Foldable electronic device
By using thermally conductive connecting plates and groove structures to connect the heat sink in foldable electronic devices, the problems of body temperature difference and insufficient heat dissipation are solved, achieving efficient heat transfer and balanced heat dissipation, and improving the heat dissipation performance of the device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING XIAOMI MOBILE SOFTWARE CO LTD
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-24
AI Technical Summary
In foldable electronic devices, uneven heating on both sides of the device can lead to significant temperature differences, and insufficient heat dissipation from the hotter side can cause functional modules to burn out.
The first and second heat sinks are connected by a heat-conducting connecting piece, which is housed in the groove structure of the rotating shaft device, to achieve efficient heat transfer between the first and second bodies, increase the effective heat dissipation area, and balance the temperature difference.
It improves the heat dissipation performance of foldable electronic devices, reduces temperature differences, avoids screen interference, and enhances heat dissipation efficiency.
Smart Images
Figure CN224555646U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic technology, and in particular to a foldable electronic device. Background Technology
[0002] In foldable electronic devices, the heat generation on each side of the device differs because different functional modules need to be installed on each side.
[0003] However, since the heat dissipation areas of the two sides of the device are basically the same, the temperature of the side that generates more heat is significantly higher than that of the other side, resulting in a significant temperature difference between the two sides of the foldable electronic device. Furthermore, the side that generates more heat may experience problems such as functional module burnout due to insufficient effective heat dissipation area. Utility Model Content
[0004] This application provides a foldable electronic device that can solve the problem of significant temperature difference between the two bodies of the foldable electronic device and insufficient effective heat dissipation area of the body with high heat generation.
[0005] The technical solution is as follows:
[0006] A foldable electronic device, comprising: a first body, a second body, a hinge device, and a heat dissipation assembly;
[0007] The first body and the second body are respectively connected to the pivot device, and the screen assembly is covered on the first body, the pivot device and the second body;
[0008] The heat dissipation assembly includes a first heat dissipation plate, a second heat dissipation plate, and a thermally conductive connecting piece. The first heat dissipation plate is located between the first body and the screen assembly, and the second heat dissipation plate is located between the second body and the screen assembly. The first end of the thermally conductive connecting piece is attached to the surface of the first heat dissipation plate facing away from the first body, and the second end of the thermally conductive connecting piece passes over the pivot device and faces the surface of the screen assembly, and is attached to the surface of the second heat dissipation plate facing away from the second body. The pivot device has a groove structure on the surface facing the screen assembly to accommodate the thermally conductive connecting piece.
[0009] In this embodiment of the foldable electronic device, a first heat sink is arranged inside a first body, and a second heat sink is arranged inside a second body. The two heat sinks are connected by a thermally conductive connecting piece. The first and second heat sinks can achieve rapid heat conduction using the thermally conductive connecting piece, thereby enabling efficient heat conduction in both the first and second bodies. The body that generates more heat can transfer heat to the body that generates less heat. This balances the temperature difference between the two bodies and allows the heat transferred to the less heated body to be fully dissipated outwards from the surface of the body, effectively increasing the effective heat dissipation area of the entire device and improving the heat dissipation performance of the foldable electronic device.
[0010] The thermally conductive connector is housed within a recessed structure, which prevents it from interfering with the screen of foldable electronic devices and reduces screen creases.
[0011] In some possible implementations, the thermally conductive connector includes a first bonding portion, a second bonding portion, and a cross-axis portion;
[0012] The first adhesive portion is located at the first end of the thermally conductive connecting piece, and the second adhesive portion is located at the second end of the thermally conductive connecting piece;
[0013] The cross-axis portion extends along a first direction and is integrally connected to the first application portion and the second application portion, respectively. The first direction is perpendicular to the axial direction of the rotating shaft device.
[0014] With the above arrangement, the heat-conducting connecting plate can realize heat transfer between the first heat sink and the second heat sink, thereby realizing heat exchange between the first body and the second body.
[0015] In some possible implementations, the dimension L1 of the cross-axis portion along the first direction ranges from 38 to 45 mm;
[0016] And / or,
[0017] The dimension L2 of the cross-shaft portion along the axial direction of the rotating shaft device ranges from 20 to 28 mm.
[0018] When the value of the dimension L1 of the cross-axis portion meets the above-mentioned range, the heat transfer requirements between the first and second application portions can be met.
[0019] When the value of the cross-axis portion L2 meets the above-mentioned range, the heat transfer requirements between the first and second application portions can be guaranteed.
[0020] In some possible implementations, the dimension of the cross-shaft portion along the first direction is L1, and the axial dimension of the cross-shaft portion along the rotating shaft device is L2, wherein the value of L1 / L2 is 1.5-1.9.
[0021] When the ratio of the dimension L1 of the cross-shaft portion along the first direction to the dimension L2 of the rotating shaft device along the axial direction satisfies the above arrangement range, the cross-shaft portion can not only meet the structural requirements of foldable electronic devices, but also has high heat transfer efficiency.
[0022] In some possible implementations, the axial dimension of the rotating shaft device is L3, and the axial dimension of the cross-shaft portion along the rotating shaft device is L2, wherein the value of L3 / L2 ranges from 2.3 to 3.3.
[0023] When the ratio of the axial dimension L3 of the rotating shaft device to the axial dimension L2 of the rotating shaft device meets the above arrangement range, the cross-shaft part can obtain a larger axial dimension as much as possible without affecting the structure of the rotating shaft device, thereby having a higher heat transfer efficiency.
[0024] In some possible implementations, the groove structure is spaced at the same distance from both ends of the rotating shaft device along its axial direction.
[0025] And / or,
[0026] The first heat sink and the second heat sink are heat spreaders, and the thermally conductive connecting piece is a graphite thermally conductive sheet.
[0027] With the above arrangement, the groove structure is located in the middle of the axial direction of the rotating shaft device, which can take into account the structural features of both ends of the axial direction of the rotating shaft device, and corresponds to the positions of the first heat sink and the second heat sink.
[0028] In some possible implementations, the heat generated by the first body is greater than that of the second body, and the start-up temperature of the first heat sink is greater than that of the second heat spreader.
[0029] With the above arrangement, the second heat spreader has a lower start-up temperature and can be started at a lower temperature, which speeds up the efficiency of heat transfer from the first body to the second body, thereby improving the heat dissipation efficiency of the foldable electronic device.
[0030] In some possible implementations, the foldable electronic device includes a motherboard module and a battery module; the second body contains a battery compartment panel;
[0031] The motherboard module is located inside the first chassis and is in at least a portion of thermally conductive contact with the first heat sink.
[0032] The battery module is located inside the first body and is in thermal contact with the surface of the battery compartment plate facing away from the screen assembly. The second heat sink is attached to the surface of the battery compartment plate facing the screen assembly.
[0033] With the above arrangement, the heat-conducting component can collect the heat of the motherboard module using the first heat sink and transfer it to the second heat sink through the heat-conducting connecting piece, and then transfer it to the second body through the second heat sink, and then dissipate it outward through the surface of the second body.
[0034] In some possible implementations, the thermally conductive connecting piece has a dimension of D1 along the thickness direction of the foldable electronic device, and the groove structure is recessed inward to a depth of D2 along the surface of the rotating shaft toward the screen assembly, where D1 ≤ D2.
[0035] With the above arrangement, the thickness D1 of the thermally conductive connecting piece is less than or equal to the depth D2 of the groove structure. The thermally conductive connecting piece is accommodated in the groove structure. The thermally conductive connecting piece is aligned with or lower than the surface of the rotating shaft device facing the screen assembly. The presence of the thermally conductive connecting piece will not interfere with the screen of the foldable electronic device.
[0036] In some possible implementation schemes, D1 = D2, and the values of D1 and D2 range from 0.13 to 0.17 mm. Attached Figure Description
[0037] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0038] Figure 1 This is a schematic diagram of the structure of the foldable electronic device provided in the embodiments of this application;
[0039] Figure 2 This is an exploded view of the structure of the foldable electronic device provided in the embodiments of this application;
[0040] Figure 3 This is a dimensional schematic diagram of the heat-conducting connecting plate and rotating shaft device provided in the embodiments of this application;
[0041] Figure 4 This is a structural cross-sectional view of the foldable electronic device provided in the embodiments of this application.
[0042] The reference numerals in the figure are respectively:
[0043] 1. First fuselage;
[0044] 2. Second fuselage;
[0045] 21. Battery compartment middle plate;
[0046] 3. Heat dissipation components;
[0047] 31. First heat sink; 32. Second heat sink; 33. Thermally conductive connecting piece; 331. First bonding part; 332. Second bonding part; 333. Cross-axis part;
[0048] 4. Rotating shaft device;
[0049] 41. Groove structure;
[0050] 5. Screen components. Detailed Implementation
[0051] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0052] In the description of this application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the appendix. Figure 1 The orientations or positional relationships shown are for the purpose of facilitating and simplifying the description of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0053] It should be understood that in this application, "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as a form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Communication connection" can refer to the transmission of electrical signals, including wireless communication connections and wired communication connections. Wireless communication connections do not require a physical medium and are not a connection relationship that limits the product structure. "Connection" and "connected" can both refer to a mechanical or physical connection relationship, that is, A and B being connected or connected can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.
[0054] Unless otherwise defined, all technical terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art.
[0055] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.
[0056] Combination Figure 1 and Figure 2 As shown, this embodiment provides a foldable electronic device, which includes: a first body 1, a second body 2, a hinge device 4, and a heat dissipation component 3.
[0057] The first body 1 and the second body 2 are respectively connected to the rotating shaft device 4, and the screen assembly 5 is covered on the first body 1, the rotating shaft device 4 and the second body 2.
[0058] The heat dissipation assembly 3 includes a first heat dissipation plate 31, a second heat dissipation plate 32, and a thermally conductive connecting piece 33. The first heat dissipation plate 31 is located between the first body 1 and the screen assembly 5, and the second heat dissipation plate 32 is located between the second body 2 and the screen assembly 5. The first end of the thermally conductive connecting piece 33 is attached to the surface of the first heat dissipation plate 31 facing away from the first body 1, and the second end of the thermally conductive connecting piece 33 passes over the rotating shaft device 4 and faces the surface of the screen assembly 5, and is attached to the surface of the second heat dissipation plate 32 facing away from the second body 2. The rotating shaft device 4 has a groove structure 41 on the surface facing the screen assembly 5 to accommodate the thermally conductive connecting piece 33.
[0059] In this embodiment of the foldable electronic device, a first heat sink 31 is arranged inside the first body 1, and a second heat sink 32 is arranged inside the second body 2. The two heat sinks are connected by a thermally conductive connecting piece 33. The first heat sink 31 and the second heat sink 32 can achieve rapid heat conduction using the thermally conductive connecting piece 33, thereby achieving efficient heat conduction for the first body 1 and the second body 2. The body with more heat can transfer heat to the body with less heat, which can balance the temperature difference between the two bodies on the one hand, and the heat conducted to the body with less heat can be fully dissipated outward from the surface of the body, which is equivalent to increasing the effective heat dissipation area of the entire device, which is beneficial to improving the heat dissipation performance of the foldable electronic device.
[0060] The thermally conductive connecting piece 33 is housed within the groove structure 41, which can prevent the thermally conductive connecting piece 33 from interfering with the screen of the foldable electronic device and reduce the screen crease problem.
[0061] Combination Figure 1 , Figure 2 and Figure 3 As shown, in some possible implementations, the thermally conductive connector 33 includes a first bonding portion 331, a second bonding portion 332, and a cross-axis portion 333.
[0062] The first application portion 331 is located at the first end of the heat-conducting connecting piece 33, and the second application portion 332 is located at the second end of the heat-conducting connecting piece 33; the cross-shaft portion 333 extends along the first direction and is integrally connected with the first application portion 331 and the second application portion 332 respectively, and the first direction is perpendicular to the axis of the rotating shaft device 4.
[0063] Through the above arrangement, the heat-conducting connecting piece 33 can realize heat transfer between the first heat sink 31 and the second heat sink 32, thereby realizing heat exchange between the first body 1 and the second body 2.
[0064] Combination Figure 3 As shown, in some possible implementations, the dimension L1 of the transaxial portion 333 along the first direction ranges from 38 to 45 mm. When the dimension L1 of the transaxial portion 333 meets the above-mentioned range, the heat transfer requirements between the first application portion 331 and the second application portion 332 can be met.
[0065] In some possible implementations, the dimension L1 of the cross-axis portion 333 along the first direction can be, for example, 38mm, 39mm, 40mm, 41mm, 42mm, 43mm, 44mm, 45mm, etc.
[0066] For example, the dimension L1 of the cross-shaft portion 333 along the first direction is 42 mm.
[0067] Combination Figure 3 As shown, in some possible implementations, the dimension L2 of the cross-axis portion 333 along the axis of the rotating shaft device 4 ranges from 20 to 28 mm. When the dimension L2 of the cross-axis portion 333 meets the above-mentioned range, the heat transfer requirements between the first application portion 331 and the second application portion 332 can be guaranteed.
[0068] In some possible implementations, the dimension L2 of the cross-shaft portion 333 along the axis of the rotating shaft device 4 can be, for example, 20mm, 21mm, 22mm, 23mm, 24mm, 25mm, 26mm, 27mm, 28mm, etc.
[0069] For example, the dimension L2 of the cross-shaft portion 333 along the axis of the rotating shaft device 4 is 24 mm.
[0070] Combination Figure 3 As shown, in some possible implementations, the dimension of the cross-shaft portion 333 along the first direction is L1, and the axial dimension of the cross-shaft portion 333 along the rotating shaft device 4 is L2, wherein the value of L1 / L2 is 1.5-1.9.
[0071] When the ratio of the dimension L1 of the cross-axis portion 333 along the first direction to the dimension L2 of the axial direction of the rotating shaft device 4 satisfies the above-mentioned arrangement range, the cross-axis portion 333 can not only meet the structural requirements of the foldable electronic device, but also has a high heat transfer efficiency.
[0072] In some possible implementations, the ratio of the dimension L1 of the cross-shaft portion 333 along the first direction to the dimension L2 of the rotating shaft device 4 along the axial direction is 1.5, 1.6, 1.7, 1.75, 1.8, 1.9, etc. For example, the value of L1 / L2 is 1.75.
[0073] Combination Figure 3 As shown, in some possible implementations, the axial dimension of the rotating shaft device 4 is L3, and the axial dimension of the cross shaft portion 333 along the rotating shaft device 4 is L2, wherein the value range of L3 / L2 is 2.3-3.3.
[0074] When the ratio of the axial dimension L3 of the rotating shaft device 4 to the axial dimension L2 of the rotating shaft device 4 meets the above arrangement range, the cross-shaft part 333 can obtain a larger axial dimension as much as possible without affecting the structure of the rotating shaft device 4, thereby having a higher heat transfer efficiency.
[0075] In some possible implementations, the ratio of the axial dimension L3 of the rotating shaft device 4 to the axial dimension L2 of the rotating shaft device 4 takes values of 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.88, 2.89, 2.9, 3.0, 3.1, 3.2, 3.3, etc. For example, the value of L3 / L2 is 2.89.
[0076] Combination Figure 3 As shown, in some possible implementations, the groove structure 41 is spaced at the same distance from both ends of the axial axis of the rotating shaft device 4. With the above arrangement, the groove structure 41 is located in the middle of the axial axis of the rotating shaft device 4, which can take into account the structural features of both ends of the axial axis of the rotating shaft device 4, and corresponds to the positions of the first heat sink 31 and the second heat sink 32.
[0077] In some possible implementations, the heat generated by the first fuselage 1 is greater than that generated by the second fuselage 2, and the starting temperature of the first heat sink 31 is greater than that of the second heat spreader.
[0078] With the above arrangement, the second heat spreader has a lower start-up temperature and can be started at a lower temperature, which speeds up the efficiency of heat transfer from the first body 1 to the second body 2 by the heat-conducting connecting piece 33, thereby improving the heat dissipation efficiency of the foldable electronic device.
[0079] In some possible implementations, the first heat sink 31 and the second heat sink 32 are respectively vapor chambers (VC), and the thermally conductive connecting piece 33 is a graphite thermally conductive sheet.
[0080] The vapor chamber features a vacuum cavity within its inner wall, which allows for the cooling liquid to vaporize in a low-vacuum environment as heat is conducted from the heat source to the evaporation zone. This vaporization absorbs heat and rapidly expands, quickly filling the cavity. When the vaporized working fluid comes into contact with a cooler area, condensation occurs. This condensation releases the heat accumulated during evaporation, and the condensed coolant returns to the evaporation heat source via capillary channels in the microstructure. This cycle repeats continuously within the cavity.
[0081] For example, the condensation zone of the first heat sink 31 is connected to the thermally conductive connecting piece 33, and the evaporator of the second heat sink 32 is connected to the thermally conductive connecting piece 33, so that the first heat sink 31 and the second heat sink 32 can continuously transfer heat using the thermally conductive connecting piece 33.
[0082] The graphite heat-conducting sheet is made from natural graphite and has a unique grain orientation, enabling it to conduct heat uniformly along the planar direction. It can quickly and evenly transfer the heat from the first heat sink 31 to the second heat sink 32. Moreover, its layered structure can adapt well to any surface.
[0083] Combination Figure 1 As shown, in some possible implementations, the foldable electronic device includes a motherboard module and a battery module; the second body 2 has a battery compartment plate 21 inside.
[0084] The motherboard module is located inside the first body 1 and is in at least part of thermal contact with the first heat sink 31.
[0085] The battery module is located inside the first body 1 and is in thermal contact with the surface of the battery compartment plate 21 facing away from the screen assembly 5. The second heat sink 32 is attached to the surface of the battery compartment plate 21 facing the screen assembly 5.
[0086] With the above arrangement, the heat-conducting component can collect the heat of the motherboard module using the first heat sink 31, and transfer it to the second heat sink 32 through the heat-conducting connecting piece 33, and then transfer it to the second body 2 through the second heat sink 32, and then dissipate it outward through the surface of the second body 2.
[0087] Combination Figure 4 As shown, in some possible implementations, the thermally conductive connecting piece 33 has a dimension of D1 along the thickness direction of the foldable electronic device, and the groove structure 41 is recessed inward to a depth of D2 along the surface of the rotating shaft device 4 toward the screen assembly 5, where D1≤D2.
[0088] With the above arrangement, the thickness D1 of the thermally conductive connecting piece 33 is less than or equal to the depth D2 of the groove structure 41. The thermally conductive connecting piece 33 is accommodated in the groove structure 41. The thermally conductive connecting piece 33 is aligned with or lower than the surface of the rotating shaft device 4 facing the screen assembly 5. The presence of the thermally conductive connecting piece 33 will not interfere with the screen of the foldable electronic device.
[0089] In some possible implementation schemes, D1 = D2, and the values of D1 and D2 range from 0.13 to 0.17 mm.
[0090] In some possible implementations, the values of D1 and D2 are 0.13mm, 0.14mm, 0.15mm, 0.16mm, 0.17mm, etc. For example, D1 = D2 = 0.15mm.
[0091] It should be noted that, in the description of this application, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0092] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0093] It should be noted that, in this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0094] In the description of this specification, the references to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the embodiments or examples that are included in at least one embodiment or example of this application.
[0095] The above description is merely an embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.
Claims
1. A foldable electronic device, characterized in that, The foldable electronic device includes: a first body (1), a second body (2), a hinge device (4), a heat dissipation component (3), and a screen component (5); The first body (1) and the second body (2) are respectively connected to the pivot device (4), and the screen assembly (5) is covered on the first body (1), the pivot device (4) and the second body (2); The heat dissipation assembly (3) includes a first heat dissipation plate (31), a second heat dissipation plate (32), and a thermally conductive connecting piece (33). The first heat dissipation plate (31) is located between the first body (1) and the screen assembly (5), and the second heat dissipation plate (32) is located between the second body (2) and the screen assembly (5). The first end of the thermally conductive connecting piece (33) is attached to the surface of the first heat dissipation plate (31) facing away from the first body (1), and the second end of the thermally conductive connecting piece (33) passes over the rotating shaft device (4) and faces the surface of the screen assembly (5), and is attached to the surface of the second heat dissipation plate (32) facing away from the second body (2). The rotating shaft device (4) has a groove structure (41) for accommodating the thermally conductive connecting piece (33) on the surface facing the screen assembly (5).
2. The foldable electronic device according to claim 1, characterized in that, The thermally conductive connecting piece (33) includes a first bonding portion (331), a second bonding portion (332), and a cross-axis portion (333); The first patch (331) is located at the first end of the thermally conductive connecting piece (33), and the second patch (332) is located at the second end of the thermally conductive connecting piece (33); The cross-axis portion (333) extends along a first direction and is integrally connected to the first application portion (331) and the second application portion (332) respectively. The first direction is perpendicular to the axial direction of the rotating shaft device (4).
3. The foldable electronic device according to claim 2, characterized in that, The dimension L1 of the cross-axis portion (333) along the first direction ranges from 38 to 45 mm; And / or, The dimension L2 of the cross-shaft portion (333) along the axial direction of the rotating shaft device (4) ranges from 20 to 28 mm.
4. The foldable electronic device according to claim 2, characterized in that, The dimension of the cross-shaft portion (333) along the first direction is L1, and the axial dimension of the cross-shaft portion (333) along the rotating shaft device (4) is L2, wherein the value of L1 / L2 is 1.5-1.
9.
5. The foldable electronic device according to claim 2, characterized in that, The axial dimension of the rotating shaft device (4) is L3, and the axial dimension of the cross shaft part (333) along the rotating shaft device (4) is L2, wherein the value range of L3 / L2 is 2.3-3.
3.
6. The foldable electronic device according to claim 1, characterized in that, The groove structure (41) is spaced at the same distance from both ends of the axial axis of the rotating shaft device (4); And / or, The first heat sink (31) and the second heat sink (32) are heat spreaders, and the thermally conductive connecting piece (33) is a graphite thermally conductive piece.
7. The foldable electronic device according to claim 1, characterized in that, The heat generated by the first body (1) is greater than that of the second body (2), and the starting temperature of the first heat sink (31) is greater than that of the second heat sink (32).
8. The foldable electronic device according to claim 1, characterized in that, The foldable electronic device includes a motherboard module and a battery module; the second body (2) is provided with a battery compartment plate (21); The motherboard module is located inside the first chassis (1) and is in at least a portion of thermally conductive contact with the first heat sink (31); The battery module is located inside the first body (1) and is in thermal contact with the surface of the battery compartment plate (21) facing away from the screen assembly (5). The second heat sink (32) is attached to the surface of the battery compartment plate (21) facing the screen assembly (5).
9. The foldable electronic device according to any one of claims 1 to 7, characterized in that, The thermally conductive connecting piece (33) has a dimension D1 along the thickness direction of the foldable electronic device, and the groove structure (41) is recessed inward along the surface of the rotating shaft device (4) toward the screen assembly (5) to a depth D2, where D1≤D2.
10. The foldable electronic device according to claim 9, characterized in that, D1 = D2, and the values of D1 and D2 are in the range of 0.13-0.17 mm.