A micro integrated circuit board

Abstract

The utility model provides a kind of miniature integrated circuit board, it is related to circuit board technical field, including buffer component, buffer component includes the second mounting plate connected in the side surface of circuit board body, the bottom of second mounting plate is provided with flexible gasket, by setting second mounting plate, to be able to fix the position of flexible gasket, by setting flexible gasket, to be able to reduce the influence caused to circuit board body when vibrating, effectively improve overall stability, by setting guide plate, to be able to guide the bending direction of pin, convenient for welding.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a micro integrated circuit board. Background Technology

[0002] Micro-integrated circuit boards are commonly used in electronic devices such as mobile phones, computers, and smart home devices. They integrate components such as transistors and resistors onto a small substrate and connect them into circuits through wiring. Their function is to realize signal processing, data transmission, and control functions, making electronic devices smaller, more efficient, and improving reliability and integration. They are one of the core components of modern electronic technology.

[0003] In practical applications, existing micro-integrated circuit boards, used in conjunction with processors and wires, can meet the basic requirements of signal processing, but the following problems still exist:

[0004] Common micro-integrated circuit boards are often installed and used within enclosed structures such as mobile phones and wearable devices, resulting in a lack of heat dissipation channels. Additionally, vibrations from the device casing can be transmitted to the thin circuit board through the mounting structure, affecting its performance. Therefore, this application provides a micro-integrated circuit board to meet these needs. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of existing technologies and provide a micro-integrated circuit board.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a micro integrated circuit board, comprising a circuit board body and a first mounting plate disposed on the top of the circuit board body, a circuit board body buffer assembly disposed at the bottom of the circuit board body, and further comprising:

[0007] A buffer assembly, the buffer assembly including a second mounting plate connected to the side of the circuit board body, the bottom of the second mounting plate being provided with a flexible pad;

[0008] An auxiliary component, the auxiliary component including a guide plate disposed on the side of the flexible pad.

[0009] Furthermore, the inner cavity of the second mounting plate is provided with a filling groove, and the inner wall of the filling groove is fixedly connected to the top of the flexible gasket.

[0010] The technical effect of adopting the above technical solution is that by opening the filling groove, a safe space can be provided for the deformation of the flexible pad, and by setting the flexible pad, the impact of vibration on the circuit board body can be reduced.

[0011] Furthermore, a support base is provided on the top of the first mounting plate, and a first groove is formed on the top of the support base.

[0012] The technical effect of adopting the above technical solution is that the cooperation between the support base and the first groove can prevent the lead screw from being overloaded during installation.

[0013] Furthermore, a flexible sleeve is connected to the bottom of the support base.

[0014] The technical effect of adopting the above technical solution is that by setting a flexible sleeve, the installation direction of the lead screw can be guided.

[0015] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0016] By setting a second mounting plate, the position of the flexible pad can be fixed. By setting the flexible pad, the impact on the circuit board body during vibration can be reduced, effectively improving the overall stability. By setting a guide plate, the bending direction of the pins can be guided, facilitating soldering. Attached Figure Description

[0017] Figure 1 A three-dimensional structural diagram of a micro-integrated circuit board provided by this utility model;

[0018] Figure 2 A schematic diagram of the bottom structure of a micro-integrated circuit board provided by this utility model;

[0019] Figure 3 A schematic diagram of the internal connection structure of a micro integrated circuit board provided by this utility model;

[0020] Figure 4 This is a bottom cross-sectional view of a micro-integrated circuit board provided by the present invention.

[0021] Legend:

[0022] 1. Circuit board body; 11. First mounting plate; 12. Pins;

[0023] 2. Buffer assembly; 21. Second mounting plate; 22. Flexible gasket; 23. Filling groove; 24. Support base; 25. First groove; 26. Flexible sleeve;

[0024] 3. Auxiliary components; 31. Guide plate; 32. Heat conduction groove; 33. Heat conduction sheet; 34. Second groove. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] like Figure 1 - Figure 4 As shown, this embodiment provides a technical solution: a micro integrated circuit board, including a circuit board body 1 and a first mounting plate 11 disposed on the top of the circuit board body 1, pins 12 disposed on the bottom of the circuit board body 1, and further including:

[0027] The buffer assembly 2 includes a second mounting plate 21 connected to the side of the circuit board body 1, and a flexible pad 22 is provided at the bottom of the second mounting plate 21.

[0028] Auxiliary component 3 includes a guide plate 31 disposed on the side of the flexible gasket 22, a filling groove 23 formed in the inner cavity of the second mounting plate 21, the inner wall of the filling groove 23 being fixedly connected to the top of the flexible gasket 22, a support base 24 disposed on the top of the first mounting plate 11, a first groove 25 formed on the top of the support base 24, and a flexible sleeve 26 connected to the bottom of the support base 24. By setting the circuit board body 1, support can be provided for the first mounting plate 11 and the second mounting plate 21. By setting the first mounting plate 11, components can be installed. By setting the second mounting plate 21, installation space can be provided for the flexible gasket 22. During installation... By using a lead screw and manual tools, the second mounting plate 21 can be installed in the inner cavity of the equipment. By setting a support base 24, the bottom of the lead screw can be supported to prevent overload rotation and facilitate subsequent disassembly. By opening a filling groove 23, space can be provided for the deformation of the flexible pad 22, thereby accommodating the deformation of the flexible pad 22. By setting the flexible pad 22, the stress generated by vibration can be absorbed when vibration occurs, reducing the impact of vibration on the circuit board body 1 and improving the overall stability. By setting a guide plate 31, the bending direction of the pin 12 can be guided to assist in subsequent soldering work.

[0029] Furthermore, such as Figure 3 and Figure 4As shown: A heat-conducting groove 32 is provided on the side of the guide plate 31, and a heat-conducting sheet 33 is connected to the bottom of the heat-conducting groove 32. A second groove 34 is provided at the bottom of the guide plate 31. By cooperating with the guide plate 31 and the second groove 34, the installation position of the pin 12 can be guided to ensure the bending accuracy of the pin 12. By setting the heat-conducting groove 32, the high temperature generated by the component can be absorbed and guided. By setting the heat-conducting sheet 33, the heat can be guided to the outside of the circuit board body 1.

[0030] Working principle:

[0031] like Figure 1-4 As shown:

[0032] In use: First, the component is installed on the top of the first mounting plate 11. Then, the second mounting plate 21 is installed into the inner cavity of the device via a lead screw. During installation, the support base 24 and the first groove 25 cooperate to guide the installation position of the lead screw and prevent overload installation. During use, the second mounting plate 21, the flexible gasket 22, and the filling groove 23 cooperate to buffer the stress generated by vibration, reduce the impact of vibration on the circuit board body 1, and improve overall stability. The guide plate 31 and the second groove 34 cooperate to guide the bending direction of the pin 12 when bending and soldering. The heat-conducting groove 32 and the heat-conducting sheet 33 cooperate to assist in guiding the heat released by the component during use and extend its service life.

[0033] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A micro integrated circuit board, comprising a circuit board body (1) and a first mounting plate (11) disposed on the top of the circuit board body (1), wherein pins (12) are disposed on the bottom of the circuit board body (1), characterized in that, Also includes: The buffer assembly (2) includes a second mounting plate (21) connected to the side of the circuit board body (1), and a flexible pad (22) is provided at the bottom of the second mounting plate (21). The auxiliary component (3) includes a guide plate (31) disposed on the side of the flexible pad (22).

2. The micro-integrated circuit board according to claim 1, characterized in that, The inner cavity of the second mounting plate (21) is provided with a filling groove (23), and the inner wall of the filling groove (23) is fixedly connected to the top of the flexible gasket (22).

3. A micro integrated circuit board according to claim 1, characterized in that, The top of the first mounting plate (11) is provided with a support base (24), and the top of the support base (24) is provided with a first groove (25).

4. A micro-integrated circuit board according to claim 3, characterized in that, The bottom of the support base (24) is connected to a flexible sleeve (26).

5. A micro-integrated circuit board according to claim 1, characterized in that, The guide plate (31) has a heat-conducting groove (32) on its side, and a heat-conducting sheet (33) is connected to the bottom of the heat-conducting groove (32).

6. A micro-integrated circuit board according to claim 1, characterized in that, The bottom of the guide plate (31) is provided with a second groove (34).

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