A power amplifier with frequency conversion function

Abstract

The utility model discloses a power amplifier with frequency conversion function belongs to power amplifier technical field, including the chassis bottom plate, the chassis main body, switch control through -hole, waveguide switch support, waveguide switch, twist waveguide, heat dissipation subassembly, input interface, power supply interface and monitoring interface, the utility model discloses through the cooperation of waveguide switch, twist waveguide, waveguide switch control interface, switch control through -hole, first output interface, second output interface and waveguide switch load mouth's use can be adapted to multi -feed source switching or load access, improve the system flexibility, realize high -frequency signal lossless switching, and waveguide structure loss is low, ensures 27 31GHz high -frequency signal transmission efficiency, supports local knob operation and remote communication control, satisfies complex scene demand to can realize the flexible switching of transmitter output direction, avoids the limitation of traditional one -way output, adapts radar, electronic countermeasure etc.

Description

Technical Field

[0001] This utility model relates to the field of power amplifier technology, specifically a power amplifier with frequency conversion function. Background Technology

[0002] A power amplifier (or simply power amplifier) ​​is a device that can generate maximum power output to drive a load under given external triggering conditions. It is also a key component of wireless communication systems, typically used in radar transmitters or receivers for satellite communication, or in communication and electronic warfare for weaponry. In the civilian field, it is also used for equipment testing in electromagnetic compatibility environments. However, with the development of technologies such as 5G and WIFI6 / 7, power amplifiers require higher performance, and power amplifier circuits are constantly developing towards modularity, miniaturization, and integration.

[0003] Existing power amplifiers are constantly being updated in terms of functionality, and traditional power amplifier chassis are no longer sufficient to meet current requirements, especially in the high-frequency field. In terms of RF performance, the power gain may not meet the requirements, and under excessive current or voltage or excessive temperature, there is a possibility of burning out the power amplifier components. In addition, they can only output in one direction. Therefore, it is necessary to improve and upgrade the RF link inside the existing chassis. Thus, we need to propose a power amplifier with frequency conversion function. Utility Model Content

[0004] The purpose of this invention is to provide a power amplifier with frequency conversion function, which has the advantage of easy frequency conversion, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a power amplifier with frequency conversion function, including a chassis base plate, a chassis body mounted on the top of the chassis base plate, a switch control through hole provided on one side of one end of the chassis body, a waveguide switch bracket installed at the corresponding end of one end of the chassis body and located at the top of the chassis base plate, a waveguide switch provided on the top of the waveguide switch bracket, a twisted waveguide connected to one side of the waveguide switch, and the waveguide switch connected to the chassis body through the twisted waveguide, a heat dissipation component for heat dissipation of the chassis body interior provided at the other end of the chassis body, and an input interface, a power supply interface, and a monitoring interface sequentially provided at the other end of the chassis body and above the heat dissipation component.

[0006] Preferably, a waveguide switch control interface is provided on one side of the waveguide switch, and the waveguide switch control interface is connected to the switch control through hole by a wire. Below the waveguide switch control interface and on the surface located at the lower end of the waveguide switch, a first output interface, a second output interface and a waveguide switch load port are sequentially provided.

[0007] Preferably, the heat dissipation component includes a fan baffle installed at one end of the chassis body. Three sets of mounting slots are provided on one side of the fan baffle and at one end of the chassis body. A fan is installed inside the mounting slots. A dustproof mechanism for preventing airflow dust is provided between one side of the fan baffle and one end of the chassis body.

[0008] Preferably, the dustproof mechanism includes a dustproof plate disposed between one side of the fan baffle and one end of the main body of the chassis, and a sealing plate is provided on the top of the dustproof plate and between the upper end of the fan baffle and one end of the main body of the chassis, and two sets of first magnet blocks are embedded at both ends of the bottom of the sealing plate.

[0009] Preferably, the dustproof mechanism further includes two sets of second magnet blocks embedded at both ends of the top of the fan baffle, the second magnet blocks being arranged correspondingly to the first magnet blocks, and the first magnet blocks and the second magnet blocks being magnetically attracted to each other.

[0010] Preferably, a chassis cover is adapted to be provided on the top of the chassis body, and an installation component for installing the chassis cover is provided between the chassis cover and the top of the chassis body;

[0011] The mounting assembly includes four sets of mounting holes at the four corners of the top of the chassis body and four sets of mounting rods located above the chassis cover. One end of each mounting rod passes through the top of the chassis cover and extends to the bottom of the chassis cover, where it is threaded into the inner cavity of the mounting hole.

[0012] Preferably, the mounting assembly further includes four sets of through holes that are opened through the four corners of the top of the chassis cover plate. The interior of the through holes is adapted to the bottom end of the mounting rod, and the bottom end of the mounting rod is inserted into the inner cavity of the through hole.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This invention utilizes a combination of a waveguide switch, a twisted waveguide, a waveguide switch control interface, a switch control through-hole, a first output interface, a second output interface, and a waveguide switch load port. The waveguide switch connects to the main body of the chassis via the twisted waveguide, supporting manual or remote control switching of the output direction. The waveguide switch control interface connects to the switch control through-hole, supporting 485 / 422 / 232 communication protocols to achieve remote command transmission. The waveguide structure has low loss, ensuring high-frequency signal transmission efficiency in the 27-31GHz range. It supports local knob operation and remote communication control, meeting the needs of complex scenarios. This allows for flexible switching of the transmitter's output direction, avoiding the limitations of traditional unidirectional output, and is suitable for multi-target applications such as radar and electronic countermeasures.

[0015] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained through the structures pointed out in the description and the accompanying drawings. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the second output interface of this utility model;

[0018] Figure 3 This is a schematic diagram of the power supply interface of this utility model;

[0019] Figure 4 This is a schematic diagram of the mounting slot of this utility model.

[0020] In the diagram: 1. Chassis base plate; 2. Chassis body; 3. Twisted waveguide; 4. Waveguide switch bracket; 5. Waveguide switch; 6. Fan baffle; 7. First output interface; 8. Second output interface; 9. Switch control through hole; 10. Waveguide switch control interface; 11. Input interface; 12. Power supply interface; 13. Monitoring interface; 14. Waveguide switch load port; 15. Chassis cover plate; 16. Mounting slot; 17. Fan; 18. Dustproof plate; 19. Sealing plate; 20. First magnet; 21. Second magnet; 22. Mounting hole; 23. Mounting rod; 24. Through hole. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-4This utility model provides a technical solution: a power amplifier with frequency conversion function, including a chassis base plate 1, a chassis body 2 mounted on the top of the chassis base plate 1, a switch control through hole 9 provided on one side of one end of the chassis body 2, a waveguide switch bracket 4 installed at the corresponding end of one end of the chassis body 2 and located at the top of the chassis base plate 1, a waveguide switch 5 provided on the top of the waveguide switch bracket 4, a twisted waveguide 3 connected to one side of the waveguide switch 5, and the waveguide switch 5 connected to the chassis body 2 through the twisted waveguide 3, a heat dissipation component for heat dissipation of the interior of the chassis body 2 provided at the other end of the chassis body 2, and an input interface 11, a power supply interface 12 and a monitoring interface 13 sequentially provided at the other end of the chassis body 2 and above the heat dissipation component.

[0023] Furthermore, a waveguide switch control interface 10 is provided on one side of the waveguide switch 5, and the waveguide switch control interface 10 is connected to the switch control through hole 9 by a wire. Below the waveguide switch control interface 10 and on the surface located at the lower end of the waveguide switch 5, a first output interface 7, a second output interface 8 and a waveguide switch load port 14 are provided in sequence.

[0024] Specifically, the rigid connection design between the chassis base plate 1 and the chassis body 2 provides a stable mechanical support, ensuring that the internal high-frequency circuits work stably under vibration or shock. The input interface 11, power supply interface 12, and monitoring interface 13 form a modular layout, so that each functional unit is concentrated at one end of the chassis body 2, which facilitates external cable management, reduces signal interference, provides physical protection for the internal circuits, optimizes space utilization, and meets the electromagnetic shielding and heat dissipation requirements of high-frequency equipment.

[0025] Through the coordinated use of waveguide switch 5, twisted waveguide 3, waveguide switch control interface 10, switch control through hole 9, first output interface 7, second output interface 8 and waveguide switch load port 14, waveguide switch 5 is connected to the main body of the chassis 2 through twisted waveguide 3, supporting manual or remote control switching of output direction. Waveguide switch control interface 10 is connected to switch control through hole 9, supporting 485 / 422 / 232 communication protocols to realize remote command transmission. The waveguide structure has low loss, ensuring the transmission efficiency of 27-31GHz high-frequency signals. It supports local knob operation and remote communication control, meeting the needs of complex scenarios. Thus, it can realize flexible switching of transmitter output direction, avoiding the limitations of traditional unidirectional output, and is suitable for multi-target applications such as radar and electronic countermeasures.

[0026] The radio frequency section includes: an upconverter unit with a cover to prevent electromagnetic interference, a final stage power amplifier unit, and a detector. The detector is connected to a waveguide switch 5 via a torsion waveguide 3 outside the chassis. The output direction can be selected by a knob on the top of the waveguide switch 5. A load is connected via the load port 14 of the waveguide switch. The upconverter unit, the final stage power amplifier unit, and the monitoring unit are all powered by the power supply unit. One output end of the detector is controlled by the monitoring unit. The monitoring unit can connect to the external switch control through-hole 9 of the chassis via the waveguide switch control interface 10 to control the direction of the waveguide switch 5 using three communication methods: 485 / 422 / 232. This allows it to select whether to connect to the first output interface 7 or the second output interface 8. The monitoring unit can also continuously monitor the current, voltage, temperature, etc. in the circuit and automatically shut down when the threshold is exceeded to protect the power amplifier chassis.

[0027] Upconverter unit: The reference signal and intermediate frequency input signal are sent to the upmixer and local oscillator module respectively after passing through the duplexer. The intermediate frequency signal and the local oscillator signal generated by the local oscillator module are upmixed to the Ka band by the upconverter unit. The input power is amplified by a multi-stage drive amplifier to provide higher gain and appropriate power level.

[0028] Power Amplifier Unit: The power amplifier unit consists of a combining network and a final stage power amplifier module. It uses odd-path power combining technology to combine the output power of multiple power amplifier modules and amplify it to the required power before sending it to the transmitter output port.

[0029] Detection unit: Detects output power and reflected power through couplers and detectors, and reports them to the monitoring unit;

[0030] Power supply unit: The power supply unit converts the transmitter input voltage provided by the host into the operating voltage required by each module and outputs it. It also provides an enable port for power amplifier automatic protection and uploads the power amplifier's operating current parameters to the monitoring processor in real time.

[0031] Monitoring Unit: The monitoring processor can adjust the transmitter's gain and level according to the instructions sent by the host. It can monitor the power amplifier's status parameters such as the transmitter's operating current, temperature, and output power in real time and upload them to the host. If abnormalities such as over-temperature, over-current, or local oscillator lockout occur, the monitoring processor will report the fault and immediately activate appropriate protection measures. In severe cases, it will shut down the power amplifier's power supply to protect the transmitter.

[0032] In summary, the input L-band signal is converted to the Ka-band by the internal reference and frequency conversion module after entering the upconversion module, and then amplified. After passing through the final stage amplification module, it is amplified again, and then output to the external waveguide switch 5 of the chassis. The direction of the RF output can be controlled by communication or by manual control; achieving a saturated output of over 100W in the 27-31GHz range and a linear output of over 60W.

[0033] Preferably, the heat dissipation assembly includes: a fan baffle 6, mounting slots 16, a fan 17, and a dustproof mechanism. The fan baffle 6 is installed at one end of the chassis body 2. Three sets of mounting slots 16 are provided on one side of the fan baffle 6 at one end of the chassis body 2. The fan 17 is installed inside the mounting slots 16. The fan 17 is pushed into the mounting slots 16 from the inside of the chassis body 1, and then the fan 17 is connected to the mounting slots 16 by a clip. At the same time, the wires connected to the fan 17 are electrically connected to the power supply interface 12 through plug-in terminals. A dustproof mechanism for preventing dust from the airflow is provided between one side of the fan baffle 6 and one end of the chassis body 2.

[0034] By using the fan baffle 6, mounting slot 16, fan 17 and dustproof mechanism in combination, the three sets of fans 17 are fixed through the mounting slot 16, which enhances the airflow circulation and forms a forced air cooling system. The dustproof mechanism then intercepts dust, which can effectively reduce the temperature of the power amplifier module and ensure the long-term stable operation of the equipment in high temperature and high dust environment, avoiding performance degradation or component damage caused by overheating.

[0035] Preferably, the dustproof mechanism includes: a dustproof plate 18, a sealing plate 19, a first magnet 20, and a second magnet 21. The dustproof plate 18 is located between one side of the fan baffle 6 and one end of the chassis body 2. The sealing plate 19 is located on the top of the dustproof plate 18, between the upper end of the fan baffle 6 and one end of the chassis body 2. Two sets of first magnets 20 are embedded at both ends of the bottom of the sealing plate 19. The dustproof mechanism also includes two sets of second magnets 21 embedded at both ends of the top of the fan baffle 6. The second magnets 21 and the first magnets 20 are connected. The first magnet 20 and the second magnet 21 are magnetically attracted to each other. Through the cooperation of the dustproof plate 18, the sealing plate 19, the first magnet 20 and the second magnet 21, the first magnet 20 and the second magnet 21 are symmetrically embedded in the top of the sealing plate 19 and the fan baffle 6. The dustproof plate 18 is fixed by magnetic attraction, so that the dustproof plate 18 can intercept dust. Then, the dustproof plate 18 can be quickly disassembled and installed by magnetic adsorption. The dustproof plate 18 can be disassembled and cleaned without tools, reducing maintenance downtime.

[0036] Preferably, a chassis cover 15 is fitted to the top of the chassis body 2. A mounting assembly for installing the chassis cover 15 is provided between the chassis cover 15 and the top of the chassis body 2. The mounting assembly includes mounting holes 22, mounting rods 23, and through holes 24. Four sets of mounting holes 22 are located at the four corners of the top of the chassis body 2. Four sets of mounting rods 23 are located above the chassis cover 15. One end of each mounting rod 23 passes through the top of the chassis cover 15 and extends to the bottom of the chassis cover 15, where it is threaded into the inner cavity of the mounting hole 22. Four sets of through holes 24 are located at the four corners of the top of the chassis cover 15, and the interior of each through hole 24 is threaded into the inner cavity of the mounting hole 22. The bottom end of the mounting rod 23 is fitted to fit the inner cavity of the through hole 24. The four-corner threaded connection design of the mounting hole 22 and the mounting rod 23 ensures a tight fixation between the chassis cover 15 and the chassis body 2. The insertion of the through hole 24 and the bottom end of the mounting rod 23 enhances the vibration resistance of the chassis cover 15. The mounting rod 23 can be quickly screwed and disassembled, making it convenient to open the chassis cover 15 to inspect the internal modules. The tight fit between the chassis cover 15 and the chassis body 2 reduces electromagnetic leakage, meets the shielding requirements of high-frequency equipment, and balances equipment protection and maintainability. It supports modular upgrades and troubleshooting of high-frequency transmitters.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A power amplifier with frequency conversion function, characterized in that: The system includes a chassis base plate (1), a chassis body (2) is mounted on the top of the chassis base plate (1), a switch control through hole (9) is provided on one side of one end of the chassis body (2), a waveguide switch bracket (4) is mounted on one end of the chassis body (2) corresponding to the top of the chassis base plate (1), a waveguide switch (5) is provided on the top of the waveguide switch bracket (4), a twisted waveguide (3) is connected to one side of the waveguide switch (5), and the waveguide switch (5) is connected to the chassis body (2) through the twisted waveguide (3). A heat dissipation component for heat dissipation inside the chassis body (2) is provided at the other end of the chassis body (2), and an input interface (11), a power supply interface (12) and a monitoring interface (13) are sequentially provided at the other end of the chassis body (2) and above the heat dissipation component.

2. The power amplifier with frequency conversion function according to claim 1, characterized in that: A waveguide switch control interface (10) is provided on one side of the waveguide switch (5), and the waveguide switch control interface (10) is connected to the switch control through hole (9) by a wire. A first output interface (7), a second output interface (8) and a waveguide switch load port (14) are sequentially provided on the surface below the waveguide switch control interface (10) and located at the lower end of the waveguide switch (5).

3. A power amplifier with frequency conversion function according to claim 1, characterized in that: The heat dissipation assembly includes a fan baffle (6) installed at one end of the chassis body (2). Three sets of mounting slots (16) are provided on one side of the fan baffle (6) and at one end of the chassis body (2). A fan (17) is installed inside the mounting slots (16). A dustproof mechanism for preventing airflow dust is provided between one side of the fan baffle (6) and one end of the chassis body (2).

4. A power amplifier with frequency conversion function according to claim 3, characterized in that: The dustproof mechanism includes a dustproof plate (18) located between one side of the fan baffle (6) and one end of the chassis body (2). A sealing plate (19) is provided on the top of the dustproof plate (18) and between the upper end of the fan baffle (6) and one end of the chassis body (2). Two sets of first magnet blocks (20) are embedded at both ends of the bottom of the sealing plate (19).

5. A power amplifier with frequency conversion function according to claim 4, characterized in that: The dustproof mechanism also includes two sets of second magnet blocks (21) embedded at both ends of the top of the fan baffle (6). The second magnet blocks (21) are arranged in a corresponding manner with the first magnet block (20), and the first magnet block (20) and the second magnet block (21) are magnetically attracted to each other.

6. A power amplifier with frequency conversion function according to claim 1, characterized in that: A chassis cover (15) is adapted to be provided on the top of the chassis body (2), and an installation component for installing the chassis cover (15) is provided between the chassis cover (15) and the top of the chassis body (2). The mounting assembly includes four sets of mounting holes (22) at the four corners of the top of the chassis body (2) and four sets of mounting rods (23) above the chassis cover (15). One end of the mounting rod (23) passes through the top of the chassis cover (15) and extends to the bottom of the chassis cover (15) and is threaded into the inner cavity of the mounting hole (22).

7. A power amplifier with frequency conversion function according to claim 6, characterized in that: The mounting assembly also includes four sets of through holes (24) that are opened through the four corners of the top of the chassis cover (15). The interior of the through holes (24) is adapted to the bottom end of the mounting rod (23), and the bottom end of the mounting rod (23) is inserted into the cavity of the through holes (24).

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