] Secondly, this application provides an electronic device including a display module as described in the first aspect. Because the thickness of the area containing the flexible circuit board assembly in the display component is reduced, the application of the display module to the electronic device allows for adaptive thinning of the electronic device, or the reduced size of the display module in the electronic device can be utilized to increase the space occupied by the battery and improve the battery capacity of the electronic device. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of another display module provided in an embodiment of this application;

[0021] Figure 4 This is a schematic diagram of the structure of a support component provided in an embodiment of this application;

[0022] Figure 5 This is a schematic diagram of another supporting component provided in an embodiment of this application;

[0023] Figure 6This is a schematic diagram of another support component provided in an embodiment of this application;

[0024] Figure 7 This is a schematic diagram of another support component provided in an embodiment of this application;

[0025] Figure 8 This is a schematic diagram of the structure of another display module provided in an embodiment of this application;

[0026] Figure 9 This is a schematic diagram of the structure of another display module provided in an embodiment of this application;

[0027] Figure 10 This is a schematic diagram of the structure of another display module provided in an embodiment of this application;

[0028] Figure 11 This is a schematic diagram of the structure of another display module provided in an embodiment of this application;

[0029] Figure 12 This is a schematic diagram of another support component provided in an embodiment of this application;

[0030] Figure 13 This is a schematic diagram of another support component provided in an embodiment of this application;

[0031] Figure 14 This is a schematic diagram of the structure of another display module provided in an embodiment of this application;

[0032] Figure 15 This is a schematic diagram of the structure of another display module provided in an embodiment of this application;

[0033] Figure 16 This is a schematic diagram of the structure of a second circuit board provided in an embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Electronic device; 10. Display module; 11. Display panel; 111. Panel body; 112. Bending portion; 113. Electrical connection portion; 12. Support assembly; 121. First part; 1211. First surface; 122. Second part; 1221. Third surface; 123. Carbon fiber; 124. Folding area; 125. Non-folding area; 13. Flexible circuit board assembly; 131. Support structure; 1311. Second surface; 132. Flexible circuit Board; 1321, First circuit board; 1322, Second circuit board; 13221, First insulating layer; 13222, Wiring layer; 13223, Second insulating layer; 13224, Through hole; 1323, Third circuit board; 14, Metal film; 15, Shielding layer; 16, Covering layer; 17, Optical grade transparent adhesive; 18, Protective sheet; 19, First back film; 20, Foam; 21, Copper foil; 22, Pressure-sensitive adhesive; 23, Second back film; 24, Protective adhesive. Detailed Implementation

[0036] To more clearly illustrate the technical solutions in the embodiments or background art of this application, the application will be further described in detail below with reference to the accompanying drawings.

[0037] Please see Figure 1 This application provides an electronic device, which may be a mobile phone with a display module 10, a watch with a display module 10, a tablet with a display module 10, a computer with a display module 10, and a television with a display module 10, etc.

[0038] Electronic device 1 may include electronic components and a display module 10. The display module 10 includes a display panel, a support assembly (Bracket, BKT), and a flexible circuit board assembly. The display panel is used to display images, and the support assembly is used to support the display panel. The flexible circuit board assembly can connect the display panel and the electronic components, and the display panel and the electronic components can transmit electrical signals to each other through the flexible circuit board assembly. The electronic components can be a motherboard, a sub-board, etc. The display module of the electronic device can be foldable or non-foldable.

[0039] Please see Figure 2 and Figure 3The display panel 11 includes a panel body portion 111, a curved portion 112, and an electrical connection portion 113 connected sequentially. The panel body portion 111, the curved portion 112, and the electrical connection portion 113 are integrally formed. The panel body portion 111 is used to display the image. In the thickness direction of the display module 10, the panel body portion 111 and the electrical connection portion 113 are spaced apart. The panel body portion 111 is smoothly connected to the curved portion 112 in a first direction (e.g., the X-axis direction), and the electrical connection portion 113 is smoothly connected to the curved portion 112 in the first direction. The flexible circuit board assembly 13 is electrically connected to the electrical connection portion 113. The dimension of the panel body portion 111 in the first direction is larger than the dimension of the electrical connection portion 113 in the first direction. The cross-section of the curved portion 112 in the second direction (e.g., the Y-axis direction) is approximately arc-shaped. The arc of the cross-section of the curved portion 112 in the second direction can be equal to π, greater than π, or less than π. The outer surface of the bent portion 112 is provided with a protective adhesive 24. The protective adhesive 24 can protect the outer surface of the bent portion 112 and prevent damage to the outer surface of the bent portion 112. The protective adhesive 24 can be a modified cycloolefin adhesive. The first direction is perpendicular to the second direction. The first direction is perpendicular to the thickness direction of the display module 10, and the second direction is perpendicular to the thickness direction of the display module 10 (e.g., the Z-axis direction).

[0040] In the embodiments provided in this application, the support component 12 is used to support the panel body 111, and the flexible circuit board assembly 13 includes a support structure 131 and a flexible circuit board 132 (Flexible Printed Circuit, FPC). The support component 12 includes a first portion 121, which can support the panel body 111. The support structure 131 is located between the panel body 111 and the electrical connection portion 113, and can also support the panel body 111 and the electrical connection portion 113. The flexible circuit board 132 is located on the side of the electrical connection portion 113 away from the support structure 131. The flexible circuit board 132 can be electrically connected to the electrical connection portion 113 and can transmit signals for the display panel 11 and electronic devices.

[0041] The support component 12 includes a first part 121, which is arranged along a first direction with the support structure 131. The first part 121 and the support structure 131 can jointly support the main body of the panel 111. The first part 121 can be connected to the support structure 131 along the first direction, or the first part 121 can be spaced apart from the support structure 131 along the first direction.

[0042] Among them, in the thickness direction of the display module 10, the panel main body portion 111, the support structure 131, and the electrical connection portion 113 are stacked, and the projection of the electrical connection portion 113 on the panel main body portion 111 and the projection of the first portion 121 on the panel main body portion 111 do not overlap.

[0043] In the embodiment provided by the present application, one side of the first portion 121 away from the panel main body portion 111 is the first surface 1211, and the side of the support structure 131 close to the panel main body is the second surface 1311. The second surface 1311 is closer to the panel main body portion 111 than the first surface 1211. The projection of the electrical connection portion 113 on the panel main body portion 111 and the projection of the first portion 121 on the panel main body portion 111 do not overlap, and the second surface 1311 is closer to the panel main body portion 111 than the first surface 1211. If the distance between the electrical connection portion 113 and the panel main body portion 111 in the thickness direction of the display module 10 is L1, the thickness dimension of the first portion 121 is L2, and the distance between the electrical connection portion 113 and the second surface 1311 is L3, L1 < L2 + L3. It can be seen that in the display module 10 provided by the embodiment of the present application, the distance between the electrical connection portion 113 and the panel main body portion 111 is relatively small, and at least part of the support component 12 is thinned or removed, so that the second surface 1311 is closer to the panel main body portion 111 than the first surface 1211. The support component 12避让 the support structure 131 of the flexible circuit board component 13, so that the area where the flexible circuit board component 13 is located in the display module 10 can obtain a smaller thickness, which is beneficial to the thinning of the area where the flexible circuit board component 13 is located in the display module 10, and the support structure 131 can support the electrical connection portion 113 and the panel main body portion 111. The thinning of the thickness of the area where the flexible circuit board component 13 is located in the display module 10 will not have a negative impact on the impact resistance of the display module 10. However, when the distance between the electrical connection portion 113 and the panel main body portion 111 is reduced, the arc radius of the bending portion 112 will be reduced. The smaller the arc radius of the bending portion 112, the less likely the bending portion 112 is to deform, and thus the impact resistance of the area where the flexible circuit board component 13 is located in the display module 10 can be improved.

[0044] In the embodiment provided by the present application, please refer to Figure 2 It should be noted that there is an unclear expression "支撑组件12避让" in the original text. You may need to check and correct it for a more accurate translation. The above translation is based on the existing text as much as possible.The support component 12 also includes a second part 122, which is located between the support structure 131 and the panel body 111. The second part 122 can be integrally formed with the first part 121. The side of the second part 122 away from the panel body 111 is a third surface 1221. The support component 12 is thinned at the second part 122, so that the third surface 1221 is closer to the panel body 111 than the first surface 1211. The support component 12 avoids the support structure 131 of the flexible circuit board assembly 13, so that the area where the flexible circuit board assembly 13 is located in the display module 10 can have a smaller thickness, which is beneficial to the thinning of the area where the flexible circuit board assembly 13 is located in the display module 10. Foam 20 and copper foil 21 can be stacked between the second surface 1311 and the third surface 1221. The foam 20 can be located on the side of the third surface 1221 away from the panel body 111, and the copper foil 21 is located between the foam 20 and the second surface 1311.

[0045] A first back film 19 is provided between the support assembly 12 and the panel body 111. The material of the first back film 19 may include polyethylene terephthalate (PET) or stainless steel (SUS). The first back film 19 is connected to the panel body 111 by an optically clear adhesive (OCA) 17, the first back film 19 is connected to the first part 121 by an optically clear adhesive 17, and the first back film 19 is connected to the second part 122 by an optically clear adhesive 17. The first back film 19 serves to support and protect the panel body 111. A second back film 23 is provided between the support assembly 12 and the electrical connection part 113. The support assembly 12 and the second back film 23 are connected by a pressure-sensitive adhesive (PSA) 22, and the second back film 23 is connected to the electrical connection part 113 by a pressure-sensitive adhesive 22. The material of the second back film 23 may include polyethylene terephthalate or stainless steel. The second back film 23 can serve to support and protect the electrical connection part 113.

[0046] In the display module 10 provided in this application, the support component 12 avoids the support structure 131 in the flexible circuit board assembly 13. The second surface 1311 is closer to the panel body portion 111 than the first surface 1211. This reduces the distance between the electrical connection portion 113 and the panel body portion 111, resulting in a thinner area of ​​the display module 10 containing the flexible circuit board assembly 13. The overall thickness reduction of the display module 10 is between 18% and 28%, and the thickness reduction in the area containing the flexible circuit board assembly 13 is between 80 μm and 120 μm. The second portion 122 supports the panel body portion 111, and the support structure 131 supports the electrical connection portion 113. The thickness reduction in the area containing the flexible circuit board assembly 13 does not negatively impact the impact resistance of the display module 10. Reducing the distance between the electrical connection portion 113 and the panel body portion 111 decreases the radius of curvature of the bend portion 112, thereby improving the impact resistance of the location of the flexible circuit board assembly 13 in the display module 10. The benefit of reducing the radius of curvature of the bend portion 112 is between 10% and 22%, and for example, the radius of curvature of the bend portion 112 is reduced by about 16%.

[0047] Please refer to the embodiments provided in this application. Figure 4 The support component 12 can be formed by stacking multiple layers of carbon fiber 123, wherein the number of carbon fiber 123 layers in the first part 121 can be more than the number of carbon fiber 123 layers in the second part 122. For example, the first part 121 can have 3 layers of carbon fiber 123, which are stacked sequentially. The second part 122 can have 1 layer of carbon fiber 123. The carbon fiber 123 layer in the first part 121 that is closest to the panel body 111 is connected to the carbon fiber 123 in the second part 122 as a whole. In this way, the third surface 1221 in the second part 122 is closer to the panel body 111 than the first surface 1211 in the first part 121. In this application, the number of carbon fiber 123 layers in the first part 121 can be 2, 4, 5, 6 or more layers, and the number of carbon fiber layers in the second part 122 can be 2, 3, 4, 5 or more layers. This application does not specifically limit the number of carbon fiber 123 layers in the first part 121, nor does it specifically limit the number of carbon fiber 123 layers in the second part 122. However, the number of carbon fiber 123 layers in the second part 122 is less than the number of carbon fiber 123 layers in the first part 121, so that the third surface 1221 of the second part 122 is closer to the panel body 111 than the first surface 1211 of the first part 121.

[0048] Please refer to the embodiments provided in this application. Figure 5The support component 12 may also include an integrally formed metal, such as titanium alloy or stainless steel. By etching the support component 12, the third surface 1221 in the second part 122 is closer to the panel body 111 than the first surface 1211 of the first part 121.

[0049] In one feasible implementation, please refer to Figure 3 In the thickness direction of the display module 10, the projections of the support structure 131 onto the panel body 111 and the support assembly 12 onto the panel body 111 do not overlap. The support assembly 12 does not extend between the panel body 111 and the electrical connection portion 113. Please refer to... Figure 6 The support component 12 can be a single layer of carbon fiber 123, or it can be formed by stamping multiple layers of carbon fiber 123. The support component 12 can be formed by stamping two, three, four, or more layers of carbon fiber 123. Please refer to [link / reference]. Figure 7 The support component 12 can be made of one piece of titanium alloy or stainless steel, etc.

[0050] A first back film 19 and foam 20 are provided between the support structure 131 and the panel body 111. The first back film 19 is connected to the panel body 111 by an optically grade transparent adhesive 17, the first back film 19 is connected to the foam 20 by an optically grade transparent adhesive 17, and the first back film 19 is connected to the support assembly 12 by an optically grade transparent adhesive 17. A copper foil 21 is provided on the surface of the foam 20 away from the first back film 19, and the support structure 131 is located on the surface of the copper foil 21 away from the foam 20. A second back film 23 is provided between the support structure 131 and the electrical connection part 113. The second back film 23 is connected to the support structure 131 by a pressure-sensitive adhesive 22, and the second back film 23 is connected to the electrical connection part 113 by an optically grade transparent adhesive 17.

[0051] The support component 12 completely avoids the flexible circuit board component 13, allowing the area where the flexible circuit board component 13 is located in the display module 10 to be thinner. The overall thickness reduction of the display module 10 is between 18% and 33%, and the thickness reduction of the area where the flexible circuit board component 13 is located in the display module 10 is between 120μm and 150μm. This reduces the radius of curvature of the bending portion 112, improving the impact resistance of the area where the flexible circuit board component 13 is located in the display module 10. The reduction in the radius of curvature of the bending portion 112 is between 10% and 22%. For example, the radius of curvature of the bending portion 112 is reduced by approximately 18%. Since the support structure 131 connects the panel body portion 111 and the electrical connection portion 113, the support structure 131 can support the panel body portion 111 and the electrical connection portion 113. Therefore, the thinning of the area where the flexible circuit board component 13 is located in the display module 10 does not reduce the impact resistance of the area where the flexible circuit board component 13 is located in the display module 10.

[0052] In the embodiments provided in this application, the flexible circuit board 132 may include a first circuit board 1321, a second circuit board 1322 and a third circuit board 1323, with the third circuit board 1323 connected between the first circuit board 1321 and the second circuit board 1322.

[0053] In one feasible implementation, please refer to Figure 8 and Figure 9 The copper foil 21 can be disposed on the side of the first part 121 away from the panel body 111. The first circuit board 1321 is located on the side of the copper foil 21 away from the first part 121, and the first circuit board 1321 can be grounded through the copper foil 21. The second circuit board 1322 is located on the side of the electrical connection part 113 away from the support structure 131, and the second circuit board 1322 is electrically connected to the electrical connection part 113. The first circuit board 1321 of the flexible circuit board 132 is grounded through the copper foil 21. The second circuit board 1322 is connected to the electrical connection part 113 through pressure-sensitive adhesive 22.

[0054] In the display module 10 provided in this application embodiment, please refer to Figure 10 and Figure 11The display module 10 also includes a metal film 14, which is disposed on the side of the support assembly 12 away from the panel body 111. The flexible circuit board 132 is grounded through the metal film 14. Compared with the conventional display module 10, the display module 10 of this embodiment eliminates the copper foil on the side of the support assembly 12 away from the panel body 111 and replaces the copper foil with a metal film 14. The thickness of the metal film 14 can be 300nm-700nm, and for example, the thickness of the metal film 14 can be 500nm. The thickness of the metal film 14 is much lower than the thickness of the copper foil 21. Replacing the copper foil 21 with the metal film 14 can reduce the thickness of the display module 10. For example, replacing the copper foil 21 with the metal film 14 can reduce the thickness of the display module 10 by 0.02mm-0.04mm, and the thickness of the display module 10 can be reduced by 0.03mm. By using a metal film 14 instead of copper foil 21, the weight of the display module 10 can also be reduced. When the metal film 14 is provided on the side of the display module 10 away from the main panel 111, the metal film 14 can be formed by physical vapor deposition (PVD).

[0055] In the embodiments provided in this application, the display module 10 is a foldable display module 10, and the support component 12 includes a folding area 124 and two non-folding areas 125, with the folding area 124 located between the two non-folding areas 125. In one possible implementation, please refer to... Figure 12 When forming the metal film 14 on the support component 12 by physical vapor deposition, the metal film 14 is not formed in the folded region 124. Instead, the metal film 14 can be formed by physical vapor deposition over the entire area of ​​the two non-bending regions in the support component 12. For another feasible implementation, please refer to... Figure 13 When forming a metal film 14 on the support component 12 by physical vapor deposition, a metal film is not formed in the folded area 124. Instead, a metal film 14 can be formed in local areas of the two non-bending areas in the support component 12 by physical vapor deposition. For example, a metal film 14 can be formed near the edges of the two non-folded areas 125 by physical vapor deposition.

[0056] In one feasible implementation, the metal film 14 can be disposed on the side of the first portion 121 away from the panel body portion 111. The first circuit board 1321 is connected to the side of the metal film 14 away from the first portion 121, and the first circuit board 1321 can be grounded through the metal film 14. The second circuit board 1322 is located on the side of the electrical connection portion 113 away from the support structure 131, and the second circuit board 1322 is electrically connected to the electrical connection portion 113. The first circuit board 1321 of the flexible circuit board 132 is grounded through the metal film 14, which can shorten the grounding path of the flexible circuit board 132 and simplify the structure of the display module 10. The second circuit board 1322 is connected to the electrical connection portion 113 through pressure-sensitive adhesive 22.

[0057] In some embodiments, see Figure 14 and Figure 15 The first circuit board 1321 and the second circuit board 1322 are spaced apart along the thickness direction of the display module 10, and the third circuit board 1323 is bent and connected to the first circuit board 1321 and the second circuit board 1322. The first circuit board 1321 is disposed between the panel body portion 111 and the electrical connection portion 113, and the first circuit board 1321 serves as at least a part of the support structure 131; the second circuit board 1322 is connected to the side of the electrical connection portion 113 away from the support structure 131. In the flexible circuit board 132, the first circuit board 1321 serves to support the panel body 111 and the electrical connection part 113. Since the first circuit board 1321 is located between the panel body 111 and the electrical connection part 113, and the first circuit board 1321 and the second circuit board 1322 are stacked in the thickness direction of the display module 10, the flexible circuit board assembly 13 occupies less space in the display module 10 in the first direction. Furthermore, since the first circuit board 1321 is no longer located on the side of the first part 121 away from the panel body 111, the thickness of the display module 10 where the first part 121 is located in the support assembly 12 can be reduced, thereby improving the appearance competitiveness of the display module 10 when applied to electronic devices. Applying a thinner display module 10 to electronic devices allows for adaptive thinning of the electronic device, or the reduced size of the display module 10 can be utilized to increase the space occupied by the battery and improve the battery capacity of the electronic device.

[0058] Please see Figure 14 Foam 20 is stacked between the first circuit board 1321 and the second part 122. A second back film 23 is stacked between the first circuit board 1321 and the electrical connection part 113. The first circuit board 1321 is connected to the second back film 23 by pressure-sensitive adhesive 22. The second back film 23 is connected to the electrical connection part 113 by optical grade transparent adhesive 17. The side of the electrical connection part 113 away from the second back film 23 is connected to the second circuit board 1322 by pressure-sensitive adhesive 22.

[0059] Please see Figure 15 A foam 20 and a first back film 19 are stacked between the first circuit board 1321 and the panel body 111. The first back film 19 is connected to the panel body 111 by an optical-grade transparent adhesive 17. The side of the first back film 19 away from the panel body 111 is connected to the foam 20 by the optical-grade transparent adhesive 17. The side of the first back film 19 away from the panel body 111 is also connected to the support assembly 12 by the optical-grade transparent adhesive 17. The foam 20 is located between the first back film 19 and the first circuit board 1321. A second back film 23 is also provided between the first circuit board 1321 and the electrical connection part 113. The side of the first circuit board 1321 away from the foam 20 is connected to the second back film 23 by a pressure-sensitive adhesive 22. The side of the second back film 23 away from the first circuit board 1321 is connected to the electrical connection part 113 by an optical-grade transparent adhesive 17. The side of the electrical connection part 113 away from the second back film 23 is connected to the second circuit board 1322 by a pressure-sensitive adhesive 22.

[0060] In the embodiments provided in this application, the support structure 131 may include a support layer, which may be a spacer. The support layer is located between the panel body portion 111 and the electrical connection portion 113, and the material of the support layer includes polyimide and silicone. Because the support layer is made of polyimide and silicone, it has support capabilities. The inclusion of the support layer in the support structure 131 enhances its support capabilities.

[0061] In the embodiments provided in this application, the first circuit board 1321 can serve as at least a part of the support structure 131. The first circuit board 1321 supports the electrical connection portion 113 or the panel body portion 111. The material of the first circuit board includes conductive metal, polyimide, and silicone. The first circuit board 1321 can replace the support layer to support the panel body portion 111 and the electrical connection portion 113. The thickness of the first circuit board 1321 is greater than the thickness of the second circuit board 1322, wherein the thickness of the first circuit board 1321 is between 0.25mm and 0.4mm, and the thickness of the second circuit board 1322 is between 0.05mm and 0.1mm. By increasing the thickness of the first circuit board 1321, the overall rigidity of the first circuit board 1321 can be improved, thereby enhancing the support capacity of the first circuit board 1321.

[0062] In the embodiments provided in this application, the support structure 131 may include a support layer and a first circuit board 1321, which may be stacked. In one feasible implementation, the support layer is located between the panel body portion 111 and the first circuit board 1321, and the first circuit board 1321 is located between the support layer and the electrical connection portion 113. In another feasible implementation, the first circuit board 1321 is located between the panel body portion and the support layer, and the support layer is located between the first circuit board 1321 and the electrical connection portion 113.

[0063] In some embodiments of this application, the first circuit board 1321 may have 6-8 layers, the second circuit board 1322 may have 2-3 layers, and the third circuit board 1323 may have 1 layer. The first circuit board 1321 may also have 8 or more layers, the second circuit board 1322 may have 3 or more layers, and the third circuit board 1323 may have 1 or more layers. This application does not impose specific limitations on the number of layers of the first circuit board 1321, the second circuit board 1322, or the third circuit board 1323.

[0064] Please continue reading Figure 15 The display module 10 may further include a shielding layer 15, which is disposed on the side of the second circuit board 1322 away from the electrical connection portion 113. The second circuit board 1322 is grounded through the shielding layer 15. The shielding layer 15 can be used to shield the flexible circuit board 132 from signals, thereby improving the electromagnetic interference resistance of the flexible circuit board assembly 13. The shielding layer 15 also enables the flexible circuit board 132 to be grounded, shortening the grounding path of the flexible circuit board 132 and simplifying the overall structure of the display module 10. The second circuit board 1322 is connected to the shielding layer 15 via pressure-sensitive adhesive 22.

[0065] Please refer to the embodiments provided in this application. Figure 16 The second circuit board 1322 includes a first insulating layer 13221, a wiring layer 13222, and a second insulating layer 13223, which are sequentially stacked along the thickness direction of the display module 10. The first insulating layer 13221 is located between the electrical connection portion 113 and the wiring layer 13222, and the second insulating layer 13223 is located between the wiring layer 13222 and the shielding layer 15. The second insulating layer 13223 is provided with a through hole 13224, through which the wiring layer 13222 is electrically connected to the shielding layer 15. The wiring layer 13222 may include copper traces, and the shielding layer 15 can contact the copper traces through the through hole 13224 to achieve grounding of the wiring layer 13222.

[0066] In the embodiments provided in this application, the display module 10 further includes a protective sheet 18 and a cover layer 16. The protective sheet 18 may include ultra-thin glass (UTG) or a polarizer (POL). The protective sheet 18 is stacked on the side of the panel body 111 away from the first back film 19, and the cover layer 16 is stacked on the side of the protective sheet 18 away from the panel body 111. The cover layer 16 and the protective sheet 18 are connected by an optical-grade transparent adhesive 17, and the protective sheet 18 and the panel body 111 are connected by a linear transparent adhesive. The material of the cover layer 16 may include polyethylene terephthalate or colorless polyimide (CPI).

[0067] It should be understood that expressions such as “comprising” and “may include” used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as “comprising” and / or “having” are to be interpreted as indicating a particular characteristic, number, operation, constituent element, component, or combination thereof, but not to exclude the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0068] Furthermore, in this application, the expression "and / or" includes any and all combinations of the associated listed words. For example, the expression "A and / or B" may include A, may include B, or may include both A and B.

[0069] In this application, expressions including ordinal numbers such as "first" and "second" may modify the elements. However, such elements are not limited by the foregoing expressions. For example, the foregoing expressions do not limit the order and / or importance of the elements. The foregoing expressions are only used to distinguish one element from other elements. For example, "first user equipment" and "second user equipment" refer to different user equipment, although both "first user equipment" and "second user equipment" are user equipment. Similarly, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0070] When a component is referred to as "connected" or "accessed" to other components, it should be understood that this component not only connects directly to or accesses other components, but also that another component may exist between this component and other components. On the other hand, when a component is referred to as "directly connected" or "directly accessed" to other components, it should be understood that no component exists between them.

[0071] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, It includes a display panel, a support assembly, and a flexible circuit board assembly, wherein the flexible circuit board assembly includes a support structure and a flexible circuit board; The display panel includes a panel body, a curved portion, and an electrical connection portion connected in sequence. The panel body and the electrical connection portion are spaced apart along the thickness direction of the display module. The support structure is located between the panel body and the electrical connection portion. The flexible circuit board is located on the side of the electrical connection portion away from the support structure. The support assembly is used to support the main body of the panel. The support assembly includes a first part, the projection of the electrical connection part on the main body of the panel and the projection of the first part on the main body of the panel do not overlap, the side of the first part away from the main body of the panel is a first surface, and the side of the support structure close to the main body of the panel is a second surface. The second surface is closer to the main body of the panel than the first surface.

2. The display module as described in claim 1, characterized in that, The support component further includes a second part located between the support structure and the panel body portion. The side of the second part away from the panel body portion is a third surface, which is closer to the panel body portion than the first surface.

3. The display module as described in claim 2, characterized in that, The second part is integrally formed with the first part.

4. The display module as described in claim 1, characterized in that, The projection of the support structure onto the main body of the panel and the projection of the support component onto the main body of the panel do not overlap.

5. The display module as described in any one of claims 1-4, characterized in that, The display module also includes a metal film located on the side of the support assembly away from the main body of the panel, and the flexible circuit board is grounded through the metal film.

6. The display module as described in claim 1, characterized in that, The flexible circuit board includes a first circuit board, a second circuit board, and a third circuit board, wherein the third circuit board is connected to the first circuit board and the second circuit board; The display module further includes a metal film located on the side of the first portion away from the main panel portion, and the first circuit board located on the side of the metal film away from the first portion, with the first circuit board grounded through the metal film; The second circuit board is located on the side of the electrical connection portion away from the support structure.

7. The display module as described in claim 1, characterized in that, The flexible circuit board includes a first circuit board, a second circuit board, and a third circuit board, wherein the third circuit board is connected to the first circuit board and the second circuit board; The first circuit board is located between the panel body and the electrical connection portion. The material of the first circuit board includes conductive metal, polyimide and silicone. The first circuit board serves as at least a part of the support structure. The second circuit board is located on the side of the electrical connection portion away from the first circuit board.

8. The display module as described in claim 7, characterized in that, The thickness of the first circuit board is greater than the thickness of the second circuit board.

9. The display module as described in claim 8, characterized in that, The thickness of the first circuit board is between 0.25mm and 0.4mm, and the thickness of the second circuit board is between 0.05mm and 0.1mm.

10. The display module as described in claim 6 or 7, characterized in that, The support structure includes a support layer located between the panel body and the electrical connection portion, and the support layer is made of polyimide and silicone.

11. The display module as described in claim 6 or 7, characterized in that, The display module further includes a shielding layer, which is disposed on the side of the second circuit board away from the electrical connection portion, and the second circuit board is grounded through the shielding layer.

12. The display module as described in claim 11, characterized in that, The second circuit board includes a first insulating layer, a wiring layer, and a second insulating layer stacked sequentially along the thickness direction of the display module. The first insulating layer is located between the electrical connection portion and the wiring layer, and the second insulating layer is located between the wiring layer and the shielding layer. The second insulating layer is provided with a through hole, and the wiring layer is electrically connected to the shielding layer through the through hole.

13. An electronic device, characterized in that, The electronic device includes a display module as described in any one of claims 1-12.

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